CN101232792A - Heat radiating device, heat radiating base and manufacturing method thereof - Google Patents
Heat radiating device, heat radiating base and manufacturing method thereof Download PDFInfo
- Publication number
- CN101232792A CN101232792A CNA2007100040649A CN200710004064A CN101232792A CN 101232792 A CN101232792 A CN 101232792A CN A2007100040649 A CNA2007100040649 A CN A2007100040649A CN 200710004064 A CN200710004064 A CN 200710004064A CN 101232792 A CN101232792 A CN 101232792A
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- heat
- conducting plate
- perforation
- heating panel
- cooling base
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat sink, which comprises a heat radiation base and a heat radiation element arranged on the heat radiation base. The heat radiation base is provided with a heat conduction plate and a heat radiation plate, wherein, the heat radiation plate is provided with a through hole, the heat conduction plate is in interference fit with the through hole to ensure that the periphery of the heat conduction plate is closely contacted with the inner wall of the through hole.
Description
Technical field
The present invention relates to a kind of heat abstractor, cooling base and manufacture method thereof, particularly relate to a kind of making and easily assembled heat abstractor, cooling base and manufacture method thereof.
Background technology
Because the progress of science and technology, the microminiaturized direction of various electronic products (for example central processing unit and chipset etc.) functional raising of trend and size develops, employed electronic component is extremely intensive, and radiating requirements is also just increasing, and heat dissipation directly influences the reliability and the useful life of electronic product.
Radiator structure with central processing unit is an example, usually a heat abstractor is binded, fastens or welds and be arranged on the central processing unit, and contact with central processing unit, the heat energy that central processing unit produced is derived and heat radiation, prior art more installs a fan additional on heat abstractor, to strengthen heat dissipation.Yet for reducing cost, existing heat abstractor uses homogenous material usually, and aluminium for example utilizes its low-density and the characteristic that is easy to moulding, makes a radiator that contains cooling base and a plurality of radiating fins by aluminium extruded moulding or punch forming mode.But relatively poor so can't fast a large amount of heat energy be derived and heat radiation because of the thermal conduction characteristic of aluminium, heat dissipation does not meet demand.Yet,, can increase substantially cost if select for use copper as the material of making radiator.
For addressing the above problem, prior art adopts the cooling base of composite metal structures (for example aluminum bronze composition metal), takes into account the characteristic that is easy to moulding and heat dissipation.Please refer to shown in Figure 1ly, a kind of existing radiator 1 comprises a cooling base 11 and a plurality of radiating fin 12, is that to be arranged at a central processing unit (figure shows) with radiator 1 be example at this.What this will specify being, showing for ease of clear, is that radiator is inverted among Fig. 1.Cooling base 11 is made of an aluminium sheet 111 and a copper coin 112, aluminium sheet 111 has a groove 1111, and copper coin 112 is arranged in the groove 1111, and copper coin 112 is derived the heat energy that central processing unit produced, and be sent to aluminium sheet 111, to dispel the heat by aluminium sheet 111 and radiating fin 12.
Please refer to shown in Fig. 2 A and Fig. 2 B, the cooling base 21 of aluminum bronze composition metal then utilizes soldering that copper coin 212 is engaged in the hole 2111 of aluminium sheet 211 if engage by the soldering mode.But this kind mode is owing to increased the interface of tin S between copper coin 212 and the aluminium sheet 211, the too much heat conduction between the different materials interface, not only reduce heat conduction efficiency, more the joint because of copper coin 212 and aluminium sheet 211 is easy to generate solder overflow, and scaling powder is full of working surface, and producing the manufacturing cost that heavy industry cleans, the tightness of soldering also directly influences heat conduction efficiency.In addition, when cooling base 21 is assembled with radiating fin again, not only bad for mold design and assembling inconvenience, the dimensional accuracy of more wayward product assembling.
How the whence provides a kind of disappearance that causes with the soldering mode of can avoiding forging because of in this, and to reduce production costs, the heat abstractor of quick conductive and efficiently radiates heat, cooling base and manufacture method thereof are one of important topic in fact with easily assembled in making.
Summary of the invention
Because above-mentioned problem, the object of the present invention is to provide a kind of disappearance that causes with the soldering mode of can avoiding forging, make with easily assembled reducing production costs, and can quick conductive and efficiently radiates heat to promote heat abstractor, cooling base and the manufacture method thereof of heat conduction efficiency.
Edge is for reaching above-mentioned purpose, to comprise a cooling base and a heat dissipation element according to a kind of heat abstractor of the present invention.Cooling base has a heat-conducting plate and a heating panel, and heating panel has a perforation, and heat-conducting plate is arranged in the perforation by the interference engagement mode, and the outer peripheral edges of heat-conducting plate are closely contacted with the inwall of perforation, and the heat dissipation element setting also is linked on the cooling base.
