KR101097997B1 - Printed circuit board on which mounting led and manufacturing mothod thereof - Google Patents

Printed circuit board on which mounting led and manufacturing mothod thereof Download PDF

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Publication number
KR101097997B1
KR101097997B1 KR1020110072925A KR20110072925A KR101097997B1 KR 101097997 B1 KR101097997 B1 KR 101097997B1 KR 1020110072925 A KR1020110072925 A KR 1020110072925A KR 20110072925 A KR20110072925 A KR 20110072925A KR 101097997 B1 KR101097997 B1 KR 101097997B1
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South Korea
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metal substrate
light emitting
emitting device
printed circuit
circuit board
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KR1020110072925A
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Korean (ko)
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안복만
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안복만
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE: A printed circuit board on which a light emitting device is mounted and a manufacturing method thereof are provided to maximize a light reflection rate, thereby drastically increasing the brightness of the light emitting device. CONSTITUTION: The top or the top and bottom of a first metal board(10) are inclined. A second metal board(20) is bonded with the first metal board. Router processing is performed on the top of the second metal board to expose the inclined surface of the first metal board with regard to a light emitting device mounting location of the second metal board. A cavity(21) is formed after a groove is formed. The light emitting device is mounted on the inclined surface.

Description

발광소자 실장용 인쇄회로기판 및 이의 제조방법{Printed circuit board on which mounting LED and manufacturing mothod thereof}Printed circuit board on which mounting LED and manufacturing mothod

본 발명은 발광소자 실장용 인쇄회로기판에 관한 것으로서, 보다 자세하게는 LED와 같은 발광소자를 경면(鏡面)상에 실장함으로써 빛의 반사율을 극대화하여 발광소자의 휘도와 에너지효율을 높일 수 있도록 구성된 발광소자 실장용 인쇄회로기판에 관한 것이다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board for mounting a light emitting device, and more particularly, a light emitting device configured to mount a light emitting device such as an LED on a mirror surface to maximize the reflectance of light to increase the brightness and energy efficiency of the light emitting device. A printed circuit board for device mounting.

LED의 기술적 발전에 따라 그 적용분야가 빠르게 확대되고 있으며, 전구를 사용하는 일반 조명등 또한 LED가 대체하고 있는 추세이다.Due to the technological development of LED, its field of application is expanding rapidly, and LED is also being replaced by general lighting lamps.

LED와 같은 발광소자를 이용하기 위해서는 LED가 실장 되는 인쇄회로기판이 필요한바, 종래의 발광소자 실장용 인쇄회로기판을 살펴보면, 알루미늄이나 구리와 같은 금속을 이용한 2개의 금속기판을 접합하고 상부에 회로를 구성한다.In order to use a light emitting device such as an LED, a printed circuit board on which an LED is mounted is required. Looking at a conventional printed circuit board for mounting a light emitting device, two metal substrates using a metal such as aluminum or copper are bonded and a circuit is formed on the top. Configure

상기 2개의 금속기판은 하부에 위치하는 제1금속기판과 상부에 위치하는 제2금속기판으로서, 상기 제1금속기판은 알루미늄이나 구리를 이용하고, 상기 제2금속기판은 구리를 이용하는 것이 일반적이다.The two metal substrates are a first metal substrate located below and a second metal substrate located above, wherein the first metal substrate uses aluminum or copper, and the second metal substrate uses copper. .

상기 2개의 금속기판은 열전도성 절연체를 개재하여 접합하며, 제2금속기판에 대한 회로구성 및 솔더 마스킹 작업 후 전해 은도금 작업을 거쳐 발광소자를 실장하고 인캡 방식으로 커버 한다.The two metal substrates are bonded to each other via a thermally conductive insulator, and the light emitting device is mounted and encapsulated after electrolytic silver plating after a circuit configuration and solder masking work for the second metal substrate.

그러나 상기 은도금에 의한 빛의 반사율은 미미하여 종래 구조의 패키지는 발광소자의 휘도 향상에 도움을 주지 못하기 때문에, 발광소자 실장용 인쇄회로기판에서 발광소자가 실장 되는 후면의 반사효율을 높일 수 있는 방법이 절실히 요구되는 실정이다.However, since the reflectance of the light by the silver plating is insignificant, the package of the conventional structure does not help to improve the brightness of the light emitting device, so that the reflection efficiency of the rear surface on which the light emitting device is mounted in the light emitting device mounting printed circuit board can be improved. This situation is desperately needed.

