KR100626845B1 - Manufacturing method of radiant heat circuit board - Google Patents

Abstract

According to the present invention, a substrate stacking step of forming a substrate by sequentially stacking a lower metal film, an insulating layer and an upper metal film; A space forming step of forming a space where components are to be mounted by removing the upper metal film and the insulating layer from the substrate formed in the substrate stacking step; And a press working step of pressing an upper portion of a space in which the component formed in the space forming step is to be mounted. According to the disclosed method of manufacturing a heat dissipation circuit board, the heat dissipation function of the heat dissipation circuit board is remarkably improved by directly mounting the heat generating parts on the lower metal film to directly transfer heat generated from the heat generating parts to the lower metal film without being blocked by the insulating layer. To improve. In addition, if the mold is designed according to the designer's purpose during press processing, not only the high brightness LED chip can be mounted but also the condensation shape formed through the press work improves the concentration of light.

Heat Sink, Heat Sink, HCM

Description

Manufacturing method of radiant heat circuit board

1 is a cross-sectional view showing a conventional heat radiation circuit board,

2 is a flowchart sequentially illustrating a manufacturing process of a heat dissipation circuit board according to an exemplary embodiment of the present invention;

3A through 3E are cross-sectional views sequentially illustrating a manufacturing process of the heat dissipation circuit board shown in FIG.

4A to 4C are cross-sectional views sequentially illustrating a manufacturing process of a heat dissipation circuit board according to another embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

300,400 ... heat-dissipating circuit board 310,410 ... lower metal film

315,335,415,435 ... rough treatment 320,420 ... insulating layer

330,430 Top metal film 340,440 Space for components

350,450 ... parts 360,460 ... lower part of lower metal film

The present invention relates to a method for manufacturing a heat dissipation circuit board, and more particularly, to a method for manufacturing a heat dissipation circuit board for improving the efficiency of heat dissipation used in automobiles, electrical and electronic components and the like.

Generally, a printed circuit board (PCB) is a circuit line pattern formed of a conductive material such as copper on an electrically insulating substrate, and refers to a substrate immediately before mounting an electronic component.

Such a PCB is equipped with a heating device such as a semiconductor device and a light emitting diode (LED), in particular, the device such as a light emitting diode emits a serious heat.

Therefore, when heat is not processed in the circuit board on which the heating element is mounted as described above, the temperature of the circuit board on which the heating element is mounted is increased to cause the inoperability and malfunction of the heating element, as well as to reduce the reliability of the product. In order to solve the heat generation problem as described above, various heat dissipation structures are conventionally employed.

1 is a cross-sectional view showing a conventional heat dissipation circuit board.

As illustrated, the conventional heat dissipation circuit board 100 sequentially deposits the lower copper foil 110, the insulating layer 120, and the upper copper foil 130, and forms a circuit pattern on the upper copper foil 130.

Next, the electronic component 140 is mounted on the upper copper foil 130 on which the circuit pattern is formed.

However, the conventional heat dissipation circuit board 100 as described above transfers heat emitted from the mounted electronic component 140 to the lower metal film 110 used for heat dissipation due to the interference of the insulating layer 120. You won't be. Therefore, there is a risk that the electronic component 140 may malfunction as well as the defective circuit board may not be manufactured because the heat cannot be efficiently released.

In addition, when the electronic component 140 that emits light, such as a light emitting diode, is mounted, light generated from the electronic component 140 may not be efficiently reflected from the heat dissipation circuit board 100, and a part of the light may be absorbed, thereby concentrating the light. Will fall.

In addition, when the thickness of the copper foils 110 and 130 becomes thicker than a predetermined thickness, there is a problem in that the reliability is lowered in the deposition on the copper foils 110 and 130 and the insulating layer 120.

The present invention was created to solve the above-mentioned problems, and more particularly, it is possible to solve the heat dissipation problem by efficiently dissipating heat generated from electronic components, and to mount electronic components emitting light such as light emitting diodes. In the case of the present invention relates to a method for manufacturing a heat dissipation circuit board having an improved structure to improve the concentration of light.

Another technical problem to be achieved by the present invention is to provide a heat dissipation circuit board, which is manufactured by the method for manufacturing the heat dissipation circuit board.

Other objects and advantages of the invention will be described below and will be appreciated by the embodiments of the invention. In addition, the objects and advantages of the present invention can be realized by means and combinations indicated in the claims.

