TWI584543B - Connector and the method of manufacturing the same - Google Patents

Connector and the method of manufacturing the same Download PDF

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Publication number
TWI584543B
TWI584543B TW102145897A TW102145897A TWI584543B TW I584543 B TWI584543 B TW I584543B TW 102145897 A TW102145897 A TW 102145897A TW 102145897 A TW102145897 A TW 102145897A TW I584543 B TWI584543 B TW I584543B
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Taiwan
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conductive terminals
insulating body
connector
engaging structure
insulative housing
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TW102145897A
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Chinese (zh)
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TW201524050A (en
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鄭尹華
蘇鈴凱
范智朋
謝清河
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欣興電子股份有限公司
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連接器與其製作方法 Connector and its making method

本發明是有關於一種連接器,且特別是有關於一種連接器與其製作方法。 The present invention relates to a connector, and more particularly to a connector and a method of making same.

近年來,隨著科技產業日益發達,電子裝置例如筆記型電腦(notebook computer,NB)、平板電腦(tablet computer)與智慧型手機(smart phone)等產品已頻繁地出現在日常生活中。電子裝置的型態與使用功能越來越多元,便利性與實用性讓這些電子裝置更為普及,可針對不同用途使用。除了電子裝置本身具有的功能之外,電子裝置的內部通常會設置連接器,以使電子裝置能連接其他外部裝置,而增加電子裝置的應用功能。 In recent years, with the development of the technology industry, electronic devices such as notebook computers (NB), tablet computers, and smart phones have frequently appeared in daily life. The types and functions of electronic devices are becoming more diverse, and the convenience and practicality make these electronic devices more popular and can be used for different purposes. In addition to the functions of the electronic device itself, a connector is usually provided inside the electronic device to enable the electronic device to connect to other external devices, thereby increasing the application function of the electronic device.

圖1是習知一種連接器的剖面示意圖。連接器50通常包括絕緣本體52與多個導電端子54,其中各導電端子54包括主體段54a與至少一延伸段54b,主體段54a固定在絕緣本體52內,而導電端子54的延伸段54b連接主體段54a,並延伸至絕緣本體54外。由於此類的連接器50的製作方法通常是先分別製作多根導 電端子54,再將導電端子54壓入絕緣本體52內。此類製作方式需藉由固定機構固定絕緣本體52方能實現。如此,絕緣本體52需具有相當厚度,才能順利固定在所述固定機構上。此外,導電端子54受限於製程因素,通常也僅能垂直地插入絕緣本體52內。亦即,主體段54a的延伸方向大致上垂直於絕緣本體52的長度方向(如圖1所示)。因此,為了容納導電端子54的主體段54a,絕緣本體52的厚度需大致上與主體段54a的長度相同。如此,連接器50的整體厚度變厚,不利於應用在薄型化設計的電子產品中。另一方面,目前有部分技術是將絕緣層壓合在已完成的導電端子上。此類技術雖可以降低連接器的整體厚度,但導電端子在壓合過程中容易產生彎曲,且絕緣層容易從導電端子上剝落,進而影響連接器的可靠度。 1 is a schematic cross-sectional view of a conventional connector. The connector 50 generally includes an insulative housing 52 and a plurality of electrically conductive terminals 54. Each of the electrically conductive terminals 54 includes a body segment 54a and at least one extension 54b. The body segment 54a is secured within the insulative body 52 and the extension 54b of the electrically conductive terminal 54 is coupled. The body segment 54a extends to the outside of the insulative body 54. Since the connector 50 of this type is usually manufactured separately, multiple guides are separately prepared. The electrical terminal 54 presses the conductive terminal 54 into the insulative housing 52. Such a manufacturing method can be realized by fixing the insulating body 52 by a fixing mechanism. Thus, the insulative housing 52 needs to have a considerable thickness to be smoothly fixed to the fixing mechanism. In addition, the conductive terminals 54 are limited by process factors and are typically only vertically inserted into the insulative housing 52. That is, the extending direction of the main body segment 54a is substantially perpendicular to the longitudinal direction of the insulative housing 52 (as shown in FIG. 1). Therefore, in order to accommodate the body segment 54a of the conductive terminal 54, the thickness of the insulative housing 52 needs to be substantially the same as the length of the body segment 54a. As such, the overall thickness of the connector 50 becomes thick, which is disadvantageous for use in an electronic product of a thin design. On the other hand, some techniques are currently used to laminate insulating laminates onto completed conductive terminals. Although such a technique can reduce the overall thickness of the connector, the conductive terminals are prone to bending during the pressing process, and the insulating layer is easily peeled off from the conductive terminals, thereby affecting the reliability of the connector.

