CN210406041U - Radiator and electronic equipment - Google Patents
Radiator and electronic equipment Download PDFInfo
- Publication number
- CN210406041U CN210406041U CN201921311611.2U CN201921311611U CN210406041U CN 210406041 U CN210406041 U CN 210406041U CN 201921311611 U CN201921311611 U CN 201921311611U CN 210406041 U CN210406041 U CN 210406041U
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- Prior art keywords
- plate
- composite sheet
- composite
- heat
- heat sink
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- 239000002131 composite material Substances 0.000 claims abstract description 71
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 230000017525 heat dissipation Effects 0.000 claims description 37
- 239000007788 liquid Substances 0.000 claims description 22
- 238000001816 cooling Methods 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 238000009434 installation Methods 0.000 abstract description 4
- 238000004080 punching Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a radiator, it includes heating panel and at least one composite sheet, be provided with the cavity in the heating panel, a composite sheet with the heating panel is laminated mutually, be provided with cooperation portion on the composite sheet, the heat source with cooperation portion cooperation installation. The utility model provides a radiator or electronic equipment has certain thickness and has the composite sheet of cooperation portion through setting up on the heating panel, has promoted structural strength, thickness and the plane degree of heating panel, and then has satisfied the requirement of using or assembling. The utility model also discloses an electronic equipment with this radiator.
Description
Technical Field
The utility model relates to a heat dissipation technical field especially, relates to a radiator and electronic equipment.
Background
With the rapid development of miniaturization, integration and high efficiency of power electronic equipment and devices, the performance and heat dissipation capacity of the devices are continuously increased, and the problems of uneven heat flow density distribution, extremely high local heat flow density, heat accumulation in local areas and overhigh local temperature are brought.
The conventional heat dissipation plate is generally in a flat plate structure and can only contact with a specific heat source, and when the heat source is in different heights and shapes, installation interference is caused when the heat source is installed with the heat dissipation plate, so that the heat source installation is inconvenient, for example, the structural strength, the thickness, the flatness and other indexes of the existing blown or brazed plate type uniform temperature plate and the plate type liquid cooling plate are poor, the heat dissipation plate cannot be in close contact with the heat source, and the application or assembly requirements cannot be met.
SUMMERY OF THE UTILITY MODEL
Accordingly, there is a need for a heat sink and an electronic device that can be attached to a heat source in a tight manner and that can be easily mounted on the heat source.
The utility model provides a technical scheme that its technical problem adopted is: the radiator comprises a radiating plate and at least one composite plate, wherein a cavity is arranged in the radiating plate, the composite plate is attached to the radiating plate, and a matching part is arranged on the composite plate.
Further, the matching part is a through hole and a groove, or a through hole.
Further, the heat dissipation plate is a phase-change temperature equalization plate, a closed cavity is arranged in the phase-change temperature equalization plate, phase-change working media are filled in the closed cavity, and a capillary structure is arranged in the closed cavity.
Further, when the heat dissipation plate is a liquid cooling plate, the liquid cooling plate is provided with a liquid inlet and a liquid outlet, a cavity is arranged in the heat dissipation plate, and the liquid inlet and the liquid outlet are communicated with the cavity.
Furthermore, at least one surface of the heat dissipation plate is a plane, and the composite plate is attached to the plane of the heat dissipation plate.
Further, the composite sheet has two, the composite sheet includes first composite sheet and second composite sheet, first composite sheet with the plane of heating panel is laminated mutually, the second composite sheet is located first composite sheet is kept away from one side of heating panel, and with first composite sheet is laminated mutually, cooperation portion sets up first composite sheet with on the second composite sheet.
Further, the composite plate is an aluminum plate or an aluminum alloy plate.
An electronic device comprising the heat spreader of any of the preceding claims.
