CN100358129C - Heat abstractor and method for making same - Google Patents
Heat abstractor and method for making same Download PDFInfo
- Publication number
- CN100358129C CN100358129C CNB2004100153910A CN200410015391A CN100358129C CN 100358129 C CN100358129 C CN 100358129C CN B2004100153910 A CNB2004100153910 A CN B2004100153910A CN 200410015391 A CN200410015391 A CN 200410015391A CN 100358129 C CN100358129 C CN 100358129C
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- heat abstractor
- radiating fin
- preparation
- pedestal
- heat
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a heat radiator and a making method thereof. The heat radiator comprises a base and a plurality of heat radiating fins formed on the base surface, wherein at least one surface of each heat radiating fin is provided with a plurality of grooves. The making method for the heat radiator comprises the following steps: the base and a screen with array-shaped screen holes are provided; a metal sheet is provided, and the screen is arranged on the surface of the metal sheet; corresponding metal corrosive liquid is used as printing liquid for screen printing, and the metal surface forms grooves owing to the corrosion of the corrosive liquid after proper reaction time; then, the screen is taken off; subsequently, the metal sheet is cleaned and punched into heat radiating fins; and finally, the heat radiating fins and the base are assembled into the heat radiator. The surface areas of the heat radiating fins of the heat radiator are increased, and the heat radiation efficiency is improved.
Description
[technical field]
The present invention relates to a kind of heat abstractor and its preparation method, relate in particular to a kind of heat abstractor and its preparation method of radiating fin surfaction.
[background technology]
At present, heat passes in related industry circle, because processor or chipset are along with the raising of arithmetic speed, the internal transistor number constantly increases, and caloric value also improves along with transistorized quantity, therefore, early stage heat abstractor is from need not radiating fin, evolve to the increase radiating fin gradually, improve again, still still can't reach the heat radiation requirement of present processor or chipset with radiating fin collocation fan.
The now existing radiating module that engages heat pipe, radiating fin, fan is widely applied to various 3C Products.Fan in the radiating module provides radiating fin surface advection heat to pass the main activation mechanism of effect.The flow of fan is bigger in theory, the performance that advection heat passes is higher, so can increase the capacity of heat transmission by the flow that increases fan, but, the part 3C Product requires to have portability, and pursue compact, so, the free space of fan will be restricted, and the size of fan certainly will also can be restricted.In addition, fan can cause noise, can influence user's the wish of accepting, and the electromagnetic interference that fan produced all limits the brought into play field of fan to the influence of 3C Product.
In order to increase the area of dissipation of heat abstractor, existing heat abstractor is many to be main material with aluminium or copper sheet, and heat abstractor radiating fin quantity in unit space constantly increases, and radiating fin thickness and spacing constantly reduce.But the spacing of radiating fin is too compact, will cause air flow resistance to improve and influences heat-conducting effect.
In view of this, providing a kind of does not influence air flow efficiency in unit space, and the radiating fin surface area is increased, and then to improve the heat abstractor of radiating efficiency and its preparation method real be necessity.
[summary of the invention]
The heat abstractor that the object of the present invention is to provide a kind of radiating fin surface area to increase.
Another object of the present invention is to provide the preparation method of the heat abstractor that a kind of radiating fin surface area increases.
For realizing the object of the invention, the invention provides a kind of heat abstractor, it comprises: a pedestal; Be formed at a plurality of radiating fins of this base-plates surface, described a plurality of grooves are the mesh array formula and distribute, and these grooves are the shrinkage pool that diameter is identical and the space is provided with.
The present invention also provides a kind of preparation method of above-mentioned heat abstractor, comprises the following steps:
One pedestal and a half tone are provided, utilize the sieve aperture of laser processing technology this half tone manufacturing array shape half tone;
One sheet metal being provided, above-mentioned half tone is placed on the sheet metal surface, is that printed liquid is carried out wire mark with the corrosive liquid of respective metal, and through after the suitable reaction time, this metal surface is subjected to the corrosive liquid corrosion and forms groove, takes off half tone again;
Clean metal sheet material is removed residual corrosive liquid;
Metallic plate punching is become radiating fin, more a plurality of radiating fins and pedestal are assembled into heat abstractor.
Compare with prior art, the present invention is owing to circulation of air between the radiating fin is smooth and easy, and the increase of radiating fin surface roughness, and the convection current conduction effect on radiating fin surface can be because the increase of turbulent flow make radiating efficiency obtain bigger lifting.
[description of drawings]
Fig. 1 is the schematic diagram of array-like half tone sieve aperture of the present invention.
Fig. 2 is the radiating fin schematic surface behind the screen painting of the present invention.
Fig. 3 is the heat abstractor schematic diagram that the present invention has L type radiating fin.
Fig. 4 is the heat abstractor schematic diagram that the present invention has C type radiating fin.
[embodiment]
The present invention is described in further detail below in conjunction with drawings and Examples.
See also Fig. 3, the heat abstractor 3 of the first embodiment of the present invention, it comprises: a pedestal 37; Be formed at a plurality of radiating fins 30 on pedestal 37 surfaces.This radiating fin 30 is the L type, is the good aluminium of heat conductivility, copper or its alloy material.Combine closely by modes such as machinery or welding manners between the radiating fin, and at least one surface of each radiating fin has a plurality of grooves 301.This pedestal 37 is the good copper of thermal conductivity, aluminium or its alloy material, and in addition, this pedestal 37 also comprises a plurality of screws 371 at four edges, is used for fixing with electronic device.Because radiating fin 30 at least one surfaces of radiator have a plurality of grooves 301, make the convection current conduction effect on radiating fin 30 surfaces cause radiating efficiency to promote because of the increase of turbulent flow.
See also Fig. 4, the heat abstractor 4 of the first embodiment of the present invention, it comprises: a pedestal 47; Be formed at a plurality of radiating fins 40 on pedestal 47 surfaces.This radiating fin 40 is the C type, is the good aluminium of heat conductivility, copper or its alloy material.Combine closely by modes such as machinery or welding between the radiating fin, and at least one surface of each radiating fin has a plurality of grooves 401.This pedestal 47 is the good copper of thermal conductivity, aluminium or its alloy material, and in addition, this pedestal 47 also comprises a plurality of screws 471 in four edges, is used for fixing with electronic device.Because radiating fin 40 at least one surfaces of radiator have a plurality of grooves 401, make the convection current conduction effect on radiating fin 40 surfaces cause radiating efficiency to promote because of the increase of turbulent flow.
In addition, those of ordinary skill in the art should be understood that by surfaction and makes the radiating fin with groove structure that making it surface area increases.Because the heat abstractor that this radiating fin and pedestal constitute also can have other associated change, should not limited with described specific embodiment.
Preparation method to heat abstractor of the present invention is described in further detail below in conjunction with embodiment and accompanying drawing:
See also Fig. 1 to Fig. 4, present embodiment carries out upgrading to a kind of surface of flake aluminum sheet material and makes radiating fin, and its step is as follows:
Step 1: a pedestal 37 and a half tone 10 are provided, utilize laser processing technology to half tone 10 manufacturing array shape half tone sieve apertures 12, the optimum range of the spacing of half tone sieve aperture 12 can be 0.05~0.1 micron (as shown in Figure 1).The material of this half tone can be selected the acid resistance sheet metal for use, as stainless steel etc.;
Step 2: a flake aluminum sheet material 20 is provided, and is printed liquid with the corrosive liquid of aluminium, and this corrosive liquid can preferably phosphoric acid solution (in addition, if be the copper coin material, corrosive liquid is frerrous chloride or salpeter solution preferably).The above-mentioned half tone 10 that has half tone sieve aperture 12 is placed on flake aluminum sheet material 20 flat surfaces, with the phosphoric acid solution is that printed liquid is carried out wire mark, through after the suitable reaction time, the surface of this flake aluminum is subjected to the corrosive liquid corrosion can form erosion grooves, and the degree of depth of groove can be controlled by etching time; Take off half tone 10 again, at this moment, the corresponding to arrayed groove 201 of diameter (as shown in Figure 2) of 20 surface formation one of flake aluminum sheet material and half tone sieve aperture 12.
Step 3: through cleaning this flake aluminum sheet material 20, remove residual corrosive liquid again, can finish the surfaction of radiating fin flake aluminum sheet material 20.
Step 4: radiating fin is made in flake aluminum sheet material 20 punch formings that above-mentioned surface had a plurality of grooves, can a plurality of radiating fins be combined closely by modes such as machinery or welding then, and be assembled into heat abstractor by modes such as bonding, welding or buckle and above-mentioned substrate 37.
In addition, under the condition that the flake aluminum sheet material that carries out upgrading can not cause technologies such as follow-up punching press are exerted an influence.The present invention can carry out upgrading to two surfaces of aluminium flake sheet material, forms groove at the aluminium flake plate surface.Be understandable that, when adopting sheet materials such as copper sheet or aluminium alloy, as long as adopt corresponding corrosive liquid also can make corresponding radiating fin.
Heat radiator preparation method of the present invention, wherein, fin surfaction processing procedure can combine with production line, and the flow process of producing line is interrupted.The planning of radiating fin surfaction flow process, only needing increases above-mentioned first three steps producing on the line, can reach of the present invention the upgrading purpose to be carried out on the fin surface, both can save cost, can effectively promote the hot transfer efficiency of radiating fin again, the application of reaching industrial mass production.
