JPS63131712A - Surface acoustic wave device - Google Patents
Surface acoustic wave deviceInfo
- Publication number
- JPS63131712A JPS63131712A JP27927086A JP27927086A JPS63131712A JP S63131712 A JPS63131712 A JP S63131712A JP 27927086 A JP27927086 A JP 27927086A JP 27927086 A JP27927086 A JP 27927086A JP S63131712 A JPS63131712 A JP S63131712A
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- surface acoustic
- lead frame
- seal ring
- saw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 21
- 239000000919 ceramic Substances 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000000463 material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、弾性表面波装置の構造に関し、特に、高信頼
性と、量産性に優れた弾性表面波装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of a surface acoustic wave device, and particularly to a surface acoustic wave device that is highly reliable and can be mass-produced.
従来、この種の弾性表面波デバイスの構造は、金属ケー
ス内に実装されたハーメチック封止が採用されている。Conventionally, the structure of this type of surface acoustic wave device employs hermetic sealing mounted within a metal case.
弾性表面波デバイスは圧電性材料である弾性体の表面を
伝播する波動を利用したデバイスなので、表面波の伝播
を妨害しないように圧電材料の表面を保つことと、気密
性を守る構造とすることが、デバイスを製造するときの
課題である。この為、従来の弾性表面波チップは第３図
に示すようにＳ人Ｗチップ２１を基板上に固定し、基板
を貫くリード２４とＳＡＷチップ２１とをＡ１１ワイヤ
ーで接続して金属ケースまたはセラミックケース２２に
収容し、シール封止して量産化されている。A surface acoustic wave device is a device that uses waves that propagate on the surface of an elastic body, which is a piezoelectric material, so the surface of the piezoelectric material must be maintained so as not to interfere with the propagation of surface waves, and the structure must be designed to maintain airtightness. is a challenge when manufacturing devices. For this reason, conventional surface acoustic wave chips are manufactured by fixing the SAW chip 21 on a substrate as shown in FIG. It is housed in a case 22, sealed and mass-produced.
しかし、この弾性表面波デバイスの製造設備としては、
ＩＣ，ＬＳＩ製造用半導体設備でなく、専用設備が開発
され使われている。またケースはノ・−メチツク構造が
多く他の半導体デバイスのケース構造（モールド形）と
異表っているため、自動搭載等が困難である。However, the manufacturing equipment for this surface acoustic wave device is
Instead of semiconductor equipment for IC and LSI manufacturing, dedicated equipment has been developed and used. In addition, the case has a non-metallic structure, which is different from the case structure (mold type) of other semiconductor devices, making automatic mounting difficult.
本発明の目的は量産が可能な弾性表面波デバイスを得る
ことにある。An object of the present invention is to obtain a surface acoustic wave device that can be mass-produced.
本発明のモールドタイプ弾性表面波（ＳＡＷ）デバイス
では、気密性に重点をおき、シールリング部を有するセ
ラミック基板上に弾性表面波チップを実装し、このメタ
ル封止された弾性表面波素子をリードフレーム上にモー
ルドした構造である。In the mold type surface acoustic wave (SAW) device of the present invention, emphasis is placed on airtightness, a surface acoustic wave chip is mounted on a ceramic substrate having a seal ring part, and this metal-sealed surface acoustic wave element is lead. It has a structure molded onto the frame.
次に本発明の実施例について図面を参照して説明する。 Next, embodiments of the present invention will be described with reference to the drawings.
第１図は、本発明の一実施例の構造の分解図である。リ
ードフレーム１７上ニ、シールリング１８を有するセラ
ミック基板１１が搭載されている。FIG. 1 is an exploded view of the structure of one embodiment of the present invention. A ceramic substrate 11 having a seal ring 18 is mounted on the lead frame 17 .
セラミック基板１１は凹状に加工されておシ、この凹部
内に８ＡＷチツプ１２が実装されている。The ceramic substrate 11 is processed into a concave shape, and an 8AW chip 12 is mounted within this concave portion.
リードフレームリード１４とＳＡＷチップとの電気的接
続はＡＩまたはＡｕワイヤー１３で行われている。メタ
ル封止用カバー１５はシールリング１８の上に固定され
、最後に全体が第２図に示すつ、モールド成形の為、耐
ブージ機械的に優れた特徴を有する。Electrical connection between the lead frame leads 14 and the SAW chip is made using AI or Au wires 13. The metal sealing cover 15 is fixed on the sealing ring 18, and finally, as shown in FIG. 2, the metal sealing cover 15 is molded and has an excellent mechanical property of being resistant to booting.
以上説明したように本発明によれは、構造的にリードフ
レームタイプである為、量産性、高信頼性が達成可能で
あり、かつ、シールリングによる気密性にも優れ、デバ
イス実装時にも、自動搭載が可能で半導体ＩＣ並の取扱
いができる。As explained above, since the structure of the present invention is a lead frame type, it is possible to achieve mass production and high reliability.It also has excellent airtightness due to the seal ring, and can be automatically mounted during device mounting. It can be mounted and handled like a semiconductor IC.
第１図は本発明の一実施例の構造の分解図、第２図は本
発明の一実施例の断面、第３図は従来のＳＡＷデバイス
を示す断面図である。 、−。
ト
華 ｆｍ
竿 ２ｆｆｉ
／／−−−ｅラミ、７７基板
１ｓ １ｚ−−−５ＡＷ−Ｆラフ１／３−−−ワ
Ａ’ｆｆ−
／、ｉｆ、−−−リード
１７−−−リードプし−ム
／β−−−シフルソ＞７パFIG. 1 is an exploded view of a structure of an embodiment of the present invention, FIG. 2 is a cross-sectional view of an embodiment of the present invention, and FIG. 3 is a cross-sectional view of a conventional SAW device. ,-. Touka fm rod 2ffi //---e lami, 77 board 1s 1z---5AW-F rough 1/3---wa A'ff-/, if, ---lead 17---lead pull- Mu/β---Sifruso>7pa
Claims (1)
と、前記基板上に固定された弾性表面波チップと、封止
された前記弾性表面波素子を搭載したリードフレームと
を有し、全体がモールディングされたことを特徴とする
弾性表面波装置。It has a ceramic substrate sealed with metal via a seal ring, a surface acoustic wave chip fixed on the substrate, and a lead frame on which the sealed surface acoustic wave element is mounted, and the whole is molded. A surface acoustic wave device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27927086A JPS63131712A (en) | 1986-11-21 | 1986-11-21 | Surface acoustic wave device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27927086A JPS63131712A (en) | 1986-11-21 | 1986-11-21 | Surface acoustic wave device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63131712A true JPS63131712A (en) | 1988-06-03 |
Family
ID=17608825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27927086A Pending JPS63131712A (en) | 1986-11-21 | 1986-11-21 | Surface acoustic wave device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63131712A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02141124U (en) * | 1989-04-28 | 1990-11-27 | ||
| US6037698A (en) * | 1995-10-20 | 2000-03-14 | Fujitsu Limited | Acoustic surface wave device |
-
1986
- 1986-11-21 JP JP27927086A patent/JPS63131712A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02141124U (en) * | 1989-04-28 | 1990-11-27 | ||
| US6037698A (en) * | 1995-10-20 | 2000-03-14 | Fujitsu Limited | Acoustic surface wave device |
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