JPS6185185U - - Google Patents
Info
- Publication number
- JPS6185185U JPS6185185U JP17051384U JP17051384U JPS6185185U JP S6185185 U JPS6185185 U JP S6185185U JP 17051384 U JP17051384 U JP 17051384U JP 17051384 U JP17051384 U JP 17051384U JP S6185185 U JPS6185185 U JP S6185185U
- Authority
- JP
- Japan
- Prior art keywords
- chassis
- protrusion
- board
- electronic component
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 2
Landscapes
- Molten Solder (AREA)
- Casings For Electric Apparatus (AREA)
Description
第１図〜第４図は本考案の実施例を示すもので
あり、第１図はシヤーシと基板とが接合されてい
る状態を示す断面側面図、第２図はその底面図、
第３図はシヤーシと基板とを下から見た斜視図、
第４図は他の実施例による第２図に相当する底面
図、第５図、第６図は従来例を示すものであり、
第５図はシヤーシと基板とが接合されている状態
を示す断面側面図、第６図はその底面図である。
１…シヤーシ、１ａ…突部、３…半田、１２…
基板、１２ｂ…ランド。
1 to 4 show an embodiment of the present invention, FIG. 1 is a cross-sectional side view showing a state in which the chassis and the board are joined, FIG. 2 is a bottom view thereof,
FIG. 3 is a perspective view of the chassis and board seen from below;
FIG. 4 is a bottom view corresponding to FIG. 2 according to another embodiment, and FIGS. 5 and 6 show conventional examples.
FIG. 5 is a cross-sectional side view showing a state in which the chassis and the substrate are joined, and FIG. 6 is a bottom view thereof. 1... Chassis, 1a... Protrusion, 3... Solder, 12...
Board, 12b...land.
Claims (1)
ヤーシの突部とが半田付けされて基板がシヤーシ
に固定されている電子部品において、シヤーシの
１個の突部に対して複数に分割されたランドが対
向しており、この分割された各ランドと突部とが
半田により固着されていることを特徴とする電子
部品の基板固定構造。 An electronic component in which the board is fixed to the chassis by soldering a soldering land formed on the bottom of the board to a protrusion on the chassis, which is divided into multiple parts for one protrusion on the chassis. A substrate fixing structure for an electronic component, characterized in that lands are opposed to each other, and each divided land and a protrusion are fixed by solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17051384U JPS6185185U (en) | 1984-11-09 | 1984-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17051384U JPS6185185U (en) | 1984-11-09 | 1984-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6185185U true JPS6185185U (en) | 1986-06-04 |
Family
ID=30728220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17051384U Pending JPS6185185U (en) | 1984-11-09 | 1984-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6185185U (en) |
-
1984
- 1984-11-09 JP JP17051384U patent/JPS6185185U/ja active Pending
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