TWM464868U - Connector - Google Patents

Connector Download PDF

Info

Publication number
TWM464868U
TWM464868U TW102206000U TW102206000U TWM464868U TW M464868 U TWM464868 U TW M464868U TW 102206000 U TW102206000 U TW 102206000U TW 102206000 U TW102206000 U TW 102206000U TW M464868 U TWM464868 U TW M464868U
Authority
TW
Taiwan
Prior art keywords
connector
circuit board
flexible circuit
flexible substrate
disposed
Prior art date
Application number
TW102206000U
Other languages
Chinese (zh)
Inventor
Chih-Peng Fan
Ching-Ho Hsieh
Yung-Hao Hsueh
Kuo-Ching Tien
Original Assignee
Unimicron Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unimicron Technology Corp filed Critical Unimicron Technology Corp
Priority to TW102206000U priority Critical patent/TWM464868U/en
Publication of TWM464868U publication Critical patent/TWM464868U/en

Links

Abstract

A connector suitable for being applied to a flexible printed circuit (FPC) board. The FPC board includes a flexible substrate. The connector includes a plurality of conductive contacts, an adhesive layer and an insulation layer. Each of the conductive contacts includes an elastic cantilever and a fixed cantilever. Each fixed cantilever is connected to the corresponding elastic cantilever and disposed on the flexible substrate to be electrically connected to the FPC board. Each elastic cantilever is extended along a direction away from the flexible substrate. The adhesive layer is disposed between the flexible substrate and the conductive contacts. The insulation layer covers the conductive contacts and has a plurality of openings. The openings respectively expose the elastic cantilevers.

Description

連接器Connector

本新型創作是有關於一種連接器,且特別是有關於一種適用於軟性電路板的連接器。The present invention relates to a connector, and more particularly to a connector suitable for a flexible circuit board.

為因應現代電子產品對於輕薄短小的要求,各種電子組件莫不積極地朝向體積小型化的趨勢發展。由於電子產品的功能越來越強大,而電子產品的體積也越來越小,使得各種攜帶式電子產品蓬勃發展,並已取代大型電子產品,而逐漸成為市場上的主流,例如筆記型電腦(Notebook)、行動電話(Cell Phone)以及平板電腦(tablet PC)等。各式攜帶式電子產品,為滿足小型化的要求,除了內部所裝設的各個零件都必須符合體積小,重量輕的條件之外,通常為了使電子產品在攜帶時體積可以更小、更便於攜帶,係將電子產品設計為兩個單元,並將此兩單元相互疊合。值得注意的是,此兩單元通常是藉由一具可撓性、能隨意彎折的軟性電路板連接於其間,而達到電性導通的目的。In response to the demand for lightness, thinness and shortness of modern electronic products, various electronic components are not actively moving toward miniaturization. As the functions of electronic products become more and more powerful, and the size of electronic products is getting smaller and smaller, various portable electronic products have flourished and replaced large-scale electronic products, and gradually become the mainstream in the market, such as notebook computers ( Notebook), Cell Phone, and tablet PC. In order to meet the requirements of miniaturization, all kinds of portable electronic products must meet the requirements of small size and light weight, in addition to the internal components, usually in order to make the electronic product smaller and more convenient when carried. Carrying, the electronic product is designed as two units, and the two units are superposed on each other. It is worth noting that the two units are usually connected by a flexible, bendable flexible circuit board to achieve electrical conduction.

上述之軟性電路板,其一端通常具有多個接點,以連接至一連接器(Connector)上,其中連接器內部具有多個接觸腳, 且一端插接於電路板上,並與電路板上之另一連接器電性連接。然而,習知配置於軟性電路板上之連接器,多半為事先做好後,再透過表面接合技術(surface mounting technology,SMT)固設於軟性電路板的接點上,其通常具有多層疊構而具有相當的厚度,加上此種連接器多半具有基板,因此連接器的厚度往往受限於基板的厚度而無法符合目前薄型化的需求。此外,軟性電路板上的連接器須與電路板上的另一連接器彼此公母配合(例如一為插頭,一為插座),因而降低了電子產品的設計彈性,加上其組裝較為複雜,無形中增加了電子產品的材料成本以及組裝成本。The above flexible circuit board generally has a plurality of contacts at one end thereof for connection to a connector, wherein the connector has a plurality of contact pins inside. One end is plugged into the circuit board and electrically connected to another connector on the circuit board. However, it is conventional that the connectors disposed on the flexible circuit board are mostly fixed in advance and then fixed on the contacts of the flexible circuit board through surface mounting technology (SMT), which usually has a multi-layer structure. While having a considerable thickness, and most of such connectors have a substrate, the thickness of the connector is often limited by the thickness of the substrate and cannot meet the current demand for thinning. In addition, the connector on the flexible circuit board must be mated with the other connector on the circuit board (for example, a plug and a socket), thereby reducing the design flexibility of the electronic product, and the assembly thereof is complicated. Invisibly increases the material cost and assembly cost of electronic products.

