CN113473702A - Electronic equipment and printed circuit board thereof - Google Patents
Electronic equipment and printed circuit board thereof Download PDFInfo
- Publication number
- CN113473702A CN113473702A CN202110598713.2A CN202110598713A CN113473702A CN 113473702 A CN113473702 A CN 113473702A CN 202110598713 A CN202110598713 A CN 202110598713A CN 113473702 A CN113473702 A CN 113473702A
- Authority
- CN
- China
- Prior art keywords
- signal transmission
- speed signal
- circuit board
- printed circuit
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000008054 signal transmission Effects 0.000 claims abstract description 82
- 229910000679 solder Inorganic materials 0.000 claims abstract description 71
- 239000004020 conductor Substances 0.000 claims abstract description 52
- 239000010410 layer Substances 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 25
- 239000002344 surface layer Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 9
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a printed circuit board, which considers that the influence degree and price of solder masks with different dielectric constants on signal transmission are different (the dielectric constant is in direct proportion to the influence degree and is in inverse proportion to the price) on one hand, and considers that the higher the signal transmission rate, the more easily the interference of the solder masks is, therefore, the application arranges a first solder mask with lower dielectric constant on the area of a high-speed signal transmission conductor, thereby utilizing the first solder mask with low dielectric constant to reduce the interference on high-speed signals, arranges a second solder mask with higher dielectric constant on the area of a low-speed signal transmission conductor, reduces the cost through the second solder mask with high dielectric constant on the basis of not influencing the low-speed signal transmission, and saves the cost on the basis of ensuring the signal transmission effect. The invention also discloses electronic equipment which has the same beneficial effects as the printed circuit board.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a printed circuit board and electronic equipment.
Background
A Printed Circuit Board (PCB) is widely used in electronic devices, a signal transmission conductor (e.g., a copper foil) is generally disposed on a surface layer of a Circuit substrate of the PCB, and a solder mask is generally disposed on the signal transmission conductor for isolating the signal transmission conductor from air and protecting the signal transmission conductor.
Therefore, how to provide a solution to the above technical problem is a problem that needs to be solved by those skilled in the art.
Disclosure of Invention
The invention aims to provide a printed circuit board, which utilizes a first solder mask layer with low dielectric constant to reduce the interference on high-speed signals, and reduces the cost through a second solder mask layer with high dielectric constant on the basis of not influencing the low-speed signal transmission, thereby saving the cost on the basis of ensuring the signal transmission effect; another object of the present invention is to provide an electronic device including the above printed circuit board, wherein the interference to high-speed signals is reduced by using the first solder resist layer with low dielectric constant, and the cost is reduced by using the second solder resist layer with high dielectric constant on the basis of not influencing the transmission of low-speed signals, thereby saving the cost on the basis of ensuring the signal transmission effect.
In order to solve the above technical problem, the present invention provides a printed circuit board, including:
the circuit substrate is used for bearing and fixing the components and the signal transmission conductors;
the high-speed signal transmission conductor is positioned on the surface layer of the circuit substrate and is used for carrying out high-speed signal transmission among components on the printed circuit board;
the low-speed signal transmission conductor is positioned on the surface layer of the circuit substrate and is used for carrying out low-speed signal transmission among components on the printed circuit board;
the first solder mask layer is arranged on the circuit substrate and covers the high-speed signal transmission conductor and is used for isolating the high-speed signal transmission conductor from air;
the second solder mask layer is arranged on the circuit substrate and covers the low-speed signal transmission conductor and is used for isolating the low-speed signal transmission conductor from air;
wherein the dielectric constant of the first solder mask layer is lower than that of the second solder mask layer, and the signal transmission rate of the high-speed signal is greater than that of the low-speed signal.
Preferably, the first solder resist layer and the second solder resist layer are made of the same material type.
Preferably, the first solder mask layer and the second solder mask layer are both made of ink.
Preferably, the circuit substrate is provided with a plurality of holes;
the holes are used for assisting in processing of the circuit substrate, mounting and fixing components or connecting other circuit substrates.
Preferably, the holes are circular holes.
Preferably, the high-speed signal transmission conductor and the low-speed signal transmission conductor are microstrip lines.
Preferably, the high-speed signal transmission conductor and the low-speed signal transmission conductor are both copper microstrip lines.
In order to solve the technical problem, the invention further provides an electronic device comprising the printed circuit board.
The invention provides a printed circuit board, which considers that the influence degree and price of solder masks with different dielectric constants on signal transmission are different (the dielectric constant is in direct proportion to the influence degree and is in inverse proportion to the price), and considers that the higher the signal transmission rate, the more easily the solder masks interfere, therefore, the application arranges a first solder mask with lower dielectric constant on the area of a high-speed signal transmission conductor, thereby utilizing the first solder mask with low dielectric constant to reduce the interference on high-speed signals, arranges a second solder mask with higher dielectric constant on the area of a low-speed signal transmission conductor, reduces the cost through the second solder mask with high dielectric constant on the basis of not influencing the low-speed signal transmission, and saves the cost on the basis of ensuring the signal transmission effect.
The invention also provides electronic equipment which has the same beneficial effects as the printed circuit board.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed in the prior art and the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a printed circuit board according to the present invention;
fig. 2 is a schematic structural diagram of another printed circuit board provided by the present invention.
Detailed Description
The core of the invention is to provide a printed circuit board, which utilizes a first solder mask layer with low dielectric constant to reduce the interference to high-speed signals, and reduces the cost through a second solder mask layer with high dielectric constant on the basis of not influencing the low-speed signal transmission, thereby saving the cost on the basis of ensuring the signal transmission effect; another core of the present invention is to provide an electronic device including the printed circuit board, wherein the first solder resist layer with a low dielectric constant is used to reduce the interference to high-speed signals, and the second solder resist layer with a high dielectric constant is used to reduce the cost on the basis of not influencing the transmission of low-speed signals, thereby saving the cost on the basis of ensuring the signal transmission effect.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a printed circuit board according to the present invention, the printed circuit board includes:
the circuit board 1 is used for bearing and fixing components and signal transmission conductors;
a high-speed signal transmission conductor 2 located on the surface layer of the circuit substrate 1 and used for carrying out high-speed signal transmission between components on the printed circuit board;
the low-speed signal transmission conductor 3 is positioned on the surface layer of the circuit substrate 1 and is used for carrying out low-speed signal transmission among components on the printed circuit board;
a first solder resist layer 4 disposed on the circuit substrate 1 and covering the high-speed signal transmission conductor 2, for insulating the high-speed signal transmission conductor 2 from air;
a second solder resist layer 5 provided on the circuit substrate 1 and covering the low-speed signal transmission conductor 3, for insulating the low-speed signal transmission conductor 3 from air;
wherein, the dielectric constant of the first solder mask layer 4 is lower than that of the second solder mask layer 5, and the signal transmission rate of the high-speed signal is greater than that of the low-speed signal.
Specifically, in view of the technical problems in the above background art, the applicant considers that although the cost of the solder resist layer with a high dielectric constant is low, the solder resist layer with a high dielectric constant is relatively easy to affect the transmission of high-speed signals, that is, the stability of the transmission of high-speed signals is reduced, while the solder resist layer with a low dielectric constant is relatively low in the degree of affecting the transmission of high-speed signals, but the solder resist layer with a low dielectric constant is relatively high in price and relatively poor in sensitivity of low-speed signals, that is, even if the dielectric constant of the solder resist layer is relatively high, the solder resist layer with a corresponding dielectric constant is not significantly affected, so that the applicant in the present application tries to achieve the purpose of reducing the design cost of the solder resist layer on the basis of ensuring the signal transmission effect by arranging the solder resist layer with the corresponding dielectric constant in different regions.
Specifically, in the embodiment of the present invention, the signal transmission conductors are set to two types according to the critical signal transmission rate, that is, the high-speed signal transmission conductor 2 and the low-speed signal transmission conductor 3, so that the first solder resist layer 4 with a lower dielectric constant and the second solder resist layer 5 with a higher node constant are respectively disposed in the area where the high-speed signal transmission conductor 2 is located and the area where the low-speed signal transmission conductor 3 is located, and thus, the transmission effect of the high-speed signal is ensured by the first solder resist layer 4 with a higher cost and less interference, and the low-speed signal transmission conductor 3 with a stronger interference resistance is covered by the second solder resist layer 5 with a lower cost, so that the cost is reduced.
The threshold of the critical signal transmission rate may be set autonomously, and the embodiment of the present invention is not limited herein.
Specifically, specific values of the dielectric constants of the first solder resist layer 4 and the second solder resist layer 5 may be set autonomously, and the embodiment of the present invention is not limited herein.
