JPH0383967U - - Google Patents
Info
- Publication number
- JPH0383967U JPH0383967U JP14613289U JP14613289U JPH0383967U JP H0383967 U JPH0383967 U JP H0383967U JP 14613289 U JP14613289 U JP 14613289U JP 14613289 U JP14613289 U JP 14613289U JP H0383967 U JPH0383967 U JP H0383967U
- Authority
- JP
- Japan
- Prior art keywords
- connection part
- wiring pattern
- printed circuit
- bare chip
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図および第２図は本考案の一実施例を示す
ものである。第１図はＴＡＢにおける接続部の構
成を示す縦断面図である。第２図はＴＡＢの接続
部と液晶パネルの接続部との接続を示す縦断面図
である。第３図は一般的なＴＡＢの構成を示す斜
視図である。第４図は従来例のＴＡＢにおける接
続部の構成を示す縦断面図である。
１……ベースフイルム、２……ベアチツプ、３
……配線パターン、４……接続端子、５……入力
側接続部（接続部）、６……出力側接続部（接続
部）、９……熱可塑性樹脂、９′……熱硬化性樹
脂、１０……導電粒子、１１……異方性樹脂層で
ある。
1 and 2 show an embodiment of the present invention. FIG. 1 is a longitudinal cross-sectional view showing the configuration of a connecting portion in TAB. FIG. 2 is a longitudinal sectional view showing the connection between the TAB connection part and the liquid crystal panel connection part. FIG. 3 is a perspective view showing the configuration of a general TAB. FIG. 4 is a longitudinal sectional view showing the configuration of a connecting portion in a conventional TAB. 1...Base film, 2...Bear chip, 3
... Wiring pattern, 4 ... Connection terminal, 5 ... Input side connection part (connection part), 6 ... Output side connection part (connection part), 9 ... Thermoplastic resin, 9' ... Thermosetting resin , 10... Conductive particles, 11... Anisotropic resin layer.
Claims (1)
載設され、ベアチツプの各端子に接続される配線
パターンが形成されるとともに、配線パターンの
端部にそれぞれ接続端子が設けられて外部との電
気的接続を行う接続部が形成されている印刷回路
において、 上記接続部上に、熱可塑性樹脂あるいは熱硬化
性樹脂に導電粒子が分散されてなる異方性樹脂層
が形成されていることを特徴とする印刷回路。[Claim for Utility Model Registration] A bare chip of an integrated circuit is mounted on a base film, a wiring pattern is formed to be connected to each terminal of the bare chip, and connection terminals are provided at each end of the wiring pattern. In a printed circuit in which a connection part is formed to make an electrical connection with the outside, an anisotropic resin layer made of thermoplastic resin or thermosetting resin with conductive particles dispersed therein is formed on the connection part. A printed circuit characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14613289U JPH0383967U (en) | 1989-12-15 | 1989-12-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14613289U JPH0383967U (en) | 1989-12-15 | 1989-12-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0383967U true JPH0383967U (en) | 1991-08-26 |
Family
ID=31692738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14613289U Pending JPH0383967U (en) | 1989-12-15 | 1989-12-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0383967U (en) |
-
1989
- 1989-12-15 JP JP14613289U patent/JPH0383967U/ja active Pending
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