JPH0715141Y2 - Hybrid integrated circuit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a hybrid integrated circuit, and more particularly to improvement of the outer shape of the hybrid integrated circuit that can be directly inserted into a socket.

(B) Conventional Technology Conventionally, a ceramic substrate or a metal substrate is used for a hybrid integrated circuit, but a metal substrate excellent in heat dissipation and mechanical strength is mainly used. In a hybrid integrated circuit using a metal substrate, as shown in FIG. 7 (see Japanese Utility Model Publication No. 52-3645), an aluminum substrate is used as a metal substrate (21) and its surface is anodized to form an aluminum oxide film (22). Then, an insulating layer (23) is formed on the aluminum oxide film (22) with a resin such as an epoxy resin. Further, a copper foil is attached onto the insulating layer (23) and etched so as to form a pattern having a desired shape, whereby a conductive path (24) is formed. A plurality of circuit elements (25) are formed on the conductive path (24), and the conductive path (24) is further formed.
External leads (26) are fixed at regular intervals on the pad at the tip end from which is extended.

When connecting such a hybrid integrated circuit to a printed circuit board, as shown in FIG. 8, the external leads (32) of the hybrid integrated circuit (31) are inserted into the holes (34) of the printed circuit board (33) and soldered. Or, as shown in FIG. 9 (see JP-A-59-92595 and JP-A-59-149082), the slits (42) provided in the printed board (41) are provided with the ceramic substrate (43). It is known to insert the following hybrid integrated circuit (44) and directly solder the board (43) and the printed board (41).

Further, FIG. 10 shows a hybrid integrated circuit to be inserted in a printed circuit board. Good conductive path (5
1) is formed and a circuit board (52) such as a power transistor, a resistor or a diode is provided in a conductive path (51) of the conductive board (53) and an insulating board, for example, a printed board. Conductive path (55) with a desired shape, like the first substrate (53)
And a second substrate (54) provided with large capacitors, resistors and the like, which are conventionally used as external parts, on the conductive path (55) of the substrate and the respective substrates (53) (54). ) Are brought into contact with each other and the pads provided at the ends of the contact surfaces of the substrates (53) and (54) are connected to each other by soldering using the metal leads (56), and the lid (57) is connected to the dotted line portion. The first and second substrates (53, 54) are integrated with each other by being fixed to a region surrounded by. At this time, as shown in FIG. 11, the lid body (57) fixes the periphery and three places of the first and second substrates (53, 54).

Such a technique is described in Japanese Patent Publication No. 57-45078.

(C) Problems to be Solved by the Invention However, the conventional hybrid integrated circuit has the following various problems. First, when inserting the metal board shown in FIG. 8 into the printed circuit board, many external leads with a width of about 2 mm are led out and deformed during transportation to allow automatic insertion into the printed circuit board by an automatic machine. There was no problem.

Next, in the structure shown in FIG. 9, the substrate itself also serves as a lead and the external lead is omitted. Therefore, even if the substrate to be inserted into the printed circuit board is an insulator, the above problems can be solved. However, when a metal substrate is used as a printed circuit board with slits, a gap is created between the metal substrate and the slits, and it is difficult to solder when connecting the respective electrodes, and the insulating film of the metal substrate is broken and the printed film is broken. There is a risk of short-circuiting with the electrodes of the substrate, and there is a problem that it cannot be used for high breakdown voltage and large current.

Next, in the integrated type of the metal substrate and the printed circuit board shown in FIG. 10, the above-mentioned problems can be solved because the portion where the printed circuit board is joined is the printed circuit board (insulator). However, such a hybrid integrated circuit formed by integrally forming a metal substrate and a printed circuit board has a problem that the mechanical strength is very weak because it is integrated only by the lid. Further, since the respective substrates are connected by the leads, there is a problem in workability or reliability of the connecting portion.

Furthermore, since the difference in the coefficient of thermal expansion from the printed circuit board integrated with the metal substrate is remarkably different, the printed circuit board has a problem that the joint portion of the distorted lead is peeled off.

(D) Means for Solving the Problems The present invention has been made in view of the above problems.
Of the connector part (6) extended from the sealing part (8) for sealing the circuit element (7) part of the case material (2) fixed to the metal substrate (1) and protruding from the end of the metal substrate (1) The external lead (3) is extended to contact with the anti-main surface to solve the conventional problems.

(E) Function According to the present invention, the external lead is supported by the connector part by abutting and extending the external lead to the anti-main surface of the connector part protruding from the end of the metal substrate from the case material. Deformation can be prevented. Further, by disposing the leads on both surfaces of the connector portion, it is possible to secure a large connection area with the electrodes of the socket when it is inserted into the socket.

(F) Examples The present invention will be described in detail below based on the examples shown in the drawings. 1 and 2 are a cross-sectional view and a plan view showing an embodiment of the hybrid integrated circuit of the present invention, showing a metal substrate (1) and
It is composed of a case material (2) and external leads (3).

An aluminum substrate is used as the metal substrate (1), and an aluminum oxide film is formed on the surface thereof by anodic oxidation.
An insulating film (4) is formed on the aluminum oxide film with a resin such as epoxy resin or polyimide resin. Further, a copper foil is stuck on the insulating film (4), and the copper foil is etched into a desired pattern to form a conductive path (5). The conductive path (5) extends in the direction of one side of the substrate (1), and a plurality of conductive pads to which the external leads (3) are fixed are formed at the tips of the conductive paths (5). Such conductive pads are formed in consideration of avoiding the corners of the substrate (1). That is, the external lead (3) is arranged on the connector portion (6) of the case material (2). A plurality of circuit elements (7) such as semiconductor integrated circuits, transistors, and chip parts are fixed on the conductive path (5).