本發明提供一種連接器的製作方法,能降低連接器的整體厚度,並提高連接器的可靠度。 The invention provides a method for manufacturing a connector, which can reduce the overall thickness of the connector and improve the reliability of the connector.

本發明提供一種連接器,具有薄型設計與良好的可靠度。 The invention provides a connector with a thin design and good reliability.

本發明的連接器的製作方法包括下列步驟。提供一基材。於基材上形成排列成陣列的多個導電端子,其中各導電端子具有一主體段以及兩延伸段,兩延伸段從主體段的同一端往遠離主體段的方向延伸。將一絕緣材料射出成型形成一絕緣本體,以將基材與導電端子固定於絕緣本體內,其中各導電端子的主體段 平行地固定於絕緣本體內,而兩延伸段從主體段各自延伸至絕緣本體外並位於絕緣本體的相對兩側。分離導電端子的陣列,以使導電端子彼此不連接。 The method of fabricating the connector of the present invention includes the following steps. A substrate is provided. Forming a plurality of conductive terminals arranged in an array on the substrate, wherein each of the conductive terminals has a body segment and two extending segments, and the two extending segments extend from the same end of the body segment away from the body segment. An insulating material is injection molded to form an insulating body to fix the substrate and the conductive terminal in the insulating body, wherein the main body of each conductive terminal The two extensions extend from the body segments to the outside of the insulation body and are located on opposite sides of the insulation body. The array of conductive terminals is separated such that the conductive terminals are not connected to each other.

本發明的連接器包括一基材、一絕緣本體以及多個導電端子。導電端子一體成型地位在基材上。導電端子排列成陣列且彼此不連接,其中各導電端子具有一主體段以及兩延伸段,主體段平行地固定於絕緣本體內,而兩延伸段從主體段的同一端往遠離主體段的方向延伸,且各自延伸至絕緣本體外而位於絕緣本體的相對兩側。 The connector of the present invention includes a substrate, an insulative body, and a plurality of conductive terminals. The conductive terminals are integrally formed on the substrate. The conductive terminals are arranged in an array and are not connected to each other, wherein each of the conductive terminals has a body segment and two extending segments, the body segments are fixed in parallel in the insulating body, and the two extending segments extend from the same end of the body segment away from the body segment. And each extending outside the insulating body and located on opposite sides of the insulating body.

在本發明的一實施例中,於基材上形成導電端子的步驟包括沖壓成型(punching)或蝕刻(etching)製程。 In an embodiment of the invention, the step of forming a conductive terminal on the substrate comprises a punching or etching process.

在本發明的一實施例中,上述的連接器的製作方法更包括,在於基材上形成導電端子的步驟之後,電鍍(plating)一保護層於導電端子上。 In an embodiment of the invention, the method of fabricating the connector further includes: plating a protective layer on the conductive terminal after the step of forming a conductive terminal on the substrate.

在本發明的一實施例中,上述的連接器的製作方法更包括,在分離導電端子的陣列後,將絕緣本體固定於一金屬框架上。 In an embodiment of the invention, the method for fabricating the connector further includes: after separating the array of the conductive terminals, fixing the insulating body to a metal frame.

在本發明的一實施例中,上述的絕緣本體具有至少一第一卡合結構,位於絕緣本體的一端,而金屬框架具有至少一第二卡合結構,位於金屬框架的一端並對應於第一卡合結構。在將絕緣本體固定於金屬框架上的步驟中,更包括將絕緣本體藉由第一卡合結構與第二卡合結構互相干涉而固定於金屬框架上。 In an embodiment of the invention, the insulative housing has at least one first engaging structure at one end of the insulative housing, and the metal frame has at least one second engaging structure at one end of the metal frame and corresponding to the first The snap structure. The step of fixing the insulating body to the metal frame further includes fixing the insulating body to the metal frame by interfering with the first engaging structure and the second engaging structure.

在本發明的一實施例中,在上述的形成絕緣本體的步驟 中,更包括同時形成多個開口於絕緣本體上。開口對應地暴露出導電端子,各導電端子的主體段鄰近對應的開口並固定於絕緣本體內,而兩延伸段各自從對應的開口延伸至絕緣本體外。 In an embodiment of the invention, the step of forming the insulative body described above The method further includes simultaneously forming a plurality of openings on the insulating body. The openings correspondingly expose the conductive terminals, and the body segments of the conductive terminals are adjacent to the corresponding openings and are fixed in the insulating body, and the two extending portions each extend from the corresponding opening to the outside of the insulating body.

在本發明的一實施例中,上述的連接器更包括一金屬框架,絕緣本體固定於金屬框架上。 In an embodiment of the invention, the connector further includes a metal frame, and the insulating body is fixed to the metal frame.

在本發明的一實施例中,上述的絕緣本體具有至少一第一卡合結構,位於絕緣本體的一端,而金屬框架具有至少一第二卡合結構,位於金屬框架的一端並對應於第一卡合結構。絕緣本體藉由第一卡合結構與第二卡合結構互相干涉而固定於金屬框架上。 In an embodiment of the invention, the insulative housing has at least one first engaging structure at one end of the insulative housing, and the metal frame has at least one second engaging structure at one end of the metal frame and corresponding to the first The snap structure. The insulating body is fixed to the metal frame by interfering with the first engaging structure and the second engaging structure.

在本發明的一實施例中,上述的第一卡合結構包括一卡槽,而第二卡合結構包括一凸柱。 In an embodiment of the invention, the first engaging structure includes a card slot, and the second engaging structure includes a protruding post.

在本發明的一實施例中,上述的第一卡合結構適於相對於第二卡合結構移動,以調整絕緣本體與金屬框架之間的一距離。 In an embodiment of the invention, the first engaging structure is adapted to move relative to the second engaging structure to adjust a distance between the insulating body and the metal frame.

在本發明的一實施例中,上述的絕緣本體具有多個開口。開口對應地暴露出導電端子。各導電端子的主體段鄰近對應的開口並固定於絕緣本體內,而兩延伸段各自從對應的開口延伸至絕緣本體外。 In an embodiment of the invention, the insulative housing has a plurality of openings. The opening correspondingly exposes the conductive terminal. The main body segments of the respective conductive terminals are adjacent to the corresponding openings and are fixed in the insulating body, and the two extending portions each extend from the corresponding opening to the outside of the insulating body.

在本發明的一實施例中,上述的各導電端子的兩延伸段之間的距離小於兩延伸段相對於主體段的距離。 In an embodiment of the invention, the distance between the two extensions of each of the conductive terminals is less than the distance between the two extensions relative to the body segment.

基於上述,本發明的連接器與其製作方法在將絕緣材料射出成型形成絕緣本體的同時將已形成有導電端子的基材固定於 絕緣本體內。如此,將導電端子固定於絕緣本體的步驟與形成絕緣本體的步驟在同一製程中執行,可使各導電端子的主體段平行地固定於絕緣本體內,亦即導電端子的延伸方向可視為是平行於絕緣本體。如此,本發明可有效降低絕緣本體用來包覆導電端子所需的厚度,且導電端子與絕緣本體不易分離。據此,本發明的連接器的製作方法能降低連接器的整體厚度,並提高連接器的可靠度,而使連接器具有薄型設計與良好的可靠度。 Based on the above, the connector of the present invention and the manufacturing method thereof are capable of fixing a substrate on which a conductive terminal has been formed while ejecting an insulating material to form an insulating body. Insulate the body. In this way, the step of fixing the conductive terminals to the insulative housing is performed in the same process as the step of forming the insulative housing, so that the main body segments of the respective conductive terminals can be fixed in parallel in the insulating body, that is, the extending direction of the conductive terminals can be regarded as parallel. Insulating body. Thus, the present invention can effectively reduce the thickness required for the insulating body to cover the conductive terminals, and the conductive terminals are not easily separated from the insulating body. Accordingly, the method of fabricating the connector of the present invention can reduce the overall thickness of the connector and improve the reliability of the connector, so that the connector has a thin design and good reliability.

為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the invention will be apparent from the following description.