For reaching above-mentioned purpose, comprise a heat-conducting plate and a heating panel according to a kind of cooling base of the present invention.Heating panel has a perforation, and heat-conducting plate is arranged in the perforation by the interference engagement mode, and the outer peripheral edges of heat-conducting plate are closely contacted with the inwall of perforation.
For reaching above-mentioned purpose, manufacture method according to a kind of cooling base of the present invention comprises the following steps: to provide a heat-conducting plate and a heating panel, heating panel has a perforation, and the shape of heat-conducting plate is identical with the shape essence of perforation, and the size of heat-conducting plate is slightly larger than the size of perforation; And by the interference engagement mode heat-conducting plate is arranged in the perforation, the outer peripheral edges of heat-conducting plate are closely contacted with the inwall of perforation.
From the above, be one heat-conducting plate to be arranged in the perforation of a heating panel, so that the outer peripheral edges of heat-conducting plate closely contact with the inwall of perforation because of foundation a kind of heat abstractor of the present invention, cooling base and manufacture method thereof by the interference engagement mode.Compared with prior art, the present invention avoids forging the disappearance that causes with the soldering mode, and cooling base is closely contacted in the interface of composition metal, thus can reach good heat conduction efficiency, and making and easily assembled to reduce production costs.In addition, link a heat dissipation element on the cooling base again, more can further improve heat conduction efficiency.
Description of drawings
Fig. 1 is a kind of schematic diagram of existing heat abstractor;
Fig. 2 A is a kind of schematic diagram of existing cooling base;
Fig. 2 B is the cutaway view of the cooling base of Fig. 2 A along the A-A line segment;
Fig. 3 is the schematic diagram according to a kind of heat abstractor of preferred embodiment of the present invention;
Fig. 4 A and Fig. 4 B are the schematic diagram according to the different interference fit systems of the cooling base of preferred embodiment of the present invention, and wherein Fig. 4 A is the heat edge, and Fig. 5 B is a shut up;
Fig. 5 A is the schematic diagram according to the cooling base of preferred embodiment of the present invention;
Fig. 5 B is the cutaway view of the cooling base of Fig. 5 A along the B-B line segment;
Fig. 6 is the flow chart according to the manufacture method of a kind of cooling base of preferred embodiment of the present invention;
Fig. 7 interferes fitting method heat-conducting plate to be arranged at the flow chart of perforation for Fig. 6 by difference.
The component symbol explanation:
1 radiator, 11,21,31 cooling bases
111,211 aluminium sheets, 1111 grooves
2111 holes, 112,212 copper coins
12,321 radiating fins, 3 heat abstractors
3111 perforation of 311 heating panels
312 heat-conducting plates, 32 heat dissipation elements
33 heat conducting element A-A, B-B line segment
S tin W drift
The process step of S10, S20, S21, S21 ', S22 manufacture method
Embodiment
Hereinafter with reference to correlative type, a kind of heat abstractor, heat-radiating substrate and manufacture method thereof according to preferred embodiment of the present invention are described, wherein components identical will be illustrated with identical reference marks.
Please refer to Fig. 3, a kind of heat abstractor 3 of preferred embodiment of the present invention comprises a cooling base 31 and a heat dissipation element 32.Cooling base 31 has a heating panel 311 and a heat-conducting plate 312; Heating panel 311 has a perforation 3111, perforation 3111 form fit heat-conducting plate 312 and being provided with.In addition, the material of heating panel 311 and heat-conducting plate 312 is a heat-conducting, such as but not limited to copper, aluminium or its alloy.
The shape of heat-conducting plate 312 is corresponding mutually with perforation 3111 shape, and the size of heat-conducting plate 312 then is slightly larger than 3111 the size of boring a hole, and present embodiment is all to be that circle is an example with heat-conducting plate 312 and 3111 the shape of boring a hole.
Heat-conducting plate 312 please refer to Fig. 4 A and Fig. 4 B with the assembling mode explanation of heating panel 311, and heat-conducting plate 312 is arranged in the perforation 3111 by the interference engagement mode, and the interference engagement mode can be hot edge mode or shut up mode.When using hot edge mode (shown in Fig. 4 A), with heating panel 311 whole or 3111 heating of boring a hole, make perforation 3111 thermal expansions be slightly larger than the size of heat-conducting plate 312 until the size of perforation 3111, again heat-conducting plate 312 is inserted in the perforation 3111 of heating panel 311, after treating heating panel 311 coolings, then the outer peripheral edges of heat-conducting plate 312 promptly closely contact with the inwall of perforation 3111.When using shut up mode (shown in Fig. 4 B), with heat-conducting plate 312 coolings, make its cold contraction until the undersized of heat-conducting plate 312 size in perforation 3111, again heat-conducting plate 312 is inserted in the perforation 3111, after treating that heat-conducting plate 312 is risen again, then the outer peripheral edges of heat-conducting plate 312 promptly closely contact with the inwall of perforation 3111.Certainly, also can utilize drift W that heat-conducting plate 312 is directly exerted pressure and make its be bumped into the perforation 3111 in.