本新型創作提供一種連接器,其厚度較薄且成本較低。The novel creation provides a connector that is thinner and less expensive.

本新型創作的連接器適用於一軟性電路板上。軟性電路板包括一軟性基材。連接器包括多個端子、一黏著層以及一絕緣層。各端子包括一彈性懸臂以及一固定端。各固定端連接對應之彈性懸臂並設置於軟性基材上,以與軟性電路板電性連接。各彈性懸臂朝遠離軟性基材的方向延伸。黏著層設置於軟性基材與端子之間。絕緣層覆蓋於端子上並具有多個開口。開口分別暴露彈性懸臂。The connector created by the present invention is suitable for use on a flexible circuit board. The flexible circuit board includes a flexible substrate. The connector includes a plurality of terminals, an adhesive layer, and an insulating layer. Each terminal includes a resilient cantilever and a fixed end. Each fixed end is connected to a corresponding elastic cantilever and is disposed on the flexible substrate to be electrically connected to the flexible circuit board. Each of the elastic cantilevers extends away from the flexible substrate. The adhesive layer is disposed between the flexible substrate and the terminal. An insulating layer covers the terminal and has a plurality of openings. The openings respectively expose the elastic cantilever.

在本新型創作的一實施例中,上述的連接器更包括一補強材。軟性基材具有一第一表面以及相對第一表面之一第二表面。端子、黏著層以及絕緣層設置於第一表面,而補強材對應設 置於第二表面。In an embodiment of the present invention, the connector further includes a reinforcing material. The flexible substrate has a first surface and a second surface opposite the first surface. The terminal, the adhesive layer and the insulating layer are disposed on the first surface, and the reinforcing material is correspondingly provided Placed on the second surface.

在本新型創作的一實施例中,上述的連接器透過多個鎖固件,穿過補強材而將連接器以及軟性電路板鎖固至一電子元件上,並透過彈性懸臂與電子元件形成電連接。In an embodiment of the present invention, the connector is configured to lock the connector and the flexible circuit board to an electronic component through the plurality of fasteners, and to electrically connect the electronic component through the elastic cantilever. .

在本新型創作的一實施例中,上述的將連接器以及軟性電路板鎖固至電子元件上時,軟性電路板位於電子元件與補強材之間,且彈性懸臂與電子元件接觸。In an embodiment of the present invention, when the connector and the flexible circuit board are locked to the electronic component, the flexible circuit board is located between the electronic component and the reinforcing material, and the elastic cantilever is in contact with the electronic component.

在本新型創作的一實施例中,上述的軟性電路板的厚度介於0.15毫米(mm)至0.3毫米(mm)之間。In an embodiment of the present invention, the flexible circuit board has a thickness of between 0.15 millimeters (mm) and 0.3 millimeters (mm).

在本新型創作的一實施例中,上述的軟性電路板與連接器的厚度總和介於0.3毫米(mm)至0.5毫米(mm)之間。In an embodiment of the present invention, the thickness of the flexible circuit board and the connector described above is between 0.3 millimeters (mm) and 0.5 millimeters (mm).

在本新型創作的一實施例中,上述的連接器更包括一導電膏,設置於軟性基材與端子之間。In an embodiment of the present invention, the connector further includes a conductive paste disposed between the flexible substrate and the terminal.

