JPS63131163U - - Google Patents
Info
- Publication number
- JPS63131163U JPS63131163U JP2301287U JP2301287U JPS63131163U JP S63131163 U JPS63131163 U JP S63131163U JP 2301287 U JP2301287 U JP 2301287U JP 2301287 U JP2301287 U JP 2301287U JP S63131163 U JPS63131163 U JP S63131163U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrates
- conductive path
- conductive
- protrusion
- thin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図及び第２図は本考案の実施例を示す断面
図、第３図及び第４図は他の実施例を示す断面図
、第５図及び第６図は従来例を示す断面図である
。
１，２は金属基板、３，４は外部リード、５は
突出部、６はケース材、７，８は回路素子、９は
コネクタ部、１０，１１はプリント基板。
1 and 2 are sectional views showing an embodiment of the present invention, 3 and 4 are sectional views showing other embodiments, and 5 and 6 are sectional views showing a conventional example. be. 1 and 2 are metal substrates, 3 and 4 are external leads, 5 is a protrusion, 6 is a case material, 7 and 8 are circuit elements, 9 is a connector portion, and 10 and 11 are printed circuit boards.
Claims (1)
けられた絶縁薄層と、前記絶縁薄層上に設けられ
た所望形状の導電路と、前記導電路上に設けられ
た回路素子と、前記導電路が延在される夫々の前
記金属基板の周端部に設けられた複数の導電パツ
ドと、絶縁樹脂から形成され前記二枚の金属基板
を離間固着するケース材とから成る混成集積回路
において、前記固着パツドが形成された前記二枚
の金属基板の終端部より外方に突出する突出部を
ケース材に設け、前記導電パツドから導出された
外部リードを前記突出部に当接延在させたことを
特徴とする混成集積回路。 two metal substrates, an insulating thin layer provided on the two metal substrates, a conductive path of a desired shape provided on the insulating thin layer, and a circuit element provided on the conductive path; A hybrid integrated circuit comprising a plurality of conductive pads provided on the peripheral edge of each of the metal substrates on which the conductive path extends, and a case material made of insulating resin and fixing the two metal substrates apart from each other. The case material is provided with a protrusion that protrudes outward from the end portions of the two metal substrates on which the fixing pads are formed, and the external lead led out from the conductive pad is extended into contact with the protrusion. A hybrid integrated circuit characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2301287U JPS63131163U (en) | 1987-02-19 | 1987-02-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2301287U JPS63131163U (en) | 1987-02-19 | 1987-02-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63131163U true JPS63131163U (en) | 1988-08-26 |
Family
ID=30820938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2301287U Pending JPS63131163U (en) | 1987-02-19 | 1987-02-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63131163U (en) |
-
1987
- 1987-02-19 JP JP2301287U patent/JPS63131163U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS62184775U (en) | ||
| JPS63131163U (en) | ||
| JPS6365246U (en) | ||
| JPS6365245U (en) | ||
| JPS63131146U (en) | ||
| JPS63131171U (en) | ||
| JPS58120662U (en) | Chippukiyariya | |
| JPS6448068U (en) | ||
| JPH0268452U (en) | ||
| JPS6398654U (en) | ||
| JPS6365263U (en) | ||
| JPS63152272U (en) | ||
| JPS6380859U (en) | ||
| JPS62118440U (en) | ||
| JPS62118439U (en) | ||
| JPS6249290U (en) | ||
| JPS60124060U (en) | Surface coating structure of flexible circuit board | |
| JPH0241474U (en) | ||
| JPS60183429U (en) | electronic components | |
| JPS594610U (en) | inductance element | |
| JPS5967961U (en) | Printed board | |
| JPS63127077U (en) | ||
| JPS6169828U (en) | ||
| JPS58105162U (en) | flexible circuit board | |
| JPS62118438U (en) |