JPS6219250U - - Google Patents
Info
- Publication number
- JPS6219250U JPS6219250U JP10995885U JP10995885U JPS6219250U JP S6219250 U JPS6219250 U JP S6219250U JP 10995885 U JP10995885 U JP 10995885U JP 10995885 U JP10995885 U JP 10995885U JP S6219250 U JPS6219250 U JP S6219250U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- metal base
- attached
- thermal head
- heating resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第1図は本考案のサーマルヘツドの一実施例を
示す一部切欠断面図、第2図はサーマルヘツドの
例を示す一部切欠斜視図、第3図は第2図の一部
切欠断面図である。
1は金属ベース、2はヘツド基板、2aは絶縁
基板、2bは発熱抵抗体、7は銅膜である。
Fig. 1 is a partially cutaway sectional view showing an embodiment of the thermal head of the present invention, Fig. 2 is a partially cutaway perspective view showing an example of the thermal head, and Fig. 3 is a partially cutaway sectional view of Fig. 2. It is. 1 is a metal base, 2 is a head substrate, 2a is an insulating substrate, 2b is a heating resistor, and 7 is a copper film.
Claims (1)
板を構成する金属ベースに取り付けたサーマルヘ
ツドに於いて、上記絶縁基板の上記金属ベースへ
の取付け面に、上記絶縁基板よりも熱導伝性の良
い材料を被着したことを特徴とするサーマルヘツ
ド。 In a thermal head in which an insulating substrate with a heating resistor on its surface is attached to a metal base constituting a heat sink, the surface of the insulating substrate that is attached to the metal base has a thermal conductivity higher than that of the insulating substrate. A thermal head characterized by being coated with a material of good quality.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10995885U JPS6219250U (en) | 1985-07-18 | 1985-07-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10995885U JPS6219250U (en) | 1985-07-18 | 1985-07-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6219250U true JPS6219250U (en) | 1987-02-05 |
Family
ID=30988543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10995885U Pending JPS6219250U (en) | 1985-07-18 | 1985-07-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6219250U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03184876A (en) * | 1989-12-15 | 1991-08-12 | Sharp Corp | Thermal head |
JP2009166267A (en) * | 2008-01-11 | 2009-07-30 | Toshiba Hokuto Electronics Corp | Thermal print head |
-
1985
- 1985-07-18 JP JP10995885U patent/JPS6219250U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03184876A (en) * | 1989-12-15 | 1991-08-12 | Sharp Corp | Thermal head |
JP2009166267A (en) * | 2008-01-11 | 2009-07-30 | Toshiba Hokuto Electronics Corp | Thermal print head |
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