基於上述,本新型創作的連接器將具有彈性懸臂的端子壓合於軟性電路板上,減少了連接器的疊構層數,進而降低了軟性電路板與連接器的整體厚度,使其符合目前電子產品薄型化的需求。並且,由於本新型創作減少了連接器的疊構層數,進而減少電流訊號需通過的介面數量,因此能提高高頻信號傳輸的完整性(Signal integratity)。此外,本新型創作的連接器無須分別於軟性電路板及其外接電子元件上設置對應的連接器,更節省了電鍍導通孔、焊球接合等繁複的製程,組裝成本以及生產成本亦可因此降低。Based on the above, the connector of the present invention presses the terminal with the elastic cantilever to the flexible circuit board, which reduces the number of layers of the connector, thereby reducing the overall thickness of the flexible circuit board and the connector, so that it conforms to the current The need for thinning electronic products. Moreover, since the novel creation reduces the number of layers of the connector, thereby reducing the number of interfaces through which the current signal needs to pass, the integrity of the high-frequency signal transmission (Signal integratity) can be improved. In addition, the connector created by the present invention does not need to be provided with a corresponding connector on the flexible circuit board and its external electronic components, which saves complicated processes such as plating vias and solder ball bonding, and the assembly cost and production cost can also be reduced. .

為讓本新型創作的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will become more apparent and understood from the following description.

100‧‧‧連接器100‧‧‧Connector

110‧‧‧端子110‧‧‧terminal

110a‧‧‧金屬箔110a‧‧‧metal foil

112‧‧‧彈性懸臂112‧‧‧Flexible cantilever

112a‧‧‧自由端112a‧‧‧Free end

114‧‧‧固定端114‧‧‧Fixed end

120‧‧‧黏著層120‧‧‧Adhesive layer

130‧‧‧絕緣層130‧‧‧Insulation

132‧‧‧開口132‧‧‧ openings

140‧‧‧補強材140‧‧‧ reinforcing materials

150‧‧‧鎖固件150‧‧‧Locker

200‧‧‧軟性電路板200‧‧‧Soft circuit board

210‧‧‧軟性基材210‧‧‧Soft substrate

212‧‧‧第一表面212‧‧‧ first surface

214‧‧‧第二表面214‧‧‧ second surface

222‧‧‧接點222‧‧‧Contacts

300‧‧‧電子元件、電路板300‧‧‧Electronic components, circuit boards

D1 ‧‧‧軟性電路板厚度D 1 ‧‧‧Soft board thickness

D2 ‧‧‧厚度總和D 2 ‧ ‧ thickness sum

D3‧‧‧間距D3‧‧‧ spacing

H1‧‧‧高度H1‧‧‧ Height

圖1為依照本創作的一實施例的一種連接器設置於軟性電路板的示意圖。1 is a schematic diagram of a connector disposed on a flexible circuit board in accordance with an embodiment of the present invention.

圖2為圖1的連接器的局部放大示意圖。2 is a partially enlarged schematic view of the connector of FIG. 1.

圖3為圖1的連接器的局部剖面示意圖。3 is a partial cross-sectional view of the connector of FIG. 1.

圖4為依照本創作的一實施例的一種軟性電路板的俯視示意圖。4 is a top plan view of a flexible circuit board in accordance with an embodiment of the present invention.

圖5A至圖5E為依照本創作的一實施例的一種連接器的製作流程示意圖。5A-5E are schematic diagrams showing a manufacturing process of a connector according to an embodiment of the present invention.

圖6為依照本創作的一實施例的一種連接器之補強材的組裝示意圖。FIG. 6 is a schematic view showing the assembly of a reinforcing material of a connector according to an embodiment of the present invention.

