CN201112378Y - Secondary power supply radiator - Google Patents
Secondary power supply radiator Download PDFInfo
- Publication number
- CN201112378Y CN201112378Y CNU2007201207283U CN200720120728U CN201112378Y CN 201112378 Y CN201112378 Y CN 201112378Y CN U2007201207283 U CNU2007201207283 U CN U2007201207283U CN 200720120728 U CN200720120728 U CN 200720120728U CN 201112378 Y CN201112378 Y CN 201112378Y
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- CN
- China
- Prior art keywords
- power supply
- secondary power
- heating panel
- radiator
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a secondary power supply heat radiator used for a secondary power supply module. In order to solve the problems of prior secondary power supply heat radiator, such as poor effect of heat dissipation, difficult installation and high production cost, the utility model provides the secondary power supply heat radiator, which comprises a heating panel. At least one convex hull made from metal material through impact molding and integrated with the heating panel is arranged below the heating panel. The secondary heat radiator of the utility model has the advantages of low production cost, easy installation and good heat dissipating effect.
Description
Technical field
The utility model relates to a kind of radiator, more particularly, relates to a kind of secondary power supply radiator that is used for the secondary power supply module.
Background technology.
The performance performance of electronic equipment is whether the speed of its calculation process reaches user's demand, and influences in the factor of its calculation process speed, and what at first will solve is the heat dissipation problem of its electronic building brick.Task handling chips such as the transmission of the various signals of responsible processing and program calculating are high warm because of its frequency that is exceedingly fast produces, yet be in the electronic component under the high hot state, and its performance is subjected to influence greatly, and computing slows down, even quits work.Therefore, radiator is developed out the radiating element as electronic component.
In the secondary power supply module, usually adopt a metallic heat radiating plate to come the chip in the secondary power supply is dispelled the heat, but the secondary power supply module is generally all less, the process chip surface area that needs to install radiator on the module is littler, element such as the iron core that exceeds chip arranged again around the chip, and in order to reach better radiating effect, heating panel is generally all done greatlyyer than chip, often also covered other electronic component, therefore, when making this type of radiator, must solve the technical problem how heating panel and chip contact.
Solve heating panel and this type of problem of chip at present, common way is to be coated with enough thick heat conductive silica gel on euthermic chip, makes the transmitter of heat between euthermic chip and the heating panel with silica gel.But owing to costing an arm and a leg of heat conductive silica gel, use more silica gel that cost is risen, simultaneously, the heat transfer efficiency of heat conductive silica gel is limited, cause radiating efficiency not high, another kind of is exactly to be bonded at the below of heating panel with one with heat conductive silica gel with the sizable sheet metal of euthermic chip, the heat of chip reaches on the heating panel by convex closure, though this way is simple, cost is lower, but still across one deck heat conductive silica gel, therefore adopt the radiating effect of this method also to be subjected to certain influence between sheet metal and the heating panel, when pasting sheet metal, occur the inaccurate problem in location simultaneously.
The utility model content
At the deficiencies in the prior art, the secondary power supply radiator that the utility model provides a kind of simple in structure, low cost of manufacture, easily installs.
The technical scheme that its technical problem that solves the utility model adopts is: construct a kind of secondary power supply radiator, comprise a heating panel, the below of described heating panel be provided with at least one and heating panel be one, by a sheet metal through stamping forming convex closure.
In secondary power supply radiator described in the utility model, described sheet metal is aluminium sheet or aluminium alloy plate.
In secondary power supply radiator described in the utility model, described sheet metal is copper coin or copper alloy plate.
In secondary power supply radiator described in the utility model, the upper surface of described heating panel is the plane.
In secondary power supply radiator described in the utility model, the upper surface of described heating panel is provided with wavy groove and fin.
The utility model secondary power supply radiator compared with prior art has following advantage:
1, the convex closure that contacts with euthermic chip is and the heating panel integrative-structure, heat transfer efficiency height, good heat dissipation effect.
2, convex closure and heating panel adopt the punching press one-shot forming, and cost is low.
3, the position of convex closure can accurately be located when the design stamping die, offset can not occur, easily installs.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the structural representation of secondary power supply radiator in the utility model;
Fig. 2 is the combination schematic diagram of secondary power supply and secondary power supply radiator in the utility model;
Fig. 3 is the making flow chart of secondary power supply radiator in the utility model.