The invention provides a printed circuit board, which considers that the influence degree and price of solder masks with different dielectric constants on signal transmission are different (the dielectric constant is in direct proportion to the influence degree and is in inverse proportion to the price), and considers that the higher the signal transmission rate, the more easily the solder masks interfere, therefore, the application arranges a first solder mask with lower dielectric constant on the area of a high-speed signal transmission conductor, thereby utilizing the first solder mask with low dielectric constant to reduce the interference on high-speed signals, arranges a second solder mask with higher dielectric constant on the area of a low-speed signal transmission conductor, reduces the cost through the second solder mask with high dielectric constant on the basis of not influencing the low-speed signal transmission, and saves the cost on the basis of ensuring the signal transmission effect.
For better explaining the embodiment of the present invention, please refer to fig. 2, fig. 2 is a schematic structural diagram of another printed circuit board provided by the present invention, and on the basis of the above embodiment:
in a preferred embodiment, the first solder resist layer 4 and the second solder resist layer 5 are made of the same material.
Specifically, the material types of the first solder mask layer 4 and the second solder mask layer 5 are set to be the same type, so that the workload can be reduced, and the working efficiency can be improved.
Of course, the material types of the first solder resist layer 4 and the second solder resist layer 5 may be set to be different types, and the embodiment of the present invention is not limited herein.
In a preferred embodiment, the first solder resist layer 4 and the second solder resist layer 5 are both made of ink.
Specifically, the ink has the advantages of strong stability, low cost and the like.
Of course, the material type of the first solder resist layer 4 and the second solder resist layer 5 may be other than ink, and the embodiment of the present invention is not limited herein.
As a preferred embodiment, the circuit substrate 1 is provided with a plurality of holes 6;
the holes 6 are used for processing the auxiliary circuit board 1, mounting and fixing components, and connecting other circuit boards 1.
Specifically, the arrangement of the hole 6 on the circuit substrate 1 can be used for processing the substrate, mounting and fixing components or connecting other circuit substrates 1, thereby being beneficial to improving the functionality and the working efficiency.
The positions and the number of the holes 6 may be set autonomously, and the embodiment of the present invention is not limited herein.
As a preferred embodiment, the holes 6 are circular holes 6.
Specifically, the circular hole 6 can reduce the area occupied by the circuit board 1, and is highly aesthetic.
Of course, the shape of the hole 6 may be other than circular, and the embodiment of the present invention is not limited herein.
As a preferred embodiment, the high-speed signal transmission conductor 2 and the low-speed signal transmission conductor 3 are microstrip lines.
Specifically, the microstrip line has the advantages of low cost, simple structure, long service life and the like.
Of course, the high-speed signal transmission conductor 2 and the low-speed signal transmission conductor 3 may be of other types besides microstrip lines, and the embodiment of the present invention is not limited herein.
As a preferred embodiment, the high-speed signal transmission conductor 2 and the low-speed signal transmission conductor 3 are each a copper microstrip line.
Specifically, the microstrip line made of copper is favorable for improving the stability of signal transmission.
Of course, the microstrip line may be made of other conductive materials besides copper, and the embodiment of the present invention is not limited herein.
In order to solve the technical problem, the invention further provides an electronic device comprising the printed circuit board.
For the introduction of the electronic device provided by the embodiment of the present invention, reference is made to the foregoing embodiment of the printed circuit board, and the embodiment of the present invention is not described herein again.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. It is further noted that, in the present specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. A printed circuit board, comprising:
the circuit substrate is used for bearing and fixing the components and the signal transmission conductors;
the high-speed signal transmission conductor is positioned on the surface layer of the circuit substrate and is used for carrying out high-speed signal transmission among components on the printed circuit board;
the low-speed signal transmission conductor is positioned on the surface layer of the circuit substrate and is used for carrying out low-speed signal transmission among components on the printed circuit board;
the first solder mask layer is arranged on the circuit substrate and covers the high-speed signal transmission conductor and is used for isolating the high-speed signal transmission conductor from air;
the second solder mask layer is arranged on the circuit substrate and covers the low-speed signal transmission conductor and is used for isolating the low-speed signal transmission conductor from air;
wherein the dielectric constant of the first solder mask layer is lower than that of the second solder mask layer, and the signal transmission rate of the high-speed signal is greater than that of the low-speed signal.
2. The printed circuit board of claim 1, wherein the first solder mask layer and the second solder mask layer are of the same material type.
3. The printed circuit board of claim 2, wherein the first solder mask layer and the second solder mask layer are both ink type.
4. The printed circuit board of claim 1, wherein the circuit substrate has a plurality of holes;
the holes are used for assisting in processing of the circuit substrate, mounting and fixing components or connecting other circuit substrates.
5. The printed circuit board of claim 4, wherein the holes are circular holes.
6. The printed circuit board of claim 1, wherein the high-speed signal transmission conductor and the low-speed signal transmission conductor are microstrip lines.
7. The printed circuit board of claim 6, wherein the high-speed signal transmission conductor and the low-speed signal transmission conductor are both copper microstrip lines.
8. An electronic device characterized by comprising a printed circuit board according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110598713.2A CN113473702B (en) | 2021-05-31 | 2021-05-31 | Electronic equipment and printed circuit board thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110598713.2A CN113473702B (en) | 2021-05-31 | 2021-05-31 | Electronic equipment and printed circuit board thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113473702A true CN113473702A (en) | 2021-10-01 |
| CN113473702B CN113473702B (en) | 2023-11-03 |
Family
ID=77871843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110598713.2A Active CN113473702B (en) | 2021-05-31 | 2021-05-31 | Electronic equipment and printed circuit board thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113473702B (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05299792A (en) * | 1992-04-23 | 1993-11-12 | Nitto Denko Corp | High frequency circuit board |
| JP2004304134A (en) * | 2003-04-01 | 2004-10-28 | Toshiba Corp | Wiring board and manufacturing method of the same |
| JP2005175078A (en) * | 2003-12-09 | 2005-06-30 | Nitto Denko Corp | Printed wiring board |
| JP2008141096A (en) * | 2006-12-05 | 2008-06-19 | Toto Ltd | Printed wiring board |
| JP2011086975A (en) * | 2009-10-13 | 2011-04-28 | Aica Kogyo Co Ltd | Printed circuit board |
| CN103270645A (en) * | 2010-12-22 | 2013-08-28 | 英特尔公司 | Crosstalk reduction for microstrip routing |
| JP2015126011A (en) * | 2013-12-25 | 2015-07-06 | 日本メクトロン株式会社 | Printed-wiring board |
| CN106550531A (en) * | 2015-09-17 | 2017-03-29 | 鸿富锦精密工业(武汉)有限公司 | Circuit board |
| CN109548268A (en) * | 2018-11-01 | 2019-03-29 | 郑州云海信息技术有限公司 | A kind of PCB impedance adjustment, control system and a kind of PCB layout plate |
| WO2020130004A1 (en) * | 2018-12-18 | 2020-06-25 | 株式会社村田製作所 | Circuit board and electronic device |
| CN112672517A (en) * | 2020-12-31 | 2021-04-16 | 株洲菲斯罗克光电技术有限公司 | Circuit board impedance optimization method and impedance optimization circuit board |
-
2021
- 2021-05-31 CN CN202110598713.2A patent/CN113473702B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05299792A (en) * | 1992-04-23 | 1993-11-12 | Nitto Denko Corp | High frequency circuit board |
| JP2004304134A (en) * | 2003-04-01 | 2004-10-28 | Toshiba Corp | Wiring board and manufacturing method of the same |
| JP2005175078A (en) * | 2003-12-09 | 2005-06-30 | Nitto Denko Corp | Printed wiring board |
| JP2008141096A (en) * | 2006-12-05 | 2008-06-19 | Toto Ltd | Printed wiring board |
| JP2011086975A (en) * | 2009-10-13 | 2011-04-28 | Aica Kogyo Co Ltd | Printed circuit board |
| CN103270645A (en) * | 2010-12-22 | 2013-08-28 | 英特尔公司 | Crosstalk reduction for microstrip routing |
| JP2015126011A (en) * | 2013-12-25 | 2015-07-06 | 日本メクトロン株式会社 | Printed-wiring board |
| CN106550531A (en) * | 2015-09-17 | 2017-03-29 | 鸿富锦精密工业(武汉)有限公司 | Circuit board |
| CN109548268A (en) * | 2018-11-01 | 2019-03-29 | 郑州云海信息技术有限公司 | A kind of PCB impedance adjustment, control system and a kind of PCB layout plate |
| WO2020130004A1 (en) * | 2018-12-18 | 2020-06-25 | 株式会社村田製作所 | Circuit board and electronic device |
| CN112672517A (en) * | 2020-12-31 | 2021-04-16 | 株洲菲斯罗克光电技术有限公司 | Circuit board impedance optimization method and impedance optimization circuit board |
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| Publication number | Publication date |
|---|---|
| CN113473702B (en) | 2023-11-03 |
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