CN211352914U - Radiator, circuit board radiating assembly and server - Google Patents
Radiator, circuit board radiating assembly and server Download PDFInfo
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- CN211352914U CN211352914U CN201922495115.3U CN201922495115U CN211352914U CN 211352914 U CN211352914 U CN 211352914U CN 201922495115 U CN201922495115 U CN 201922495115U CN 211352914 U CN211352914 U CN 211352914U
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- circuit board
- chip
- heat sink
- connecting column
- heat dissipation
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Abstract
The utility model discloses a radiator, circuit board radiator unit and server, the radiator includes: the heat dissipation plate comprises a plurality of heat dissipation plates and at least one connecting column, wherein the heat dissipation plates are parallel to each other and are arranged in a stacked mode; the connecting column sequentially penetrates through the center positions of the plurality of radiating fins to integrate the plurality of radiating fins together, and the connecting column is in interference fit with the radiating fins. By adopting the design, the surface nickel plating treatment of the radiating fin can be omitted, the welding can be effectively carried out, the heat conduction in the height direction can be effectively increased by the placing mode, and the radiating efficiency is higher. In addition, the directionality of the original chip installation is changed, and more selectivity is provided on the layout of the computational power chip of the circuit board.
Description
Technical Field
The utility model belongs to the technical field of the circuit board heat dissipation and specifically relates to a radiator, circuit board radiator unit and server are related to.
Background
At present, the heating value of electronic products is larger and larger, the power density is larger and larger, the calculation power chip adopts the BSM technology to carry out metallization processing on the surface of the calculation power chip, and thus, the aluminum radiating fin can be welded with the calculation power chip after surface nickel plating, the processing is troublesome and the cost is higher.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, an object of the present invention is to provide a heat sink, a circuit board heat dissipation assembly and a server.
According to the utility model discloses heat sink of the first aspect embodiment, include: the heat dissipation plate comprises a plurality of heat dissipation plates and at least one connecting column, wherein the heat dissipation plates are parallel to each other and are arranged in a stacked mode; the connecting column sequentially penetrates through the center positions of the plurality of radiating fins so as to integrate the plurality of radiating fins together.
Therefore, the radiator adopts the connecting column to connect the plurality of radiating fins, nickel plating of each radiating fin is avoided, the connecting column is directly plated with nickel or is made of directly-welded materials, machining procedures are saved, and machining cost is reduced.
In some embodiments, the connecting posts are copper posts.
In some embodiments, the connection posts are aluminum posts and one end of the connection posts for soldering with the computational force chip is nickel plated.
In some embodiments, the connecting column is a hollow structure or a solid structure.
In some embodiments, two of the plurality of fins at both ends satisfy the following condition: one of the fins is flush with the end of the connection post and the other fin is spaced from the end of the connection post.
In some embodiments, the connecting column has a positioning step, and the other heat sink abuts against the positioning step to be positioned by the positioning step.
According to the utility model discloses circuit board radiator unit of second aspect embodiment includes: the power calculating device comprises a circuit board and a plurality of radiators, wherein a plurality of power calculating chips are arranged on one side of the circuit board; each force calculating chip is provided with one radiator, the connecting columns correspond to the force calculating chips one by one, and each connecting column is welded with one side, back to the circuit board, of the force calculating chip.
From this, compress tightly a plurality of fin through adopting the spliced pole and be connected to together to through can be in the same place every radiator with the chip integration of calculating power with the spliced pole of calculating power chip welding, so that the heat of calculating the power chip up transmits from calculating the power chip through the spliced pole, and in transmitting a plurality of fin that are passed by the spliced pole through the spliced pole, take away the heat through external realization fan at last, realized the heat dissipation to calculating the power chip from this.
In some embodiments, one end of the connecting column connected with the force calculating chip is a circle internally tangent to the force calculating chip or positioned inside the outer contour of the force calculating chip.
According to the utility model discloses server of third aspect embodiment include circuit board radiator unit. By adopting the design, the surface nickel plating treatment of the radiating fin can be omitted, the welding can be effectively carried out, the heat conduction in the height direction can be effectively increased by the placing mode, and the radiating efficiency is higher. In addition, the directionality of the original chip installation is changed, and more selectivity is provided on the layout of the computational power chip of the circuit board.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic perspective view of a circuit board heat dissipation assembly according to an embodiment of the present invention;
fig. 2 is a schematic top view of a circuit board heat dissipation assembly according to an embodiment of the present invention;
fig. 3 is a schematic front view of a circuit board heat dissipation assembly according to an embodiment of the present invention;
fig. 4 is a partially enlarged schematic view of the area a in fig. 3.
Fig. 5 is a left side view of a circuit board heat dissipation assembly according to the embodiment of the present invention.
Reference numerals:
the circuit board heat dissipation assembly 100, the circuit board 10, the power calculating chip 11, the connecting column 20, the heat sink 30 and the heat sink 31.
Detailed Description
Embodiments of the present invention are described in detail below, and the embodiments described with reference to the drawings are exemplary.
The circuit board heat dissipation assembly 100 and the heat sink of the server according to the embodiment of the present invention are described below with reference to fig. 1 to 5.
According to the utility model discloses heat sink 30 of the first aspect embodiment includes: a plurality of fins 31 and a connecting column 20, wherein the plurality of fins 31 are parallel to each other and are stacked; the connecting column 20 passes through the plurality of heat sinks 31 in sequence to integrate the plurality of heat sinks 31 together, and the connecting column 20 is in interference fit with the heat sinks 31. With reference to fig. 1-4, the plurality of fins are rectangular, but in other embodiments, the shape of the fins may also be circular or square, and the central axis of the connecting column 20 vertically passes through the center of the plurality of fins, i.e. the central axis of the connecting column 20 coincides with the central axis of the fins.
From this, radiator 30 adopts spliced pole 20 to compress tightly a plurality of fin 31 and is connected to together, provides a novel radiator, sets spliced pole 20 to the material that can directly weld for example copper, can realize radiator 30 and the direct welding of chip, has practiced thrift manufacturing procedure, has reduced the processing cost.
When the heat dissipation structure is applied to heat dissipation of a circuit board 10, the connecting columns 20 are used for connecting the plurality of heat dissipation fins 31, each heat radiator 30 and the power calculation chip 11 are integrated together through the connecting columns 20 capable of being welded with the power calculation chip 11, so that heat of the power calculation chip 11 is transmitted upwards from the power calculation chip 11 through the connecting columns 20 and is transmitted into the plurality of heat dissipation fins 31 penetrated through the connecting columns 20, and finally the heat is taken away through an external fan, so that heat dissipation of the power calculation chip 11 is achieved.
Specifically, the heat dissipation fins 31 may be made of aluminum, the surface of the computation force chip 11 is metallized so as to connect with the heat dissipation structure, the connection posts 20 sequentially penetrate through the plurality of heat dissipation fins 31 in each heat sink 30, and then the connection posts 20 may be vertically connected to the surface of the computation force chip 11, and may be connected with the computation force chip 11 by using a welding method.
The connecting column 20 has the functions of being capable of being welded with the power calculating chip 11 and conducting heat, can be made of a single metal material and can also be made of any suitable material of a coating, for example, in some embodiments, the connecting column 20 can be a copper column, so that the connecting column 20 has better heat conduction performance, and the copper column can be directly welded with the power calculating chip 11 without nickel plating, the cost of nickel plating on the surface of aluminum is saved, the process flow is simplified, and the production cost is saved.
In addition, the thermal conductivity of copper is 380w/mk, the thermal conductivity of aluminum is 180w/mk, and the copper cylinder has higher heat dissipation efficiency compared with the traditional method of directly plating nickel on the heat sink 31.