Furthermore, the electronic equipment further comprises a panel, a circuit board, a heat source and a rear cover, wherein the panel and the rear cover are matched and connected with each other to form a mounting cavity, the circuit board, the heat source and the radiator are all mounted in the mounting cavity, and the heat source is attached to the matching part.
The utility model has the advantages that: the utility model provides a radiator or electronic equipment has certain thickness and has the composite sheet of cooperation portion through setting up on the heating panel, has promoted structural strength, thickness and the plane degree of heating panel, and then has satisfied the requirement of using or assembling.
Drawings
The present invention will be further explained with reference to the drawings and examples.
Fig. 1 is a schematic structural diagram of a heat sink and a heat source according to a first embodiment of the present invention;
fig. 2 is a schematic structural view of a heat dissipating plate in a heat sink according to a second embodiment of the present invention;
fig. 3 is a sectional view of the heat radiating plate of fig. 2 taken along a-a;
FIG. 4 is a schematic view of the heat sink and heat source of FIG. 2 in combination;
fig. 5 is a schematic structural diagram of the cooperation of the heat sink and the heat source according to the third embodiment of the present invention;
fig. 6 is a schematic structural diagram of an electronic device according to a fourth embodiment of the present invention.
The names and the numbers of the parts in the figure are respectively as follows:
Through hole 211 groove 212 first heat source 4
First via 213 second via 214 third via 215
Liquid inlet 12, liquid outlet 13 and rear cover 8
Detailed Description
The present invention will now be described in detail with reference to the accompanying drawings. This figure is a simplified schematic diagram, and merely illustrates the basic structure of the present invention in a schematic manner, and therefore it shows only the constitution related to the present invention.
Referring to fig. 1 and 2, the present invention provides a heat sink, which includes a heat dissipating plate 1 and at least one composite plate 2, wherein a cavity is disposed in the heat dissipating plate 1, the composite plate 2 is attached to the heat dissipating plate 1, a fitting portion 21 is disposed on the composite plate 2, and a heat source is fitted to the fitting portion 21.
Example one
Referring to fig. 1, the heat sink includes a heat dissipation plate 1 and a composite plate 2, the heat dissipation plate 1 is a phase-change uniform temperature plate, and the heat dissipation plate 1 may be produced through a blow-up process or a brazing process. At least one surface of the heat dissipation plate 1 is a plane, a closed cavity 11 is arranged in the heat dissipation plate 1, and the closed cavity 11 is filled with a phase change working medium.
After the heat dissipation plate 1 absorbs heat, the liquid working medium in the evaporation section is rapidly expanded and vaporized, moves to the condensation section to be cooled and liquefied, and then flows back to the evaporation section under the capillary action.
The composite plate 2 is an aluminum plate or an aluminum alloy plate. In the present embodiment, the composite plate 2 has one fitting portion 21, which is a through hole 211 and a groove 212, the groove 212 is located on the side of the composite plate 2 away from the heat radiating plate 1, and the positions, shapes, and depths of the through hole 211 and the groove 212 correspond to the positions, shapes, and heights of the heat source. In the present embodiment, the through hole 211 and the groove 212 each have a square structure, the through hole 211 can be processed by punching, and the groove 212 can be formed by punching.
In the present embodiment, the composite plate 2 is bonded to the plane of the heat sink 1. Specifically, the heat dissipation plate 1 and the composite plate 2 are connected together by gluing, welding, riveting, or the like.
It is understood that, in other embodiments, not shown, the fitting part 21 is a plurality of through holes 211 or a plurality of grooves 212 for heat sources requiring heat dissipation, the number and positions of the through holes 211 or the grooves 212 are set according to the number and positions of the heat sources, and the depth of the grooves 212 is set according to the height of the heat sources.