50、100‧‧‧連接器 50, 100‧‧‧ connectors

52、120‧‧‧絕緣本體 52, 120‧‧‧Insulated body

54、110‧‧‧導電端子 54,110‧‧‧Electrical terminals

54a、112‧‧‧主體段 54a, 112‧‧‧ main body

54b、114a、114b‧‧‧延伸段 54b, 114a, 114b‧‧‧ extension

102‧‧‧基材 102‧‧‧Substrate

122‧‧‧開口 122‧‧‧ openings

124‧‧‧第一卡合結構 124‧‧‧First engagement structure

130‧‧‧金屬框架 130‧‧‧Metal frame

132‧‧‧第二卡合結構 132‧‧‧Second snap-in structure

d1、d2‧‧‧距離 D1, d2‧‧‧ distance

D‧‧‧延伸方向 D‧‧‧ Extension direction

L‧‧‧長度方向 L‧‧‧ Length direction

t‧‧‧厚度 T‧‧‧thickness

圖1是習知一種連接器的剖面示意圖。 1 is a schematic cross-sectional view of a conventional connector.

圖2是本發明一實施例的連接器的製作流程圖。 2 is a flow chart showing the fabrication of a connector in accordance with an embodiment of the present invention.

圖3A至圖3D是圖2的連接器的製作方法的示意圖。 3A to 3D are schematic views of a method of fabricating the connector of Fig. 2.

圖4是本發明一實施例的連接器的局部放大示意圖。 4 is a partially enlarged schematic view of a connector in accordance with an embodiment of the present invention.

圖5是圖4的連接器的局部放大剖面圖。 Figure 5 is a partial enlarged cross-sectional view of the connector of Figure 4;

圖2是本發明一實施例的連接器的製作流程圖。圖3A至圖3D是圖2的連接器的製作方法的示意圖。請參考圖2與圖3A至圖3D,在本實施例中,連接器100的製作方法包括下列步驟: 在步驟S110中,提供基材102。在步驟S120中,於基材102上形成排列成陣列的多個導電端子110。在步驟S130中,將一絕緣材料射出成型形成絕緣本體120,以將基材102與導電端子110固定於絕緣本體120內。在步驟S140中,分離導電端子的陣列,以使排列成陣列的導電端子110彼此不連接。在步驟S150中,將絕緣本體120固定於金屬框架130上。對應上述步驟S110至S150的連接器100的製作流程的示意圖分別繪示於圖3A至圖3D。以下將以文字搭配圖2以及圖3A至圖3D依序說明本實施例的連接器100的製作方法。 2 is a flow chart showing the fabrication of a connector in accordance with an embodiment of the present invention. 3A to 3D are schematic views of a method of fabricating the connector of Fig. 2. Referring to FIG. 2 and FIG. 3A to FIG. 3D , in the embodiment, the manufacturing method of the connector 100 includes the following steps: In step S110, a substrate 102 is provided. In step S120, a plurality of conductive terminals 110 arranged in an array are formed on the substrate 102. In step S130, an insulating material is injection molded to form the insulative housing 120 to fix the substrate 102 and the conductive terminal 110 in the insulative housing 120. In step S140, the array of conductive terminals is separated such that the conductive terminals 110 arranged in an array are not connected to each other. In step S150, the insulative housing 120 is fixed to the metal frame 130. A schematic diagram of a manufacturing process of the connector 100 corresponding to the above steps S110 to S150 is shown in FIGS. 3A to 3D, respectively. Hereinafter, a method of fabricating the connector 100 of the present embodiment will be sequentially described with reference to FIG. 2 and FIGS. 3A to 3D.

首先,請參考圖2與圖3A,在步驟S110中,提供基材102。在本實施例中,基材102具有導電性以及可撓性,其材質例如是銅合金。然而,在其他實施例中,基材102可選用適當的材質,本發明並不以此為限制。 First, referring to FIG. 2 and FIG. 3A, in step S110, the substrate 102 is provided. In the present embodiment, the substrate 102 has electrical conductivity and flexibility, and the material thereof is, for example, a copper alloy. However, in other embodiments, the substrate 102 may be made of a suitable material, and the invention is not limited thereto.

