CN109548268A - A kind of PCB impedance adjustment, control system and a kind of PCB layout plate - Google Patents
A kind of PCB impedance adjustment, control system and a kind of PCB layout plate Download PDFInfo
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- CN109548268A CN109548268A CN201811295721.4A CN201811295721A CN109548268A CN 109548268 A CN109548268 A CN 109548268A CN 201811295721 A CN201811295721 A CN 201811295721A CN 109548268 A CN109548268 A CN 109548268A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
The invention proposes a kind of PCB impedance adjustment, control system and a kind of PCB layout plates.Layout design is carried out using to the region PCB Breakout, makes PCB Breakout that area of isolation be needed to be square as far as possible or polygon；It is re-packed according to layout design, measures the numerical value and Er1 of W1, W2, T1 of its signal wire, H1 value；The numerical value of measurement is input to impedance computation software, in processing procedure allowed band, adjusts C1, the value of C2, CEr, as far as possible increase C1, the value of C2, CEr, when selecting closest to target impedance value, corresponding target C1, target C2, the value of target CEr；By rationally designing the layout in the region breakout and changing the green paint material in the region breakout, and the position that the region breakout needs to change green paint is isolated with isolation jig, and the green paint new in the spraying of this position, the impedance in the region breakout can be reduced, make it as far as possible close to design impedance value, so that signal integrity can be improved.
Description
Technical field
The present invention relates to PCB (Printed Circuit Board, printed circuit board) technical fields, specifically a kind of
PCB impedance adjustment, control system and a kind of PCB layout plate.
Background technique
Along with internet, the fast development of big data, the arrival of cloud computing era, more and more business need by
Server realizes that graphics process, data calculate, and with the increase of portfolio, the stability of server is become more and more important.Clothes
Most important part is high-speed signaling designs in business device design, if high-speed signaling designs are bad, it is possible to make design function
It is impacted, it is serious to make system cisco unity malfunction.The core of problems of Signal Integrity is impedance matching, and design one is complete
The matched link of whole impedance is the target of Signal Integrity Design.But for the region Breakout of chip, Breakout is
Ball Grid Array, i.e. fan-out area, welded ball array encapsulation, since space limits, signal line width is restricted, and one
As be less than 4min width, the impedance of its impedance and non-chip BGA area in this way will have impedance discontinuity.Existing skill
Art scheme is to reduce the width of signal wire in the BGA area of chip, other to remain unchanged, and that is to say to default in BGA area exist
The signal wire of impedance discontinuity.As shown in Figure 1, the intensive region of via hole is BGA area, limited by space, this region
For line width than external line width, these narrow line widths are referred to as Breakout wiring, this region impedance is larger.Breakout wiring solution
After limitation, line width becomes normal line width, and impedance also becomes the normal impedance of design.In the wiring region Breakout of chip
Domain, since space limits, cabling attenuates, thus herein cause impedance to become larger, bring the impedance discontinuity of entire link, impedance
It discontinuously will lead to problems of Signal Integrity.
Summary of the invention
For disadvantage mentioned above, the invention proposes a kind of PCB impedance adjustment, control system and a kind of PCB layout plate,
The impedance value for reducing the region BreakOut, keeps the impedance of its impedance and normal region consistent as far as possible, avoids problems of Signal Integrity.
The region BreakOut is divided into TOP, BOT layers and internal layer, and the present invention is effective just for TOP the and BOT outer layer containing green paint layer.
The embodiment of the invention provides a kind of PCB impedance adjustments, comprising the following steps:
S1: layout design is carried out to the region PCB Breakout；PCB Breakout is set to need area of isolation regular
Shape；
S2: it to the region PCB Breakout, is re-packed according to layout design, measures W1, W2, T1's of its signal wire
Numerical value and Er1, H1 value；Wherein W1 be signal wire be upper surface width, W2 be signal wire be lower surface width, T1 is signal wire
Thickness, Er1 are that the signal wire dielectric constant of medium FR4, H1 between the plane of reference are at a distance from signal wire to the plane of reference；
S3: the numerical value and Er1 of signal wire W1, W2, T1 will be measured, H1 value is input to impedance computation software, in processing procedure
In allowed band, dynamic adjusts C1, and the value of C2, CEr calculate separately its impedance and compare with target impedance value, selects
When closest to target impedance value, corresponding target C1, target C2, the value of target CEr；Wherein C1 is the green paint of signal wire or so
Thickness, C2 are the dielectric constant that green Qi Houdu, CEr right above signal wire is green paint layer；
S4: jig identical with the shape of rule to the production of PCB Breakout area of isolation, and according to target C1, target
C2, target CEr value adjust the green paint sprayed in PCB Breakout area of isolation.
Further, the shape of the rule includes square or polygon.
Further, the target impedance value is the impedance value of normal region.
Further, the specific steps of the S3 are as follows:
Open polar impedance computation software；
Select outer layer difference without welding resistance mode；
W1, W2, T1, Er1 are inputted, H1, in processing procedure allowed band, dynamic adjusts C1, and the value of C2, CEr calculate separately it
Impedance；
And calculated impedance and target impedance value compare, it is corresponding when selecting closest to target impedance value
Target C1, target C2, the value of target CEr.
A kind of PCB impedance control system characterized by comprising
Design cell: for carrying out layout design to the region PCB Breakout；PCB Breakout is set to need isolated area
Domain is the shape of rule；
Re-pack measuring unit: for being re-packed according to layout design, measuring its signal to the region PCB Breakout
The numerical value and Er1 of W1, W2, T1 of line, H1 value；
Calculate selecting unit: for that will measure the numerical value and Er1 of signal wire W1, W2, T1, H1 value is input to impedometer
Calculate software, in processing procedure allowed band, dynamic adjust C1, the value of C2, CEr, calculate separately its impedance and and target impedance value into
Row comparison, when selecting closest to target impedance value, corresponding target C1, target C2, the value of target CEr.
Make spray unit: for making jig identical with the shape of rule to PCB Breakout area of isolation, and
According to target C1, target C2, target CEr value adjusts the green paint sprayed in PCB Breakout area of isolation.
Further, the measuring unit that re-packs includes re-pack unit and measuring unit；
The unit that re-packs: for being beaten according to the signal wire shaped that layout is designed to the region PCB Breakout
Plate；
The measuring unit: for measuring the numerical value and Er1 of W1, W2, T1 of the signal wire according to layout design, H1
Value.
Further, the calculating selecting unit includes computing unit and selecting unit；
The computing unit: for that will measure the numerical value and Er1 of signal wire W1, W2, T1, H1 value is input to impedometer
Software is calculated, in processing procedure allowed band, dynamic adjusts C1, and the value of C2, CEr calculate separately its impedance；
The selecting unit: the impedance for calculating computing unit is compared with target impedance value respectively, choosing
When selecting out closest to target impedance value, corresponding target C1, target C2, the value of target CEr.
Further, the production spray unit includes production unit and spray unit；
The production unit: for PCB Breakout area of isolation production jig identical with the shape of rule；
The spray unit: for according to target C1, target C2, target CEr value, adjustment to be in PCB Breakout isolated area
The green paint of domain spraying.
Further, a kind of PCB layout plate is made according to a kind of PCB impedance adjustment.
The effect provided in summary of the invention is only the effect of embodiment, rather than invents all whole effects, above-mentioned
A technical solution in technical solution have the following advantages that or the utility model has the advantages that
The invention proposes a kind of PCB impedance adjustment, control system and a kind of PCB layout plates.Using to PCB
The region Breakout carries out layout design, and so that PCB Breakout is needed area of isolation as far as possible is the square or polygon of rule
Shape, in order to the subsequent green paint of spraying；According to layout design re-pack, measure the numerical value of W1, W2, T1 of its signal wire with
And Er1, H1 value；The numerical value and Er1 of signal wire W1, W2, T1 will be measured, H1 value is input to impedance computation software, in processing procedure
In allowed band, dynamic adjusts C1, and the value of C2, CEr calculate separately its impedance and compare with target impedance value, selects
When closest to target impedance value, corresponding target C1, target C2, the value of target CEr；Practical process conditions, as far as possible increase C1,
The value of C2, CEr, because impedance is inversely proportional.It is identical with the shape of rule to the production of PCB Breakout area of isolation to control
Tool, and according to target C1, target C2, the green paint that the adjustment of target CEr value is sprayed in PCB Breakout area of isolation.By reasonable
It designs the layout in the region breakout and changes the green paint material in the region breakout, and isolated with isolation jig
The region breakout needs to change the position of green paint, and the green paint new in the spraying of this position, can reduce the resistance in the region breakout
It is anti-, make it as far as possible close to design impedance value, so that signal integrity can be improved, this method is easily achieved, and precision is high.