The case material (2) is composed of a sealing portion (8) surrounding the circuit element (7) and a connector portion (6) supporting the external leads (3), and is injection-molded with an insulating resin, for example, FRPET (trade name). To be done.

The sealing portion (8) is formed in a box shape so as to fix the periphery of the metal substrate (1) excluding the pad to seal the circuit element (7), and the sealing portion (8) formed in the box shape. ), The connector portion (6) extending from the bottom portion and protruding from the end of the metal substrate (1) is formed. The connector portion (6) is formed so as to project from the end of the metal substrate (1), and external leads (3) led out from the metal substrate (1) are arranged in contact with both surfaces thereof.

Further, as is clear from FIG. 2, the connector portion (6) is formed narrower than the width of the sealing portion (8) for sealing the circuit element (7). At this time, the width of the connector portion (6) can be arbitrarily changed depending on the application. Further, the thickness of the connector portion (6) is formed to be the same as the thickness of the printed circuit board to be inserted or smaller by the thickness of the external lead (3).
Further, the stepped portion (9) in the width between the sealing portion (8) and the connector portion (6) serves as a stopper when it is inserted into the printed board.

The external lead (3) has one end connected to a conductive pad by solder or the like, and a connector protruding from the case material (2) from the board (1) when the metal board (1) and the case material (2) are fixed to each other. The part (6) is abutted and extended in the direction of the tip end, bent at the terminal end of the connector part (6), and abutted and extended to a substantially middle part of the anti-main surface. The metal substrate (1) and the case member (2) can be bonded and fixed to each other as long as they are adhesives, and a J sheet is used in this embodiment.

FIG. 3 is a cross-sectional view of the hybrid integrated circuit of the present invention inserted into a printed circuit board (10), in which a connector portion (6) of a case member (2) is inserted into an insertion hole of the printed circuit board (10). The electrodes (12) of the printed board (10) and the external leads (3) are connected by solder (13).

In this way, the connector part (6) in which the external lead (3) led out from the metal substrate (1) is projected from the case material (2)
The outer leads (3) are supported by the connector portion (6) and are not deformed by an external force by bringing them into contact with both surfaces of the printed circuit board, and automatic insertion into a printed circuit board using an automatic machine can be performed.

Further, the connector portion (6) and the printed circuit board (10) are both insulators, and the connection area of the external lead (3) is large, so that it can be used for large current.

Another embodiment is shown in FIGS. 4 and 5, FIG. 4 is a sectional view of the hybrid integrated circuit, FIG. 5 is a plan view of the case member (2), and this embodiment is a connector portion (6). The cutouts (11) are provided at the same pitch as the external leads (3) on both surfaces of the connector part (6) with which the external leads (3) extend and abut. By disposing the external lead (3) in the notch (11), the position of the external lead (3) is regulated by the notch (11), and the lead (3) can be prevented from being displaced.

Still another embodiment is shown in FIG. 6. This embodiment is an improvement of the connector portion (6), and is approximately the middle of the anti-main surface of the connector portion (6) with which the external lead (3) extends and contacts. The holes (14) are provided in the portion at the same pitch as the external leads (3). Its holes (14)
The same effect as described above can be obtained by bending and inserting the tips of the external leads (3) extending to the anti-main surface of the connector (6).

(G) Effect of the Invention As described above in detail, according to the present invention, the conventional hybrid integrated circuit is not inserted into the printed circuit board, but the connector portion is formed in the hybrid integrated circuit. This has the advantage that the printed circuit board and the printed circuit board are equalized and can be easily inserted. Further, since the external lead is supported by the connector portion, bending of the lead can be prevented and automatic insertion into a printed circuit board by an automatic machine can be performed.

Further, according to the present invention, since the metal substrate and the case material are integrated and the connector portion of the case material is inserted into the printed circuit board, the influence of distortion and the like due to thermal expansion can be completely ignored.

Further, in the present invention, since the metal substrate is not directly inserted into the socket but the connector portion of the case material is inserted, the insulating property is excellent and the connection area of the external lead is large, so that it is suitable for large currents.
It can be used for IC.

[Brief description of drawings]

1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a sectional view when a hybrid integrated circuit of the present embodiment is inserted into a printed circuit board, and FIGS. FIG. 6 is a diagram showing another embodiment, and FIGS. 7 to 11 are diagrams showing a conventional example. (1) is a metal substrate, (2) is a case material, (3) is an external lead, and (6) is a connector part.

Claims (1)

[Scope of utility model registration request] 1. A metal substrate, an insulating film provided on the metal substrate, and a conductive path having a desired shape formed on the insulating film.
A plurality of circuit elements fixed on the conductive path, a plurality of conductive pads formed at a peripheral edge of one side of the metal substrate on which the conductive path extends, and an insulating resin. A case member having a box-shaped sealing portion that is in contact with an edge and seals the circuit element, and a connector portion that projects from the end portion of the metal substrate from the sealing portion; and one end of the conductive pad. A hybrid integrated circuit, comprising: an external lead that is fixed and abuts on a main surface of the connector portion arranged on the side of the metal substrate and extends to an opposite main surface of the connector portion.