Please refer to Fig. 5 A and Fig. 5 B, the present invention also can be by direct punching press interference engagement mode, the outer peripheral edges of heat-conducting plate 312 contact closely with interface between perforation 3111 the inwall, and heat energy can be sent to heating panel 311 via heat-conducting plate 312 fast, reaches good heat conduction efficiency.In addition,, make making more simple and easy, also reduce production costs with assembling owing to do not need welding between heat-conducting plate 312 and heating panel 311.
Please refer to Fig. 6, the manufacture method of a kind of cooling base of preferred embodiment of the present invention can be applicable to the cooling base 31 of above-mentioned preferred embodiment.The manufacture method of cooling base 31 comprises that step S10 is to step S20.Step S10 provides a heat-conducting plate 312 and a heating panel 311, and heating panel 311 has a perforation 3111, and the shape of heat-conducting plate 312 is corresponding mutually with the shape of perforation 3111, and the size of heat-conducting plate 312 is slightly larger than the size of perforation 3111.Step S20 is arranged at heat-conducting plate 312 in the perforation 3111 by the interference engagement mode, and the outer peripheral edges of heat-conducting plate 312 are closely contacted with the inwall of perforation 3111.
Please refer to Fig. 7, the interference engagement mode of step S20 comprises the mode of heating and the type of cooling.Step S21 is when the interference engagement mode is mode of heating, with heating panel 311 heating, makes the size of perforation 3111 be slightly larger than the size of heat-conducting plate 312; Step S22 inserts heat-conducting plate 312 in the perforation 3111, after contracting in perforation 3111 coolings outer peripheral edges of heat-conducting plate 312 is closely contacted with the inwall of perforation 3111.Step S21 ' is when the interference engagement mode is the type of cooling, with heat-conducting plate 312 coolings, the undersized that makes heat-conducting plate 312 is in the size of perforation 3111, step S22 inserts heat-conducting plate 312 in the perforation 3111, when rise again outer peripheral edges that the body machine can make heat-conducting plate 312 after expanding of heat conduction version 312 closely contact with 3111 the inwall of boring a hole.
In sum, be one heat-conducting plate to be arranged in the perforation of a heating panel, so that the outer peripheral edges of heat-conducting plate closely contact with the inwall of perforation because of foundation a kind of heat abstractor of the present invention, cooling base and manufacture method thereof by the interference engagement mode.Compared with prior art, the present invention avoids forging the disappearance that causes with the soldering mode, and cooling base is closely contacted in the interface of composition metal, thus can reach good heat conduction efficiency, and making and easily assembled to reduce production costs.In addition, link a heat dissipation element on the cooling base again, more can further improve heat conduction efficiency.
The above only is an illustrative, but not is restricted person.Anyly do not break away from spirit of the present invention and category, and, all should be contained in the accompanying Claim its equivalent modifications of carrying out or change.
Claims (18)
1. heat abstractor comprises:
One cooling base has a heat-conducting plate and a heating panel, and this heating panel has a perforation, and this heat-conducting plate is arranged in this perforation by an interference engagement mode; And
One heat dissipation element is provided with and is linked on this cooling base.
2. heat abstractor as claimed in claim 1, wherein this interference engagement mode is hot edge, shut up or direct punching press close-fitting.
3. heat abstractor as claimed in claim 2, wherein this interference engagement mode with the heat edge is to heat this heating panel, make this perforation be slightly larger than this heat-conducting plate, this heat-conducting plate is inserted in this perforation of this heating panel again, this heat-conducting plate and this heating panel are promptly combined closely after cooling.
4. heat abstractor as claimed in claim 2, wherein this interference engagement mode with shut up is to cool off this heat-conducting plate, make this heat-conducting plate be slightly less than this perforation of this heating panel, this heat-conducting plate is inserted in this perforation of this heating panel, this heat-conducting plate and this heating panel are promptly combined closely after waiting to rise again.
5. heat abstractor as claimed in claim 2, wherein the shape of this heat-conducting plate is corresponding mutually with the shape of this Durchgangshohle, and the size of this heat-conducting plate is slightly larger than the size of this perforation.