본 발명은 종래 발광소자 실장용 인쇄회로기판의 반사효율을 높일 수 있도록 경면(鏡面)을 이용한 발광소자 실장용 인쇄회로기판 및 이의 제조방법을 제공하고자 한다.The present invention is to provide a light emitting device mounting printed circuit board using a mirror surface and a manufacturing method thereof to increase the reflection efficiency of the conventional light emitting device mounting printed circuit board.

본 발명은 하부의 제1금속기판과 상부의 제2금속기판이 접합하고 상기 제2금속기판상에 발광소자를 실장 하기 위한 회로를 구성하여서 되는 발광소자 실장용 인쇄회로기판에 있어서, 상기 제1금속기판은 상부 또는 상하부가 경면(鏡面)으로 처리되어 있고, 상기 제2금속기판은 발광소자를 실장 할 지점에서 상기 제1금속기판이 위치하는 지점까지 캐비티(Cavity)가 형성되어 상기 제1금속기판의 경면이 외부에 노출되며, 상기 발광소자는 상기 노출된 경면 상에 실장되고 커버링 됨으로써, 상기 경면을 통해 발광소자의 반사율을 극대화할 수 있도록 구성된 것을 특징으로 하는 발광소자 실장용 인쇄회로기판을 제공한다.The present invention relates to a printed circuit board for mounting a light emitting device, wherein the first metal substrate and the second metal substrate are bonded to each other, and a circuit for mounting a light emitting device on the second metal substrate is provided. The upper or upper portion of the substrate is treated with a mirror surface, and the second metal substrate has a cavity formed from a point at which the light emitting device is to be mounted to a point at which the first metal substrate is located, thereby forming the first metal substrate. The mirror surface of is exposed to the outside, the light emitting device is mounted on the exposed mirror surface, thereby providing a light emitting device mounting printed circuit board, characterized in that configured to maximize the reflectance of the light emitting device through the mirror surface. do.

본 발명의 다른 특징에 의하면, 하부의 제1금속기판과 상부의 제2금속기판이 접합하고 상기 제2금속기판상에 발광소자를 실장 하기 위한 회로를 구성하여서 되는 발광소자 실장용 인쇄회로기판의 제조방법에 있어서, 상기 제1금속기판의 상부 또는 상하부가 경면(鏡面)으로 처리되는 단계; 상기 제2금속기판을 상기 제1금속기판 상에 접합하는 단계; 상기 제2금속기판 상에 회로를 구성하는 단계; 상기 제2금속기판 상에 솔더 마스킹 하는 단계; 상기 제2금속기판 상의 발광소자 실장 위치에 대하여 상기 제1금속기판의 경면이 노출되도록 캐비티를 형성하는 단계; 상기 캐비티 위치에서 상기 경면 상에 발광소자를 실장하고 커버링하는 단계;를 포함하여, 상기 경면을 통해 발광소자의 반사율을 극대화할 수 있도록 구성된 것을 특징으로 하는 발광소자 실장용 인쇄회로기판의 제조방법을 제공한다.According to another feature of the present invention, a printed circuit board for manufacturing a light emitting device mounting is constructed by forming a circuit for joining a lower first metal substrate and an upper second metal substrate to mount a light emitting device on the second metal substrate. A method, comprising: treating a top or a bottom of a surface of the first metal substrate with a mirror surface; Bonding the second metal substrate onto the first metal substrate; Constructing a circuit on the second metal substrate; Solder masking on the second metal substrate; Forming a cavity such that a mirror surface of the first metal substrate is exposed with respect to a light emitting device mounting position on the second metal substrate; And mounting and covering the light emitting device on the mirror surface at the cavity position, wherein the manufacturing method of the printed circuit board for light emitting device mounting is configured to maximize the reflectance of the light emitting device through the mirror surface. to provide.

이때, 상기 제2금속기판 하부에 프리프레그층이 형성된 경우 상기 프리프레그층 하부의 캐비티가 형성될 지점에 대하여 라우터 가공을 선행하고, 상기 제1금속기판 상에 제2금속기판을 접합하는 방법을 제공한다.In this case, when a prepreg layer is formed under the second metal substrate, a router process is performed at a point where a cavity under the prepreg layer is to be formed, and a method of bonding the second metal substrate on the first metal substrate is described. to provide.

본 발명에 따르면 발광소자가 경면 상에 직접 실장되므로, 광반사율을 극대화할 수 있어 발광소자의 휘도를 크게 향상시킬 수 있다.According to the present invention, since the light emitting device is directly mounted on a mirror surface, the light reflectance can be maximized, thereby greatly improving the brightness of the light emitting device.

도 1은 본 발명에 따른 인쇄회로기판의 단면 구성도이다.
도 2는 본 발명에 따른 인쇄회로기판의 제조공정에 따른 변화과정을 도시한 도면이다.
도 3은 본 발명에 따른 인쇄회로기판 제조공정 중 제2금속기판의 다른 실시예에 따른 변화과정을 도시한 것이다.1 is a cross-sectional view of a printed circuit board according to the present invention.
2 is a view illustrating a change process according to a manufacturing process of a printed circuit board according to the present invention.
3 is a view illustrating a change process according to another embodiment of a second metal substrate during a printed circuit board manufacturing process according to the present invention.

이하, 도면을 이용하여 본 발명의 기술적 특징을 상세히 설명한다.Hereinafter, the technical features of the present invention will be described in detail with reference to the drawings.

본 발명은 종래의 발광소자 실장용 인쇄회로기판을 전제로 하부의 제1금속기판표면을 거울로 만드는 경면(鏡面)처리 작업을 통해 거울의 반사 효과를 제공하는 것을 기술적 특징으로 하며, 이를 위해서 상부의 제2금속기판에 대한 캐비티(Cavity) 가공 등에 대한 기타 기술적 특징을 함께 제공한다.The present invention is characterized in that it provides a reflection effect of the mirror through a mirror surface treatment operation to make the surface of the first metal substrate of the lower surface on the premise of a conventional printed circuit board for mounting a light emitting device. It also provides other technical features, such as cavity (cavity) processing of the second metal substrate.

하부의 제1금속기판(10)은 알루미늄이나 구리 소재가, 상부의 제2금속기판(20)은 구리 소재가 바람직하고, 상기 양 기판은 열전도성 절연체, 프리프레그 또는 수퍼본드 등의 접합층(12)을 개재시켜 접합하고 상부에 회로층(22)을 형성한다.Preferably, the lower first metal substrate 10 is made of aluminum or copper, and the upper second metal substrate 20 is made of copper, and both substrates are formed of a bonding layer such as a thermally conductive insulator, a prepreg or a superbond. 12) is interposed and the circuit layer 22 is formed on the top.

이때, 상기 금속기판은 필요에 따라 다른 소재의 레이어와 일체를 이루어 공급될 수 있는바, 상기 제2금속기판은 프리프레그(미도시)가 하부에 결합한 형태일 수 있다.In this case, the metal substrate may be supplied integrally with a layer of another material, if necessary, the second metal substrate may have a form in which a prepreg (not shown) is coupled to the bottom.

본 발명에 따른 인쇄회로기판은 도 1에 도시된 바와 같이, 상기 제1금속기판(10)은 상부 또는 상하부가 경면(鏡面)(11)으로 처리되어 있고, 상기 제2금속기판(20)은 발광소자를 실장 할 지점에서 상기 제1금속기판(10)이 위치하는 지점까지 캐비티(Cavity)(21)가 형성되어 상기 제1금속기판(10)의 경면(11)이 상기 캐비티(21)를 통해 외부에 노출된다.In the printed circuit board according to the present invention, as shown in FIG. 1, the first metal substrate 10 has a top or bottom portion treated with a mirror surface 11, and the second metal substrate 20 is A cavity 21 is formed from a point at which the light emitting device is to be mounted to a point at which the first metal substrate 10 is located, so that the mirror surface 11 of the first metal substrate 10 is disposed in the cavity 21. Exposed to the outside through.

상기 캐비티 형성은 라우터 가공, 캐비티 가공 방법과 같은 종래의 다양한 기술이 활용될 수 있으며, 본 발명은 그 가공기술에 제한을 두지 아니한다.The cavity can be formed using a variety of conventional techniques, such as router processing, cavity processing method, the present invention is not limited to the processing technology.