Of course, the present invention is not limited thereto, and in other embodiments, the connection post 20 may be a non-copper post, such as an aluminum post, that is, the connection post 20 may be an aluminum post and the end of the connection post 20 for welding with the computing power chip 11 is plated with nickel. Therefore, the nickel-plated end part of the connecting column 20 can be directly welded with the power calculating chip 11 to fix each radiator 30 on the corresponding power calculating chip 11, so that the heat dissipation of the power calculating chip 11 can be realized, the nickel plating treatment on a plurality of radiating fins 31 is not needed, the end part of the connecting column 20 is only needed to be treated, and the production cost is reduced.
The connecting column 20 may be hollow or solid. When the connection column 20 is a hollow structure, the connection column 20 may also be called a heat pipe column, and the connection column 20 may be a hollow sleeve having an inner hole penetrating through both ends, or a hollow sleeve having an open end and a closed end.
It will be appreciated that the connecting stud 20 and the heat sink 31 may be connected by an interference fit. Referring to fig. 2 and 5, in particular, each heat sink 31 has a mounting hole for the connecting column 20 to pass through, the size of the mounting hole being slightly smaller than the outer diameter of the connecting column 20, so that a plurality of heat sinks 31 can be press-fitted together to the connecting column 20.
In some embodiments, two of the plurality of fins 31 located at both ends satisfy the following condition: one of the fins 31 is flush with the end of the connecting column 20 and the other fin 31 is spaced from the end of the connecting column 20. In other words, of the two heat dissipation fins 31 near both ends of each connection post 20, the heat dissipation fin 31 at one end may be disposed to be flush with the end of the connection post 20, and the heat dissipation fin 31 at the other end may be disposed to be spaced apart from the end of the connection post 20 by a predetermined distance, that is, the heat dissipation fin 31 closest to the power calculating chip 11 is spaced apart from the power calculating chip 11, so as to facilitate the subsequent welding operation of the end of the connection post 20 and the power calculating chip 11.
Alternatively, a positioning structure may be provided on the connection post 20 to maintain the heat sink 31 closest to the force computing chip 11 at a predetermined distance from the force computing chip 11. Specifically, positioning can be achieved in the following manner: the connection post 20 has a positioning step against which the heat sink 31 closest to the force chip 11 abuts to be positioned by the positioning step (not shown in the figure).
According to the utility model discloses circuit board radiator unit of second aspect embodiment includes: the power calculating device comprises a circuit board 10 and a plurality of radiators 30, wherein a plurality of power calculating chips 11 are arranged on one side of the circuit board 10; each force calculating chip 11 is provided with one radiator 30, the connecting columns 20 correspond to the force calculating chips 11 one by one, and one side of each connecting column 20, which is opposite to the circuit board 10, of each force calculating chip 11 is welded. As shown in fig. 4, each heat sink 30 includes a plurality of heat dissipation fins 31 parallel to each other and sequentially distributed in a direction perpendicular to the wiring board 10, and the plurality of heat dissipation fins 31 are penetrated by the connection posts 20 and fixed to the connection posts 20.
Therefore, one heat radiator 30 is connected together in a pressing mode through the connecting column 20, each heat radiator 30 and the power calculating chip 11 are integrated together through the connecting column 20 capable of being welded with the power calculating chip 11, heat of the power calculating chip 11 is transmitted upwards from the power calculating chip 11 through the connecting column 20 and is transmitted to the plurality of radiating fins 31 penetrated by the connecting column 20 through the connecting column 20, and finally the heat is taken away through an external cooling fan, so that heat dissipation of the power calculating chip 11 is achieved. By adopting the design, the surface nickel plating treatment of the radiating fin 31 can be omitted, the welding can be effectively carried out, the heat conduction in the height direction can be effectively increased by the placing mode, and the radiating efficiency is higher. In addition, the directionality of the original chip mounting is changed, and the layout of the power chip 11 of the circuit board 10 has more selectivity.
