CN206350228U - A kind of printed circuit board (PCB) of the blind buried via hole of high-accuracy band - Google Patents
A kind of printed circuit board (PCB) of the blind buried via hole of high-accuracy band Download PDFInfo
- Publication number
- CN206350228U CN206350228U CN201720027985.6U CN201720027985U CN206350228U CN 206350228 U CN206350228 U CN 206350228U CN 201720027985 U CN201720027985 U CN 201720027985U CN 206350228 U CN206350228 U CN 206350228U
- Authority
- CN
- China
- Prior art keywords
- channel plates
- circuit board
- blind
- pcb
- layer sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model is related to a kind of printed circuit board (PCB) of the blind buried via hole of high-accuracy band, including multi-layer sheet, the first channel plates, the second channel plates, pin interface, cover copper vias and blind hole, multiple-plate two sides is equipped with pin interface, the first channel plates are fixedly mounted in multiple-plate surface crown, the second channel plates are fixedly mounted in multiple-plate surface bottom portion, the copper vias that covers is through multi-layer sheet, and multiple-plate top and multiple-plate bottom are equipped with blind hole.The printed circuit board (PCB) of the high-accuracy blind buried via hole of band; by filling heat conductive silica gel in the inside for covering the inside of copper vias and blind hole; sealing protection is carried out to covering copper vias and blind hole with this; and heat transfer work is convenient for, and the heat transfer efficiency for the printed circuit board (PCB) for being respectively mounted the first channel plates and the second channel plates progress heat transfer in multiple-plate both sides and improving the high-accuracy blind buried via hole of band.
Description
Technical field
The utility model is related to circuit board apparatus technical field, specially a kind of printed circuit of the blind buried via hole of high-accuracy band
Plate.
Background technology
Blind buried via hole technology is an important technical characteristic of multilayer circuit board, and the structure of blind buried via hole completes different circuits
Connection work between layer, greatly improves the usable floor area of circuit board with this, but the blind hole of multilayer circuit board and through hole
All it is an exposure in air, this causes dust and steam all to enter in blind hole and through hole, not only causes blind hole and through hole
The interior copper that covers is oxidized damage, it is easier to directly affect the impedance value of blind hole and through hole, thus the stabilization that influence circuit board is used
Property.
Utility model content
The purpose of this utility model, which is that, provides a kind of simple in construction, reasonable in design one in order to solve the above problems
Plant the printed circuit board (PCB) of the high-accuracy blind buried via hole of band.
The utility model is achieved through the following technical solutions above-mentioned purpose：
A kind of printed circuit board (PCB) of the blind buried via hole of high-accuracy band, including multi-layer sheet, the first channel plates, the second channel plates,
Pin interface, cover copper vias and blind hole, multiple-plate two sides is equipped with pin interface, and multiple-plate surface crown is consolidated
Dingan County fills the first channel plates, and the second channel plates are fixedly mounted in multiple-plate surface bottom portion, and the copper vias that covers runs through
Multi-layer sheet, multiple-plate top and multiple-plate bottom are equipped with blind hole.
As further prioritization scheme of the present utility model, first channel plates and the second channel plates are oxidation
Beryllium ceramic circuit-board.
As further prioritization scheme of the present utility model, the inside of the inside for covering copper vias and blind hole is filled with
Heat conductive silica gel.
The beneficial effects of the utility model are：
The utility model is simple in construction, reasonable in design, by filling heat conduction in the inside for covering the inside of copper vias and blind hole
Silica gel, carries out sealing protection, so that the copper that covers for ensureing to cover in copper vias and blind hole is difficult by oxygen with this to covering copper vias and blind hole
Change and damage, and ensure to cover the impedance value stabilization in copper vias and blind hole, and ensure the stability that circuit board is used, while just
In progress heat transfer work, and the first channel plates and the second channel plates and heat conductive silica gel are respectively mounted in multiple-plate both sides
Contact, carries out heat transfer and improves the heat transfer efficiency of the printed circuit board (PCB) of the high-accuracy blind buried via hole of band, and the first channel plates
Cut with the second channel plates according to multiple-plate structure, it is ensured that pin interface is exposed in atmosphere, for follow-up prototype
Part welding job.
Brief description of the drawings
Fig. 1 is axonometric drawing of the present utility model；
Fig. 2 is sectional view of the present utility model.
In figure：Copper vias is covered in 1 multi-layer sheet, 2 first channel plates, 3 second channel plates, 4 pin interfaces, 5.
