JPS6380859U - - Google Patents
Info
- Publication number
- JPS6380859U JPS6380859U JP1986176217U JP17621786U JPS6380859U JP S6380859 U JPS6380859 U JP S6380859U JP 1986176217 U JP1986176217 U JP 1986176217U JP 17621786 U JP17621786 U JP 17621786U JP S6380859 U JPS6380859 U JP S6380859U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrates
- terminal end
- conductive
- sealing portion
- conductive path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
Description
第１図は本考案の混成集積回路を示す断面図、
第２図はその平面図、第３図は混成集積回路をプ
リント基板に挿入した際の断面図、第４図乃至第
９図は従来例を示す図である。
１，１′は金属基板、２はケース材、６はコネ
クタ部、３，３′は外部リード。
FIG. 1 is a cross-sectional view showing the hybrid integrated circuit of the present invention;
FIG. 2 is a plan view thereof, FIG. 3 is a sectional view when the hybrid integrated circuit is inserted into a printed circuit board, and FIGS. 4 to 9 are views showing conventional examples. 1 and 1' are metal substrates, 2 is a case material, 6 is a connector part, and 3 and 3' are external leads.
Claims (1)
られた絶縁膜と、該夫々の絶縁膜上に形成された
所望形状の導電路と、該導電路上に固着された複
数の回路素子と、前記導電路の延在される前記夫
々の金属基板の周端部に形成された複数の導電パ
ツドと、絶縁樹脂よりなり前記二枚の金属基板を
離間すると共に回路素子を囲む封止部と前記封止
部の略中間部より前記二枚の金属基板の端部より
突出するコネクタ部とを有するケース材と、前記
夫々の導電パツドに一端が固着され前記ケース材
のコネクタ部の両面に当接して該コネクタ部の終
端部まで延在され該終端部で交互に接続される外
部リードとを備えたことを特徴とする混成集積回
路。 Two metal substrates, an insulating film provided on the two metal substrates, a conductive path of a desired shape formed on each of the insulating films, and a plurality of circuit elements fixed on the conductive path. a plurality of conductive pads formed on the peripheral edge of each of the metal substrates where the conductive paths extend; and a sealing portion made of insulating resin that separates the two metal substrates and surrounds the circuit element. and a connector portion protruding from the ends of the two metal substrates from approximately the middle of the sealing portion; A hybrid integrated circuit comprising external leads that abut and extend to a terminal end of the connector portion and are alternately connected at the terminal end.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986176217U JPS6380859U (en) | 1986-11-17 | 1986-11-17 | |
| US07/107,990 US4884125A (en) | 1986-10-15 | 1987-10-13 | Hybrid integrated circuit device capable of being inserted into socket |
| DE8787114938T DE3777324D1 (en) | 1986-10-15 | 1987-10-13 | INTEGRATED HYBRID CIRCUIT ARRANGEMENT THAT CAN BE INSERTED INTO A BASE. |
| EP87114938A EP0264780B1 (en) | 1986-10-15 | 1987-10-13 | Hybrid integrated circuit device capable of being inserted into socket |
| KR1019870011409A KR900007232B1 (en) | 1986-10-15 | 1987-10-14 | Hybrid intergrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986176217U JPS6380859U (en) | 1986-11-17 | 1986-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6380859U true JPS6380859U (en) | 1988-05-27 |
Family
ID=31116251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986176217U Pending JPS6380859U (en) | 1986-10-15 | 1986-11-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6380859U (en) |
-
1986
- 1986-11-17 JP JP1986176217U patent/JPS6380859U/ja active Pending