JPH0493092A - Flexible circuit board - Google Patents
Flexible circuit boardInfo
- Publication number
- JPH0493092A JPH0493092A JP20992890A JP20992890A JPH0493092A JP H0493092 A JPH0493092 A JP H0493092A JP 20992890 A JP20992890 A JP 20992890A JP 20992890 A JP20992890 A JP 20992890A JP H0493092 A JPH0493092 A JP H0493092A
- Authority
- JP
- Japan
- Prior art keywords
- bending
- holes
- flexible
- board
- flexible wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 abstract description 22
- 239000004020 conductor Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011889 copper foil Substances 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はフレキシブル配線基板に関し、特に折り曲げを
要するフレキスプル配線基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a flexible wiring board, and particularly to a flexible wiring board that requires bending.
電気製品、及び通信装置など大幅に小型化が要求され、
フレキシブル配線基板の利用が広まっている。フレキシ
ブル配線基板の折り曲げ自在な特色を利用することによ
り、電子部品の搭載した後のせまいスペースが利用でき
、フレキシブル配線基板は前述の小型化に寄与できる大
きな効果のあるものである。しかしながら、従来のフレ
キシブル配線基板の折り曲げはフレキシブル配線基板製
作時に、機械的治具（プレスなど）を利用しておりまげ
でおり、部品搭載後の折り曲けは、搭載部品に、機械的
ストレスが加わるなど、不利な条件があり、部品搭載後
の折り曲げ加工は、避けていた。折り曲げ加工が不可避
な場合は、折り曲げに大きな力が加わらないように折り
曲げ加工を行い、要求に合わせた形状加工をしていた。Significant miniaturization of electrical products and communication equipment is required,
The use of flexible wiring boards is becoming widespread. By utilizing the bendable feature of the flexible wiring board, the narrow space after electronic components are mounted can be utilized, and the flexible wiring board is highly effective in contributing to the above-mentioned miniaturization. However, conventional bending of flexible wiring boards involves the use of mechanical jigs (presses, etc.) when manufacturing flexible wiring boards, and bending after mounting components places mechanical stress on the mounted components. Due to disadvantageous conditions, such as bending the parts after mounting them, the company had avoided bending the parts after mounting them. When bending is unavoidable, the bending process is done to avoid applying a large force to the bending process, and the shape is processed to meet the requirements.
上述した従来のフレキシブル配線基板は、折り曲げ加工
を容易にする格別の構造を有していないので、第３図に
示すように、折り曲げ部に丸味ができ、折り曲は後の全
体の厚さを小さくするのが困雛であるので、組み込みス
ペースにおさまらない不具合が生しるという問題があっ
た。The above-mentioned conventional flexible wiring board does not have a special structure that facilitates bending, so as shown in Figure 3, the bent portion is rounded and the overall thickness is Since it is difficult to make it small, there is a problem that it does not fit in the built-in space.
本発明のフレキシブル配線基板は、フレキシフル基板の
折り曲げ部に少なくとも１箇の貫通孔を設けたというも
のである。In the flexible wiring board of the present invention, at least one through hole is provided in the bent portion of the flexible board.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の第１の実施例の平面模式図である。FIG. 1 is a schematic plan view of a first embodiment of the present invention.
この実施例はフレキシブル基板１（厚さ２００μｍ程度
の絶縁性樹脂フィルム）の折り曲げ線４に沿って直径２
．０市の貫通孔２−１〜２−４をピッチ３．５ｍｍで設
けたもので貫通孔の間に銅箔の配線導体３を配置しであ
る。折り曲げ線に沿って折り曲げるのが容易となり、部
品搭載後に折り曲けることができ折り曲げ後の全体の厚
さも、従来例では約５１１１！ｌ＋であったがこの実施
例では、約２ｉｎ厚まで小さくできる。In this embodiment, the diameter 2 is
．． The through-holes 2-1 to 2-4 are provided at a pitch of 3.5 mm, and a copper foil wiring conductor 3 is arranged between the through-holes. It is easy to bend along the bending line, and it can be bent after parts are mounted, and the total thickness after bending is approximately 5111mm compared to the conventional example! In this example, the thickness can be reduced to about 2 inches.
第４図は第２の実施例の平面模式図である。この実施例
は、第１の実施例と同様に折り曲げ部に、貫通孔２−１
〜２−４を設け、更に、フレキシブル基板１端面に、く
びれ５−１．５−２を設けることにより、更に折り曲げ
易くなり、全体の厚さも、約２ｍｍ弱となる。FIG. 4 is a schematic plan view of the second embodiment. This embodiment has a through hole 2-1 in the bending part as in the first embodiment.
2-4 and further provide constrictions 5-1 and 5-2 on the end face of the flexible substrate 1, the flexible substrate 1 can be bent even more easily, and the total thickness is about 2 mm.
