JPS6169847U - - Google Patents

Info

Publication number
JPS6169847U
JPS6169847U JP15482084U JP15482084U JPS6169847U JP S6169847 U JPS6169847 U JP S6169847U JP 15482084 U JP15482084 U JP 15482084U JP 15482084 U JP15482084 U JP 15482084U JP S6169847 U JPS6169847 U JP S6169847U
Authority
JP
Japan
Prior art keywords
insulating case
semiconductor device
terminal board
external terminal
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15482084U
Other languages
Japanese (ja)
Other versions
JPH0246058Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15482084U priority Critical patent/JPH0246058Y2/ja
Publication of JPS6169847U publication Critical patent/JPS6169847U/ja
Application granted granted Critical
Publication of JPH0246058Y2 publication Critical patent/JPH0246058Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、この考案の一実施例を示す複合半導
体装置の外観図、第2図はその横断面図、第3図
A,B,Cはそれぞれ外部回路の構成例を示す回
路図、第4図は従来の複合半導体装置の一例を示
す外観図、第5図はその縦断面図である。 図において、1は絶縁ケース、2は放熱板、5
は半導体ペレツト、10は外部端子板、13はポ
ケツト部である。
FIG. 1 is an external view of a composite semiconductor device showing an embodiment of this invention, FIG. 2 is a cross-sectional view thereof, FIGS. 3A, B, and C are circuit diagrams showing an example of the configuration of an external circuit, FIG. 4 is an external view showing an example of a conventional composite semiconductor device, and FIG. 5 is a longitudinal sectional view thereof. In the figure, 1 is an insulating case, 2 is a heat sink, and 5
1 is a semiconductor pellet, 10 is an external terminal board, and 13 is a pocket portion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁ケースと、このケースの底面に設けた放熱
板と、絶縁ケース内に封入した複数の半導体素子
と、この素子と電気的に接続され前記絶縁ケース
の表面に配置した複数の端子と、この端子間にま
たがり前記絶縁ケースの側面で所定回路を形成す
る外部端子板とを有する複合半導体装置において
、前記絶縁ケースの側面に少なくとも1つのポケ
ツト部を設け、このポケツト部に前記外部端子板
の一端を挿入したことを特徴とする複合半導体装
置。
An insulating case, a heat sink provided on the bottom of the case, a plurality of semiconductor elements sealed within the insulating case, a plurality of terminals electrically connected to the elements and arranged on the surface of the insulating case, and the terminals. In a composite semiconductor device having an external terminal board extending between the two and forming a predetermined circuit on a side surface of the insulating case, at least one pocket section is provided on the side surface of the insulating case, and one end of the external terminal board is attached to the pocket section. A composite semiconductor device characterized by being inserted.
JP15482084U 1984-10-12 1984-10-12 Expired JPH0246058Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15482084U JPH0246058Y2 (en) 1984-10-12 1984-10-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15482084U JPH0246058Y2 (en) 1984-10-12 1984-10-12

Publications (2)

Publication Number Publication Date
JPS6169847U true JPS6169847U (en) 1986-05-13
JPH0246058Y2 JPH0246058Y2 (en) 1990-12-05

Family

ID=30712815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15482084U Expired JPH0246058Y2 (en) 1984-10-12 1984-10-12

Country Status (1)

Country Link
JP (1) JPH0246058Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013102242A (en) * 2013-03-05 2013-05-23 Mitsubishi Electric Corp Power semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013102242A (en) * 2013-03-05 2013-05-23 Mitsubishi Electric Corp Power semiconductor device

Also Published As

Publication number Publication date
JPH0246058Y2 (en) 1990-12-05

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