CN206674295U - A kind of Low ESR multilayer circuit board - Google Patents
A kind of Low ESR multilayer circuit board Download PDFInfo
- Publication number
- CN206674295U CN206674295U CN201720275839.5U CN201720275839U CN206674295U CN 206674295 U CN206674295 U CN 206674295U CN 201720275839 U CN201720275839 U CN 201720275839U CN 206674295 U CN206674295 U CN 206674295U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- multilayer circuit
- line plate
- unit line
- low esr
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a kind of Low ESR multilayer circuit board, including multilayer circuit board body, the multilayer circuit board body includes several unit line plate bodies, the unit line plate body includes individual layer wiring board and green oil structure sheaf, the individual layer wiring board is located inside green oil structure sheaf, the edge of the unit line plate body is provided with rim area, the multilayer circuit board body is provided with mounting hole, the mounting hole bottom is provided with mounting post, and heat sink strip is also uniformly provided with the multilayer circuit board body.A kind of Low ESR multilayer circuit board is reasonable in design, individual layer wiring board is damaged when avoiding punching or installing, avoid when mounted other objects directly contact multilayer circuit board body, pass through the design of heat sink strip, radiating efficiency is improved, the thickness of green oil structure sheaf is rationally controlled, so as to reduce the overall impedance of multilayer circuit board body, the performance of multilayer circuit board body is improved, there is very high practicality.
Description
【Technical field】
A kind of multilayer circuit board is the utility model is related to, more particularly to a kind of Low ESR multilayer circuit board.
【Background technology】
The market of wiring board plate is evolving, and this mainly has benefited from both sides power.First, wiring board plate should
With the market space of industry in lasting expansion, the application lifting of communications industry and notebook computer industry so that high-end multilayer wire
The growth in road plate market is very rapid, and application percentage reaches 50% at present.Meanwhile colour TV, mobile phone, automotive electronics digital circuit
The ratio of plate also substantially increases, so that the space of circuit board industry is constantly expanded.Furthermore global circuit board industry to
Shift the rapid expansion for also resulting in China's wiring board market space in China.Recently, U.S. PCB specialized manufacturers (PCB pure-
Plays) avail data announced discloses an ever-increasing market environment of demand:In last year, PCB order goes out
Goods is than being surely more than one.Still further aspect, due to the fierceness of PCB industry competitions, the big factories of some PCB by active development new technology,
Increase PCB layer number or facilitated technique requires high FPC commercializations, to meet the continually changing market demand.How to drop
The impedance of low multilayer circuit board, the performance for improveing multilayer circuit board are to improve the effective way of competitiveness.
【Utility model content】
Main purpose of the present utility model is to provide a kind of Low ESR multilayer circuit board, a kind of Low ESR multilayer line
Plate is reasonable in design, and use is easy to operate, is adapted to be widely popularized, and effectively can solve the problems, such as in background technology.
To achieve the above object, the technical scheme that the utility model is taken is：
A kind of Low ESR multilayer circuit board, including multilayer circuit board body, the multilayer circuit board body include several
Unit line plate body, the unit line plate body include individual layer wiring board and green oil structure sheaf, the individual layer wiring board position
Inside green oil structure sheaf, the edge of the unit line plate body is provided with rim area, and the multilayer circuit board body is provided with
Mounting hole, the mounting hole bottom are provided with mounting post, heat sink strip are also uniformly provided with the multilayer circuit board body.
Further, the mounting hole is located at four turnings of rim area respectively.
Further, the thickness of green oil structure sheaf is identical in the unit line plate body, and thickness range is in 1mm-
Between 1.5mm.
Further, by bonding gemel connection, the thickness of the unit line plate body between the unit line plate body
Spend identical.
Further, the inside of the mounting hole and mounting post is equipped with internal thread.
Compared with prior art, the utility model has the advantages that：A kind of Low ESR multilayer circuit board design
Rationally, when avoiding punching or installing damage individual layer wiring board, avoid when mounted other objects directly contact multilayer line
Plate body, by the design of heat sink strip, radiating efficiency is improved, the thickness of green oil structure sheaf is rationally controlled, so as to reduce multilayer wire
The overall impedance of road plate body, the performance of multilayer circuit board body is improved, there is very high practicality, greatly improve the one kind
The use feature of Low ESR multilayer circuit board, ensures its using effect and utilization benefit, is adapted to be widely popularized.
【Brief description of the drawings】
Fig. 1 is a kind of overall structure diagram of Low ESR multilayer circuit board of the utility model；
Fig. 2 is a kind of A-A cross section structure diagrams of Low ESR multilayer circuit board of the utility model；
Fig. 3 is a kind of B portions mplifying structure schematic diagram of Low ESR multilayer circuit board of the utility model.
