CN113473702B - Electronic equipment and printed circuit board thereof - Google Patents
Electronic equipment and printed circuit board thereof Download PDFInfo
- Publication number
- CN113473702B CN113473702B CN202110598713.2A CN202110598713A CN113473702B CN 113473702 B CN113473702 B CN 113473702B CN 202110598713 A CN202110598713 A CN 202110598713A CN 113473702 B CN113473702 B CN 113473702B
- Authority
- CN
- China
- Prior art keywords
- signal transmission
- speed signal
- solder mask
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000008054 signal transmission Effects 0.000 claims abstract description 83
- 229910000679 solder Inorganic materials 0.000 claims abstract description 72
- 239000004020 conductor Substances 0.000 claims abstract description 55
- 239000010410 layer Substances 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 9
- 239000002344 surface layer Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 10
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000000976 ink Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application discloses a printed circuit board, which considers that the influence degree and price of a solder mask with different dielectric constants on signal transmission are different (the dielectric constants are in direct proportion to the influence degree and in inverse proportion to the price), and the higher the signal transmission rate is, the more easily the interference of the solder mask is considered, so that the first solder mask with lower dielectric constant is arranged on the area where a high-speed signal transmission conductor is positioned, the interference on a high-speed signal is reduced by using the first solder mask with lower dielectric constant, the second solder mask with higher dielectric constant is arranged on the area where a low-speed signal transmission conductor is positioned, the cost is reduced by using the second solder mask with higher dielectric constant on the basis of not influencing the low-speed signal transmission, and the cost is saved on the basis of ensuring the signal transmission effect. The application also discloses electronic equipment which has the same beneficial effects as the printed circuit board.
Description
Technical Field
The application relates to the field of circuit boards, in particular to a printed circuit board and an electronic device.
Background
PCB (Printed Circuit Board ) has wide application in electronic devices, a surface layer of a circuit substrate of the printed circuit board is usually provided with a signal transmission conductor (e.g. copper foil), and a solder mask layer is usually disposed on the signal transmission conductor in order to isolate the signal transmission conductor from air to protect the signal transmission conductor, however, the prior art is not mature for the design of the distribution of the solder mask layer on the printed circuit board, which may lead to higher cost of the solder mask layer on one hand, and may affect the signal transmission effect of the signal transmission conductor on the other hand.
Therefore, how to provide a solution to the above technical problem is a problem that a person skilled in the art needs to solve at present.
Disclosure of Invention
The application aims to provide a printed circuit board, which utilizes a first solder mask layer with low dielectric constant to reduce interference on high-speed signals, and reduces cost by a second solder mask layer with high dielectric constant on the basis of not influencing low-speed signal transmission, thereby saving cost on the basis of ensuring signal transmission effect; another object of the present application is to provide an electronic device including the above-mentioned printed circuit board, in which the interference to the high-speed signal is reduced by using the first solder mask with a low dielectric constant, and the cost is reduced by using the second solder mask with a high dielectric constant on the basis of not affecting the transmission of the low-speed signal, thereby saving the cost on the basis of ensuring the effect of the signal transmission.
In order to solve the above technical problems, the present application provides a printed circuit board, comprising:
the circuit substrate is used for bearing and fixing the components and the signal transmission conductors;
the high-speed signal transmission conductor is positioned on the surface layer of the circuit substrate and is used for carrying out high-speed signal transmission among components on the printed circuit board;
the low-speed signal transmission conductor is positioned on the surface layer of the circuit substrate and is used for carrying out low-speed signal transmission among components on the printed circuit board;
the first solder mask layer is arranged on the circuit substrate and covers the high-speed signal transmission conductor and is used for isolating the high-speed signal transmission conductor from air;
the second solder mask layer is arranged on the circuit substrate and covers the low-speed signal transmission conductor and is used for isolating the low-speed signal transmission conductor from air;
the dielectric constant of the first solder mask layer is lower than that of the second solder mask layer, and the signal transmission rate of the high-speed signal is higher than that of the low-speed signal.
Preferably, the first solder mask layer and the second solder mask layer are the same in material type.
Preferably, the material types of the first solder mask layer and the second solder mask layer are all ink.
Preferably, the circuit substrate is provided with a plurality of holes;
the hole is used for assisting in processing the circuit substrate, installing and fixing components or connecting other circuit substrates.
Preferably, the holes are circular holes.
Preferably, the high-speed signal transmission conductor and the low-speed signal transmission conductor are microstrip lines.
Preferably, the high-speed signal transmission conductor and the low-speed signal transmission conductor are copper microstrip lines.