LED와 같은 발광소자는 상기 제2금속기판(20)의 캐비티(21)를 통해 노출된 경면(11) 상에 실장(와이어 본딩) 되고, 해당 캐비티(21)가 실리콘과 같은 보호물질로 충진 됨으로써 발광소자가 커버 되고 패키징 작업은 완료된다. A light emitting device such as an LED is mounted (wire bonded) on a mirror surface 11 exposed through the cavity 21 of the second metal substrate 20, and the cavity 21 is filled with a protective material such as silicon. The light emitting element is covered and the packaging operation is completed.

이와 같은 구조에서는 형성된 캐비티를 메우거나, 발광소자를 커버하는 실리콘 등의 보호물질 충진용 댐을 형성하여 커버링 작업을 할 수 있으며, 상기 경면을 통해 발광소자의 반사율을 극대화할 수 있어 발광소자의 휘도와 에너지 효율을 높이는 데에 현저한 효과를 제공한다.In this structure, covering can be performed by filling the formed cavity or by forming a dam for filling a protective material such as silicon to cover the light emitting device, and the reflectance of the light emitting device can be maximized through the mirror surface. And a significant effect on increasing energy efficiency.

도 2 및 도 3은 본 발명에 따른 인쇄회로기판의 제조공정에 대한 것으로서, 하부의 제1금속기판과 상부의 제2금속기판을 구비하는, 발광소자 실장용 인쇄회로기판의 제조공정을 전제로 한다.2 and 3 are for the manufacturing process of the printed circuit board according to the present invention, on the premise of the manufacturing process of a printed circuit board for mounting a light emitting device having a lower first metal substrate and an upper second metal substrate do.

구비된 제1금속기판의 상부 또는 상하부를 경면(鏡面)으로 처리하는 단계(s100);가 진행되어야 하는데, 경면처리기술 자체에 본 발명의 특징이 있는 것은 아니므로 경면 처리는 화학적 처리 또는 연마 가공과 같은 종래기술 및 예측 가능한 기술에 의하며, 경면을 형성할 수 있는 방법이 무엇이든 본 발명을 위해 적용 가능하다.The step (s100) of treating the upper or upper portion of the provided first metal substrate with a mirror surface (s100); should proceed, the mirror surface treatment technology itself is not characterized by the present invention, the mirror surface treatment is chemical treatment or polishing process By conventional and predictable techniques such as, any method that can form a mirror surface is applicable for the present invention.

이와 같이, 제1금속기판의 적어도 상부에 경면을 형성한 다음에는, 준비된 제2금속기판을 상기 제1금속기판 상에 접합하는 단계(s200)가 수행된다.As such, after the mirror surface is formed on at least an upper portion of the first metal substrate, a step (s200) of joining the prepared second metal substrate onto the first metal substrate is performed.

단, 상기 접합공정에 앞서서, 발광소자 실장 위치에 대하여 좌표를 이용하여 캐비티 가공을 할 수 있으며, 특히, 제2금속기판의 하부에 프리프레그와 같은 추가 결합층이 있는 경우에는 도 3과 같이 상기 프리프레그층의 하부에 대해서 라우터 (Router)가공을 성행한 후 접합공정을 수행할 수 있다. However, prior to the bonding process, the cavity can be processed using the coordinates with respect to the mounting position of the light emitting device, and in particular, when there is an additional bonding layer such as a prepreg in the lower portion of the second metal substrate, as shown in FIG. The bonding process may be performed after router processing is performed on the lower part of the prepreg layer.

다음으로 상기 제1금속기판과 열정도성 절연체 등으로 접합한 상기 제2금속기판 상에 회로를 구성하고, 솔더 마스킹 하는 단계(s300)는 종래 기술과 동일하다.Next, the step (s300) of constructing a circuit on the second metal substrate bonded to the first metal substrate and the conductive insulator or the like and solder masking is the same as in the related art.

캐비티 형성단계(s400)는 상기 제2금속기판 상의 발광소자 실장 위치에 대하여 상기 제1금속기판의 경면이 노출되도록 홈을 가공을 하는 것으로서, 제2금속기판에서 제1금속기판의 경면에 이르는 깊이만큼 홈을 형성하고 제2금속기판에서 상기 경면이 보일 수 있도록 한다.The cavity forming step (s400) is to process the groove so that the mirror surface of the first metal substrate is exposed to the mounting position of the light emitting device on the second metal substrate, the depth from the second metal substrate to the mirror surface of the first metal substrate The groove is formed as much as possible so that the mirror surface can be seen from the second metal substrate.