Embodiment
A preferred embodiment of the present utility model such as Fig. 1, Fig. 2, shown in Figure 3.In the present embodiment, secondary power supply radiator 20 comprises heat-dissipating aluminium plate 21 and exceeds the convex closure 22 on heat-dissipating aluminium plate surface, heat-dissipating aluminium plate 21 is the integrative-structures that adopt the processing mode punching press of punching press to form with diel with convex closure 22, and heating panel is provided with wavy groove and the fin with its one.The moulding flow process of secondary power supply radiator is as shown in Figure 3: but an aluminium sheet 40 is placed between the patrix 31 and counterdie 32 of diel of punching out secondary power supply radiator, adopt the mode of punch process, metal aluminum sheet 40 is struck out a heating panel 21 and exceeds the convex closure 22 on heating panel surface, being wavy groove and fin of formation one and form the blank of radiator on heat-dissipating aluminium plate; Then the radiator with blank is carried out deburring removal clout and form secondary power supply radiator 20 of the present utility model.
When radiator in the present embodiment and the assembling of secondary power supply module, as shown in Figure 2, the convex closure 22 of radiator 20 contacts with the euthermic chip 11 of secondary power supply module 10, and the heating panel 21 of radiator is covered in whole secondary power supply wiring board, comprises the iron-core element 12 that exceeds chip.
In the present embodiment, radiator has only a convex closure, and in the specific implementation, the number of convex closure can realize a plurality of convex closures by the design diel according to the number of chips of required heat radiation on the secondary power supply module.
In the present embodiment, radiator is to use the metal aluminum sheet punch forming, in the specific implementation, and also available copper or other high heat conductive metal or sheet alloy punch forming.
Claims (5)
1. a secondary power supply radiator comprises a heating panel, it is characterized in that: the below of described heating panel is provided with at least one and heating panel one, by a sheet metal through stamping forming convex closure.
2. secondary power supply radiator according to claim 1 is characterized in that: described sheet metal is aluminium sheet or aluminium alloy plate.
3. secondary power supply radiator according to claim 1 is characterized in that: described sheet metal is copper coin or copper alloy plate.
4. secondary power supply radiator according to claim 1 is characterized in that: the upper surface of described heating panel is the plane.
5. secondary power supply radiator according to claim 1 is characterized in that: the upper surface of described heating panel is provided with and is wavy groove and fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201207283U CN201112378Y (en) | 2007-06-13 | 2007-06-13 | Secondary power supply radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201207283U CN201112378Y (en) | 2007-06-13 | 2007-06-13 | Secondary power supply radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201112378Y true CN201112378Y (en) | 2008-09-10 |
Family
ID=39964124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201207283U Expired - Lifetime CN201112378Y (en) | 2007-06-13 | 2007-06-13 | Secondary power supply radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201112378Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105323996A (en) * | 2015-12-09 | 2016-02-10 | 江苏天安智联科技股份有限公司 | Car-mounted enclosure with heat radiation function |
| CN106211713A (en) * | 2016-08-02 | 2016-12-07 | 江苏兆能电子有限公司 | A kind of assembling radiating plate |
-
2007
- 2007-06-13 CN CNU2007201207283U patent/CN201112378Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105323996A (en) * | 2015-12-09 | 2016-02-10 | 江苏天安智联科技股份有限公司 | Car-mounted enclosure with heat radiation function |
| CN106211713A (en) * | 2016-08-02 | 2016-12-07 | 江苏兆能电子有限公司 | A kind of assembling radiating plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: YADA POWER SUPPLY PRODUCTS (SHENZHEN) CO., LTD. Free format text: FORMER OWNER: AIMOSHENG NETWORK ENERGY SOURCE CO LTD Effective date: 20140905 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518057 SHENZHEN, GUANGDONG PROVINCE TO: 518101 SHENZHEN, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20140905 Address after: 518101 Guangdong city of Shenzhen province Baoan District Xin'an road two North 68 Street office Honglang District Industrial Park plant Patentee after: Astec power supply (Shenzhen) Co., Ltd. Address before: 518057 Nanshan District science and Technology Industrial Park, Guangdong, Shenzhen Branch Road, No. Patentee before: Aimosheng Network Energy Source Co., Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20080910 |
|
| CX01 | Expiry of patent term |