KR100346050B1 - Attachment structure for chip-type parts and method for attaching chip-type parts - Google Patents

Abstract

In the conventional attachment structure of chip components, a plurality of pairs of first, second, and third land portions 23, 24, and 25 provided on the printed board 2l have a horizontal line Y on the printed board 2l. In the parallel state, the length of the occupation in the longitudinal direction A2 is increased, which is not suitable for small size.

In order to solve this problem, in the attachment structure of the chip component of the present invention, the pair of first land portions 3 are arranged on a line K inclined with respect to the line Y in the horizontal direction of the printed board 1, Since the first chip component 6 is soldered to the pair of first land portions 3, the space factor of the chip component on the printed circuit board 1 can be improved, particularly in the case where a large number of chip components are provided. Occupancy area can be made small, and the attachment structure of a small chip component can be provided.

Description

ATTACHMENT STRUCTURE FOR CHIP-TYPE PARTS AND METHOD FOR ATTACHING CHIP-TYPE PARTS}

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an attachment structure of a chip component and a method of attaching the chip component which are most suitable for use in circuit boards used in electronic devices such as mobile phones and television tuners.

Background Art [0002] Conventionally, circuit boards used in electronic devices are constructed by mounting various electric parts and chip parts on a printed board.

Referring to FIG. 5, a conventional attachment structure of a chip component mounted on the printed board is provided with a conductive pattern on the surface of the printed board 2l and a land portion on the conductive pattern and the printed board 21. Except for this, the solder resist 22 is formed.

That is, although FIG. 5 shows that the 1st, 2nd, 3rd land parts 23, 24, 25 which consist of a pair are provided, these 1st, 2nd, 3rd land parts 23, 24, 25 has a configuration in which each pair is provided in parallel with the horizontal line Y of the printed circuit board 2l and spaced apart in the vertical line T direction.

The length of the occupation in the longitudinal direction by this installation is the length A2 from the end of the first land portion 23 to the end of the third land portion 25.

In addition, the first, second, and third chip parts 26, 27, and 28, such as resistors and capacitors, are crossed across the pair of first, second, and third land portions 23, 24, and 25, respectively. In each land portion 23, 24, 25 is soldered (30) is attached.

In the chip attaching method, first, as shown in FIG. 6, the cream solder 29 is applied to the pair of first, second, and third land portions 23, 24, and 25 by screen printing or the like. Install.

Next, as shown in FIG. 7, the 1st, 2nd, 3rd chip parts 26, 27, and 28 are respectively attached to the 1st, 2nd, 3rd land parts 23, 24 by the mounting apparatus of a chip component. On the cream solder 29 of FIG.

Each of the first, second, and third chip components 26, 27, and 28 is provided in a state parallel to the horizontal line Y of the printed circuit board 21. As shown in FIG.

This is then conveyed to a heating furnace to melt the cream solder 29 so that the first, second, and third chip parts 26, 27, and 28 respectively have the first, second, and third land portions 23, 24, 25 is soldered (30).

And the 1st, 2nd, 3rd chip components 26, 27, 28 which were soldered 30 are provided in parallel with the line Y of the horizontal direction.

In the conventional attachment structure of chip components, a plurality of pairs of first, second, and third land portions 23, 24, and 25 provided on the printed board 21 have a horizontal line Y on the printed board 21. In the parallel state and spaced apart in the longitudinal direction T, there is a problem that the length A2 in the longitudinal direction becomes large and is not suitable for small size.

1 is a plan view showing a first embodiment of an attachment structure of a chip component of the present invention;

2 is an explanatory diagram showing a method for attaching a chip component of the present invention;

3 is an explanatory diagram showing a method for attaching a chip component of the present invention;

4 is a plan view showing a second embodiment of the attachment structure of the chip component of the present invention;

5 is a plan view showing an attachment structure of a conventional chip component;

6 and 7 are explanatory views showing a conventional method for attaching chip components.

※ Explanation of symbols for main parts of drawing

1 printed board 2 solder resist

3: first land portion 3a: one land portion

3b: other land part 4: second land part

4a: one land part 4b: the other land part

5: third land portion 5a: one land portion

5b: other land portion 6: first chip component

7: second chip part 8: third chip part

9 solder 10 cream solder

A first solution for solving the above problems includes a printed circuit board having at least a pair of first land portions, a first chip component soldered to the pair of first land portions, and the pair of first pairs. The land portion is provided on a line inclined with respect to the horizontal line of the printed board, and the first chip part is soldered to the pair of first land portions.

Further, as a second solution, the longitudinal spacing of the printed circuit boards in the pair of first land portions is determined by the range from which portions of the pair of first land portions are located on the horizontal line. The pair of first land portions were formed to have a width smaller than the width of the chip component so as to be open at intervals in the longitudinal direction.

Moreover, as a 3rd solution means, the said 1st land part was set as the L shape, arc shape, or rectangular shape.

Further, as a fourth solution, the printed board has a pair of second land portions formed separately from the first land portion and installed in parallel with the horizontal line, and a pair of the first land portions. One land portion of the portion is provided so as to be positioned on the longitudinal line in the second land portion in the vicinity of the second land portion, and the other land portion of the first land portion is in the vicinity of the second land portion. It was provided so that it might be located in the said horizontal direction line in a 2nd land part, and it was set as the structure which soldered the 2nd chip component to the said 2nd land part.

As a fifth solution, the first and second land portions are formed separately on the printed board, and have a pair of third land portions provided in parallel with the horizontal line. One land part is located on the horizontal line in the one land part of the first land part in the vicinity of the first land part, and at the other land part of the first land part. It was set so that a part may be located on the said longitudinal line of and the 3rd chip component was soldered to the said 3rd land part.

As a sixth solution, at least a pair of first land portions formed on the printed circuit board are provided on a line inclined with respect to the horizontal line of the printed board, and after the cream solder is provided on the first land portion, The chip solder was placed on the cream solder in a state parallel to the transverse lines of the printed circuit board, and the cream solder was melted in a heating furnace to solder the chip component onto the inclined line.

As a seventh solution, the printed board has a pair of second land portions formed in the vicinity of the first land portion and provided in parallel with the horizontal line. After the cream solder is installed on the land portion, a second chip component is placed on the cream solder in a state parallel to the horizontal line of the printed circuit board, and the cream solder is melted by the heating furnace to form the first chip component. The soldering method was performed by soldering the second chip component to the second land portion simultaneously with soldering.

1 to 4, the attachment structure of the chip component and the attachment method of the chip component of the present invention will be described. FIG. 1 is a plan view showing a first embodiment of the attachment structure of the chip component of the present invention. Explanatory drawing which shows the attachment method of the chip component of this invention, FIG. 3 is explanatory drawing which shows the attachment method of the chip component of this invention, FIG. 4 is a top view which shows 2nd Example of the attachment structure of the chip component of this invention.

Next, a first embodiment of the attachment structure of the chip component of the present invention will be described with reference to FIG. 1, while a conductive pattern (not shown) is provided on the surface of the printed board 1, and the conductive pattern and the printed board 1 The solder resist 2 is formed except the land part.

In a pair of L-shaped first land portions 3 provided on the printed board 1, one land portion 3a and the other land portion 3b are lines in the horizontal direction of the printed board 1. It is provided on the line K inclined with respect to (Y).

Moreover, the space | interval in the line T direction of the longitudinal direction of one land part 32 of the 1st land part 3, and the printed circuit board 1 of the other land part 3b is one land part. Width H of the first chip component 6 from a range (state as shown in FIG. 1) where part 3a and the part of the other land part 3b are located on the line Y in the horizontal direction. In a smaller width, the land portion 3a and the land portion 3b are formed in a range in which the gap is opened vertically.

Further, the pair of second land portions 4 formed on the printed board 1 are formed separately from the first land portions 3, and one land is in parallel with the horizontal line Y. The land portion 4b on the other side is provided with the portion 4a.

The other land portion 4b of the second land portion 4 is a vertical line in one land portion 3a of the first land portion 3 in the vicinity of the first land portion 3. It is arrange | positioned so that it may be located on (T), and it is provided so that it may be located on the horizontal line Y in the other land part 3b of the 1st land part 3.

That is, as shown in FIG. 1, the other land portion 4b of the second land portion 4 is located between the land portion 3a and the land portion 3b below the first land portion 3. It is arranged in.

Also, the pair of third land portions 5 formed on the printed board 1 are formed separately from the first land portions 3 and the second land portions 4, and are formed on the horizontal line Y. One land portion 5a and the other land portion 5b are provided in a state parallel to the other.

One land portion 5a of the third land portion 5 is a line in the horizontal direction in one land portion 3a of the first land portion 3 in the vicinity of the first land portion 3. It is provided so as to be located on Y) and is disposed so as to be located on the longitudinal line T in the other land portion 3b of the first land portion 3.

That is, one land portion 5a of the third land portion 5 is located between the land portion 3a and the land portion 3b above the first land portion 3 as shown in FIG. 1. It is arranged.

In addition, the first, second, and third chip parts 6, 7, 8 made of resistors, capacitors, and the like are respectively crossed with the pair of first, second, and third land portions 3, 4, and 5, respectively. The lands 3, 4, and 5 are soldered 9 in the state.

When each of the chip parts 6, 7, 8 is soldered 9, the first chip part 6 is provided on the line K inclined with respect to the line Y in the horizontal direction. The second and third chip parts 7 and 8 are provided in a state parallel to the line Y in the horizontal direction.

The length of occupation in the vertical direction by this installation is the length A1 from the end of the second land portion 4 to the end of the third land portion 5.

In the method of attaching such chip components, first, as shown in FIG. 2, the cream solder 10 is formed by screen printing or the like on the pair of first, second, and third land portions 3, 4, and 5, respectively. Install it.

Next, as shown in Fig. 3, the first, second and third land portions 3, 4 are used to mount the first, second and third chip parts 6, 7, and 8, respectively, by the mounting device of the chip parts. , 5) on the cream solder (10).

Each of the first, second, and third chip components 6, 7, 8 is provided in a state parallel to the horizontal line Y of the printed circuit board 1.

At this time, as described above, the interval in the longitudinal line T direction between the land portion 3a of the first land portion 3 and the printed circuit board 1 of the other land portion 3b is: From the range (state as shown in FIG. 1) in which one land part 3a and a part of the other land part 3b are located on the horizontal line Y, the first chip part 6 The first chip part 6 is peeled off from the land portions 3a and 3b by forming the land portion 3a and the land portion 3b in a range in which the gap between the land portions 3a and 3b is widened in the vertical direction. It can be installed without.

Thereafter, this is conveyed to a heating furnace to melt the cream solder 10 so that the first, second, and third chip parts 6, 7, and 8 each have the first, second, and third land portions 3, 4, and the like. 5) is soldered (9).

At this time, the second and third chip parts 7 and 8, which are soldered 9, are arranged in a state parallel to the line Y in the horizontal direction, but the cream solder 10 melted on the first chip part 6 side. ) Is drawn to the centers of the land portions 3a and 3b by its surface tension, so that the first chip component 6 also has the end portions of the first chip component 6 corresponding to the land portions 3a and 3b, respectively. ), The first chip component 6 is placed on a line K inclined with respect to the line Y in the horizontal direction.

4 shows a second embodiment of the attachment structure of the chip component of the present invention, which is the first land portion 3 disposed on the line K inclined with respect to the line Y in the horizontal direction. Is formed in an arc shape.

Since the rest of the configuration is the same as in the first embodiment, the same components are denoted by the same reference numerals and the description thereof is omitted here.

In addition, although the shape of the 1st land part 3 was made into the arc shape in 2nd Example, you may use a rectangular thing.

In the attachment structure of the chip component of the present invention, a pair of first land portions 3 are provided on a line K inclined with respect to the line Y in the horizontal direction of the printed circuit board 1, Since the first chip part 6 is soldered to the land part 3, in particular, in the case where a large number of chip parts are provided, the space factor of the chip part on the printed circuit board 1 can be made good and the occupied area is increased. Can be made small, and a small chip component can provide an attachment structure.

In addition, the longitudinal spacing of the printed circuit boards 1 in the pair of first land portions 3 is such that a part of the pair of first land portions 3 is positioned on the horizontal line Y. Since the pair of first land portions 3 have a width that is smaller than the width of the first chip component 6 from the range, the gap is opened in the longitudinal direction from each other, so that when the chip component 6 is placed thereon, the chip The component 6 can be provided with a chip component mounting structure which can be reliably soldered on the inclined line K without peeling off the land portions 3a and 3b.

