JPS5954946U - hybrid integrated circuit - Google Patents
hybrid integrated circuitInfo
- Publication number
- JPS5954946U JPS5954946U JP14925782U JP14925782U JPS5954946U JP S5954946 U JPS5954946 U JP S5954946U JP 14925782 U JP14925782 U JP 14925782U JP 14925782 U JP14925782 U JP 14925782U JP S5954946 U JPS5954946 U JP S5954946U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- board
- hybrid integrated
- bonded
- end surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１−図ａ、 ｂは本考案の実施例の組立時および完
成時の斜視図、第２図ａ、 ｂは第１図の混成集積回
路基板と金属薄板との接続部分を示す導体パターンの平
面図、第３図は第１図の実施例の実装時の断面図、第４
図は本考案の他の実施例の斜視図である。図において、
１・・・・・・混成集積回路基板、２・・・・・・金属
薄板、３・・・・・・リードフレーム、３′・・・・・
・端子、４・・・・・・基板裏面の導体パターン、５・
・・・・・樹脂コート材料、６・・・・・・基板表面に
ある発熱体の位置、７・・・・・・プリント板、８・・
・・・・シャーシ（接地板）、９・・・・・・ねじ、で
ある。1A and 1B are perspective views of the embodiment of the present invention when assembled and completed, and FIGS. 2A and 2B are diagrams of a conductor pattern showing the connecting portion between the hybrid integrated circuit board of FIG. 1 and the thin metal plate. A plan view, FIG. 3 is a sectional view when the embodiment of FIG. 1 is mounted, and FIG.
The figure is a perspective view of another embodiment of the present invention. In the figure, 1...hybrid integrated circuit board, 2...metal thin plate, 3...lead frame, 3'...
・Terminal, 4... Conductor pattern on the back of the board, 5.
...Resin coat material, 6...Position of heating element on board surface, 7...Printed board, 8...
... Chassis (ground plate), 9 ... Screws.
Claims (2)
を取付けた個所の裏面の一部分に形成した導電体パタ
ーンと接合され少くとも一端がその基板端面からはみ出
した放熱板となる金属薄板と、前記基板端面に接合され
た端子群とを含み、前記基板の両面が樹脂被覆されて構
成される混成集積回路。(1) Hybrid integrated circuit board and heat generating components on this board,
A thin metal plate that is bonded to a conductor pattern formed on a part of the back surface of the part where the board is attached and serves as a heat sink with at least one end protruding from the end surface of the board, and a group of terminals that are bonded to the end surface of the board; A hybrid integrated circuit consisting of both sides coated with resin.
新案登録請求の範囲第１項記載の混成集積回路。(2) The hybrid integrated circuit according to claim 1, wherein the metal thin plate is formed as a grounding terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14925782U JPS5954946U (en) | 1982-10-01 | 1982-10-01 | hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14925782U JPS5954946U (en) | 1982-10-01 | 1982-10-01 | hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5954946U true JPS5954946U (en) | 1984-04-10 |
Family
ID=30331375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14925782U Pending JPS5954946U (en) | 1982-10-01 | 1982-10-01 | hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5954946U (en) |
-
1982
- 1982-10-01 JP JP14925782U patent/JPS5954946U/en active Pending
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