In order to solve the technical problems, the application also provides electronic equipment comprising the printed circuit board.
The application provides a printed circuit board, which considers that the influence degree and price of a solder mask with different dielectric constants on signal transmission are different (the dielectric constants are in direct proportion to the influence degree and in inverse proportion to the price), and the higher the signal transmission rate is, the more easily the interference of the solder mask is considered, so that the first solder mask with lower dielectric constant is arranged on the area where a high-speed signal transmission conductor is positioned, the interference on a high-speed signal is reduced by using the first solder mask with lower dielectric constant, the second solder mask with higher dielectric constant is arranged on the area where a low-speed signal transmission conductor is positioned, the cost is reduced by using the second solder mask with higher dielectric constant on the basis of not influencing the low-speed signal transmission, and the cost is saved on the basis of ensuring the signal transmission effect.
The application also provides electronic equipment, which has the same beneficial effects as the printed circuit board.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required in the prior art and the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a printed circuit board according to the present application;
fig. 2 is a schematic structural diagram of another printed circuit board according to the present application.
Detailed Description
The core of the application is to provide a printed circuit board, which utilizes a first solder mask with low dielectric constant to reduce the interference on high-speed signals, and reduces the cost by a second solder mask with high dielectric constant on the basis of not influencing the transmission of the low-speed signals, thereby saving the cost on the basis of ensuring the transmission effect of the signals; another core of the present application is to provide an electronic device including the above-mentioned printed circuit board, in which the interference to the high-speed signal is reduced by using the first solder mask with a low dielectric constant, and the cost is reduced by using the second solder mask with a high dielectric constant on the basis of not affecting the transmission of the low-speed signal, thereby saving the cost on the basis of ensuring the effect of the signal transmission.
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a printed circuit board according to the present application, where the printed circuit board includes:
the circuit substrate 1 is used for bearing and fixing components and signal transmission conductors;
the high-speed signal transmission conductor 2 is positioned on the surface layer of the circuit substrate 1 and is used for carrying out high-speed signal transmission among components on the printed circuit board;
the low-speed signal transmission conductor 3 is positioned on the surface layer of the circuit substrate 1 and is used for carrying out low-speed signal transmission among components on the printed circuit board;
a first solder mask layer 4 disposed on the circuit substrate 1 and covering the high-speed signal transmission conductor 2, for isolating the high-speed signal transmission conductor 2 from air;
a second solder mask layer 5 disposed on the circuit substrate 1 and covering the low-speed signal transmission conductor 3 for isolating the low-speed signal transmission conductor 3 from air;
wherein, the dielectric constant of the first solder mask layer 4 is lower than that of the second solder mask layer 5, and the signal transmission rate of the high-speed signal is higher than that of the low-speed signal.
In particular, in view of the technical problems in the background art, the applicant considers that the cost of the solder mask with high dielectric constant is low, but the solder mask with low dielectric constant is easier to influence the transmission of high-speed signals, namely, the stability of the transmission of the high-speed signals is reduced, while the solder mask with low dielectric constant is lower in the degree of influence on the transmission of the high-speed signals, but is higher in price, and the sensitivity of the low-speed signals is poorer, namely, even if the dielectric constant of the solder mask is higher, the solder mask with low dielectric constant is not obviously influenced in the transmission process of the low-speed signals, so the aim of reducing the design cost of the solder mask on the basis of ensuring the transmission effect of the signals is attempted to be achieved through the solder mask with the corresponding dielectric constants arranged in different areas.
Specifically, in the embodiment of the application, the signal transmission conductors are arranged into two types according to the critical signal transmission rate, namely, the high-speed signal transmission conductor 2 and the low-speed signal transmission conductor 3, so that the first solder mask layer 4 with lower dielectric constant and the second solder mask layer 5 with higher node constant are respectively arranged on the area where the high-speed signal transmission conductor 2 is located and the area where the low-speed signal transmission conductor 3 is located, therefore, the transmission effect of the high-speed signal is ensured through the first solder mask layer 4 with higher cost but smaller interference, and the low-speed signal transmission conductor 3 with stronger anti-interference capability is covered through the second solder mask layer 5 with lower cost, and the cost is reduced.
The preset threshold of the critical signal transmission rate may be set autonomously, which is not limited in the embodiment of the present application.
Specifically, the specific values of the dielectric constants of the first solder mask layer 4 and the second solder mask layer 5 may be set independently, which is not limited herein.