In figure：1st, multilayer circuit board body；2nd, unit line plate body；3rd, green oil structure sheaf；4th, individual layer wiring board；5th, pacify
Fill hole；6th, mounting post；7th, heat sink strip；8th, rim area.
【Embodiment】
Technological means, creation characteristic, reached purpose and effect to realize the utility model are easy to understand, below
With reference to embodiment, the utility model is expanded on further.
As Figure 1-3, a kind of Low ESR multilayer circuit board, including multilayer circuit board body 1, the multilayer circuit board sheet
Body 1 includes several unit line plate bodies 2, and the unit line plate body 2 includes individual layer wiring board 4 and green oil structure sheaf 3,
The individual layer wiring board 4 is located inside green oil structure sheaf 3, and the edge of the unit line plate body 2 is provided with rim area 8, described
Multilayer circuit board body 1 is provided with mounting hole 5, and the bottom of mounting hole 5 is provided with mounting post 6, on the multilayer circuit board body 1
Also it is uniformly provided with heat sink strip 7.
Wherein, the mounting hole 5 is located at four turnings of rim area 8 respectively.
Wherein, the thickness of green oil structure sheaf 3 is identical in the unit line plate body 2, and thickness range is in 1mm-1.5mm
Between.
Wherein, by bonding gemel connection, the thickness of the unit line plate body 2 between the unit line plate body 2
It is identical.
Wherein, the inside of the mounting hole 5 and mounting post 6 is equipped with internal thread.
It should be noted that the utility model is a kind of Low ESR multilayer circuit board, during work, by unit line plate
The edge of body 2 is provided with rim area 8, and individual layer wiring board 4 is damaged when avoiding punching or installing, passes through mounting hole 5 and mounting post 6
Design, avoid when mounted other objects directly contact multilayer circuit board body 1, by the design of heat sink strip 7, improve and dissipate
The thermal efficiency, the thickness of green oil structure sheaf 3 is rationally controlled, so as to reduce the overall impedance of multilayer circuit board body 1, improve multilayer wire
The performance of road plate body 1, ensure a kind of utilization benefit of Low ESR multilayer circuit board.
The advantages of general principle and principal character of the present utility model and the utility model has been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the utility model is not restricted to the described embodiments, described in above-described embodiment and specification
Simply illustrate principle of the present utility model, on the premise of the spirit and scope of the utility model is not departed from, the utility model is also
Various changes and modifications are had, these changes and improvements are both fallen within claimed the scope of the utility model.The utility model
Claimed scope is by appended claims and its equivalent thereof.
Claims (5)
1. a kind of Low ESR multilayer circuit board, including multilayer circuit board body（1）, it is characterised in that：The multilayer circuit board sheet
Body（1）Including several unit line plate bodies（2）, the unit line plate body（2）Including individual layer wiring board（4）And green oil
Structure sheaf（3）, the individual layer wiring board（4）Positioned at green oil structure sheaf（3）Inside, the unit line plate body（2）Edge
Provided with rim area（8）, the multilayer circuit board body（1）It is provided with mounting hole（5）, the mounting hole（5）Bottom is provided with installation
Post（6）, the multilayer circuit board body（1）On be also uniformly provided with heat sink strip（7）.
A kind of 2. Low ESR multilayer circuit board according to claim 1, it is characterised in that：The mounting hole（5）Position respectively
In rim area（8）Four turnings.
A kind of 3. Low ESR multilayer circuit board according to claim 1, it is characterised in that：The unit line plate body
（2）Middle green oil structure sheaf（3）Thickness it is identical, and thickness range is between 1mm-1.5mm.
A kind of 4. Low ESR multilayer circuit board according to claim 1, it is characterised in that：The unit line plate body
（2）Between by bonding gemel connection, the unit line plate body（2）Thickness it is identical.
A kind of 5. Low ESR multilayer circuit board according to claim 1, it is characterised in that：The mounting hole（5）And installation
Post（6）Inside be equipped with internal thread.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720275839.5U CN206674295U (en) | 2017-03-21 | 2017-03-21 | A kind of Low ESR multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720275839.5U CN206674295U (en) | 2017-03-21 | 2017-03-21 | A kind of Low ESR multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206674295U true CN206674295U (en) | 2017-11-24 |
Family
ID=60377965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720275839.5U Expired - Fee Related CN206674295U (en) | 2017-03-21 | 2017-03-21 | A kind of Low ESR multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206674295U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109548268A (en) * | 2018-11-01 | 2019-03-29 | 郑州云海信息技术有限公司 | A kind of PCB impedance adjustment, control system and a kind of PCB layout plate |
-
2017
- 2017-03-21 CN CN201720275839.5U patent/CN206674295U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109548268A (en) * | 2018-11-01 | 2019-03-29 | 郑州云海信息技术有限公司 | A kind of PCB impedance adjustment, control system and a kind of PCB layout plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171124 Termination date: 20210321 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |