CN212628599U - Circuit board and electronic equipment - Google Patents

Abstract

The embodiment of the application discloses circuit board and electronic equipment, and belongs to the technical field of communication equipment. The circuit board comprises a device pad and a through hole, the device pad is correspondingly provided with the through hole, the device pad is connected with the outside through the through hole, and the shortest distance from the center of the through hole to the outer side wall of the device pad is set as a first distance; the through hole is correspondingly provided with the through hole pad, the through hole is arranged in the through hole pad, the shortest distance from the center of the through hole to the outer side wall of the through hole pad is set to be a second distance, and the first distance is larger than the second distance. There is the clearance between the lateral wall of this application via hole pad and the lateral wall of device pad, when electronic equipment's device passes through the tin cream and welds with the device pad, the tin cream can not set up in via hole pad and punchhole department because of its mobility, and the device can accurately weld with the device pad, avoids the device to take place phenomenons such as skew when the welding, has improved the performance of device.

Description

Circuit board and electronic equipment

Technical Field

The present application relates to the field of communications device technology, and more particularly, to a circuit board and an electronic device.

Background

At present, as the functions of electronic equipment are more and more abundant, the layout density of devices on a circuit board is also more and more increased. The outgoing line of the device bonding pad basically needs to be punched to the inner layer, and the inner layer is connected with the bonding pad of the same network through the routing line. For example, in the design of a through hole plate, a via cannot be formed on a device pad, and in the current design, the via is arranged next to the device pad, and referring to fig. 1, a via pad 02 is tangent to a device pad 01, and then the via pad and the device pad are connected through a copper sheet 03.

And the solder mask window 04 of the device pad is larger than the device pad 01, and after the solder mask window of the device pad is finished, part of copper sheets of the via hole pad 02 are stripped, so that the via hole pad is enlarged. Because the pad at the via hole becomes large, when a device is welded with the device pad, the solder paste can be adsorbed towards the via hole direction, so that the welding position of the device finally deviates from the device pad, and the performance of the device is influenced.

Disclosure of Invention

An object of this application is to provide a new technical scheme of circuit board to solve the technical problem that the device is easy to deviate from the pad when the device is fixed with the pad corresponding to the device by welding in the prior art.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides a circuit board. The circuit board includes:

a pad of the device is bonded to the substrate,

the device pad is connected with the outside through the through hole, and the shortest distance from the center of the through hole to the outer side wall of the device pad is set as a first distance;

the via hole is correspondingly provided with the via hole pad, the via hole is arranged in the via hole pad, and the shortest distance from the center of the via hole to the outer side wall of the via hole pad is set as a second distance;

the first distance is greater than the second distance.

In a second aspect, an embodiment of the present application provides an electronic device. The electronic device includes:

the electronic equipment comprises an equipment main body and the circuit board, wherein the equipment main body is electrically connected with the circuit board;

the electronic device includes a device soldered to the device pad by solder paste.

In an embodiment of the application, the shortest distance from the center of a via hole in a circuit board to the outer side wall of a device pad is set as a first distance, the shortest distance from the center of the via hole to the outer side wall of the via hole pad is set as a second distance, and the first distance is greater than the second distance. There is the clearance between the lateral wall of this application via hole pad and the lateral wall of device pad, when electronic equipment's device passes through the tin cream and welds with the device pad, the tin cream can not set up in via hole pad and punchhole department because of its mobility, and the device can accurately weld with the device pad, avoids the device to take place phenomenons such as skew when the welding, has improved the performance of device.

Drawings

Fig. 1 is a schematic structural diagram of a circuit board in the prior art.

Fig. 2 is a schematic structural diagram of a circuit board according to an embodiment of the present application.

Fig. 3 is a second schematic structural diagram of a circuit board according to an embodiment of the present application.

Description of reference numerals:

01-device pad, 02 via, 03-via pad, 011-first pad, 012 second pad,

021 a-first via, 031 a-first via pad, 021 b-second via, 031 b-second via pad,

012a first sub-pad, 022a first sub-via, 032a first sub-via pad, 012b second sub-pad, 022b second sub-via, 032b second sub-via pad,

101-metal overlay, 100-connection line, 102-third pad, 103-solder mask window.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The electronic device provided by the embodiment of the present application is described in detail by specific embodiments with reference to the accompanying drawings.

The embodiment of the application provides a circuit board. Referring to fig. 2 to 3, the circuit board includes:

and a device pad 01, the circuit board being applied to an electronic apparatus, the device pad 01 being used for device soldering corresponding to the electronic apparatus. For example, the device may be a housing of an electronic device, a chip disposed inside the electronic device, or other devices that need to be soldered and fixed.

The device pad 01 is connected with the outside through the via 02, and the shortest distance from the center of the via 02 to the outer side wall of the device pad 01 is set as a first distance D1;

for example, the device pad 01 may be correspondingly provided with one via hole or two via holes, and when the device pad 01 is correspondingly provided with two via holes, the two via holes and the device pad may be in the same network, that is, the two via holes and the device pad are connected by the same connecting line; or two connecting lines are led out from the device bonding pad, one connecting line is connected with the device bonding pad and one through hole, the other connecting line is connected with the device bonding pad and the other through hole, and the two connecting lines are in different networks.

The via hole 02 is correspondingly provided with the via hole pad 03, the via hole 02 is arranged in the via hole pad 03, and the shortest distance from the center of the via hole 02 to the outer side wall of the via hole pad 03 is set as a second distance D2;

for example, the center of via pad 03 and the center of via 02 may coincide, or the center of via pad 03 and the center of via 02 may not coincide, i.e., via 02 is located off-center with respect to via pad 03.

The first distance D1 is greater than the second distance D2.

Through hole pad and the tangent setting of device pad among the prior art, set up the tin cream on the device pad, the tin cream adsorbs easily in through hole department, general condition department producer needs to carry out the consent to the through hole and handles, carry out the consent to the through hole and handle and be formed with the recess (for example the producer needs to be stopped up the through-hole with resin or printing ink material, the consent material is shrink when the solidification, finally recess appears at the both ends of through hole), the recess can long-pending tin pearl that stays, when the tin pearl is too much, the fixed height of device in through hole department can be higher than the height that the device was fixed in device pad department when the paster, influence the stationarity that the device is fixed, and then influence its function and performance.

The shortest distance from the center of the via hole to the outer side wall of the device pad in the circuit board is set to be a first distance, the center of the via hole to the shortest distance from the outer side wall of the via hole pad is set to be a second distance, and the first distance is larger than the second distance. There is the clearance between the lateral wall of this application via hole pad and the lateral wall of device pad promptly, when electronic equipment's device passes through the solder paste and welds with the device pad, the solder paste can not set up in via hole pad and punchhole department because of its mobility, and the device can accurately weld with the device pad, avoids the device to take place phenomenons such as skew when the welding, has improved the performance of device.

In addition, on the one hand, the solder paste is coated on the device bonding pad, and the first distance is arranged between the via hole and the device bonding pad, so that when the via hole is plugged, a solder ball is arranged at the groove of the via hole, the phenomenon that one end of the device is lifted due to the accumulation of the solder ball in the prior art can be prevented, and the stability of the device and the device bonding pad during welding is improved.

Optionally, as shown in fig. 2 to fig. 3, the device pad 01 is correspondingly provided with a first via 021a and a second via 021b, where the first via 021a is correspondingly provided with a first via pad 031a, and the second via 021b is correspondingly provided with a second via pad 031b, where a gap exists between the first via pad 031a and the second via pad 031 b.

Compared with the prior art, the first via pad 031a and the second via pad 031b of the present example do not have a tangent relationship, so that the device pad 01 can be separated out of a line by the first via 021a and the second via 021 b; the pad and the via are connected by a connection line 100, for example, the device pad 01 is connected with the first via 021a by a first connection line, the device pad 01 is connected with the second via 021b by a second connection line, and the first connection line and the second connection line are not crossed or interfered, so that the accuracy of signal transmission is ensured.

Optionally, as shown in fig. 2 to 3, the first via and the second via are symmetrically disposed about a central axis of the device pad 01. This example has guaranteed that device pad 01 is qualified for next round of competitions and can evenly be drawn according to the overall arrangement of first via hole and second via hole, avoids circuit board device pad to be qualified for the next round of competitions phenomenon such as disordered.

Optionally, the first distance is greater than or equal to 0.37 mm. In the case of not changing the overall structure of the circuit board, the first distance is greater than or equal to 0.37mm, which does not affect the arrangement of the via hole and the via hole pad, nor the opening of the solder mask windowing window on the device pad; on the other hand, a gap exists between the via hole bonding pad and the device bonding pad, so that the device and the device bonding pad can be conveniently welded.

In an alternative embodiment, the device pad 01 is provided with a through hole 010.

Specifically, referring to fig. 2, when the device pad 01 is provided with the through hole 010, the device pad 01 is used to carry a device having an opening, for example, the device having an opening may be a sound guide of an electronic apparatus, a sound guide hole of the sound guide is provided corresponding to the through hole 010, and the sound guide is soldered on the circuit board through the device pad 01.

The electronic device may be a microphone, for example. When the electronic equipment is set as a microphone, a sound guide part is arranged on the microphone, and a sound guide hole is formed in the sound guide part; the sound guide part and the device bonding pad provided with the through hole are welded by adopting solder paste, and the sound guide hole and the through hole can be arranged just opposite to each other, so that the phenomena of deviation and the like of the sound guide part and the device bonding pad in the fixing process are avoided, and the phenomena of sound leakage and the like of the microphone are avoided.

Optionally, referring to fig. 3, the device pad 01 is provided with a solder mask window 103, a distance of the solder mask window 103 is smaller than the first distance D1, and a gap exists between the solder mask window and an outer side wall of the via pad 03; wherein the distance of the solder resist window 103 is defined as: a distance D4 between an outer sidewall of the solder mask window and an outer sidewall of the device pad.

It should be noted that: when explaining solder mask windowing, firstly defining a solder mask layer; solder mask layer: the solder mask is characterized in that an insulating layer on the surface layer of the circuit board is covered with a layer of ink to prevent the circuit from being oxidized and play a role in protection, a device pad does not need to be covered with ink and can be exposed to weld the device, and the solder mask window is the size of the part, where copper is exposed, of the position needing to be welded.

This example forms on the circuit board and hinders and welds the windowing, hinder and weld the windowing and can not form the interference with the via hole pad, also can understand to set up on the device pad and hinder when windowing, can not lead to the fact the destruction to the via hole pad that the device pad is right, consequently hinder and be provided with the tin cream in windowing the region, the tin cream also can not be because its mobility sets up in via hole pad and cross downtheholely, in order to avoid via hole and via hole pad department tin pearl too much, the device setting causes the device setting to be unstable easily on the device pad, influence device performance.

Alternatively, referring to fig. 2, the device pad includes a first pad 011 and a second pad 012, the first pad 011 and the second pad 012 being arranged in a first direction of the circuit board; the first direction and the second direction of the circuit board are different, and the length of the first direction is larger than that of the second direction.

Specifically, when the circuit board is provided with a plurality of device pads, the device pads are arranged along the length direction of the circuit board, and the length direction of the circuit board has abundant space, so that the circuit arrangement is facilitated.

For example, the electronic device is a microphone, the microphone comprises a circular pad and a rectangular pad, wherein the circular pad is used for fixing a sound guide part of the microphone, the rectangular pad is used for fixing a microphone chip, and the circular pad and the rectangular pad are arranged along the length direction of the circuit board, so that the internal circuit arrangement of the microphone is facilitated.

In an optional embodiment, the first pad 011 is provided with a first via hole and a first via hole pad arranged corresponding to the first via hole, wherein the first via hole pad and the first pad 011 are arranged along the length direction of the circuit board;

the second pad 012 is provided with a second via hole and a second via pad corresponding to the second via hole, wherein the second via pad and the second pad 012 are arranged along the length direction of the circuit board.

The pads of the electronic device and the corresponding through holes and the corresponding through hole pads are arranged along the length direction of the circuit board, and the circuit board has abundant space in the length direction and is convenient for line arrangement.

Alternatively, as shown in fig. 2, the second pad 012 includes a first sub-pad 012a and a second sub-pad 012b, which are arranged in the second direction of the circuit board, and the first and second sub-pads 012a and 012b are symmetrically arranged about a central axis of the first pad 011.

The first sub pad 012a is correspondingly provided with a first sub via 022a, the second sub pad 012b is correspondingly provided with a second sub via 022b, and the first sub via 022a and the second sub via 022b are symmetrically arranged about the central axis of the first pad 011.