In the specific example shown in fig. 1, one end of the connection post 20 connected to the force calculating chip 11 is a circle inscribed in the force calculating chip 11 or located inside the outer contour of the force calculating chip 11. That is, the cross section of the connection post 20 may be circular, and the outer diameter of the connection post 20 may be equal to the diameter of the circle inscribed in the force calculating chip 11, or may be located inside the circle inscribed in the force calculating chip 11. Therefore, the connection of the connecting column 20 and the force calculating chip 11 is firmer, more compact and more reliable. It will of course be appreciated that alternative to circular cross-section copper pillars could be square cross-section copper pillars, rectangular cross-section copper pillars, etc.
Referring to fig. 4, each heat sink 30 includes a connection column 20, a plurality of computation force chips 11 are distributed in multiple rows and multiple columns along the length direction and the width direction of the circuit board 10, each of the heat dissipation fins 31 is rectangular, the plurality of heat dissipation fins 31 in each heat sink 30 are stacked along the axial direction of the connection column 20 or the thickness direction of the circuit board 10, and the distribution modes of the plurality of heat sinks 30 and the computation force chips 11 are consistent.
Of course, the present invention is not limited thereto, and in other embodiments, each heat sink 30 includes a plurality of (i.e., at least one) connecting posts 20, and the connecting posts 20 belonging to the same heat sink 30 are respectively welded to the plurality of power calculating chips 11 distributed along the width direction of the circuit board 10 in a one-to-one correspondence manner. Each radiator 30 can radiate two or more force calculating chips 11, and the modularization degree of the whole radiating device is higher.
The server according to the third aspect of the present invention includes the circuit board heat sink assembly 100. By adopting the design, the surface nickel plating treatment of the radiating fin 31 can be omitted, the welding can be effectively carried out, the heat conduction in the height direction can be effectively increased by the placing mode, and the radiating efficiency is higher. In addition, the directionality of the original power calculating chip 11 mounting is changed, and the layout of the power calculating chip 11 of the circuit board 10 has more selectivity.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (9)
1. A heat sink, comprising:
a plurality of heat radiating fins which are parallel to each other and are stacked;
the connecting column sequentially penetrates through the center positions of the plurality of radiating fins so as to integrate the plurality of radiating fins together.
2. The heat sink as claimed in claim 1, wherein the connection posts are copper posts.
3. The heat sink as claimed in claim 1, wherein the connection posts are aluminum posts and one end of the connection posts for soldering with a power chip is plated with nickel.
4. The heat sink as claimed in any one of claims 1 to 3, wherein the connecting columns are of hollow or solid construction.
5. The heat sink according to any one of claims 1 to 3, wherein two of the plurality of fins located at both ends satisfy the following condition: one of the fins is flush with the end of the connection post and the other fin is spaced from the end of the connection post.
6. The heat sink as claimed in claim 5, wherein the connection column has a positioning step, and the other heat dissipating fin abuts against the positioning step to be positioned by the positioning step.
7. A circuit board heat dissipation assembly, comprising:
the force calculating device comprises a circuit board, a plurality of force calculating chips and a plurality of control units, wherein one side of the circuit board is provided with the force calculating chips;
the radiator of any one of claims 1-6 is arranged on each force calculating chip, connecting columns of the radiator correspond to the force calculating chips one by one, and each connecting column is welded with one side, opposite to the circuit board, of the force calculating chip.
8. A circuit board heat dissipation assembly as recited in claim 7, wherein the end of the connection post connected to the computation chip is a circle inscribed in the computation chip or located inside the outer contour of the computation chip.
9. A server comprising the circuit board heat sink assembly of any one of claims 7-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922495115.3U CN211352914U (en) | 2019-12-31 | 2019-12-31 | Radiator, circuit board radiating assembly and server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922495115.3U CN211352914U (en) | 2019-12-31 | 2019-12-31 | Radiator, circuit board radiating assembly and server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211352914U true CN211352914U (en) | 2020-08-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922495115.3U Active CN211352914U (en) | 2019-12-31 | 2019-12-31 | Radiator, circuit board radiating assembly and server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211352914U (en) |
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2019
- 2019-12-31 CN CN201922495115.3U patent/CN211352914U/en active Active
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