CN105357940A - Radiating fin - Google Patents

Radiating fin Download PDF

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Publication number
CN105357940A
CN105357940A CN201510909800.XA CN201510909800A CN105357940A CN 105357940 A CN105357940 A CN 105357940A CN 201510909800 A CN201510909800 A CN 201510909800A CN 105357940 A CN105357940 A CN 105357940A
Authority
CN
China
Prior art keywords
heat radiation
fin
radiating fin
radiating
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510909800.XA
Other languages
Chinese (zh)
Inventor
陈宗福
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chongqing Hangqiang Electronic Technology Co Ltd
Original Assignee
Chongqing Hangqiang Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chongqing Hangqiang Electronic Technology Co Ltd filed Critical Chongqing Hangqiang Electronic Technology Co Ltd
Priority to CN201510909800.XA priority Critical patent/CN105357940A/en
Publication of CN105357940A publication Critical patent/CN105357940A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Abstract

The invention discloses a radiating fin. The radiating fin includes a radiating fin body and a glue nail; two first radiating groups and a plurality of second radiating groups are arranged on the radiating fin body; the plurality of second radiating groups are located between the two first radiating groups; each first radiating group consists of a plurality of first radiating fins separated from one another; each second radiating group consists of a plurality of second radiating fins separated from one another; and the radiating fin body is also provided with a through hole matched with the glue nail. According to the radiating fin provided by the invention, heat is radiated to the air through the two first radiating groups and the plurality of second radiating groups, thereby achieving the purpose of heat radiation of a heating element, and the radiating fin is simple in structure and strong in practicability.