接著,請參考圖2與圖3B,在步驟S120中,於基材102上形成排列成陣列的多個導電端子110。在本實施例中,各導電端子110具有主體段112以及兩延伸段114a與114b。主體段112平行於基材102,而兩延伸段114a與114b從主體段112的同一端往遠離主體段112的方向延伸,並且各自往基材102的相對兩側延伸,其中所述基材102的相對兩側例如是基材102的上下兩側(相對於圖3B為往圖面外與圖面內延伸),而同時參照後續的圖式(例如圖3C至圖5)能更為清楚理解此特徵。在圖3B中,排列成陣列的導電端子110是以排列成四排,且每排具有等間距排列的四 個導電端子110,但本發明並不限制導電端子110的數量與排列方式,其可依據需求調整。再者,在本實施例中,於基材102上形成導電端子110的步驟包括沖壓成型(punching)製程,其中各導電端子110周圍的部分基材102沖壓成型製程中被移除,以大致上形成導電端子110的外型,且從主體段112的同一側延伸的兩延伸段114a與114b藉由沖壓而分別朝向基材102的相對兩側彎折,進而突出於基材102外。此時,各導電端子110的主體段112仍藉由殘留的基材102互相連接。如此,即可於基材102上一體成型地形成多個導電端子110。然而,在其他實施例中,藉由基材102形成導電端子110的步驟可以例如是先藉由蝕刻(etching)移除各導電端子110周圍的部分基材102,再藉由沖壓成型而形成導電端子110。本發明的導電端子110不限於上述的製作方式,其可依據需求選擇適當的製程。此外,在於基材102上形成導電端子110的步驟之後,還可以電鍍(plating)導電端子110,以在導電端子110表面形成保護層(圖未示),但本發明不限制導電端子110電鍍與否。 Next, referring to FIG. 2 and FIG. 3B, in step S120, a plurality of conductive terminals 110 arranged in an array are formed on the substrate 102. In this embodiment, each of the conductive terminals 110 has a body segment 112 and two extensions 114a and 114b. The body section 112 is parallel to the substrate 102, and the two extensions 114a and 114b extend from the same end of the body section 112 away from the body section 112 and each extend to opposite sides of the substrate 102, wherein the substrate 102 The opposite sides of the substrate 102 are, for example, the upper and lower sides of the substrate 102 (external to the plane of the drawing relative to FIG. 3B), and can be more clearly understood by referring to the subsequent drawings (eg, FIG. 3C to FIG. 5). This feature. In FIG. 3B, the conductive terminals 110 arranged in an array are arranged in four rows, and each row is arranged at equal intervals. The conductive terminals 110, but the present invention does not limit the number and arrangement of the conductive terminals 110, which can be adjusted according to requirements. Furthermore, in the present embodiment, the step of forming the conductive terminals 110 on the substrate 102 includes a punching process in which a portion of the substrate 102 around each of the conductive terminals 110 is removed during the stamping process to substantially The outer shape of the conductive terminal 110 is formed, and the two extensions 114a and 114b extending from the same side of the main body segment 112 are respectively bent toward the opposite sides of the substrate 102 by punching, thereby protruding beyond the substrate 102. At this time, the main body segments 112 of the respective conductive terminals 110 are still connected to each other by the residual substrate 102. Thus, a plurality of conductive terminals 110 can be integrally formed on the substrate 102. However, in other embodiments, the step of forming the conductive terminals 110 by the substrate 102 may be, for example, first removing a portion of the substrate 102 around each of the conductive terminals 110 by etching, and then forming conductive by stamping. Terminal 110. The conductive terminal 110 of the present invention is not limited to the above-described manufacturing method, and an appropriate process can be selected according to requirements. In addition, after the step of forming the conductive terminal 110 on the substrate 102, the conductive terminal 110 may be plated to form a protective layer (not shown) on the surface of the conductive terminal 110, but the present invention does not limit the plating of the conductive terminal 110. no.