6. radiator as claimed in claim 1, wherein the material of this heat-conducting plate and this heating panel is a heat-conducting, wherein this heat-conducting is copper, aluminium or its alloy.。
7. heat abstractor as claimed in claim 1, wherein this heat dissipation element has a plurality of radiating fins, these a plurality of radiating fins be with bind, sealed, fixing or welding manner and the binding of this cooling base.
8. heat abstractor as claimed in claim 1 more comprises:
At least one heat conducting element, its two end contact with this heat dissipation element and this cooling base respectively.
9. heat abstractor as claimed in claim 8, wherein this heat conducting element is a heat pipe, the shape of this heat pipe is U font or C font.。
10. cooling base comprises:
One heat-conducting plate; And
One heating panel has a perforation, and this heat-conducting plate is arranged in this perforation by the interference engagement mode, and the outer peripheral edges of this heat-conducting plate are closely contacted with the inwall of this perforation.
11. cooling base as claimed in claim 10, wherein the interference engagement mode is hot edge, shut up or direct punching press close-fitting.
12. cooling base as claimed in claim 11, wherein this interference engagement mode with the heat edge is to heat this heating panel, make this perforation be slightly larger than this heat-conducting plate, this heat-conducting plate is inserted in this perforation of this heating panel again, this heat-conducting plate and this heating panel are promptly combined closely after cooling.
13. cooling base as claimed in claim 11, wherein the interference engagement mode with shut up is to cool off this heat-conducting plate, make this heat-conducting plate be slightly less than this perforation of this heating panel, this heat-conducting plate is inserted in this perforation of this heating panel, this heat-conducting plate and this heating panel are promptly combined closely after waiting to rise again.
14. cooling base as claimed in claim 11, wherein the shape of this heat-conducting plate is corresponding mutually with the shape of this perforation, and the size of this heat-conducting plate is slightly larger than the size of this perforation.
15. cooling base as claimed in claim 10, wherein the material of this heat-conducting plate and this heating panel is a heat-conducting, and this heat-conducting is copper, aluminium or its alloy.
16. the manufacture method of a cooling base comprises the following steps:
One heat-conducting plate and a heating panel are provided, and this heating panel has a perforation, and the shape of this heat-conducting plate is corresponding mutually with the shape of this perforation, and the size of this heat-conducting plate is slightly larger than the size of this perforation; And
By an interference engagement mode this heat-conducting plate is arranged in this perforation, the outer peripheral edges of this heat-conducting plate are closely contacted with the inwall of this perforation.
17. manufacture method as claimed in claim 20, wherein the step of this interference engagement comprises:
With the heating of this heating panel, make the size of this perforation be slightly larger than the size of this heat-conducting plate; And
This heat-conducting plate is inserted in this perforation.
18. manufacture method as claimed in claim 20, wherein the step of this interference engagement comprises:
With this heat-conducting plate cooling, make the size of the undersized of this heat-conducting plate in this perforation; And
This heat-conducting plate is inserted in this perforation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100040649A CN101232792A (en) | 2007-01-23 | 2007-01-23 | Heat radiating device, heat radiating base and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100040649A CN101232792A (en) | 2007-01-23 | 2007-01-23 | Heat radiating device, heat radiating base and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101232792A true CN101232792A (en) | 2008-07-30 |
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ID=39898873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100040649A Pending CN101232792A (en) | 2007-01-23 | 2007-01-23 | Heat radiating device, heat radiating base and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101232792A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661488A (en) * | 2013-11-21 | 2015-05-27 | 奇鋐科技股份有限公司 | Manufacturing method for heat dissipation modules |
| CN105283033A (en) * | 2014-07-21 | 2016-01-27 | 奇鋐科技股份有限公司 | Manufacture method of heat-dissipating module |
| CN111491493A (en) * | 2020-04-30 | 2020-08-04 | 联想(北京)有限公司 | Heat dissipation component and electronic equipment |
-
2007
- 2007-01-23 CN CNA2007100040649A patent/CN101232792A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661488A (en) * | 2013-11-21 | 2015-05-27 | 奇鋐科技股份有限公司 | Manufacturing method for heat dissipation modules |
| CN104661488B (en) * | 2013-11-21 | 2018-03-09 | 奇鋐科技股份有限公司 | The manufacture method of radiating module |
| CN105283033A (en) * | 2014-07-21 | 2016-01-27 | 奇鋐科技股份有限公司 | Manufacture method of heat-dissipating module |
| CN111491493A (en) * | 2020-04-30 | 2020-08-04 | 联想(北京)有限公司 | Heat dissipation component and electronic equipment |
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Application publication date: 20080730 |