なお、フレキシブル配線基板で配線導体同士の間隔は、
搭載する部品の大きさによる制約が主なものであり、
上述の実施例のように貫通孔を設けた部分で密にする余
裕は十分にある。In addition, the spacing between wiring conductors on a flexible wiring board is
The main limitation is the size of the parts to be mounted.
As in the above-mentioned embodiment, there is sufficient room to make the through holes denser.
以上、説明したように本発明は、フレキシブル基板の折
り曲げ線上に、貫通孔を設けることにより、折り曲げ加
工が容易となるので部品搭載後に折り曲げることが可能
となるほか折り曲げ箇所が丸味が少なくなり、全体の厚
さが、薄くできるという効果を有する。As explained above, in the present invention, by providing a through hole on the bending line of the flexible substrate, the bending process is facilitated, so it is possible to bend the flexible board after mounting the parts, and the bending part is less rounded, making the overall This has the effect that the thickness can be reduced.
第１図は、本発明の第１の実施例の平面模式図、第２図
は、本発明のフレキシブル配線基板を折り曲げ加工した
後の状態を示す側面模式図、第３図は、従来のフレキシ
ブル配線基板を折り曲げ加工した後の状態を示す側面模
式図、第４図は、第２の実施例の平面模式図である。
１．１１・・・フレキシブル基板、２−１〜２−４・・
・折り曲げ部の貫通孔、３・・・配線導体、４・・・折
り曲げ線、５−１．５−２・・・基板端面のくびれ。1 is a schematic plan view of the first embodiment of the present invention, FIG. 2 is a schematic side view showing the state after bending the flexible wiring board of the present invention, and FIG. 3 is a schematic plan view of the flexible wiring board of the present invention. FIG. 4 is a schematic side view showing the state after the wiring board is bent and processed, and is a schematic plan view of the second embodiment. 1.11...Flexible board, 2-1 to 2-4...
- Through hole in bent portion, 3... Wiring conductor, 4... Bending line, 5-1.5-2... Constriction in end surface of substrate.
Claims (1)
通孔を設けていることを特徴とするフレキシブル配線基
板。A flexible wiring board characterized in that at least one through hole is provided in a bent portion of the flexible board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20992890A JPH0493092A (en) | 1990-08-08 | 1990-08-08 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20992890A JPH0493092A (en) | 1990-08-08 | 1990-08-08 | Flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0493092A true JPH0493092A (en) | 1992-03-25 |
Family
ID=16580981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20992890A Pending JPH0493092A (en) | 1990-08-08 | 1990-08-08 | Flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0493092A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998013206A1 (en) * | 1996-09-24 | 1998-04-02 | Mitsubishi Denki Kabushiki Kaisha | Thermal head |
| US5748209A (en) * | 1994-10-31 | 1998-05-05 | Hewlett-Packard Company | Thermal ink jet tab circuit having a plurality of trace groups wherein adjacent traces in each group are staggered |
| US6121988A (en) * | 1994-09-27 | 2000-09-19 | Seiko Epson Corporation | Printed wiring board and its manufacturing method, and electronic apparatus |
| FR2811507A1 (en) * | 2000-07-06 | 2002-01-11 | Lg Philips Lcd Co Ltd | Flexible printed circuit film for preventing contact breaking by transmission of remote forces, comprises film which is elbow shaped and has opening adjacent to contacts likely to transmit force |
| JP2010123971A (en) * | 2008-11-20 | 2010-06-03 | Yiguang Electronic Ind Co Ltd | Light module |
| US20220418087A1 (en) * | 2021-06-29 | 2022-12-29 | Icare Diagnostics International Co. Ltd. | Multilayered flexible printed circuit, method for manufacturing the same, and application thereof |
-
1990
- 1990-08-08 JP JP20992890A patent/JPH0493092A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6121988A (en) * | 1994-09-27 | 2000-09-19 | Seiko Epson Corporation | Printed wiring board and its manufacturing method, and electronic apparatus |
| US5748209A (en) * | 1994-10-31 | 1998-05-05 | Hewlett-Packard Company | Thermal ink jet tab circuit having a plurality of trace groups wherein adjacent traces in each group are staggered |
| WO1998013206A1 (en) * | 1996-09-24 | 1998-04-02 | Mitsubishi Denki Kabushiki Kaisha | Thermal head |
| FR2811507A1 (en) * | 2000-07-06 | 2002-01-11 | Lg Philips Lcd Co Ltd | Flexible printed circuit film for preventing contact breaking by transmission of remote forces, comprises film which is elbow shaped and has opening adjacent to contacts likely to transmit force |
| JP2010123971A (en) * | 2008-11-20 | 2010-06-03 | Yiguang Electronic Ind Co Ltd | Light module |
| US8136963B2 (en) | 2008-11-20 | 2012-03-20 | Everlight Electronics Co., Ltd. | Light module |
| US20220418087A1 (en) * | 2021-06-29 | 2022-12-29 | Icare Diagnostics International Co. Ltd. | Multilayered flexible printed circuit, method for manufacturing the same, and application thereof |
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