接著,請參考圖2與圖3C,在步驟S130中,將絕緣材料射出成型形成絕緣本體120,以將基材102與導電端子110固定於絕緣本體120內。具體而言,在本實施例中,絕緣材料例如為塑膠(plastic),但本發明不以此為限制。由於本製作方法在步驟S120中已於基材102上形成導電端子110,其中導電端子110的主體段112平行於基材102,而兩延伸段114a與114b朝向基材 102的相對兩側延伸。因此,將基材102配置於未繪示的模具中,並將流動的絕緣材料流入模具內,可以在絕緣材料形成絕緣本體120的同時將基材102與連接基材102的導電端子110固定於絕緣本體120內。基材102可藉由模具的設計而平行於絕緣本體120。如此,各導電端子110的主體段112可以平行地固定於絕緣本體120內,而兩延伸段114a與114b從主體段112各自延伸至絕緣本體120外並位於絕緣本體120的相對兩側,其中所述絕緣本體120的相對兩側例如是絕緣本體120的上下兩側(相對於圖3C為往圖式上方與圖式下方延伸)。此外,在本實施例中,在上述形成絕緣本體120的步驟中(步驟S130),更包括同時形成多個開口122於絕緣本體120上,例如是事先設計模具的形狀,以使絕緣材料形成絕緣本體120的同時即具有多個開口122。開口122對應地暴露出導電端子110,其中各導電端子110的主體段112鄰近對應的開口122並固定於絕緣本體120內,而兩延伸段114a與114b各自從對應的開口122延伸至絕緣本體120外。 Next, referring to FIG. 2 and FIG. 3C , in step S130 , the insulating material is injection molded to form the insulative housing 120 to fix the substrate 102 and the conductive terminal 110 in the insulative housing 120 . Specifically, in the present embodiment, the insulating material is, for example, plastic, but the invention is not limited thereto. Since the fabrication method has formed the conductive terminal 110 on the substrate 102 in step S120, wherein the body segment 112 of the conductive terminal 110 is parallel to the substrate 102, and the two extensions 114a and 114b are oriented toward the substrate. The opposite sides of 102 extend. Therefore, the substrate 102 is disposed in a mold (not shown), and the flowing insulating material flows into the mold, and the substrate 102 and the conductive terminal 110 of the connection substrate 102 can be fixed to the insulating body 120 while the insulating material is formed. Insulating body 120. The substrate 102 can be parallel to the insulative body 120 by the design of the mold. As such, the body segments 112 of the conductive terminals 110 can be fixed in parallel in the insulative housing 120, and the two extensions 114a and 114b extend from the main body segment 112 to the outside of the insulative housing 120 and on opposite sides of the insulative housing 120. The opposite sides of the insulative housing 120 are, for example, upper and lower sides of the insulative housing 120 (above the upper side of the drawing and the lower side of the drawing with respect to FIG. 3C). In addition, in the embodiment, in the step of forming the insulative housing 120 (step S130), the method further includes simultaneously forming a plurality of openings 122 on the insulative housing 120, for example, the shape of the mold is designed in advance to insulate the insulating material. The body 120 has a plurality of openings 122 at the same time. The opening 122 correspondingly exposes the conductive terminal 110 , wherein the body segment 112 of each conductive terminal 110 is adjacent to the corresponding opening 122 and is fixed in the insulative housing 120 , and the two extending segments 114 a and 114 b each extend from the corresponding opening 122 to the insulative housing 120 . outer.

接著,請繼續參考圖2與圖3C,在步驟S140中,分離導電端子110的陣列,以使導電端子110彼此不連接。在本實施例中,在形成絕緣本體120,並同時將基材102與導電端子110固定於絕緣本體120內的步驟之後,固定於絕緣本體120內的導電端子110仍藉由殘留的基材102互相連接(如圖3B所示)。為了避免各導電端子110在傳輸訊號時互相干擾,導電端子110的陣列必須互相分離。因此,在完成絕緣本體120之後,可以藉由未 繪示的模具將排列成陣列的各導電端子110的連接處斷開。如此,可使各導電端子110彼此互相獨立而不連接。然而,在前述步驟中已先電鍍各導電端子110,故各導電端子110的兩延伸段114a與114b以及主體段112彼此電性導通。據此,由於兩延伸段114a與114b從主體段112各自延伸至絕緣本體120外並位於絕緣本體120的相對兩側,當連接器100配置在未繪示的線路板(circuit board)上時,連接器100可藉由兩延伸段114a與/或114b連接線路板(例如是線路板上的導電接墊),或者當連接器100配置於電子裝置(未繪示)內時,連接器100可藉由兩延伸段114a與/或114b連接其他外部裝置。此時,連接器100可藉由導電端子110傳遞訊號。 Next, referring to FIG. 2 and FIG. 3C, in step S140, the array of conductive terminals 110 is separated such that the conductive terminals 110 are not connected to each other. In this embodiment, after the step of forming the insulative housing 120 and simultaneously fixing the substrate 102 and the conductive terminal 110 in the insulative housing 120, the conductive terminal 110 fixed in the insulative housing 120 is still retained by the residual substrate 102. Connected to each other (as shown in Figure 3B). In order to prevent each of the conductive terminals 110 from interfering with each other while transmitting signals, the array of conductive terminals 110 must be separated from each other. Therefore, after the insulating body 120 is completed, it can be The illustrated mold disconnects the joints of the respective conductive terminals 110 arranged in an array. In this way, the respective conductive terminals 110 can be made independent of each other without being connected. However, in the foregoing steps, each of the conductive terminals 110 has been plated first, so that the two extended segments 114a and 114b and the body segment 112 of each of the conductive terminals 110 are electrically connected to each other. Accordingly, since the two extensions 114a and 114b extend from the main body segment 112 to the outside of the insulative housing 120 and on opposite sides of the insulative housing 120, when the connector 100 is disposed on a circuit board (not shown), The connector 100 can be connected to the circuit board (for example, a conductive pad on the circuit board) by the two extensions 114a and/or 114b, or when the connector 100 is disposed in an electronic device (not shown), the connector 100 can be Other external devices are connected by two extensions 114a and/or 114b. At this time, the connector 100 can transmit a signal through the conductive terminal 110.