圖1為依照本創作的一實施例的一種連接器設置於軟性電路板的示意圖。圖2為圖1的連接器的局部放大示意圖。圖3為圖1的連接器的局部剖面示意圖。請同時參照圖1、圖2及圖3,本實施例的連接器100如圖1所示適於設置於一軟性電路板200 上。軟性電路板200包括一軟性基材210。連接器100包括多個端子110、一黏著層120以及一絕緣層130。各端子110包括一彈性懸臂112以及一固定端114。各固定端114連接對應之彈性懸臂112並設置於軟性基材210上,以與軟性電路板200電性連接。各彈性懸臂112朝遠離軟性基材210的方向延伸。在本實施例中,彈性懸臂112以及固定端114為一體成型,且端子110的材料包括銅,也就是說,端子110分別為一體成型的圖案化銅箔層,而端子110的間距D3約介於1毫米(mm)至2毫米(mm)之間。黏著層120設置於軟性基材210與端子110之間。絕緣層130覆蓋於端子110上並具有多個開口132。開口132分別暴露彈性懸臂112。1 is a schematic diagram of a connector disposed on a flexible circuit board in accordance with an embodiment of the present invention. 2 is a partially enlarged schematic view of the connector of FIG. 1. 3 is a partial cross-sectional view of the connector of FIG. 1. Referring to FIG. 1 , FIG. 2 and FIG. 3 , the connector 100 of the embodiment is adapted to be disposed on a flexible circuit board 200 as shown in FIG. 1 . on. The flexible circuit board 200 includes a flexible substrate 210. The connector 100 includes a plurality of terminals 110, an adhesive layer 120, and an insulating layer 130. Each terminal 110 includes a resilient cantilever 112 and a fixed end 114. Each of the fixed ends 114 is connected to the corresponding elastic cantilever 112 and disposed on the flexible substrate 210 to be electrically connected to the flexible circuit board 200. Each of the elastic cantilevers 112 extends away from the flexible substrate 210. In this embodiment, the elastic cantilever 112 and the fixed end 114 are integrally formed, and the material of the terminal 110 includes copper, that is, the terminal 110 is an integrally formed patterned copper foil layer, and the pitch D3 of the terminal 110 is approximately Between 1 mm (mm) and 2 mm (mm). The adhesive layer 120 is disposed between the flexible substrate 210 and the terminal 110. The insulating layer 130 covers the terminal 110 and has a plurality of openings 132. The openings 132 respectively expose the resilient cantilever 112.

如圖3所示,彈性懸臂112包括一自由端112a,其凸出於絕緣層130的表面。在本實施例中,彈性懸臂112的自由端112a至絕緣層130之表面的高度H1約為0.2毫米(mm)。此外,連接器100更可包括一導電膏(未繪示),設置於電連接端220上,並位於電連接端220與端子110之間。在本實施例中,導電膏可例如為銅膏、銀膏、錫膏、碳膏、錫球、奈米銀或是其他低電阻係數的導電高分子材料,並透過印刷的方式形成於電連接端220上。As shown in FIG. 3, the resilient cantilever 112 includes a free end 112a that protrudes from the surface of the insulating layer 130. In the present embodiment, the height H1 of the free end 112a of the elastic cantilever 112 to the surface of the insulating layer 130 is about 0.2 millimeters (mm). In addition, the connector 100 further includes a conductive paste (not shown) disposed on the electrical connection end 220 and between the electrical connection end 220 and the terminal 110. In this embodiment, the conductive paste can be, for example, a copper paste, a silver paste, a solder paste, a carbon paste, a solder ball, a nano silver or another low-resistance conductive polymer material, and is formed in an electrical connection by printing. On end 220.

在本實施例中,兩個連接器100可分別設置於軟性電路板200之相對兩端上。如此,兩個連接器100可分別連接至例如兩個相互疊合的外部電子元件,以藉由軟性電路板200的可撓性,將相互疊合的兩個外部電子元件電性連接。上述的兩個外部電子 元件可例如分別為一電路板以及一液晶顯示面板,以透過軟性電路板200的兩個連接器100將視訊訊號從電路板傳送到液晶顯示面板上,以使液晶顯示面板達到顯示的功能。當然,本實施例僅用以舉例說明,本創作新型並不限定連接器100的數量、其與電子元件連接的方式以及與其連接之電子元件的種類。In this embodiment, the two connectors 100 can be respectively disposed on opposite ends of the flexible circuit board 200. As such, the two connectors 100 can be respectively connected to, for example, two external electronic components that are superposed on each other to electrically connect the two external electronic components that are superposed on each other by the flexibility of the flexible circuit board 200. The two external electronics mentioned above The components can be, for example, a circuit board and a liquid crystal display panel for transmitting video signals from the circuit board to the liquid crystal display panel through the two connectors 100 of the flexible circuit board 200 to enable the liquid crystal display panel to perform the display function. Of course, this embodiment is for illustrative purposes only, and the present invention does not limit the number of connectors 100, the manner in which they are connected to electronic components, and the types of electronic components to which they are connected.

圖4為依照本創作的一實施例的一種軟性電路板的俯視示意圖。請參照圖4,在本實施例中,軟性電路板200可例如具有兩個彼此電性連接的連接部220、230,分別位於軟性基板210的相對兩端。兩個連接器100可分別設置於連接部220、230上。連接部220、230各具有多個接點222。接點222間以及兩連接部220、230間可例如為圖4所示透過導線電性連接,而接點222則分別與圖3所示的端子110電性連接。當然,本創作新型並不用以限定連接器100的數量、其與電子元件連接的方式或是電子元件的種類。軟性電路板200除了可如圖1所示的彎折設置,以分別電性連接兩相互疊合的外部電子元件外,軟性電路板200亦可無需彎折,而是如圖4所示之平直設置,以分別電連接至兩個同平面設置之外部電子元件。4 is a top plan view of a flexible circuit board in accordance with an embodiment of the present invention. Referring to FIG. 4 , in the embodiment, the flexible circuit board 200 can have two connecting portions 220 , 230 electrically connected to each other, respectively, at opposite ends of the flexible substrate 210 . Two connectors 100 may be disposed on the connecting portions 220, 230, respectively. The connecting portions 220, 230 each have a plurality of contacts 222. For example, the contacts 222 and the two connecting portions 220 and 230 can be electrically connected by a transmission wire as shown in FIG. 4, and the contacts 222 are electrically connected to the terminal 110 shown in FIG. Of course, the present invention is not intended to limit the number of connectors 100, the manner in which they are connected to electronic components, or the types of electronic components. The flexible circuit board 200 can be flexibly disposed as shown in FIG. 1 to electrically connect the two external electronic components that are overlapped with each other, and the flexible circuit board 200 can also be bent without being bent, but is flat as shown in FIG. Straight set to electrically connect to two external electronic components in the same plane.

如此配置,軟性電路板200便可透過端子110之彈性懸臂112與外部元件電性連接。並且,在本實施例中,軟性電路板200的厚度D1 約介於0.15毫米(mm)至0.3毫米(mm)之間,而本實施例的連接器100由於僅透過其黏著層120壓合於軟性電路板200上,其疊構層數較少,因此,本實施例之軟性電路板200 與連接器100的厚度總和D2 僅約介於0.3毫米(mm)至0.5毫米(mm)之間,可符合目前電子產品薄型化的需求。In this configuration, the flexible circuit board 200 can be electrically connected to the external component through the elastic cantilever 112 of the terminal 110. Moreover, in the present embodiment, the thickness D 1 of the flexible circuit board 200 is between about 0.15 mm (mm) and 0.3 mm (mm), and the connector 100 of the present embodiment is pressed only by the adhesive layer 120 thereof. On the flexible circuit board 200, the number of layers is small. Therefore, the total thickness D 2 of the flexible circuit board 200 and the connector 100 of the present embodiment is only about 0.3 mm (mm) to 0.5 mm (mm). In the meantime, it can meet the current demand for thinning electronic products.

圖5A至圖5E為依照本創作的一實施例的一種連接器的製作流程示意圖。上述的連接器100的製作方法可例如包括下列步驟。首先,如圖5A所示,提供一軟性電路板200,其包括一軟性基材210,且軟性基材210如圖5A所示具有多個接點222。接著,再參照圖5B,形成一黏著層120於軟性基材210上,在本實施例中,更可再透過鋼板印刷、網板印刷或其他適當的印刷方法,形成一導電膏於軟性基材210上。5A-5E are schematic diagrams showing a manufacturing process of a connector according to an embodiment of the present invention. The above-described method of fabricating the connector 100 can include, for example, the following steps. First, as shown in FIG. 5A, a flexible circuit board 200 is provided which includes a flexible substrate 210, and the flexible substrate 210 has a plurality of contacts 222 as shown in FIG. 5A. Next, referring to FIG. 5B, an adhesive layer 120 is formed on the flexible substrate 210. In this embodiment, a conductive paste can be formed on the flexible substrate by using a steel plate printing, screen printing or other suitable printing method. 210 on.