Detailed description of the invention
Fig. 1 is BGA area schematic wiring diagram in the prior art；
Fig. 2 is the single signal wire schematic diagram of outer layer in the embodiment of the present invention 1；
Fig. 3 is to calculate normal region impedance value interface using impedance computation software in the embodiment of the present invention 1；
Fig. 4 is to calculate the region Breakout existing design impedance value circle using impedance computation software in the embodiment of the present invention 1
Face；
Fig. 5 is a kind of PCB impedance adjustment flow chart in the real-time example 1 of the present invention；
Fig. 6 is to calculate impedance value interface after the region Breakout adjusts using impedance computation software in example 1 in real time of the invention；
Fig. 7 is to change position view according to the green paint in the region Breakout after calculating in example 1 in real time of the invention；
Fig. 8 is a kind of PCB impedance control system architecture diagram in example 1 in real time of the invention.
Specific embodiment
In order to clarify the technical characteristics of the invention, below by specific embodiment, and its attached drawing is combined, to this hair
It is bright to be described in detail.Following disclosure provides many different embodiments or example is used to realize different knots of the invention
Structure.In order to simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.In addition, the present invention can be with
Repeat reference numerals and/or letter in different examples.This repetition is that for purposes of simplicity and clarity, itself is not indicated
Relationship between various embodiments and/or setting is discussed.It should be noted that illustrated component is not necessarily to scale in the accompanying drawings
It draws.Present invention omits the descriptions to known assemblies and treatment technology and process to avoid the present invention is unnecessarily limiting.
Embodiment 1
The embodiment of the present invention 1 provides a kind of PCB impedance adjustment, control system and a kind of PCB layout plate.
As shown in Fig. 2, it is the outer layer schematic diagram of single signal, the trapezoidal of black is signal wire, and upper surface width is
W1, lower surface width is W2, with a thickness of T1.Black rectangles are the plane of reference, generally ground level, signal wire to the plane of reference
Distance is H1.It is medium FR4, dielectric constant Er1 between signal wire and the plane of reference.C1, C2 are the thickness of the green paint layer of PCB surface
Degree, wherein C1 is the green Qi Houdu of signal wire or so, and C2 is the green Qi Houdu right above signal wire.Under normal circumstances, the thickness of C1
Degree is greater than C2.
The parameters of signal wire shown in Fig. 2, impedance and diagram have relationship, PCB after the completion of impedance value design
The change that Er1, H1, T1, W1 and W2 can not be designed again in plate factory process, but the green paint as surface layer, can be with
It is adjusted according to design, that is, C1, C2, CEr can be adjusted in the last of design according to impedance needs, so that it is hindered
Resist as far as possible close to target impedance value, and then reach link impedance matching, improves the purpose of signal integrity.
According to normal design situation, normal region impedance is calculated as shown in figure 3, calculating the impedance in the region Breakout as schemed
Shown in 4, it can be seen that the impedance in the region Breakout deviates 49.51 ohm to 18% of normal impedance, wherein normal impedance 49.51
For target impedance value.
By above analysis it is found that the C1 in the region Breakout can be adjusted according to actual design, C2, CEr value makes to adjust
Impedance afterwards is as far as possible close to 49.51 ohm of target impedance value.
It is illustrated in figure 5 a kind of PCB impedance adjustment flow chart；
In step S501, the process is started to process；
In step S502, layout design is carried out to the region PCB Breakout, PCB Breakout is made to need isolated area
Domain is the square or regular polygon of rule as far as possible, in order to the subsequent green paint of spraying.
In step S503, to the region PCB Breakout, is re-packed according to layout design, measure its signal wire
The numerical value and Er1 of W1, W2, T1, H1 value.Wherein W1 be signal wire be upper surface width, W2 be signal wire be lower surface width,
T1 is signal wire thickness, Er1 is that the dielectric constant of medium FR4, H1 are signal wire to the plane of reference between signal wire and the plane of reference
Distance.