The application provides a printed circuit board, which considers that the influence degree and price of a solder mask with different dielectric constants on signal transmission are different (the dielectric constants are in direct proportion to the influence degree and in inverse proportion to the price), and the higher the signal transmission rate is, the more easily the interference of the solder mask is considered, so that the first solder mask with lower dielectric constant is arranged on the area where a high-speed signal transmission conductor is positioned, the interference on a high-speed signal is reduced by using the first solder mask with lower dielectric constant, the second solder mask with higher dielectric constant is arranged on the area where a low-speed signal transmission conductor is positioned, the cost is reduced by using the second solder mask with higher dielectric constant on the basis of not influencing the low-speed signal transmission, and the cost is saved on the basis of ensuring the signal transmission effect.
For a better explanation of the embodiments of the present application, please refer to fig. 2, fig. 2 is a schematic structural diagram of another printed circuit board provided by the present application, based on the above embodiments:
as a preferred embodiment, the first solder resist layer 4 and the second solder resist layer 5 are the same material type.
Specifically, the material types of the first solder mask layer 4 and the second solder mask layer 5 are set to be the same type, so that the workload can be reduced, and the working efficiency can be improved.
Of course, the material types of the first solder mask layer 4 and the second solder mask layer 5 may be different, which is not limited herein.
As a preferred embodiment, the material types of the first solder resist layer 4 and the second solder resist layer 5 are both inks.
Specifically, the ink has the advantages of strong stability, low cost and the like.
Of course, the material types of the first solder mask layer 4 and the second solder mask layer 5 may be other types besides ink, and the embodiment of the application is not limited herein.
As a preferred embodiment, the circuit substrate 1 is provided with a plurality of holes 6;
holes 6 are used to assist in processing the circuit board 1, mounting the fixed components, or connecting other circuit boards 1.
Specifically, the arrangement of the holes 6 on the circuit substrate 1 can be used for processing the substrate, mounting and fixing components or connecting other circuit substrates 1, which is beneficial to improving the functionality and the working efficiency.
The positions and the number of the holes 6 may be set autonomously, which is not limited in this embodiment of the present application.
As a preferred embodiment, the holes 6 are circular holes 6.
Specifically, the circular hole 6 can reduce the occupied area for the circuit substrate 1, and has a strong aesthetic property.
Of course, the shape of the hole 6 may be other than circular, and the embodiment of the present application is not limited herein.
As a preferred embodiment, the high-speed signal transmission conductor 2 and the low-speed signal transmission conductor 3 are microstrip lines.
Specifically, the microstrip line has the advantages of low cost, simple structure, long service life and the like.
Of course, the high-speed signal transmission conductor 2 and the low-speed signal transmission conductor 3 may be of other types besides microstrip lines, and the embodiment of the present application is not limited herein.
As a preferred embodiment, the high-speed signal transmission conductor 2 and the low-speed signal transmission conductor 3 are copper microstrip lines.
Specifically, the microstrip line made of copper is favorable for improving the stability of signal transmission.
Of course, the microstrip line may be made of other conductive materials besides copper, and the embodiment of the present application is not limited herein.
In order to solve the technical problems, the application also provides electronic equipment comprising the printed circuit board.
For the description of the electronic device provided by the embodiment of the present application, reference is made to the foregoing embodiments of the printed circuit board, and the embodiments of the present application are not repeated herein.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. It should also be noted that in this specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. A printed circuit board, comprising:
the circuit substrate is used for bearing and fixing the components and the signal transmission conductors;
the high-speed signal transmission conductor is positioned on the surface layer of the circuit substrate and is used for carrying out high-speed signal transmission among components on the printed circuit board;
the low-speed signal transmission conductor is positioned on the surface layer of the circuit substrate and is used for carrying out low-speed signal transmission among components on the printed circuit board;
the first solder mask layer is arranged on the circuit substrate and covers the high-speed signal transmission conductor and is used for isolating the high-speed signal transmission conductor from air;
the second solder mask layer is arranged on the circuit substrate and covers the low-speed signal transmission conductor and is used for isolating the low-speed signal transmission conductor from air;
wherein the dielectric constant of the first solder mask layer is lower than that of the second solder mask layer, and the signal transmission rate of the high-speed signal is greater than that of the low-speed signal; the high-speed signal transmission conductor and the low-speed signal transmission conductor are positioned on the same surface layer of the circuit substrate.
2. The printed circuit board of claim 1, wherein the first solder mask layer and the second solder mask layer are the same type of material.
3. The printed circuit board of claim 2, wherein the first solder mask layer and the second solder mask layer are both ink in material type.
4. The printed circuit board of claim 1, wherein the circuit substrate is provided with a plurality of holes;
the hole is used for assisting in processing the circuit substrate, installing and fixing components or connecting other circuit substrates.
5. The printed circuit board of claim 4, wherein the holes are circular holes.
6. The printed circuit board of claim 1, wherein the high speed signal transmission conductor and the low speed signal transmission conductor are microstrip lines.
7. The printed circuit board of claim 6, wherein the high speed signal transmission conductor and the low speed signal transmission conductor are copper microstrip lines.
8. An electronic device comprising a printed circuit board as claimed in any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110598713.2A CN113473702B (en) | 2021-05-31 | 2021-05-31 | Electronic equipment and printed circuit board thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110598713.2A CN113473702B (en) | 2021-05-31 | 2021-05-31 | Electronic equipment and printed circuit board thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113473702A CN113473702A (en) | 2021-10-01 |
| CN113473702B true CN113473702B (en) | 2023-11-03 |
Family
ID=77871843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110598713.2A Active CN113473702B (en) | 2021-05-31 | 2021-05-31 | Electronic equipment and printed circuit board thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113473702B (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05299792A (en) * | 1992-04-23 | 1993-11-12 | Nitto Denko Corp | High frequency circuit board |
| JP2004304134A (en) * | 2003-04-01 | 2004-10-28 | Toshiba Corp | Wiring board and manufacturing method of the same |
| JP2005175078A (en) * | 2003-12-09 | 2005-06-30 | Nitto Denko Corp | Printed wiring board |
| JP2008141096A (en) * | 2006-12-05 | 2008-06-19 | Toto Ltd | Printed wiring board |
| JP2011086975A (en) * | 2009-10-13 | 2011-04-28 | Aica Kogyo Co Ltd | Printed circuit board |
| CN103270645A (en) * | 2010-12-22 | 2013-08-28 | 英特尔公司 | Crosstalk reduction for microstrip routing |
| JP2015126011A (en) * | 2013-12-25 | 2015-07-06 | 日本メクトロン株式会社 | Printed-wiring board |
| CN106550531A (en) * | 2015-09-17 | 2017-03-29 | 鸿富锦精密工业(武汉)有限公司 | Circuit board |
| CN109548268A (en) * | 2018-11-01 | 2019-03-29 | 郑州云海信息技术有限公司 | A kind of PCB impedance adjustment, control system and a kind of PCB layout plate |
| WO2020130004A1 (en) * | 2018-12-18 | 2020-06-25 | 株式会社村田製作所 | Circuit board and electronic device |
| CN112672517A (en) * | 2020-12-31 | 2021-04-16 | 株洲菲斯罗克光电技术有限公司 | Circuit board impedance optimization method and impedance optimization circuit board |
-
2021
- 2021-05-31 CN CN202110598713.2A patent/CN113473702B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05299792A (en) * | 1992-04-23 | 1993-11-12 | Nitto Denko Corp | High frequency circuit board |
| JP2004304134A (en) * | 2003-04-01 | 2004-10-28 | Toshiba Corp | Wiring board and manufacturing method of the same |
| JP2005175078A (en) * | 2003-12-09 | 2005-06-30 | Nitto Denko Corp | Printed wiring board |
| JP2008141096A (en) * | 2006-12-05 | 2008-06-19 | Toto Ltd | Printed wiring board |
| JP2011086975A (en) * | 2009-10-13 | 2011-04-28 | Aica Kogyo Co Ltd | Printed circuit board |
| CN103270645A (en) * | 2010-12-22 | 2013-08-28 | 英特尔公司 | Crosstalk reduction for microstrip routing |
| JP2015126011A (en) * | 2013-12-25 | 2015-07-06 | 日本メクトロン株式会社 | Printed-wiring board |
| CN106550531A (en) * | 2015-09-17 | 2017-03-29 | 鸿富锦精密工业(武汉)有限公司 | Circuit board |
| CN109548268A (en) * | 2018-11-01 | 2019-03-29 | 郑州云海信息技术有限公司 | A kind of PCB impedance adjustment, control system and a kind of PCB layout plate |
| WO2020130004A1 (en) * | 2018-12-18 | 2020-06-25 | 株式会社村田製作所 | Circuit board and electronic device |
| CN112672517A (en) * | 2020-12-31 | 2021-04-16 | 株洲菲斯罗克光电技术有限公司 | Circuit board impedance optimization method and impedance optimization circuit board |
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| Publication number | Publication date |
|---|---|
| CN113473702A (en) | 2021-10-01 |
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