請同時參照圖5B以及圖5C,提供一金屬箔110a,其包括多個彈性懸臂112以及多個固定端114,固定端114分別連接對應之彈性懸臂112,而彈性懸臂112則如圖3所示分別朝遠離固定端114的方向延伸。接著,將上述的金屬箔110a壓合於如圖5B所示的軟性基材210上,使其黏著層120以及導電膏位於軟性基材210與金屬箔110a之間。此時,固定端114分別連接如圖5B所示的軟性基材210上之接點222,以與軟性電路板200電性連接,而彈性懸臂112則分別朝遠離軟性基材210的方向延伸。5B and FIG. 5C, a metal foil 110a is provided, which includes a plurality of elastic cantilevers 112 and a plurality of fixed ends 114. The fixed ends 114 are respectively connected to the corresponding elastic cantilevers 112, and the elastic cantilevers 112 are as shown in FIG. They extend away from the fixed end 114, respectively. Next, the above-described metal foil 110a is pressed against the flexible substrate 210 as shown in FIG. 5B so that the adhesive layer 120 and the conductive paste are positioned between the flexible substrate 210 and the metal foil 110a. At this time, the fixed ends 114 are respectively connected to the contacts 222 on the flexible substrate 210 as shown in FIG. 5B to be electrically connected to the flexible circuit board 200, and the elastic cantilevers 112 respectively extend away from the flexible substrate 210.

接著,再如圖5D所示,移除如圖5C所示的金屬箔110a中除了彈性懸臂112以及固定端114以外的部份,以形成多個彼此獨立的端子110。如此,端子110包括上述的彈性懸臂112以及固定端114。在本實施例中,移除金屬箔110a中除了彈性懸臂112以及固定端114以外的部份的方法包括蝕刻。此外,在本實施例 中,更可選擇性地於各彈性懸臂112的自由端(例如為圖3所示之自由端112a)處鍍上一金屬層,例如為金、銀或錫,以提高自由端112a與外部元件之間的接觸介面品質,防止自由端112a與外部元件之間接觸不良的問題發生。Next, as shown in FIG. 5D, portions other than the elastic cantilever 112 and the fixed end 114 of the metal foil 110a as shown in FIG. 5C are removed to form a plurality of terminals 110 which are independent of each other. As such, the terminal 110 includes the above-described elastic cantilever 112 and the fixed end 114. In the present embodiment, the method of removing portions of the metal foil 110a other than the elastic cantilever 112 and the fixed end 114 includes etching. In addition, in this embodiment Further, a metal layer, such as gold, silver or tin, may be selectively plated at the free end of each elastic cantilever 112 (for example, the free end 112a shown in FIG. 3) to enhance the free end 112a and the external component. The quality of the contact interface between them prevents the problem of poor contact between the free end 112a and the external component.

請接續參照圖5E,覆蓋一絕緣層130於端子110上,絕緣層130具有多個開口132,以分別暴露彈性懸臂112。如此,即大致完成了軟性電路板(例如為圖5A所示之軟性電路板200)上之連接器100的製作,而軟性電路板便可透過絕緣層130暴露出之彈性懸臂112與外部元件電性連接。Referring to FIG. 5E, an insulating layer 130 is disposed on the terminal 110. The insulating layer 130 has a plurality of openings 132 to respectively expose the elastic cantilever 112. Thus, the fabrication of the connector 100 on the flexible circuit board (for example, the flexible circuit board 200 shown in FIG. 5A) is substantially completed, and the flexible circuit board can expose the elastic cantilever 112 and the external components through the insulating layer 130. Sexual connection.

圖6為依照本創作的一實施例的一種連接器之補強材的組裝示意圖。軟性電路板200透過連接器100與一電子元件300電性連接。在本實施例中,電子元件300例如為一電路板300。為確保連接器100與電子元件300間之連接穩固性,在本實施例中,連接器100更可包括一補強材140,用以增強軟性電路板200的結構強度。軟性電路板200的軟性基材210具有一第一表面212以及相對第一表面212之一第二表面214。上述的端子110、黏著層120以及絕緣層130即設置於第一表面212,而補強材140則對應設置於第二表面214上。補強材140是透過多個鎖固件150,穿過補強材140而將連接器100以及軟性電路板200鎖固至電路板300上。連接器100以及軟性電路板200鎖固於電路板300上時,軟性電路板200位於電路板300與補強材140之間,且連接器100之彈性懸臂與電路板300接觸,使軟性電路板200透過彈性懸臂 與電路板300形成電連接。FIG. 6 is a schematic view showing the assembly of a reinforcing material of a connector according to an embodiment of the present invention. The flexible circuit board 200 is electrically connected to an electronic component 300 through the connector 100. In the embodiment, the electronic component 300 is, for example, a circuit board 300. In order to ensure the connection stability between the connector 100 and the electronic component 300, in the embodiment, the connector 100 further includes a reinforcing material 140 for enhancing the structural strength of the flexible circuit board 200. The flexible substrate 210 of the flexible circuit board 200 has a first surface 212 and a second surface 214 opposite the first surface 212. The terminal 110, the adhesive layer 120 and the insulating layer 130 are disposed on the first surface 212, and the reinforcing material 140 is disposed on the second surface 214. The reinforcing material 140 is used to lock the connector 100 and the flexible circuit board 200 to the circuit board 300 through the plurality of fasteners 150 through the reinforcing material 140. When the connector 100 and the flexible circuit board 200 are locked on the circuit board 300, the flexible circuit board 200 is located between the circuit board 300 and the reinforcing material 140, and the elastic cantilever of the connector 100 is in contact with the circuit board 300, so that the flexible circuit board 200 Through the elastic cantilever Electrical connection is made to circuit board 300.