In the embodiment, the first sub-pad and the second sub-pad are arranged along the second direction of the circuit board, and/or the via hole and the via hole pad corresponding to the first sub-pad and the second sub-pad are symmetrically arranged relative to the first pad, so that the device lines are conveniently arranged; on the other hand, a gap exists between the via hole pads correspondingly arranged on the first sub-pad and the second sub-pad, and the phenomena of line short circuit and the like caused by line adhesion are avoided in the aspect of line arrangement.

First sub-pad and second sub-pad of this example are arranged along the length direction of circuit board with first pad respectively for circuit board is walked the wiring overall arrangement and is avoided the mixed and disorderly indiscriminate condition of arranging of circuit board circuit in the both sides on circuit board long limit, reduces because of the unreasonable hidden danger that causes of circuit arrangement.

Alternatively, referring to fig. 2, the first sub pad 012a is correspondingly provided with a first sub via 022a, the second sub pad 012b is correspondingly provided with a second sub via 022b, a shortest distance from a center of the first sub via 022a to an outer sidewall of the first pad 011 is set as a third distance D3,

a first sub-via pad 032a is correspondingly disposed in the first sub-via 022a, and the third distance D3 is greater than a second distance D2 of the first sub-via pad 032 a;

the third distance D3 is greater than the second distance D2.

In this example, the first sub-pad and the first pad are arranged along the length direction of the circuit board, and the first sub-pad is arranged along the length direction of the circuit board corresponding to the first sub-via-hole pad and the first sub-pad, so that the first sub-via-hole pad is substantially located between the first sub-via-hole pad and the first pad, and the third distance of the example is greater than the second distance, that is, a gap is formed between the first sub-via-hole pad and the first pad, thereby avoiding opening a solder-resisting window on the first pad, and preventing the solder-resisting window from affecting the structure of the first sub-via-hole pad.

Alternative embodiment, referring to fig. 2, the shortest distance from the center of the second sub-via 022b to the outer sidewall of the first pad 011 is set to a third distance D3,

a second sub-via pad 032b is correspondingly disposed on the second sub-via 022b, and the third distance D3 is greater than a second distance D2 of the second sub-via pad 032 b;

the third distance D3 is greater than the second distance D2.

In this example, a gap is formed between the second sub-via-hole pad and the first pad, so that the solder mask opening window is prevented from being formed on the first pad, and the solder mask opening window affects the structure of the second sub-via-hole pad.

Optionally, referring to fig. 2, the device pad is provided with a metal cover layer 101, and the metal cover layer 101 is connected to the device pad 01 and is away from a via pad 03 corresponding to the device pad 01.

Specifically, the metal covering layer 101 is arranged on the device pad, the metal covering layer 101 and the device pad belong to the same network, and the metal covering layer 101 can enhance the adhesion of the device pad. For example, as shown in fig. 2, the first sub-pad 012a is provided with a first metal coating layer 101, and the first sub-pad 012a is provided with a second metal coating layer 101. The metal overlayer 101 may be a copper layer, for example.

Referring to fig. 1, in the prior art, a metal covering layer connects a via hole and a device pad, and a solder mask window is arranged on the device pad to damage the structure of the metal covering layer, so that the damaged metal covering layer realizes the function of the pad, and the area of the pad at the via hole is increased; when coating tin cream on the device pad, the tin cream flows via hole and via hole pad through destroyed metallic cover easily, and the device welds and takes place offset and fixed unstable phenomenon easily on the device pad to and cause the device pad face of weld uneven easily, the fixed unstable phenomenon of device etc. (for example because tin cream piles up at via hole and via hole pad easily among the prior art, make certain department tin cream pile up too high, the device welds inequality etc.).

In the example, the metal covering layer is arranged far away from the via hole bonding pad, the solder resisting window is arranged on the device bonding pad, the solder resisting window can damage the structure of the metal covering layer, the damaged metal covering layer cannot form a connection relation with the via hole bonding pad, and therefore the metal covering layer cannot influence the structure of the via hole bonding pad.

Optionally, the circuit board includes a third pad 102, and when the circuit board is applied to an electronic device, the third pad 102 is used for carrying an electronic device housing. For example, when the electronic device is a microphone, the third pad 102 is used for welding with a shielding cover of the microphone, and the shielding cover is used for protecting the microphone.

According to another aspect of the embodiments of the present application, an electronic device is provided. The electronic equipment comprises an equipment main body and the circuit board, wherein the equipment main body is electrically connected with the circuit board;

the electronic device includes a device soldered to the device pad by solder paste.

For example, the device may be a chip of an electronic device, a housing of an electronic device, or other device that requires soldering.

The circuit board is applied to the electronic equipment, when a device of the electronic equipment is welded with the device bonding pad through the solder paste, the solder paste cannot be arranged at the via hole bonding pad and the via hole due to the fluidity of the solder paste, the device can be accurately welded with the device bonding pad, the phenomena of deviation and the like of the device during welding are avoided, and the use performance of the electronic equipment is improved.

Optionally, the electronic device includes a sound guide part, the sound guide part being provided with a sound guide hole;

the device pad is provided with a through hole, the sound guide part is welded with the device pad, and the sound guide hole is arranged corresponding to the through hole.

For example, the electronic device may be a microphone, and the sound guide hole and the through hole of the microphone can be arranged just opposite to each other, so that the phenomena that the sound guide part deviates from a device bonding pad in the fixing process and the like are avoided, and further the phenomena that the microphone leaks sound and the like are avoided.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. The term "comprising" is used to specify the presence of stated features, integers, steps, operations, elements, components, operations.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. A circuit board, the circuit board comprising:

a device bonding pad (01),

the device pad (01) is correspondingly provided with a via hole (02), the device pad (01) is connected with the outside through the via hole (02), and the shortest distance from the center of the via hole (02) to the outer side wall of the device pad (01) is set as a first distance (D1);

the through hole (02) is correspondingly provided with the through hole pad (03), the through hole (02) is arranged in the through hole pad (03), and the shortest distance from the center of the through hole (02) to the outer side wall of the through hole pad (03) is set as a second distance (D2);

the first distance (D1) is greater than the second distance (D2).

2. The circuit board of claim 1, wherein the device pad (01) is correspondingly provided with a first via hole (021a) and a second via hole (021b), wherein the first via hole (021a) is correspondingly provided with a first via pad (031a), the second via hole (021b) is correspondingly provided with a second via pad (031b), and a gap exists between the first via pad (031a) and the second via pad (031 b).

3. The circuit board of claim 1, wherein the first distance (D1) is greater than or equal to 0.37 mm.

4. The circuit board according to claim 1, wherein the device pad (01) is provided with a solder resist window (103), the solder resist window (103) having a distance less than the first distance (D1) and having a gap with an outer sidewall of the via pad (03); wherein the distance of the solder mask window (103) is defined as: a distance (D4) between an outer sidewall of the solder mask window and an outer sidewall of the device pad.

5. The circuit board of claim 1, wherein the device pads (01) comprise a first pad (011) and a second pad (012), the first pad (011) and the second pad (012) being arranged along a first direction of the circuit board; the first direction and the second direction of the circuit board are different, and the length of the first direction is larger than that of the second direction.

6. The circuit board of claim 5, wherein the second pad (012) includes a first sub-pad (012a) and a second sub-pad (012b), the first sub-pad (012a) and the second sub-pad (012b) are arranged in a second direction of the circuit board, and the first sub-pad (012a) and the second sub-pad (012b) are symmetrically arranged about a central axis of the first pad (011).

7. The circuit board according to claim 6, wherein the first sub-pad (012a) is correspondingly provided with a first sub-via (022a), the second sub-pad (012b) is correspondingly provided with a second sub-via (022b), a shortest distance from a center of the first sub-via (022a) to an outer sidewall of the first pad (011) is set to a third distance (D3),

a first sub-via pad (032a) is correspondingly arranged on the first sub-via (022a), and the third distance is greater than the second distance of the first sub-via pad (032 a);

the third distance is greater than the second distance.

8. A circuit board according to claim 1, characterized in that the device pad (01) is provided with a metal overlayer (101), the metal overlayer (101) being connected to the device pad (01) and remote from a via pad (03) corresponding to the device pad (01).

9. An electronic device characterized in that the electronic device comprises a device body, and the circuit board of any one of claims 1 to 8, the device body being electrically connected to the circuit board;

the electronic device includes a device soldered to the device pad by solder paste.

10. The electronic device according to claim 9, characterized in that the electronic device comprises a sound leading part provided with a sound leading hole;

the device pad is provided with a through hole, the sound guide part is welded with the device pad, and the sound guide hole is arranged corresponding to the through hole.

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