JPS6365263U - - Google Patents

Info

Publication number
JPS6365263U
JPS6365263U JP1986160393U JP16039386U JPS6365263U JP S6365263 U JPS6365263 U JP S6365263U JP 1986160393 U JP1986160393 U JP 1986160393U JP 16039386 U JP16039386 U JP 16039386U JP S6365263 U JPS6365263 U JP S6365263U
Authority
JP
Japan
Prior art keywords
metal substrates
conductive path
connector portion
connector
terminal ends
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986160393U
Other languages
Japanese (ja)
Other versions
JPH0639483Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986160393U priority Critical patent/JPH0639483Y2/en
Priority to EP87114938A priority patent/EP0264780B1/en
Priority to US07/107,990 priority patent/US4884125A/en
Priority to DE8787114938T priority patent/DE3777324D1/en
Priority to KR1019870011409A priority patent/KR900007232B1/en
Publication of JPS6365263U publication Critical patent/JPS6365263U/ja
Application granted granted Critical
Publication of JPH0639483Y2 publication Critical patent/JPH0639483Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Combinations Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の混成集積回路を示す断面図、
第２図はその平面図、第３図は混成集積回路をプ
リント基板に挿入した際の断面図、第４図乃至第
９図は従来例を示す図である。 １，１′は金属基板、２はケース材、６はコネ
クタ部、３，３′は外部リード。 FIG. 1 is a cross-sectional view showing the hybrid integrated circuit of the present invention;
FIG. 2 is a plan view thereof, FIG. 3 is a sectional view when the hybrid integrated circuit is inserted into a printed circuit board, and FIGS. 4 to 9 are views showing conventional examples. 1 and 1' are metal substrates, 2 is a case material, 6 is a connector part, and 3 and 3' are external leads.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 二枚の金属基板と、該二枚の金属基板上に設け
られた絶縁膜と、該夫々の絶縁膜上に形成された
所望形状の導電路と、該導電路上に固着された複
数の回路素子と、前記導電路の延在される前記夫
々の金属基板の周端部に形成された複数の導電パ
ツドと、絶縁樹脂よりなり前記二枚の金属基板を
離間すると共に回路素子を囲む封止部と前記封止
部の略中間部より前記二枚の金属基板の端部より
突出するコネクタ部とを有するケース材と、前記
夫々の導電パツドに一端が固着され前記ケース材
のコネクタ部の両面に当接して該コネクタ部の終
端部まで延在され該終端部で夫々接続される外部
リードとを備えたことを特徴とする混成集積回路
。 Two metal substrates, an insulating film provided on the two metal substrates, a conductive path of a desired shape formed on each of the insulating films, and a plurality of circuit elements fixed on the conductive path. a plurality of conductive pads formed on the peripheral edge of each of the metal substrates where the conductive path extends; and a sealing portion made of insulating resin that separates the two metal substrates and surrounds the circuit element. and a connector portion protruding from the ends of the two metal substrates from a substantially middle portion of the sealing portion, and a connector portion having one end fixed to each of the conductive pads and attached to both sides of the connector portion of the case material. A hybrid integrated circuit comprising external leads that abut and extend to the terminal ends of the connector section and are connected to each other at the terminal ends.
JP1986160393U 1986-10-15 1986-10-20 Hybrid integrated circuit Expired - Lifetime JPH0639483Y2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1986160393U JPH0639483Y2 (en) 1986-10-20 1986-10-20 Hybrid integrated circuit
EP87114938A EP0264780B1 (en) 1986-10-15 1987-10-13 Hybrid integrated circuit device capable of being inserted into socket
US07/107,990 US4884125A (en) 1986-10-15 1987-10-13 Hybrid integrated circuit device capable of being inserted into socket
DE8787114938T DE3777324D1 (en) 1986-10-15 1987-10-13 INTEGRATED HYBRID CIRCUIT ARRANGEMENT THAT CAN BE INSERTED INTO A BASE.
KR1019870011409A KR900007232B1 (en) 1986-10-15 1987-10-14 Hybrid intergrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986160393U JPH0639483Y2 (en) 1986-10-20 1986-10-20 Hybrid integrated circuit

Publications (2)

Publication Number Publication Date
JPS6365263U true JPS6365263U (en) 1988-04-30
JPH0639483Y2 JPH0639483Y2 (en) 1994-10-12

Family

ID=31085731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986160393U Expired - Lifetime JPH0639483Y2 (en) 1986-10-15 1986-10-20 Hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPH0639483Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63219187A (en) * 1986-10-17 1988-09-12 三洋電機株式会社 Hybrid integrated circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63219187A (en) * 1986-10-17 1988-09-12 三洋電機株式会社 Hybrid integrated circuit

Also Published As

Publication number Publication date
JPH0639483Y2 (en) 1994-10-12

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