In addition, since the first land portion 3 has an L shape, an arc shape, or a rectangular shape, the first land portion 3 can be configured in a simple shape, and the shape thereof can be appropriately selected to provide a mounting structure for chip parts with freedom. Can be.

In addition, the printed board 1 has a pair of second land portions 4 formed separately from the first land portion 3 and arranged in parallel with the horizontal line Y. One land portion 3a of the first land portion 3 in the first land portion 3 is disposed on the longitudinal line T in the second land portion 4 in the vicinity of the second land portion 4; At the same time, the other land portion 3b of the first land portion 3 is provided so as to be located on the horizontal line Y in the second land portion 4 in the vicinity of the second land portion 4. Therefore, the space factor in the printed circuit board 1 of the first and second land portions 3 and 4 is good, and a small chip component attachment structure can be provided.

In addition, the printed circuit board 1 is provided with a pair of third land portions 5 formed separately from the first and second land portions 3 and 4 and provided in parallel with the horizontal line Y. One land portion 5a of the third land portion 5 has a horizontal line in one land portion 3a of the first land portion 3 in the vicinity of the first land portion 3. Since a part is located on (Y) and a part is located on the longitudinal line T in the other land part 3b of the first land part 3, the first and second parts are located. The space factor in the printed circuit board 1 of the second and third land portions 3, 4, and 5 is very good, and a small chip component attachment structure can be provided.

In addition, at least a pair of first land portions formed on the printed board 1 are disposed on the line K inclined with respect to the line Y in the horizontal direction of the printed board 1, and on the first land portion 3. After the cream solder 10 is installed, the chip solder 6 is placed on the cream solder 10 in parallel with the horizontal line Y of the printed circuit board 1, and then the cream solder 10 is heated in the heating furnace. ) And soldered the chip component 6 on the inclined line K. Therefore, the chip component 6 was soldered on the inclined line K while the chip component 6 was placed in the transverse direction. (10) A method for attaching a chip component with high productivity can be provided.

In such a method, the mounting device for the chip component 6 may have a function of placing the chip component 6 in the horizontal or vertical direction, and the mounting apparatus can provide a simple method for attaching the chip component. .

In addition, the printed circuit board (1) has a pair of second land portions (4) formed separately from the first land portions (3) and arranged in parallel with the horizontal line (Y). After the cream solder 10 is provided on the second land portion 4, the cream chip 10 is formed on the cream solder 10 in a state parallel to the horizontal line Y of the printed circuit board 1 4), the cream solder 10 was melted in the heating furnace, and the second chip component 7 was soldered to the second land portion 4 simultaneously with the soldering 9 of the first chip component 3. Therefore, the mounting direction of the chip parts 6 and 7 before the soldering 9 can be made constant and simple, especially in the case where a large number of chip parts are used, thereby providing a method for attaching chip parts with good productivity.

Claims (7)

A printed circuit board having a pair of first land portions, a pair of second land portions, and a pair of third land portions; First to third chip parts soldered to the pair of first to third land parts, respectively; The pair of first land portions are provided on a line inclined with respect to the horizontal line of the printed board, and the pair of second and third land portions are arranged on a line parallel to the line in the horizontal direction of the printed board. The pair of first land portions is installed between the pair of second land portions and the pair of third land portions, And the first to third chip components are soldered to the pair of first to third land portions. The method of claim 1, One land portion of the first land portion is provided so as to be located in the vicinity between one land portion of the second land portion and one land portion of the third land portion, And the land portion on the other side of the first land portion is disposed so as to be located between the land portion on the other side of the second land portion and the land portion on the other side of the third land portion. The method of claim 1, And the first land portion has an L shape, an arc shape, or a rectangular shape. delete delete After the cream solder is provided to the first to third land portions of claim 1, First to third chip components are placed on the cream solder in a state parallel to the transverse lines of the printed circuit board; A method for attaching chip components, comprising melting the cream solder in a heating furnace and soldering the first chip component on a line inclined in the transverse direction of the first land portion. The method of claim 6, And the second and third chip components are soldered on a line parallel to the transverse direction of the pair of second and third land portions, respectively.