In the present embodiment, two heat sources are required to dissipate heat, for example, the heat sources include a first heat source 4 and a second heat source 5 mounted on the circuit board 3, wherein the height of the second heat source 5 is smaller than the height of the first heat source 4. The first heat source 4 passes through the through hole 211 and then is attached to the plane of the heat dissipation plate 1, and the second heat source 5 extends into the groove 212 and is attached to the bottom wall of the groove 212. Specifically, the through hole 211 is provided with the first heat source 4 which is in contact with the heat dissipation plate 1 to achieve an avoiding effect, so that the first heat source 4 directly transfers heat to the heat dissipation plate 1 to dissipate heat, and the groove 212 is provided with the second heat source 5 to achieve an avoiding effect, so that assembly interference in the installation process is avoided.
The embodiment of the utility model provides a radiator has certain thickness and has the composite sheet of cooperation portion 21 through setting up on heating panel 1, has promoted structural strength, thickness and the plane degree of heating panel 1, and then has satisfied the requirement of using or assembling.
Example two
Referring to fig. 2 to 4, a heat sink according to a second embodiment of the present invention is different from the heat sink according to the first embodiment in that: in this embodiment, the heat dissipation plate 1 is a liquid cooling plate, the heat dissipation plate 1 is formed by processing a plate, a liquid inlet 12 and a liquid outlet 13 are formed in the heat dissipation plate 1, a cavity is formed in the heat dissipation plate 1, the liquid inlet 12 and the liquid outlet 13 are both communicated with the cavity, and the liquid inlet 12 and the liquid outlet 13 are used for being connected with a liquid supply part (not shown). One surface of the heat dissipation plate 1 is a plane, and the other surface is a flow path formed by the cavity.
EXAMPLE III
Referring to fig. 5, a heat sink provided in the third embodiment of the present invention is different from the heat sink provided in the first embodiment in that: in this embodiment, the heat sink includes a heat dissipation plate 1, a first composite plate 23, and a second composite plate 24, where the first composite plate 23 is attached to the plane of the heat dissipation plate 1, and the second composite plate 24 is attached to the first composite plate 23. The matching part 21 is a through hole 211, the through hole 211 comprises a first through hole 213, a second through hole 214 and a third through hole 215, the first through hole 213 is arranged on the first composite board 23, the second through hole 214 and the third through hole 215 are arranged on the second composite board 24, the first heat source 4 sequentially passes through the first through hole 213 and the second through hole 214 and then is attached to the plane of the heat dissipation plate 1, and the second heat source 5 extends into the third through hole 215 and is attached to the surface of the composite board 2.
In the present embodiment, the first composite plate 23 and the second composite plate 24 are provided, and the height of the second heat source 5 is lower than that of the first heat source 4, so that the second heat source 5 is attached to the surface of the first composite plate 23, thereby making up for the defect that the height of the second heat source 5 is relatively low.
The embodiment of the utility model provides a third radiator that provides, cooperation portion 21 and heat source cooperation installation, use a composite sheet 2 with the embodiment one and compare, only need to first composite sheet 23 and second composite sheet 24 punch a hole the operation can, need not carry out punching press recess 212 to first composite sheet 23 and second composite sheet 24, compare in punching press recess 212's operation mode, because the punching press degree of depth of recess 212 is difficult to control when punching press recess 212, consequently, the operation of punching a hole is changed in processing to manufacturing cost has been reduced.
It can be understood that the manner of providing a plurality of composite plates 2 and performing only punching in this embodiment is also applicable to the second embodiment, and the description thereof is omitted.
Example four
Referring to fig. 6, the present invention further provides an electronic device, which includes a panel 6, a circuit board 3, a heat source 7, a rear cover 8 and a heat sink, wherein the heat sink includes a heat dissipation plate 1 and a composite plate 2, the heat dissipation plate 1 is a phase-change temperature equalization plate, the composite plate 2 has one, and a matching portion 21 of the composite plate 2 is a through hole 211. The panel 6 and the rear cover 8 are cooperatively connected with each other, so that a mounting cavity 61 is formed between the panel 6 and the rear cover 8, and the circuit board 3, the heat source 7 and the heat sink are all mounted in the mounting cavity 61.
