JPH02131328U - - Google Patents
Info
- Publication number
- JPH02131328U JPH02131328U JP4016889U JP4016889U JPH02131328U JP H02131328 U JPH02131328 U JP H02131328U JP 4016889 U JP4016889 U JP 4016889U JP 4016889 U JP4016889 U JP 4016889U JP H02131328 U JPH02131328 U JP H02131328U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit board
- electrode terminal
- concentrated
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図、第２図、第３図はそれぞれ本考案の異
なる実施例の構成図、第４図、第５図は従来にお
ける表面実装形電子部品の構造図である。図にお
いて、
１……チツプ、２……電極端子、３……回路基
板、４……半田層。
FIGS. 1, 2, and 3 are configuration diagrams of different embodiments of the present invention, and FIGS. 4 and 5 are configuration diagrams of conventional surface-mounted electronic components. In the figure, 1...chip, 2...electrode terminal, 3...circuit board, 4...solder layer.
Claims (1)
面実装形電子部品において、チツプより引出した
各電極端子の半田付け部をチツプの面域内で相互
に接近させて集中配置したことを特徴とする表面
実装形電子部品。 A surface mount electronic component wirelessly bonded onto a circuit board, characterized in that the soldered portions of each electrode terminal drawn out from the chip are concentrated and arranged close to each other within the surface area of the chip. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4016889U JPH02131328U (en) | 1989-04-05 | 1989-04-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4016889U JPH02131328U (en) | 1989-04-05 | 1989-04-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02131328U true JPH02131328U (en) | 1990-10-31 |
Family
ID=31549726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4016889U Pending JPH02131328U (en) | 1989-04-05 | 1989-04-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02131328U (en) |
-
1989
- 1989-04-05 JP JP4016889U patent/JPH02131328U/ja active Pending