Embodiment
The utility model is described in further detail below in conjunction with the accompanying drawings：
As shown in Figure 1 and Figure 2, a kind of printed circuit board (PCB) of the blind buried via hole of high-accuracy band, including multi-layer sheet 1, the first channel plates
2nd, the second channel plates 3, pin interface 4, cover copper vias 5 and blind hole 6, the two sides of the multi-layer sheet 1 is equipped with pin interface 4,
The first channel plates 2 are fixedly mounted in the surface crown of the multi-layer sheet 1, and the surface bottom portion of the multi-layer sheet 1 is fixedly mounted second
Channel plates 3, the copper vias 5 that covers is through multi-layer sheet 1, and the top of the multi-layer sheet 1 and the bottom of multi-layer sheet 1 are equipped with blind hole
6.The channel plates 3 of first channel plates 2 and second are beryllium oxide ceramics wiring board, and beryllium oxide ceramics wiring board is a kind of
The high wiring board of heat conductivility, quick heat conduction work can be carried out with this to multi-layer sheet 1.The inside for covering copper vias 5
Heat conductive silica gel is filled with the inside of blind hole 6.
The utility model is simple in construction, reasonable in design, is led by being filled in the inside for covering the inside of copper vias 5 and blind hole 6
Hot silica gel, carries out sealing protection to covering copper vias 5 and blind hole 6 with this, copper is covered not so as to ensure to cover in copper vias 5 and blind hole 6
Easily it is oxidized and damages, and ensure to cover the impedance value stabilization in copper vias 5 and blind hole 6, and ensures the stabilization that circuit board is used
Property, while heat transfer work is convenient for, and it is irregular to be respectively mounted in the both sides of multi-layer sheet 1 first channel plates 2 and second
Plate 3 is contacted with heat conductive silica gel, is carried out heat transfer and is improved the heat transfer efficiency of the printed circuit board (PCB) of the high-accuracy blind buried via hole of band, and
First channel plates 2 and the second channel plates 3 are cut according to the structure of multi-layer sheet 1, it is ensured that pin interface 4 is exposed to air
In, for follow-up prototype part welding job.
General principle of the present utility model, principal character and advantage has been shown and described above.The technical staff of the industry
It should be appreciated that the utility model is not restricted to the described embodiments, the simply explanation described in above-described embodiment and specification is originally
The principle of utility model, on the premise of the utility model spirit and scope are not departed from, the utility model also has various change
And improvement, these changes and improvements are both fallen within the range of claimed the utility model.Scope is claimed in the utility model
Defined by appended claims and its effect thing.
Claims (3)
1. a kind of printed circuit board (PCB) of the blind buried via hole of high-accuracy band, it is characterised in that：Including multi-layer sheet（1）, the first channel plates
（2）, the second channel plates（3）, pin interface（4）, cover copper vias（5）And blind hole（6）, the multi-layer sheet（1）Two sides be all provided with
There is pin interface（4）, the multi-layer sheet（1）Surface crown be fixedly mounted the first channel plates（2）, the multi-layer sheet（1）'s
The second channel plates are fixedly mounted in surface bottom portion（3）, it is described to cover copper vias（5）Through multi-layer sheet（1）, the multi-layer sheet（1）'s
Top and multi-layer sheet（1）Bottom be equipped with blind hole（6）.
2. a kind of printed circuit board (PCB) of high-accuracy blind buried via hole of band according to claim 1, it is characterised in that：Described first is not
Regular plate（2）With the second channel plates（3）It is beryllium oxide ceramics wiring board.
3. a kind of printed circuit board (PCB) of high-accuracy blind buried via hole of band according to claim 1, it is characterised in that：The copper that covers leads to
Hole（5）Inside and blind hole（6）Inside be filled with heat conductive silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720027985.6U CN206350228U (en) | 2017-01-11 | 2017-01-11 | A kind of printed circuit board (PCB) of the blind buried via hole of high-accuracy band |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720027985.6U CN206350228U (en) | 2017-01-11 | 2017-01-11 | A kind of printed circuit board (PCB) of the blind buried via hole of high-accuracy band |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206350228U true CN206350228U (en) | 2017-07-21 |
Family
ID=59324555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720027985.6U Expired - Fee Related CN206350228U (en) | 2017-01-11 | 2017-01-11 | A kind of printed circuit board (PCB) of the blind buried via hole of high-accuracy band |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206350228U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110779105A (en) * | 2019-10-22 | 2020-02-11 | 四川长虹空调有限公司 | Waterproof assembly process for electric control box |
-
2017
- 2017-01-11 CN CN201720027985.6U patent/CN206350228U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110779105A (en) * | 2019-10-22 | 2020-02-11 | 四川长虹空调有限公司 | Waterproof assembly process for electric control box |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170721 Termination date: 20200111 |