綜上所述,本新型創作的連接器將具有彈性懸臂的端子壓合於軟性電路板上,減少了連接器的疊構層數,進而降低了軟性電路板與連接器的整體厚度,使其符合目前電子產品薄型化的需求。並且,由於本新型創作減少了連接器的疊構層數,進而減少電流訊號需通過的介面數量,因此能提高高頻信號傳輸的完整性(Signal integratity)。此外,本新型創作的連接器無須分別於軟性電路板及其外接電子元件上設置對應的連接器,更節省了電鍍導通孔、焊球接合等繁複的製程,組裝成本以及生產成本亦可因此降低。In summary, the connector of the present invention presses the terminal with the elastic cantilever to the flexible circuit board, which reduces the number of layers of the connector, thereby reducing the overall thickness of the flexible circuit board and the connector, thereby making it In line with the current needs of thinning electronic products. Moreover, since the novel creation reduces the number of layers of the connector, thereby reducing the number of interfaces through which the current signal needs to pass, the integrity of the high-frequency signal transmission (Signal integratity) can be improved. In addition, the connector created by the present invention does not need to be provided with a corresponding connector on the flexible circuit board and its external electronic components, which saves complicated processes such as plating vias and solder ball bonding, and the assembly cost and production cost can also be reduced. .

雖然本新型創作已以實施例揭露如上,然其並非用以限定本新型創作,任何所屬技術領域中具有通常知識者,在不脫離本新型創作的精神和範圍內,當可作些許的更動與潤飾,故本新型創作的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.

110‧‧‧端子110‧‧‧terminal

112‧‧‧彈性懸臂112‧‧‧Flexible cantilever

112a‧‧‧自由端112a‧‧‧Free end

114‧‧‧固定端114‧‧‧Fixed end

120‧‧‧黏著層120‧‧‧Adhesive layer

130‧‧‧絕緣層130‧‧‧Insulation

210‧‧‧軟性基板210‧‧‧Soft substrate

D1 ‧‧‧軟性電路板厚度D 1 ‧‧‧Soft board thickness

D2 ‧‧‧厚度總和D 2 ‧ ‧ thickness sum

H1‧‧‧高度H1‧‧‧ Height

Claims (7)

