CN206350229U - A kind of super-thick copper printed circuit board - Google Patents
A kind of super-thick copper printed circuit board Download PDFInfo
- Publication number
- CN206350229U CN206350229U CN201720028037.4U CN201720028037U CN206350229U CN 206350229 U CN206350229 U CN 206350229U CN 201720028037 U CN201720028037 U CN 201720028037U CN 206350229 U CN206350229 U CN 206350229U
- Authority
- CN
- China
- Prior art keywords
- thick copper
- super
- polytetrafluoroethylene
- ptfe
- solder mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model is related to a kind of super-thick copper printed circuit board, including super thick copper base, silica gel sheath, heat-conducting glue layer, polytetrafluoroethylene (PTFE) circuit plate, solder mask layer, aluminium nitride protective layer and blind hole.The super-thick copper printed circuit board, supporting plate is used as by super thick copper base, it can greatly improve the heat conductivility of the super-thick copper printed circuit board, use polytetrafluoroethylene (PTFE) circuit plate, in the surface smear solder mask layer of polytetrafluoroethylene (PTFE) circuit plate, and aluminium nitride protective layer is installed at the top of solder mask layer, solder mask layer is protected, avoid damaging polytetrafluoroethylene (PTFE) circuit plate after solder mask layer is scratched in the welding process of large-scale original paper, and silica gel sheath is installed at the top of super thick copper base, pass through edge of the silica gel sheath to polytetrafluoroethylene (PTFE) circuit plate, the edge of solder mask layer and the edge of aluminium nitride protective layer are protected, heat transfer work is convenient for simultaneously.
Description
Technical field
The utility model is related to circuit board apparatus technical field, specially a kind of super-thick copper printed circuit board.
Background technology
The copper printed circuit board that thickness is larger is needed to use on the control terminal of some big machineries, it is ensured that the capacity of heat transmission
And robustness, traditional ultrathin circuit board can not meet use requirement, easily in the welding process damage of Large components, and
The enabling capabilities to large-scale original paper can not be ensured, traditional circuit board easily causes the situation that plate face is damaged in use, and shadow
Sound is used.
Utility model content
The purpose of this utility model, which is that, provides a kind of simple in construction, reasonable in design one in order to solve the above problems
Plant super-thick copper printed circuit board.
The utility model is achieved through the following technical solutions above-mentioned purpose：
A kind of super-thick copper printed circuit board, including super thick copper base, silica gel sheath, heat-conducting glue layer, polytetrafluoroethylene (PTFE) circuit plate,
Solder mask layer, aluminium nitride protective layer and blind hole, the surface crown of the super thick copper base is fixedly connected with heat-conducting glue layer, described to lead
The top edge of hot glue layer is fixedly connected with silica gel sheath, and the inside top of the silica gel sheath is provided with aluminium nitride protective layer, the nitridation
The bottom of aluminium protective layer is provided with solder mask layer, and the bottom of the solder mask layer is provided with polytetrafluoroethylene (PTFE) circuit plate, described poly-
Tetrafluoroethene wiring board is fixedly connected by heat-conducting glue layer with super thick copper base, the side distribution of the aluminium nitride protective layer
There is blind hole, the blind hole sequentially passes through aluminium nitride protective layer and solder mask layer and connect with the wiring of polytetrafluoroethylene (PTFE) circuit plate
Touch.
As further prioritization scheme of the present utility model, four turnings of the super thick copper base are equipped with bolt hole.
The beneficial effects of the utility model are：
The utility model is simple in construction, reasonable in design, and supporting plate is used as by super thick copper base, can greatly improve this and surpasses
The heat conductivility of thick copper printed circuit board, using polytetrafluoroethylene (PTFE) circuit plate, hinders in the surface smear of polytetrafluoroethylene (PTFE) circuit plate
Solder paste layer of ink, carries out anti-oxidation protection to polytetrafluoroethylene (PTFE) circuit plate, and install aluminium nitride at the top of solder mask layer with this
Protective layer, is protected to solder mask layer, it is to avoid damaged after solder mask layer is scratched in the welding process of large-scale original paper
Silica gel sheath is installed to polytetrafluoroethylene (PTFE) circuit plate, and at the top of super thick copper base, by silica gel sheath to polytetrafluoroethylene wire
The edge at the edge of road plate, the edge of solder mask floor and aluminium nitride protective layer is protected, while being convenient for heat transfer
Work.