In a specific embodiment, the heat source 7 includes a first heat source 72 and a second heat source 73, wherein the second heat source 73 is mounted on the circuit board 7, and the second heat source 73 extends into the through hole 211 and is attached to the heat dissipation plate 1. The surface of the heat dissipation plate 1 opposite to the composite plate 2 is attached to the rear cover 8, one of the two opposite surfaces of the first heat source 72 is attached to the panel 6, and the other surface is attached to the surface of the composite plate 2 away from the heat dissipation plate 1.
So, through set up the composite sheet that has certain thickness and have cooperation portion 21 on heating panel 1, promoted heating panel 1's structural strength, thickness and plane degree, and then satisfied the requirement of using or assembling.
In a specific embodiment, the electronic device is a notebook computer or a tablet computer, in which case the panel 6 is a keyboard and a frame of the notebook computer or a display and a frame of the tablet computer, the first heat source 72 is a battery, and the second heat source 72 is a heat-generating electronic device.
In light of the foregoing, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made without departing from the scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (9)
1. A heat sink, characterized by: the radiator comprises a radiating plate and at least one composite plate, a cavity is arranged in the radiating plate, the composite plate is attached to the radiating plate, and a matching portion is arranged on the composite plate.
2. The heat sink of claim 1, wherein: the matching part is a through hole and/or a groove.
3. The heat sink of claim 1, wherein: the heat dissipation plate is a phase-change temperature equalization plate, a closed cavity is arranged in the phase-change temperature equalization plate, phase-change working media are filled in the closed cavity, and a capillary structure is arranged in the closed cavity.
4. The heat sink of claim 1, wherein: the heating panel is the liquid cooling board, the liquid cooling board is provided with inlet and liquid outlet, the inlet with the liquid outlet all with the cavity intercommunication.
5. The heat sink of claim 1, wherein: at least one surface of the heat dissipation plate is a plane, and the composite plate is attached to the plane of the heat dissipation plate.
6. The heat sink of claim 1, wherein: the composite sheet has two, the composite sheet includes first composite sheet and second composite sheet, first composite sheet with the plane of heating panel is laminated mutually, the second composite sheet is located first composite sheet is kept away from one side of heating panel, and with first composite sheet laminates mutually, cooperation portion sets up first composite sheet with on the second composite sheet.
7. The heat sink of claim 6, wherein: the composite board is an aluminum plate or an aluminum alloy plate.
8. An electronic device, characterized in that: the electronic device comprising the heat sink of any of claims 1-7.
9. The electronic device of claim 8, wherein: the electronic equipment further comprises a panel, a circuit board, a heat source and a rear cover, the panel and the rear cover are mutually matched and connected to form a mounting cavity, the circuit board, the heat source and the radiator are all mounted in the mounting cavity, and the heat source is attached to the matching portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921311611.2U CN210406041U (en) | 2019-08-13 | 2019-08-13 | Radiator and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921311611.2U CN210406041U (en) | 2019-08-13 | 2019-08-13 | Radiator and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210406041U true CN210406041U (en) | 2020-04-24 |
Family
ID=70359814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921311611.2U Active CN210406041U (en) | 2019-08-13 | 2019-08-13 | Radiator and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210406041U (en) |
-
2019
- 2019-08-13 CN CN201921311611.2U patent/CN210406041U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 213176 No.20, Jiandong Road, Lijia Town, Wujin District, Changzhou City, Jiangsu Province Patentee after: Changzhou Hengchuang Thermal Management System Co.,Ltd. Country or region after: China Address before: 213000 No.20, Jiandong Road, Lijia Town, Wujin District, Changzhou City, Jiangsu Province Patentee before: CHANGZHOU HENGCHUANG HEAT MANAGEMENT Co.,Ltd. Country or region before: China |
|
| CP03 | Change of name, title or address |