一種連接器,適用於一軟性電路板上,該軟性電路板包括一軟性基材,該連接器包括:多個端子,各該端子包括一彈性懸臂以及一固定端,各該固定端連接對應之彈性懸臂並設置於該軟性基材上,以與該軟性電路板電性連接,各該彈性懸臂朝遠離該軟性基材的方向延伸;一黏著層,設置於該軟性基材與該些端子之間;以及一絕緣層,覆蓋於該些端子上並具有多個開口,該些開口分別暴露該些彈性懸臂。A connector for a flexible circuit board, the flexible circuit board comprising a flexible substrate, the connector comprising: a plurality of terminals, each of the terminals comprising a resilient cantilever and a fixed end, each of the fixed ends being connected The elastic cantilever is disposed on the flexible substrate to be electrically connected to the flexible circuit board, and each of the elastic cantilevers extends away from the flexible substrate; an adhesive layer is disposed on the flexible substrate and the terminals And an insulating layer covering the terminals and having a plurality of openings respectively exposing the elastic cantilevers. 如申請專利範圍第1項所述的連接器,更包括一補強材(stiffner),該軟性基材具有一第一表面以及相對該第一表面之一第二表面,該些端子、該黏著層以及該絕緣層設置於該第一表面,該補強材對應設置於該第二表面。The connector of claim 1, further comprising a stiffener having a first surface and a second surface opposite the first surface, the terminals, the adhesive layer And the insulating layer is disposed on the first surface, and the reinforcing material is correspondingly disposed on the second surface. 如申請專利範圍第2項所述的連接器,其中該連接器透過多個鎖固件,穿過該補強材而將該連接器以及該軟性電路板鎖固至一電子元件上,並透過該些彈性懸臂與該電子元件形成電連接。The connector of claim 2, wherein the connector passes through the plurality of fasteners, and the connector and the flexible circuit board are locked to an electronic component through the reinforcing material, and The resilient cantilever is electrically connected to the electronic component. 如申請專利範圍第3項所述的連接器,其中將該連接器以及該軟性電路板鎖固至該電子元件上時,該軟性電路板位於該電子元件與該補強材之間,且該些彈性懸臂與該電子元件接觸。The connector of claim 3, wherein when the connector and the flexible circuit board are locked to the electronic component, the flexible circuit board is located between the electronic component and the reinforcing material, and the The elastic cantilever is in contact with the electronic component. 如申請專利範圍第1項所述的連接器,其中該軟性電路板的厚度介於0.15毫米(mm)至0.3毫米(mm)之間。The connector of claim 1, wherein the flexible circuit board has a thickness of between 0.15 mm (mm) and 0.3 mm (mm). 如申請專利範圍第1項所述的連接器,其中該軟性電路板 與該連接器的厚度總和介於0.3毫米(mm)至0.5毫米(mm)之間。The connector of claim 1, wherein the flexible circuit board The sum of the thicknesses of the connector is between 0.3 mm (mm) and 0.5 mm (mm). 如申請專利範圍第1項所述的連接器,更包括一導電膏,設置於該軟性基材與該些端子之間。The connector of claim 1, further comprising a conductive paste disposed between the flexible substrate and the terminals.
TW102206000U 2013-04-01 2013-04-01 Connector TWM464868U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW102206000U TWM464868U (en) 2013-04-01 2013-04-01 Connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102206000U TWM464868U (en) 2013-04-01 2013-04-01 Connector

Publications (1)

Publication Number Publication Date
TWM464868U true TWM464868U (en) 2013-11-01

Family

ID=49991756

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102206000U TWM464868U (en) 2013-04-01 2013-04-01 Connector

Country Status (1)

Country Link
TW (1) TWM464868U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI584543B (en) * 2013-12-12 2017-05-21 欣興電子股份有限公司 Connector and the method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI584543B (en) * 2013-12-12 2017-05-21 欣興電子股份有限公司 Connector and the method of manufacturing the same

Similar Documents

Publication Publication Date Title
CN107006116B (en) Flexible circuit board, electronic device including the same, and method of manufacturing the same
US8242374B2 (en) Flexible-circuit-board cable with positioning structure for insertion
US20130069898A1 (en) Pad for touch panel and touch panel using the same
WO2008050448A1 (en) Electrical connection structure
TWI556692B (en) Fpc-based gold finger device
US8525035B2 (en) Double-side-conducting flexible-circuit flat cable with cluster section
US7285727B2 (en) Flexible wiring boards for double-side connection
CN105555018A (en) Printed circuit board and electronic terminal
US20060027395A1 (en) Flexible printed circuit board
CN101365294B (en) Copper coated substrate material and flexible circuit board having the copper coated substrate material
US20130277095A1 (en) Double-side-conducting flexible-circuit flat cable with cluster section
KR101357587B1 (en) Touch window and forming method for the same
EP3430469B1 (en) Flexible circuit board, array substrate, fabricating method thereof, and display apparatus
CN102131340A (en) Flexible printed wiring board, method of manufacturing the same, and electronic equipment with the same
TWM464868U (en) Connector
US11307706B2 (en) FPC connector, touch-sensitive screen and display device
JP2005050971A (en) Flexible circuit board
CN104661428A (en) Double-sided flexible circuit board and manufacturing method thereof
US10660218B2 (en) Method of manufacturing multilayer circuit board
CN203242783U (en) Connector
JP2007157907A (en) Flexible printed wiring board
CN211788750U (en) Electronic equipment
CN108601204A (en) A kind of low-loss flat transmission line
KR101170148B1 (en) Flexible printed circuit boards with single side flexible printed circuit board member
CN115023025B (en) Flexible circuit board and electronic equipment

Legal Events

Date Code Title Description
MK4K Expiration of patent term of a granted utility model