Description

Fin
Technical field
The invention belongs to fin field, specifically fin.
Background technology
Fin is a kind of to the device of the easy heat-generating electronic elements heat radiation in electrical equipment, and power consumption increases thereupon, and therefore various electronic component also creates very huge heat, brings heat dissipation problem, creates heat abstractor thereupon.
Summary of the invention
The technical problem to be solved in the present invention is to provide fin and can dispels the heat to electronic component.
Technical scheme of the present invention is as follows: fin, comprises heat sink body and glue nail; Described heat sink body is provided with two the first heat radiation groups and multiple second heat radiation group; Multiple described second heat radiation group is all between two described first heat radiation groups; Described first heat radiation group is made up of multiple first radiating fin separated from one another; Described second heat radiation group is made up of multiple second radiating fin separated from one another; Described heat sink body is also provided with follows closely with described glue the perforation coordinated.
Fin provided by the invention, by described two the first heat radiation groups and multiple second heat radiation group in the middle of heat spreader to air, multiple described second heat radiation group all can realize heat radiation in various degree between two described first heat radiation groups, the heat radiation of described first heat radiation group is realized by the first radiating fin separated from one another, the heat radiation of described second heat radiation group is realized by the second radiating fin separated from one another, play the object realized heater element heat radiation, structure is simple, practical.
Further, the face of described heat sink body described first heat radiation group and the second heat radiation group is dorsad provided with the foam that a trap is closed.
Further, described fin also comprises conducting strip; Described conducting strip one end is connected by binder with the described heat sink body face of described first heat radiation group and the second heat radiation group dorsad, and joint face is positioned at closed described foamed cotton ring.
Further, the described first radiating fin length on first direction is greater than the length on described second radiating fin first direction.
Further, the upper surface that described first radiating fin and described second radiating fin contact with air is equipped with multiple groove.
Further, two described first heat radiation groups and multiple described second heat radiation group are arranged in matrix.
Further, between adjacent described between two the first radiating fin, there is arcuate furrow.
Further, two described first heat radiation groups are positioned at outside described heat sink body.
Further, the number of holes that described glue is followed closely and is mated is 2.
Accompanying drawing explanation
Fig. 1 is heat radiating fin structure schematic diagram provided by the invention.
Fig. 2 is fin structure schematic diagram provided by the invention.
Fig. 3 is the first radiating fin provided by the invention and the second radiating fin surface structure schematic diagram.
Fig. 4 is fin side structure schematic diagram provided by the invention.
By illustrating, 1-heat sink body, 2-glue is followed closely, the 3-the first heat radiation group, the 4-the second heat radiation group, the 5-the first radiating fin, the 6-the second radiating fin, 7-foam, 8-conducting strip, 9-groove, 10-arcuate furrow.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
It should be noted that first direction that the present invention mentions refers to X1 direction as shown in Figure 1, X1 direction is parallel with a wherein side of described heat sink body 1.
As shown in Figure 1, fin provided by the invention, comprises heat sink body 1 and glue nail 2; Described heat sink body 1 is provided with two the first heat radiation groups 3 and multiple second heat radiation group 4; Multiple described second heat radiation group 4 is all between two described first heat radiation groups 3; Described first heat radiation group 3 is made up of multiple first radiating fin 5 separated from one another; Described second heat radiation group 4 is made up of multiple second radiating fin 6 separated from one another; Described heat sink body 1 is also provided with follows closely 2 perforation coordinated with described glue.
Fin provided by the invention, by described two the first heat radiation groups and multiple second heat radiation group in the middle of heat spreader to air, multiple described second heat radiation group all can realize heat radiation in various degree between two described first heat radiation groups, the heat radiation of described first heat radiation group is realized by the first radiating fin separated from one another, the heat radiation of described second heat radiation group is realized by the second radiating fin separated from one another, play the object realized heater element heat radiation, structure is simple, practical.
As shown in Figure 2, as specific embodiment, the face of described heat sink body 1 described first heat radiation group 3 and the second heat radiation group 4 is dorsad provided with the foam 7 that a trap is closed, and described foam 7 can be used for insulation, heat radiation, fire prevention.
As shown in Figure 2, as specific embodiment, in order to make heat-generating electronic elements can high efficiency thermal energy transfer give described heat sink body 1, described fin also comprises conducting strip 8, then described conducting strip 8 just can give described heat sink body 1 thermal energy transfer, described conducting strip 8 can be connected by binder with the connection of described heat sink body 1, and joint face is positioned at closed described foam 7 encloses and avoid overlappingly with described foam 7 causing bad effect.
As shown in Figure 1, as specific embodiment, because described first radiating fin keeps to the side, the length that described first radiating fin 5 length on first direction is greater than on described second radiating fin 6 first direction contributes to extending the described fan backing life-span.
As shown in Figure 3, as specific embodiment, the upper surface that described first radiating fin 5 contacts with air with described second radiating fin 6 is equipped with multiple groove 9, effectively increases described fin heat exchange area, contributes to heat radiation.
As shown in Figure 1, as specific embodiment, two described first heat radiation groups 3 and multiple described second heat radiation group 4 are arranged in matrix, ensure that fin can play good radiating effect equally under the limited condition of setting height(from bottom).
As shown in Figure 4, as specific embodiment, there is between adjacent described between two the first radiating fin 5 arcuate furrow 10 and contribute to heat radiation, because two described first heat radiation groups 3 and multiple described second heat radiation group 4 are arranged in matrix, so also there is arcuate furrow 10 contribute to heat radiation between adjacent described between two the second radiating fin 6.
As shown in Figure 1, as specific embodiment, two described first heat radiation groups 3 are positioned at outside described heat sink body 1.
As shown in Figure 1, as specific embodiment, in order to better fix described fin, described glue nail 2 and the number of holes be mated are 2.
These are only embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every equivalent structure utilizing specification of the present invention and accompanying drawing content to do, is directly or indirectly used in the technical field that other are relevant, all in like manner within scope of patent protection of the present invention.

Claims (9)

1. fin, is characterized in that: comprise heat sink body (1) and glue nail (2); Described heat sink body (1) is provided with two the first heat radiation groups (3) and multiple second heat radiation group (4); Multiple described second heat radiation group (4) is all positioned between two described first heat radiation groups (3); Described first heat radiation group (3) is made up of multiple first radiating fin (5) separated from one another; Described second heat radiation group (4) is made up of multiple second radiating fin (6) separated from one another; Described heat sink body (1) is also provided with the perforation of to follow closely (2) with described glue and coordinating.
2. fin according to claim 1, is characterized in that: the face of described heat sink body (1) described first heat radiation group (3) and the second heat radiation group (4) is dorsad provided with the foam (7) that a trap is closed.
3. fin according to claim 2, is characterized in that: described fin also comprises conducting strip (8); Described conducting strip (8) one end is connected by binder with described heat sink body (1) face of described first heat radiation group (3) and the second heat radiation group (4) dorsad, and joint face is positioned at closed described foam (7) circle.
4. fin according to claim 1, is characterized in that: described first radiating fin (5) length on first direction is greater than the length on described second radiating fin (6) first direction.
5. fin according to claim 1, is characterized in that: the upper surface that described first radiating fin (5) contacts with air with described second radiating fin (6) is equipped with multiple groove (9).
6. fin according to claim 1, is characterized in that: two described first heat radiation groups (3) and multiple described second heat radiation group (4) are arranged in matrix.
7. fin according to claim 6, is characterized in that: have arcuate furrow (10) between adjacent described between two the first radiating fin (5).
8. fin according to claim 1, is characterized in that: two described first heat radiation groups (3) are positioned at described heat sink body (1) outside.
9. fin according to claim 1, is characterized in that: described glue nail (2) and the number of holes be mated are 2.
CN201510909800.XA 2015-12-10 2015-12-10 Radiating fin Pending CN105357940A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510909800.XA CN105357940A (en) 2015-12-10 2015-12-10 Radiating fin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510909800.XA CN105357940A (en) 2015-12-10 2015-12-10 Radiating fin

Publications (1)

Publication Number Publication Date
CN105357940A true CN105357940A (en) 2016-02-24

Family

ID=55333758

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510909800.XA Pending CN105357940A (en) 2015-12-10 2015-12-10 Radiating fin

Country Status (1)

Country Link
CN (1) CN105357940A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106558562A (en) * 2016-11-21 2017-04-05 武汉精立电子技术有限公司 A kind of high power load metal-oxide-semiconductor heat abstractor
CN107044406A (en) * 2016-08-31 2017-08-15 浙江永源机电制造有限公司 A kind of air compressor machine with high pressure ability
CN108491046A (en) * 2018-05-22 2018-09-04 郑州天点科技有限公司 A kind of heat radiation type computer cabinet

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2375063Y (en) * 1999-04-02 2000-04-19 富准精密工业(深圳)有限公司 Radiator
CN2490794Y (en) * 2001-06-11 2002-05-08 富准精密工业(深圳)有限公司 Heat sink assembly
CN1655345A (en) * 2004-02-14 2005-08-17 鸿富锦精密工业(深圳)有限公司 Heat abstractor and method for making same
US20090151896A1 (en) * 2007-12-12 2009-06-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
CN205209314U (en) * 2015-12-10 2016-05-04 重庆航墙电子科技有限公司 Radiating fin

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2375063Y (en) * 1999-04-02 2000-04-19 富准精密工业(深圳)有限公司 Radiator
CN2490794Y (en) * 2001-06-11 2002-05-08 富准精密工业(深圳)有限公司 Heat sink assembly
CN1655345A (en) * 2004-02-14 2005-08-17 鸿富锦精密工业(深圳)有限公司 Heat abstractor and method for making same
US20090151896A1 (en) * 2007-12-12 2009-06-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
CN205209314U (en) * 2015-12-10 2016-05-04 重庆航墙电子科技有限公司 Radiating fin

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107044406A (en) * 2016-08-31 2017-08-15 浙江永源机电制造有限公司 A kind of air compressor machine with high pressure ability
CN106558562A (en) * 2016-11-21 2017-04-05 武汉精立电子技术有限公司 A kind of high power load metal-oxide-semiconductor heat abstractor
CN108491046A (en) * 2018-05-22 2018-09-04 郑州天点科技有限公司 A kind of heat radiation type computer cabinet

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Application publication date: 20160224

RJ01 Rejection of invention patent application after publication