Brief description of the drawings
Fig. 1 is axonometric drawing of the present utility model；
Fig. 2 is profile of the present utility model.
In figure：1 super thick copper base, 2 bolts hole, 3 silica gel sheaths, 4 heat-conducting glue layers, 5 polytetrafluoroethylene (PTFE) circuit plates, 6 welding resistances oil
Layer of ink, 7 aluminium nitride protective layers, 8 blind holes.
Embodiment
The utility model is described in further detail below in conjunction with the accompanying drawings：
As shown in Figure 1 and Figure 2, a kind of super-thick copper printed circuit board, including super thick copper base 1, silica gel sheath 3, heat-conducting glue layer 4,
Polytetrafluoroethylene (PTFE) circuit plate 5, solder mask layer 6, aluminium nitride protective layer 7 and blind hole 8, the surface crown of the super thick copper base 1
Heat-conducting glue layer 4 is fixedly connected with, the top edge of the heat-conducting glue layer 4 is fixedly connected with silica gel sheath 3, the medial roof of the silica gel sheath 3
Portion is provided with aluminium nitride protective layer 7, and the bottom of the aluminium nitride protective layer 7 is provided with solder mask layer 6, the solder mask layer 6
Bottom is provided with polytetrafluoroethylene (PTFE) circuit plate 5, and the polytetrafluoroethylene (PTFE) circuit plate 5 is carried out by heat-conducting glue layer 4 with super thick copper base 1
It is fixedly connected, blind hole 8 is distributed with the side of the aluminium nitride protective layer 7, and the blind hole 8 sequentially passes through the He of aluminium nitride protective layer 7
Solder mask layer 6 and with the wiring contact of polytetrafluoroethylene (PTFE) circuit plate 5.Four turnings of the super thick copper base 1 are equipped with spiral shell
Keyhole 2, by bolt hole 2, is easy to that installment work is fixed to super thick copper base 1.
The utility model is simple in construction, reasonable in design, is used as supporting plate by super thick copper base 1, can greatly improve this
The heat conductivility of super-thick copper printed circuit board, using polytetrafluoroethylene (PTFE) circuit plate 5, is applied on the surface of polytetrafluoroethylene (PTFE) circuit plate 5
Solder mask layer 6 is smeared, anti-oxidation protection is carried out to polytetrafluoroethylene (PTFE) circuit plate 5 with this, and install at the top of solder mask layer 6
Aluminium nitride protective layer 7, is protected to solder mask layer 6, it is to avoid scrape solder mask layer 6 in the welding process of large-scale original paper
Damage polytetrafluoroethylene (PTFE) circuit plate 5 after spending, and silica gel sheath 3 is installed at the top of super thick copper base 1, by 3 pairs of silica gel sheath
Edge, solder mask 6 edge of layer and the edge of aluminium nitride protective layer 7 of polytetrafluoroethylene (PTFE) circuit plate 5 are protected, simultaneously
Heat transfer work is convenient for, ensures the normal work of the super-thick copper printed circuit board with this.
General principle of the present utility model, principal character and advantage has been shown and described above.The technical staff of the industry
It should be appreciated that the utility model is not restricted to the described embodiments, the simply explanation described in above-described embodiment and specification is originally
The principle of utility model, on the premise of the utility model spirit and scope are not departed from, the utility model also has various change
And improvement, these changes and improvements are both fallen within the range of claimed the utility model.Scope is claimed in the utility model
Defined by appended claims and its effect thing.
Claims (2)
1. a kind of super-thick copper printed circuit board, it is characterised in that：Including super thick copper base（1）, silica gel sheath（3）, heat-conducting glue layer
（4）, polytetrafluoroethylene (PTFE) circuit plate（5）, solder mask layer（6）, aluminium nitride protective layer（7）And blind hole（8）, the super thick copper base
（1）Surface crown be fixedly connected with heat-conducting glue layer（4）, the heat-conducting glue layer（4）Top edge be fixedly connected with silica gel sheath（3）,
The silica gel sheath（3）Inside top be provided with aluminium nitride protective layer（7）, the aluminium nitride protective layer（7）Bottom be provided with welding resistance
Ink layer（6）, the solder mask layer（6）Bottom be provided with polytetrafluoroethylene (PTFE) circuit plate（5）, the polytetrafluoroethylene (PTFE) circuit plate
（5）Pass through heat-conducting glue layer（4）With super thick copper base（1）It is fixedly connected, the aluminium nitride protective layer（7）Side be distributed with
Blind hole（8）, the blind hole（8）Sequentially pass through aluminium nitride protective layer（7）With solder mask layer（6）And with polytetrafluoroethylene (PTFE) circuit plate
（5）Wiring contact.
2. a kind of super-thick copper printed circuit board according to claim 1, it is characterised in that：The super thick copper base（1）'s
Four turnings are equipped with bolt hole（2）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720028037.4U CN206350229U (en) | 2017-01-11 | 2017-01-11 | A kind of super-thick copper printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720028037.4U CN206350229U (en) | 2017-01-11 | 2017-01-11 | A kind of super-thick copper printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206350229U true CN206350229U (en) | 2017-07-21 |
Family
ID=59324536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720028037.4U Expired - Fee Related CN206350229U (en) | 2017-01-11 | 2017-01-11 | A kind of super-thick copper printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206350229U (en) |
-
2017
- 2017-01-11 CN CN201720028037.4U patent/CN206350229U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206575657U (en) | Water proof type prints pcb board | |
| CN205071462U (en) | Multilayer circuit board heat conduction radiation structure | |
| CN206350229U (en) | A kind of super-thick copper printed circuit board | |
| CN103987211B (en) | A kind of high-efficiency heat-radiating aluminum plate based on increase aluminium base face and preparation method thereof | |
| CN208104280U (en) | A kind of new and effective property heat conducting film | |
| CN203618272U (en) | Novel thermal insulating structure | |
| CN108174577A (en) | A kind of environmental protection equipment double-row heat dissipation device | |
| CN207652771U (en) | A kind of LED circuit board of electrical equipment | |
| CN206895117U (en) | A kind of high-efficiency radiator of Communication Equipment | |
| CN206118265U (en) | Radiating structure for electronic equipment | |
| CN108901173A (en) | A kind of environmental protection equipment double-row heat dissipation device | |
| CN209731701U (en) | A kind of bent aluminum substrate | |
| CN208424910U (en) | A kind of high thermal conductivity printed circuit board | |
| CN208156594U (en) | A kind of computer circuit board of included heat sinking function | |
| CN207171352U (en) | A kind of LED aluminum base plate welds location structure | |
| CN206851133U (en) | A kind of novel corrosion resistant multilayer circuit board | |
| CN206350228U (en) | A kind of printed circuit board (PCB) of the blind buried via hole of high-accuracy band | |
| CN203435219U (en) | Novel circuit board | |
| CN208300108U (en) | A kind of accurate printed wiring board | |
| CN206251432U (en) | A kind of high efficiency and heat radiation FPC | |
| CN207474866U (en) | A kind of exchange composite bus bar | |
| CN206674295U (en) | A kind of Low ESR multilayer circuit board | |
| CN206807852U (en) | A kind of novel fire resistant double-sided PCB | |
| CN209640843U (en) | A kind of plate turns the High-speed I/O transmission device of FFC rotating plate again | |
| CN205179511U (en) | Power electronic component circuit board of high heat dissipating ability |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170721 Termination date: 20200111 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |