CN207399605U - A kind of circuit board of high impedance - Google Patents
A kind of circuit board of high impedance Download PDFInfo
- Publication number
- CN207399605U CN207399605U CN201721159692.XU CN201721159692U CN207399605U CN 207399605 U CN207399605 U CN 207399605U CN 201721159692 U CN201721159692 U CN 201721159692U CN 207399605 U CN207399605 U CN 207399605U
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- Prior art keywords
- circuit board
- layer
- board body
- close
- electronic component
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a kind of circuit boards of high impedance,Including circuit board body,The upper surface of the circuit board body is provided with electronic component,The top of the circuit board body is provided with protective plate,Filament circle is provided on the inside of the protective plate,The inside of the circuit board body is provided with signals layer close to the one side of electronic component,The inside of the circuit board body is provided with protective layer close to the one side of signals layer,The inside of the circuit board body is provided with silk-screen layer close to the one side of protective layer,The inside of the circuit board body is provided with interior layer close to the one side of silk-screen layer,The inside of the circuit board body is provided with radiating and cooling dope layer close to the one side of circuit board main stor(e)y,Radiating and cooling dope layer effectively reduces the temperature of circuit board,Reduce electronic component spoilage to a greater extent,Reduce maintenance cost and use cost,Filament circle can effectively enhance the impedance of circuit board,Reduce the spoilage of the circuit on circuit board.
Description
Technical field
The utility model belongs to circuit board technology field, and in particular to a kind of circuit board of high impedance.
Background technology
The title of circuit board has：Ceramic circuit board, aluminium oxide ceramics circuit board, aluminium nitride ceramics circuit board, wiring board,
Pcb board, aluminum substrate, high frequency plate, thick copper coin, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board print (copper lithographic technique)
Circuit board etc..Circuit board makes circuit miniaturization, directly perceivedization, batch production and optimization electrical appliance layout lifting for permanent circuit
It acts on.Circuit board can be described as printed wiring board or printed circuit board (PCB), and (it is soft that FPC wiring boards are also known as flexible circuit board to FPC wiring boards
Property circuit board be using polyimides or polyester film be a kind of made of base material there is height reliability, excellent flexible printing
Circuit board.Have the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good！) and Rigid Flex-FPC and PCB birth
Raw and development has expedited the emergence of Rigid Flex this new product.Therefore, Rigid Flex is exactly flexible circuit board and rigid circuit
Plate by processes such as pressings, is combined by related process requirement, the circuit with FPC characteristics and PCB characteristics of formation
Plate.
Existing circuit board during use can run into circuit board overheat, cause capacitance, resistance, electricity sometimes
Sense, diode, triode, field-effect etc. go wrong, and the electronic component surface for having apparent damage, which has, more significantly to be burnt
Trace, it is necessary to which repair can just make circuit board normal use, like this just waste time and cost, and the low-resistance of circuit board
It is anti-to cause circuit that can not work or the problem of job insecurity, therefore it is proposed that a kind of circuit board of high impedance.
Utility model content
It is existing to solve to propose in above-mentioned background technology the purpose of this utility model is to provide a kind of circuit board of high impedance
Some circuit boards, can be run into sometimes during use circuit board overheat, cause capacitance, resistance, inductance, diode,
Triode, field-effect etc. go wrong, and the electronic component surface for having apparent damage, which has, more significantly burns trace, it is necessary to tie up
Circuit board normal use can just be made by repairing, and like this just waste time and cost, and the Low ESR of circuit board can cause electricity
Road can not work or the problem of job insecurity.
To achieve the above object, the utility model provides following technical solution：A kind of circuit board of high impedance, including circuit
Plate body, the upper surface of the circuit board body are provided with electronic component, and the top of the circuit board body is provided with protective plate, described anti-
Filament circle is provided on the inside of backplate, the inside of the circuit board body is provided with signals layer close to the one side of electronic component, described
The inside of circuit board body is provided with protective layer close to the one side of signals layer, and the inside of the circuit board body is close to the one side of protective layer
Be provided with silk-screen layer, the inside of the circuit board body is provided with interior layer close to the one side of silk-screen layer, the circuit board body it is interior
Portion is provided with circuit board main stor(e)y close to the one side of interior layer, and the inside of the circuit board body is set close to the one side of circuit board main stor(e)y
There is radiating and cooling dope layer.
Preferably, the protective plate is fixedly connected with circuit board body by welding manner.
Preferably, the electronic component is fixedly connected with circuit board body by the scolding tin of thawing.
Preferably, the protective plate is fixedly connected by the scolding tin of thawing with filament circle.
Preferably, the interior layer is fixedly connected with circuit board main stor(e)y by welding manner.
Compared with prior art, the beneficial effects of the utility model are：The utility model is scientific and reasonable for structure, safe to use
Convenient, radiating and cooling dope layer effectively reduces the temperature of circuit board, reduces electronic component spoilage to a greater extent, reduces
Maintenance cost and use cost, filament circle can effectively enhance the impedance of circuit board, reduce circuit on circuit board
Spoilage.
Description of the drawings
Fig. 1 is the structure diagram of the utility model；
Fig. 2 is the circuit board working surfaces structure diagram of the utility model；
Fig. 3 is the board structure of circuit schematic diagram of the utility model；
In figure：1- electronic components, 2- circuit board bodies, 3- signals layers, 4- protective layers, 5- silk-screen layers, 6- interior layers, 7- circuits
Plate main stor(e)y, 8- radiating and coolings dope layer, 9- protective plates, 10- filament circles.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained shall fall within the protection scope of the present invention.
It please refers to Fig.1, Fig. 2 and Fig. 3, the utility model provide a kind of technical solution：A kind of circuit board of high impedance, including
Circuit board body 2, the upper surface of circuit board body 2 are provided with electronic component 1, and the top of circuit board body 2 is provided with protective plate 9, protection
The inside of plate 9 is provided with filament circle 10, and the inside of circuit board body 2 is provided with signals layer 3, circuit close to the one side of electronic component 1
The inside of plate body 2 is provided with protective layer 4 close to the one side of signals layer 3, and the inside of circuit board body 2 is set close to the one side of protective layer 4
Silk-screen layer 5 is equipped with, the inside of circuit board body 2 is provided with interior layer 6 close to the one side of silk-screen layer 5, and the inside of circuit board body 2 is close
The one side of interior layer 6 is provided with circuit board main stor(e)y 7, and the inside of circuit board body 2 is provided with heat dissipation close to the one side of circuit board main stor(e)y 7
High tailored coating layer 8.
In order to which the connection between protective plate 9 and circuit board body 2 is more stablized, in the present embodiment, it is preferred that protective plate 9
It is fixedly connected with circuit board body 2 by welding manner.
In order to which the connection between electronic component 1 and circuit board body 2 is more stablized and does not influence the use of electronic component 1, this
In embodiment, it is preferred that electronic component 1 is fixedly connected with circuit board body 2 by the scolding tin of thawing.
The use of electronic component 1 is not influenced for the stable connection of protective plate 9 and filament circle 10 and, it is excellent in the present embodiment
Choosing, protective plate 9 is fixedly connected by the scolding tin of thawing with filament circle 10.
More stablize for the connection of interior layer 6 and circuit board main stor(e)y 7, in the present embodiment, it is preferred that interior layer 6 and electricity
Road plate main stor(e)y 7 is fixedly connected by welding manner.
The working lining of circuit board body 2 in the utility model is divided into：Signals layer 3 is mainly used to place component or wiring；
Protective layer 4 is mainly used to ensure to be not required tin plating place not tin plating on circuit board, so as to ensure the reliable of circuit board operation
Property；Silk-screen layer 5 is mainly used to stamp the serial number of component, production number, Business Name etc. on circuit boards；Interior layer 6 is led
It is used as signal wiring layer；Wherein other layers 7 mainly include bore direction layer, forbid wiring layer, drilling drawing layer and more
Layer is mainly used for the position to drill on printed circuit board (PCB), the electrical frame of protracting circuit plate, setting borehole shape and setting respectively
Multiaspect layer；Radiating and cooling dope layer 8 has high thermoconductivity and larger cooling surface area, while in comparatively wide wave-length coverage
Interior (1-20 μm) have high radiant rate, can significantly improve including conduction, convection current, heat loss through radiation comprehensive performance.
The operation principle and process for using of the utility model：The circuit board is to isolate cleaved surface copper using plate based insulation material
Paper tinsel conductive layer so that electric current flows completion in various components along pre-designed route and such as does work, amplifies, declining
The functions such as subtract, modulate, demodulating, encoding.In the production process, radiating and cooling dope layer 8 can be coated onto to 2 bottom of circuit board ma,
So when circuit board works, the hot heat that generates heat of circuit board ma 2 can pass to radiating and cooling dope layer 8, realize
The effect of cooling, the filament circle 10 of 9 inside of protective plate on circuit board ma 2 can effectively increase the impedance of circuit board.
While there has been shown and described that the embodiment of the utility model, for the ordinary skill in the art,
It is appreciated that in the case where not departing from the principle of the utility model and spirit can these embodiments be carried out with a variety of variations, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of circuit board of high impedance, including circuit board body (2), it is characterised in that：The upper surface of the circuit board body (2) is set
Electronic component (1) is equipped with, the top of the circuit board body (2) is provided with protective plate (9), and the inside of the protective plate (9) is set
There is filament circle (10), the inside of the circuit board body (2) is provided with signals layer (3), the electricity close to the one side of electronic component (1)
The inside of road plate body (2) is provided with protective layer (4) close to the one side of signals layer (3), and the inside of the circuit board body (2) is close to anti-
The one side of sheath (4) is provided with silk-screen layer (5), in the inside of the circuit board body (2) is provided with close to the one side of silk-screen layer (5)
Portion's layer (6), the inside of the circuit board body (2) is provided with circuit board main stor(e)y (7), the circuit close to the one side of interior layer (6)
The inside of plate body (2) is provided with radiating and cooling dope layer (8) close to the one side of circuit board main stor(e)y (7).
2. a kind of circuit board of high impedance according to claim 1, it is characterised in that：The protective plate (9) and circuit board
Body (2) is fixedly connected by welding manner.
3. a kind of circuit board of high impedance according to claim 1, it is characterised in that：The electronic component (1) and circuit
Plate body (2) is fixedly connected by the scolding tin of thawing.
4. a kind of circuit board of high impedance according to claim 1, it is characterised in that：The protective plate (9) passes through thawing
Scolding tin be fixedly connected with filament circle (10).
5. a kind of circuit board of high impedance according to claim 1, it is characterised in that：The interior layer (6) and circuit board
Main stor(e)y (7) is fixedly connected by welding manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721159692.XU CN207399605U (en) | 2017-09-11 | 2017-09-11 | A kind of circuit board of high impedance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721159692.XU CN207399605U (en) | 2017-09-11 | 2017-09-11 | A kind of circuit board of high impedance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207399605U true CN207399605U (en) | 2018-05-22 |
Family
ID=62417247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721159692.XU Expired - Fee Related CN207399605U (en) | 2017-09-11 | 2017-09-11 | A kind of circuit board of high impedance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207399605U (en) |
-
2017
- 2017-09-11 CN CN201721159692.XU patent/CN207399605U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180522 Termination date: 20200911 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |