JPS6268241U - - Google Patents
Info
- Publication number
- JPS6268241U JPS6268241U JP16020385U JP16020385U JPS6268241U JP S6268241 U JPS6268241 U JP S6268241U JP 16020385 U JP16020385 U JP 16020385U JP 16020385 U JP16020385 U JP 16020385U JP S6268241 U JPS6268241 U JP S6268241U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- insulating member
- lead
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 230000009977 dual effect Effects 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の実施例のＩＣケースを示す平
面図、第２図は第１図のＡ―Ａ線に沿つて切断し
て見た断面図、第３図は第１図のＩＣケースの側
面図、第４図は第１図のリード端子に用いるリー
ド線の側面図である。１……ＤＩＰ―ＩＣ、２…
…ＤＩＰ―ＩＣ端子、３……リード端子、４……
エポキシモールドしたＤＩＰ部品、５……絶縁材
、６……接着剤、７……リード線、８……ソケツ
ト。
Fig. 1 is a plan view showing an IC case according to an embodiment of the present invention, Fig. 2 is a sectional view taken along line A-A in Fig. 1, and Fig. 3 is a plan view of the IC case of Fig. 1. FIG. 4 is a side view of a lead wire used in the lead terminal of FIG. 1. 1...DIP-IC, 2...
...DIP-IC terminal, 3... Lead terminal, 4...
Epoxy molded DIP parts, 5...insulating material, 6...adhesive, 7...lead wire, 8...socket.
Claims (1)
装置の表面を覆う絶縁性部材と、この絶縁性部材
の表面に露出しかつ前記集積回路装置のリードと
電気的に接続された外部端子と、前記絶縁性部材
の一主面に設けられた接着材とを備えていること
を特徴とするＩＣケース。 an insulating member covering the surface of the dual in-line package integrated circuit device; an external terminal exposed on the surface of the insulating member and electrically connected to a lead of the integrated circuit device; An IC case comprising an adhesive provided on one main surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16020385U JPS6268241U (en) | 1985-10-18 | 1985-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16020385U JPS6268241U (en) | 1985-10-18 | 1985-10-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6268241U true JPS6268241U (en) | 1987-04-28 |
Family
ID=31085361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16020385U Pending JPS6268241U (en) | 1985-10-18 | 1985-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6268241U (en) |
-
1985
- 1985-10-18 JP JP16020385U patent/JPS6268241U/ja active Pending