Heat abstractor of the present invention, the radiating fin of process surfaction is along with the degree of depth of sieve aperture corrosion, then surface area can significantly increase, cause mainly is to dispel the heat in the heat conducting mode of convection current with the radiating fin surface, do not increasing radiating fin quantity and dwindling under the radiating fin spacer conditions, so increase the surface area of fin, can promote the heat conducting performance of radiating fin surface convection current of heat abstractor.
Heat radiator preparation method of the present invention mainly carries out upgrading to the radiating fin surface.Utilize the processing mode of screen painting, the method for bond chemical corrosion, the effective surface area of increase radiating fin promotes radiating fin surface forced convertion heat conduction efficiency, and makes the usefulness of integral heat sink module can obtain effective lifting.
Claims (10)
1. heat abstractor, it comprises: a pedestal, be formed on a plurality of radiating fins of this base-plates surface, and at least one surface of this radiating fin has a plurality of grooves, it is characterized in that: described a plurality of grooves are the mesh array formula and distribute, and these grooves are the shrinkage pool that diameter is identical and the space is provided with.
2. a kind of heat abstractor as claimed in claim 1, it is characterized in that described radiating fin comprise one with the surface of pedestal contact and at least one surface that is connected with this surface, described at least one surface is provided with above-mentioned groove.
3. a kind of heat abstractor as claimed in claim 1 is characterized in that flute pitch is 0.05~0.1 micron.
4. the preparation method of a heat abstractor comprises the following steps:
Provide a pedestal and to have the half tone of array-like sieve aperture;
One sheet metal being provided, above-mentioned half tone is placed on the sheet metal surface, is that printed liquid is carried out wire mark with the corrosive liquid of respective metal, and through after the suitable reaction time, this metal surface is subjected to the corrosive liquid corrosion and forms groove, takes off half tone again;
Clean metal sheet material;
Metallic plate punching is become radiating fin, and be assembled into heat abstractor with this pedestal.
5. the preparation method of a kind of heat abstractor as claimed in claim 4 is characterized in that the array-like sieve aperture of half tone can be made by laser processing technology.
6. the preparation method of a kind of heat abstractor as claimed in claim 4 is characterized in that radiating fin and pedestal can be by bonding, buckle or welding manner assemblings.
7. the preparation method of a kind of heat abstractor as claimed in claim 4 is characterized in that fin can be made by copper, aluminium or its alloy material.
8. the preparation method of a kind of heat abstractor as claimed in claim 4 is characterized in that half tone can be made by stainless steel.
9. the preparation method of a kind of heat abstractor as claimed in claim 4 is characterized in that corrosive liquid is a phosphoric acid solution.
10. the preparation method of a kind of heat abstractor as claimed in claim 4 is characterized in that corrosive liquid is frerrous chloride or salpeter solution.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2004100153910A CN100358129C (en) | 2004-02-14 | 2004-02-14 | Heat abstractor and method for making same |
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CNB2004100153910A CN100358129C (en) | 2004-02-14 | 2004-02-14 | Heat abstractor and method for making same |
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CN1655345A CN1655345A (en) | 2005-08-17 |
CN100358129C true CN100358129C (en) | 2007-12-26 |
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CNB2004100153910A Expired - Fee Related CN100358129C (en) | 2004-02-14 | 2004-02-14 | Heat abstractor and method for making same |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105357940A (en) * | 2015-12-10 | 2016-02-24 | 重庆航墙电子科技有限公司 | Radiating fin |
CN110340198A (en) * | 2019-06-28 | 2019-10-18 | 鑫佰图科技(惠州)有限公司 | The processing method of radiating fin and radiating fin |
CN111893539A (en) * | 2020-07-07 | 2020-11-06 | 广西保力星照明科技有限公司 | Surface treatment method of aluminum alloy |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2307279Y (en) * | 1997-01-30 | 1999-02-10 | 吴宗 | High density finned radiator |
WO2003061000A1 (en) * | 2002-01-02 | 2003-07-24 | Alcan Technology & Management Ltd. | Heat sink for semiconductor components or similar devices, method for producing the same and tool for carrying out said method |
CN2590170Y (en) * | 2002-12-10 | 2003-12-03 | 技嘉科技股份有限公司 | Radiator structure |
-
2004
- 2004-02-14 CN CNB2004100153910A patent/CN100358129C/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2307279Y (en) * | 1997-01-30 | 1999-02-10 | 吴宗 | High density finned radiator |
WO2003061000A1 (en) * | 2002-01-02 | 2003-07-24 | Alcan Technology & Management Ltd. | Heat sink for semiconductor components or similar devices, method for producing the same and tool for carrying out said method |
CN2590170Y (en) * | 2002-12-10 | 2003-12-03 | 技嘉科技股份有限公司 | Radiator structure |
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CN1655345A (en) | 2005-08-17 |
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