According to an aspect of the present invention, there is provided a method of manufacturing a heat dissipation circuit board, comprising: a substrate stacking step of sequentially stacking a lower metal layer, an insulating layer, and an upper metal layer to form a substrate; A space forming step of forming a space in which a component is mounted by removing the upper metal film and the insulating layer from the substrate formed in the substrate stacking step; And a press working step of pressing an upper portion of the space in which the component formed in the space forming step is to be mounted.

Further, in the substrate stacking step, the lower metal film or the upper metal film is preferably laminated with the insulating layer by roughening the surface.

In addition, in the substrate stacking step, the lower metal film or the upper metal film is preferably laminated with the insulating layer by a hot press pressure bonding method.

On the other hand, it is preferable to further include a lower metal film removing step of removing the lower portion of the lower metal film by a predetermined depth corresponding to the space in which the component formed in the space forming step is to be mounted.

On the other hand, the space in which the component is to be mounted is preferably formed larger than the area of the surface on which the component is mounted.

In addition, the space in which the component is to be mounted is preferably equal to the area of the surface on which the component is mounted.

In addition, the lower metal film and the upper metal film may be removed through an etching or etching process, and the insulating layer may be removed using a drill or a laser.

On the other hand, in the press working step, it is preferable that the inner surface of the space where the upper part is to be mounted is plated for light reflection.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Prior to this, terms or words used in the present specification and claims should not be construed as being limited to the common or dictionary meanings, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiments of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

2 is a flow chart sequentially showing a manufacturing process of the heat radiation circuit board according to a preferred embodiment of the present invention, Figures 3a to 3e is a cross-sectional view sequentially showing the manufacturing process of the heat radiation circuit board shown in FIG.

As shown in FIG. 2, the method of manufacturing a heat dissipation circuit board 300 according to an exemplary embodiment of the present invention includes a substrate stacking step S200, a space forming step S210, a lower metal film removing step S220, and a press. It includes a machining step (S230).

First, referring to FIGS. 3A to 3E, the substrate 300 is formed by sequentially laminating the lower metal layer 310, the insulating layer 320, and the upper metal layer 330 (S200). The lower metal film 310 and the upper metal film 330 are preferably made of copper, and may be manufactured using other aluminum or alloys thereof.

In this case, the lower metal film 310 or the upper metal film 330 is subjected to rough treatments 315 and 335 in order to make a close connection to the portion adjacent to the insulating layer 320. Here, a fine nodule is formed on the surfaces of the metal films 310 and 330 which have undergone the rough treatments 315 and 335. The nodule holds the insulating layer 320 when the nodule is bonded to the insulating layer 320 at high temperature and high pressure instead of an adhesive. The ring role (anchor) to improve the adhesion.

After the rough treatments 315 and 335 are performed, the lower metal layer 310 and the upper metal layer 330 are laminated with the insulating layer 320 by hot pressing.

According to the configuration of the present invention, the lower metal film 310 and the upper metal film 330 are not limited in thickness, and form a circuit pattern so as to properly dissipate heat according to the component 350. You can set the thickness.

Next, the upper metal layer 330 and the insulating layer 320 are removed from the substrate formed in the substrate stacking step S200 to form a space 340 in which the component 350 is to be mounted (S210).

The lower metal layer 310 and the upper metal layer 330 may be removed through an etching or etching process, and the insulating layer 320 may be removed using a drill, but is not limited thereto. Ultraviolet) or CO ₂ (Carbon dioxide) lasers can be used for removal.

Then, the lower portion 360 of the lower metal layer 310 is removed by a predetermined depth corresponding to the space 340 in which the component 350 formed in the space forming step S210 is to be mounted (S220). Here, the predetermined depth means a reference value that is set to prevent the metal film from being pushed when the upper part of the space where the component is to be mounted is processed by a press, and the heat resistance and the flexibility of the heat radiating circuit board, and the degree of heat radiating circuit board The reference value is determined according to the thickness and the like.

Meanwhile, the space 340 on which the component 350 is to be mounted is preferably formed to be larger than the area of the surface on which the component 350 is to be mounted, and wire bonding or electrodes of the component 350 may be formed on the substrate 300. It is connected to the surface of the upper metal film 330 that is the upper.

Next, the upper portion of the space 340 on which the component 350 formed in the space forming step S210 is to be mounted is pressed (S230). The press processed substrate has a substantially concave shape and directly mounts the component 350 on the lower metal layer 310 without blocking the heat generated by the component 350 by the insulating layer 320. Direct delivery to the lower metal film 310.

In addition, the inner surface of the space 340 in which the upper part pressed part 350 is to be mounted in the press working step S230 is plated for light reflection to improve the concentration of light.