In step S504, the numerical value and Er1 of signal wire W1, W2, T1 will be measured, it is soft that H1 value is input to impedance computation
Part, in processing procedure allowed band, dynamic adjusts C1, and the value of C2, CEr increase C1, and the value of C2, CEr calculate its impedance.Wherein C1
Green Qi Houdu, C2 for signal wire or so are the dielectric constant that green Qi Houdu, CEr right above signal wire is green paint layer.
In step S505, calculated impedance and target impedance value are compared, selected closest to target impedance
When value, corresponding target C1, target C2, the value of target CEr.
In step S506, jig identical with the shape of rule to the production of PCB Breakout area of isolation, and according to
Target C1, target C2, target CEr value adjust the green paint sprayed in PCB Breakout area of isolation.
In step s 507, process terminates.
Fig. 6 is that impedance value surface chart after the adjustment of the region Breakout is calculated using impedance computation software, as seen from the figure,
C1, C2, CEr desirable maximum value is 3.8,3,6.It brings this data into impedance computation software, obtains the impedance in the region breaout
It is 51.81 ohm, substantially improves impedance continuity.
Fig. 7 is to change position view according to the green paint in the region Breakout after calculating in example 1 in real time of the invention；Area of isolation
Production isolation jig, covers other regions, and retain area of isolation out, green paint of the spraying after improving in this region.
The embodiment of the present invention also proposed a kind of PCB impedance control system, which includes
Design cell: for carrying out layout design to the region PCB Breakout；PCB Breakout is set to need isolated area
Domain is the shape of rule；
Re-pack measuring unit: for being re-packed according to layout design, measuring its signal to the region PCB Breakout
The numerical value and Er1 of W1, W2, T1 of line, H1 value；
The measuring unit that re-packs includes re-pack unit and measuring unit；
Re-pack unit: for being re-packed according to the signal wire shaped that layout is designed to the region PCB Breakout；
Measuring unit: for measuring the numerical value and Er1 of W1, W2, T1 of the signal wire according to layout design, H1 value.
Calculate selecting unit: for that will measure the numerical value and Er1 of signal wire W1, W2, T1, H1 value is input to impedometer
Calculate software, in processing procedure allowed band, dynamic adjust C1, the value of C2, CEr, calculate separately its impedance and and target impedance value into
Row comparison, when selecting closest to target impedance value, corresponding target C1, target C2, the value of target CEr.
Calculating selecting unit includes computing unit and selecting unit；
Computing unit: for that will measure the numerical value and Er1 of signal wire W1, W2, T1, it is soft that H1 value is input to impedance computation
Part, in processing procedure allowed band, dynamic adjusts C1, and the value of C2, CEr calculate separately its impedance；
Selecting unit: the impedance for calculating computing unit is compared with target impedance value respectively, is selected
When closest to target impedance value, corresponding target C1, target C2, the value of target CEr.
Make spray unit: for making jig identical with the shape of rule to PCB Breakout area of isolation, and
According to target C1, target C2, target CEr value adjusts the green paint sprayed in PCB Breakout area of isolation.
Making spray unit includes production unit and spray unit；
Production unit: for PCB Breakout area of isolation production jig identical with the shape of rule；
Spray unit: for according to target C1, target C2, target CEr value, adjustment to be in the spray of PCB Breakout area of isolation
The green paint applied.
The embodiment of the present invention also proposed a kind of PCB layout plate, the wiring plate be a kind of PCB impedance adjustment production and
At
Although specification and drawings and examples have been carried out detailed description to the invention, this field skill
Art personnel should be appreciated that and still can be modified or replaced equivalently to the invention；And all do not depart from wound of the present invention
The technical solution and its improvement for the spirit and scope made, are encompassed by the protection scope of the invention patent.
Claims (9)
1. a kind of PCB impedance adjustment, which comprises the following steps:
S1: layout design is carried out to the region PCB Breakout；PCB Breakout is set to need the shape of area of isolation rule；
S2: it to the region PCB Breakout, is re-packed according to layout design, measures the numerical value of W1, W2, T1 of its signal wire
And Er1, H1 value；Wherein W1 be signal wire be upper surface width, W2 be signal wire be lower surface width, T1 be signal wire thickness
Degree, Er1 are that the signal wire dielectric constant of medium FR4, H1 between the plane of reference are at a distance from signal wire to the plane of reference；
S3: will measure the numerical value and Er1 of signal wire W1, W2, T1, and H1 value is input to impedance computation software, allow in processing procedure
In range, dynamic adjusts C1, and the value of C2, CEr calculate separately its impedance and compare with target impedance value, selects and most connect
When close-target impedance value, corresponding target C1, target C2, the value of target CEr；Wherein C1 is that the green paint of signal wire or so is thick
Degree, C2 are the dielectric constant that green Qi Houdu, CEr right above signal wire is green paint layer；
S4: to the production of PCB Breakout area of isolation and the identical jig of regular shape, and according to target C1, target C2,
Target CEr value adjusts the green paint sprayed in PCB Breakout area of isolation.
