JPS6196346U - - Google Patents
Info
- Publication number
- JPS6196346U JPS6196346U JP18171884U JP18171884U JPS6196346U JP S6196346 U JPS6196346 U JP S6196346U JP 18171884 U JP18171884 U JP 18171884U JP 18171884 U JP18171884 U JP 18171884U JP S6196346 U JPS6196346 U JP S6196346U
- Authority
- JP
- Japan
- Prior art keywords
- flexible substrate
- cylindrical case
- opening
- semiconductor pressure
- pressure sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第１図は電気的等価回路図、第２図は本考案の
一実施例構造を示す断面図、第３図は本考案に使
用するフレキシブル基板の平面図である。
図においてＡはセンサ部、Ｂは電源、Ｃは制御
回路、１は筒状ケース、２は端子部材保持具、２
ａ，２ｂ，５ｂは端子、２ｃ，７は充填樹脂材、
２ｄはコネクタ、３はＯリング、４はセンサ部保
持具、５はセンサ素子、５ａは素子固定台、８は
フレキシブル基板、８ａは導電パターン、８ｂ，
８ｃはピンホール、８′は端部、９，１０は回路
部品である。
FIG. 1 is an electrical equivalent circuit diagram, FIG. 2 is a sectional view showing the structure of an embodiment of the present invention, and FIG. 3 is a plan view of a flexible substrate used in the present invention. In the figure, A is a sensor section, B is a power supply, C is a control circuit, 1 is a cylindrical case, 2 is a terminal member holder, 2
a, 2b, 5b are terminals, 2c, 7 are filled resin materials,
2d is a connector, 3 is an O-ring, 4 is a sensor part holder, 5 is a sensor element, 5a is an element fixing base, 8 is a flexible substrate, 8a is a conductive pattern, 8b,
8c is a pinhole, 8' is an end portion, and 9 and 10 are circuit components.
Claims (1)
と共に他方の開口部にセンサ部材を設け、又前記
筒状ケースの内部にフレキシブル基板上に搭載さ
れた回路部品を配設し、且つ前記フレキシブル基
板の両端部を夫々前記端子部材及びセンサ部材に
接続するようにしたことを特徴とする半導体圧力
センサ装置。 A terminal member is provided in one opening of the cylindrical case, a sensor member is provided in the other opening, and a circuit component mounted on a flexible substrate is disposed inside the cylindrical case, and the flexible substrate A semiconductor pressure sensor device characterized in that both ends of the semiconductor pressure sensor device are connected to the terminal member and the sensor member, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18171884U JPS6196346U (en) | 1984-11-30 | 1984-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18171884U JPS6196346U (en) | 1984-11-30 | 1984-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6196346U true JPS6196346U (en) | 1986-06-20 |
Family
ID=30739259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18171884U Pending JPS6196346U (en) | 1984-11-30 | 1984-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6196346U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01156438U (en) * | 1988-04-20 | 1989-10-27 | ||
| JPH0496036U (en) * | 1991-01-19 | 1992-08-20 | ||
| US6955091B2 (en) | 2003-05-19 | 2005-10-18 | Seizo Fujimoto | Pressure sensor apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57128981A (en) * | 1981-02-04 | 1982-08-10 | Hitachi Ltd | Semiconductor pressure transducer |
-
1984
- 1984-11-30 JP JP18171884U patent/JPS6196346U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57128981A (en) * | 1981-02-04 | 1982-08-10 | Hitachi Ltd | Semiconductor pressure transducer |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01156438U (en) * | 1988-04-20 | 1989-10-27 | ||
| JPH0496036U (en) * | 1991-01-19 | 1992-08-20 | ||
| US6955091B2 (en) | 2003-05-19 | 2005-10-18 | Seizo Fujimoto | Pressure sensor apparatus |