앞서 설명한 바와 같이, 제2금속기판에 추가 레이어가 있는 경우에는 상기 캐비티는 상기 s200단계에서 부분적으로 라우터 가공을 선행하고 상기 캐비티 형성단계(s400)에서는 나머지 부분에 대하여 라우터 가공을 통해 캐비티를 형성하는 것이 바람직하다.As described above, when there is an additional layer on the second metal substrate, the cavity is partially preceded by the router processing in step s200 and in the cavity forming step (s400), the cavity is formed through router processing on the remaining part. It is preferable.

마지막으로서 상기 캐비티 위치에서 상기 경면 상에 발광소자를 실장(와이어 본딩)하고 상기 캐비티를 메우는 커버링하는 단계(s500);를 수행한다.Finally, mounting (wire bonding) a light emitting device on the mirror surface at the cavity position and covering the cavity (s500).

10 : 제1금속기판 11 : 경면
12 : 접합층 20 : 제2금속기판
21 : 캐비티 22 : 회로층 10: first metal substrate 11: mirror surface
12: bonding layer 20: second metal substrate
21: cavity 22: circuit layer

Claims (3)

삭제delete 삭제delete 알루미늄 또는 구리 소재인 하부의 제1금속기판과 구리 소재인 상부의 제2금속기판이 접합하고 상기 제2금속기판상에 발광소자를 실장 하기 위한 회로를 구성하여서 되는 발광소자 실장용 인쇄회로기판의 제조방법에 있어서,
상기 제1금속기판의 상부 또는 상하부를 경면(鏡面)화하여 거울의 반사효과를 제공하도록 구성하는 단계;
상기 제2금속기판 하부에 형성된 프리프레그층 하부의 캐비티가 형성될 지점에 대하여 라우터 가공을 선행하고, 상기 제1금속기판 상에 제2금속기판을 접합하는 단계;
상기 제2금속기판 상에 회로를 구성하는 단계;
상기 제2금속기판 상에 솔더 마스킹 하는 단계;
상기 제2금속기판 상의 발광소자 실장 위치에 대하여 상기 제1금속기판의 경면이 노출되도록 제2금속기판 윗부분을 라우터 가공하고, 상기 제2금속기판에서 상기 제1금속기판의 경면에 이르는 깊이만큼 홈을 형성하고 상기 제2금속기판에서 상기 경면이 보일 수 있도록 하는 캐비티를 형성하는 단계;
상기 경면 상에 발광소자를 실장하고 커버링하는 단계;를 포함하여,
경면(거울)을 통한 반사효과를 이용하도록 구성된 것을 특징으로 하는 발광소자 실장용 인쇄회로기판의 제조방법.


Fabrication of a printed circuit board for light emitting device mounting comprising a circuit for joining a lower first metal substrate made of aluminum or copper to a second metal substrate made of copper and mounting a light emitting device on the second metal substrate. In the method,
Mirroring the upper or upper portion of the first metal substrate to provide a reflection effect of the mirror;
Bonding a second metal substrate on the first metal substrate and performing a router process on a point where a cavity under the prepreg layer formed below the second metal substrate is to be formed;
Constructing a circuit on the second metal substrate;
Solder masking on the second metal substrate;
The upper portion of the second metal substrate is router-processed so that the mirror surface of the first metal substrate is exposed to the mounting position of the light emitting device on the second metal substrate, and the groove is formed to have a depth from the second metal substrate to the mirror surface of the first metal substrate. Forming a cavity to allow the mirror surface to be visible on the second metal substrate;
Mounting and covering the light emitting device on the mirror surface;
A manufacturing method of a printed circuit board for mounting a light emitting device, characterized in that configured to use a reflection effect through a mirror (mirror).


KR1020110072925A 2011-07-22 2011-07-22 Printed circuit board on which mounting led and manufacturing mothod thereof KR101097997B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101166561B1 (en) 2012-02-16 2012-07-19 안창규 Printed circuit board on which mounting led manufacturing method and printed circuit board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100626845B1 (en) 2006-03-13 2006-09-20 이이근 Manufacturing method of radiant heat circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100626845B1 (en) 2006-03-13 2006-09-20 이이근 Manufacturing method of radiant heat circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101166561B1 (en) 2012-02-16 2012-07-19 안창규 Printed circuit board on which mounting led manufacturing method and printed circuit board

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