2. a kind of PCB impedance adjustment according to claim 1, which is characterized in that the shape of the rule includes just
Rectangular or polygon.
3. a kind of PCB impedance adjustment according to claim 1, which is characterized in that the target impedance value is normal
The impedance value in region.
4. a kind of PCB impedance adjustment according to claim 1, which is characterized in that the specific steps of the S3 are as follows:
Open polar impedance computation software；
Select outer layer difference without welding resistance mode；
W1, W2, T1, Er1 are inputted, H1, in processing procedure allowed band, dynamic adjusts C1, and the value of C2, CEr calculate separately its resistance
It is anti-；
And calculated impedance and target impedance value compare, when selecting closest to target impedance value, corresponding target
C1, target C2, the value of target CEr.
5. a kind of PCB impedance control system characterized by comprising
Design cell: for carrying out layout design to the region PCB Breakout；PCB Breakout is set to need area of isolation
The shape of rule；
Re-pack measuring unit: for being re-packed according to layout design, measuring its signal wire to the region PCB Breakout
The numerical value and Er1 of W1, W2, T1, H1 value；
Calculate selecting unit: for that will measure the numerical value and Er1 of signal wire W1, W2, T1, it is soft that H1 value is input to impedance computation
Part, in processing procedure allowed band, dynamic adjusts C1, and the value of C2, CEr calculate separately its impedance and carries out pair with target impedance value
Than, when selecting closest to target impedance value, corresponding target C1, target C2, the value of target CEr；
Make spray unit: for the production of PCB Breakout area of isolation and the identical jig of regular shape, and according to
Target C1, target C2, target CEr value adjust the green paint sprayed in PCB Breakout area of isolation.
6. a kind of PCB impedance control system according to claim 5, which is characterized in that the measuring unit that re-packs includes
Re-pack unit and measuring unit；
The unit that re-packs: for being re-packed according to the signal wire shaped that layout is designed to the region PCB Breakout；
The measuring unit: for measuring the numerical value and Er1 of W1, W2, T1 of the signal wire according to layout design, H1 value.
7. a kind of PCB impedance control system according to claim 5, which is characterized in that the calculating selecting unit includes
Computing unit and selecting unit；
The computing unit: for that will measure the numerical value and Er1 of signal wire W1, W2, T1, it is soft that H1 value is input to impedance computation
Part, in processing procedure allowed band, dynamic adjusts C1, and the value of C2, CEr calculate separately its impedance；
The selecting unit: the impedance for calculating computing unit is compared with target impedance value respectively, is selected
When closest to target impedance value, corresponding target C1, target C2, the value of target CEr.
8. a kind of PCB impedance control system according to claim 5, which is characterized in that the production spray unit includes
Production unit and spray unit；
The production unit: for PCB Breakout area of isolation production jig identical with the shape of rule；
The spray unit: for according to target C1, target C2, target CEr value, adjustment to be in the spray of PCB Breakout area of isolation
The green paint applied.
9. a kind of PCB layout plate, which is characterized in that be a kind of PCB impedance control according to any one of claims 1 to 4
What method processed was made.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109918330A (en) * | 2019-04-10 | 2019-06-21 | 苏州浪潮智能科技有限公司 | A kind of SATA link impedance optimum design method |
| CN113473702A (en) * | 2021-05-31 | 2021-10-01 | 浪潮电子信息产业股份有限公司 | Electronic equipment and printed circuit board thereof |
| CN114266218A (en) * | 2021-12-24 | 2022-04-01 | 麦田能源有限公司 | PCB layout and wiring method and device |
| CN115455886A (en) * | 2022-08-05 | 2022-12-09 | 上海移柯通信技术股份有限公司 | PCB design method, PCB, electronic device, storage medium and terminal |
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