4A to 4C are cross-sectional views sequentially illustrating a manufacturing process of a heat dissipation circuit board according to another embodiment of the present invention.

As shown, after rough treatment 415 and 435 on the substrate 400 on which the lower metal film 410, the insulating layer 420, and the upper metal film 430 are sequentially deposited, the upper metal film 430 ) And the insulating layer 420 are removed to form a space 440 on which the component 450 is to be mounted. Here, the space 440 on which the component 450 is to be mounted is preferably formed to have the same area as the surface on which the component 450 is mounted.

Then, the lower portion 460 of the lower metal layer 410 is removed by a predetermined depth corresponding to the space 440 in which the formed component 450 is to be mounted. Here, the predetermined depth means a reference value that is set to prevent the metal film from being pushed when the upper part of the space where the component is to be mounted is processed by a press, and the heat resistance and the flexibility of the heat radiating circuit board, and the degree of heat radiating circuit board The reference value is determined according to the thickness and the like.

Next, the upper portion of the space 440 on which the component 450 is to be mounted is pressed. The substrate subjected to the press working as described above has a substantially concave shape, and the heat generated from the component 450 is directly transferred by the insulating layer 420 by directly mounting the component 450 on the lower metal film 410. Direct transfer to the lower metal film 410 without blocking heat.

As shown in FIG. 4C, since the upper metal layer 430 and the insulating layer 420 remain on the inner surface of the space 440 in which the component 450 is to be mounted, wire bonding or an electrode of the component 450 may be performed. The component 450 is connected to the inner surface of the space 440 to be mounted, which makes it easier to achieve miniaturization of the component.

In addition, the inner surface of the space 440 in which the upper part of the space in which the component is mounted is to be mounted is mounted is preferably plated for light reflection, and the upper surface in which the component 450 in which the upper part is to be mounted is mounted. The inner surface of the 440 is plated for light reflection to improve the concentration of light.

On the other hand, the present invention is also possible a heat dissipation circuit board, characterized in that the manufacturing method of the heat dissipation circuit board.

As described above, although the present invention has been described by means of a limited embodiment and drawings, the present invention is not limited thereto and is described below by the person skilled in the art to which the present invention pertains. Various modifications and variations are possible without departing from the scope of the appended claims.

According to the present invention, a method of manufacturing a heat dissipation circuit board is a heat dissipation function of a heat dissipation circuit board since the heat generating parts are directly mounted on the lower metal film to directly transfer heat generated from the heat generating parts to the lower metal film without being blocked by the insulating layer. Significantly improves.

In addition, after the roughening treatment is performed on the surface of the lower metal film or the upper metal film, the lamination is performed by the insulating layer and the hot press, so that the thick metal can be laminated without being limited by the thickness of the lower metal film or the upper metal film.

In addition, if the mold is designed according to the designer's purpose during the press work, not only the high brightness LED chip can be mounted but also the concave shape formed through the press work improves the light concentration.

In addition, there is an advantage that can contribute to the miniaturization of the parts do not require a separate heat sink.

Claims (9)

A substrate stacking step of forming a substrate by sequentially stacking a lower metal film, an insulating layer, and an upper metal film; A space forming step of forming a space in which a component is mounted by removing the upper metal film and the insulating layer from the substrate formed in the substrate stacking step; A lower metal film removing step of removing a lower portion of the lower metal film to a predetermined depth in consideration of heat resistance, flexibility, and thickness of the heat dissipation circuit board in correspondence to a space in which the component formed in the space forming step is to be mounted; And And a press working step of pressing an upper portion of the space in which the component formed in the space forming step is to be mounted, In the substrate stacking step, And the lower metal film or the upper metal film is roughened on a surface thereof and laminated with the insulating layer. delete The method of claim 1, wherein in the substrate stacking step, The lower metal film or the upper metal film is laminated with the insulating layer by a hot press pressure bonding method. delete The method of claim 1, And a space in which the component is to be mounted is larger than an area of a surface on which the component is mounted. The method of claim 1, And a space in which the component is to be mounted is equal to the area of a surface on which the component is mounted. The method of claim 1, The lower metal film and the upper metal film are removed through an etching or etching process, And the insulating layer is removed using a drill or a laser. According to claim 1, In the press working step, The inner surface of the space in which the upper part is to be mounted is plated for light reflection, characterized in that the heat treatment circuit board manufacturing method. A heat dissipation circuit board manufactured by the method for producing a heat dissipation circuit board according to any one of claims 1, 3, and 5 to 8.

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