最後,請參考圖2與圖3D,在步驟S150中,將絕緣本體120固定於金屬框架130上。在本實施例中,當步驟S140完成時,實際上已大致完成本發明的連接器100。然而,本實施例的連接器100可選擇性地配置金屬框架130,以加強連接器100的機械強度。具體而言,在本實施例中,絕緣本體120具有兩第一卡合結構124,位於絕緣本體120的相對兩端,而金屬框架130具有兩第二卡合結構132,位於金屬框架130的相對兩端,並對應於第一卡合結構124。因此,在將絕緣本體120固定於金屬框架130上的步驟中(步驟S150),更包括將絕緣本體120藉由第一卡合結構124與第二卡合結構132互相干涉而固定於金屬框架130上。其中,第一卡合結構124例如是卡槽,而第二卡合結構132例如是 凸柱,故兩者可以互相配合並產生干涉。如此,配置有金屬框架130的連接器100具有良好的機械強度。然而,在其他未繪示的實施例中,連接器的第一卡合結構與第二卡合結構的數量、位置與類型可依據需求調整,且連接器也可以省略配置金屬框架,本發明並不限於上述的實施方式。 Finally, referring to FIG. 2 and FIG. 3D, in step S150, the insulative housing 120 is fixed to the metal frame 130. In the present embodiment, when the step S140 is completed, the connector 100 of the present invention has been substantially completed. However, the connector 100 of the present embodiment can selectively configure the metal frame 130 to enhance the mechanical strength of the connector 100. Specifically, in the embodiment, the insulative housing 120 has two first engaging structures 124 at opposite ends of the insulative housing 120, and the metal frame 130 has two second engaging structures 132 located opposite to the metal frame 130. Both ends, and corresponding to the first engaging structure 124. Therefore, in the step of fixing the insulative housing 120 to the metal frame 130 (step S150), the insulating body 120 is further fixed to the metal frame 130 by interfering with the first engaging structure 124 and the second engaging structure 132. on. The first engaging structure 124 is, for example, a card slot, and the second engaging structure 132 is, for example, The studs, so the two can cooperate and interfere. As such, the connector 100 provided with the metal frame 130 has good mechanical strength. However, in other embodiments not shown, the number, position and type of the first engaging structure and the second engaging structure of the connector can be adjusted according to requirements, and the connector can also omit the configuration of the metal frame. It is not limited to the above embodiment.

圖4是本發明一實施例的連接器的局部放大示意圖。圖5是圖4的連接器的局部放大剖面圖。請參考圖3D、圖4與圖5,在本實施例中,經由前述的製作方法所完成的連接器100包括基材102(繪示於圖3A與圖3B)、多個導電端子110以及絕緣本體120。導電端子110一體成型地位在基材102上,且導電端子110排列成陣列且彼此不連接。換言之,在藉由前述步驟所製作完成的連接器100中,基材102與導電端子110固定於絕緣本體120內。此時,導電端子110彼此分離,但由於基材102在導電端子110仍彼此連接的時候就固定在絕緣本體120內,故分離導電端子110的陣列之後所留下的基材102的殘料仍會在絕緣本體120內。另外,各導電端子110具有主體段112以及兩延伸段114a與114b,主體段112平行地固定於絕緣本體120內,而兩延伸段114a與114b從主體段112的同一端往遠離主體段112的方向延伸,且各自延伸至絕緣本體120外而位於絕緣本體120的相對兩側,例如是圖5所示的絕緣本體120的上下兩側。更進一步地說,在本實施例中,絕緣本體120具有多個開口122。開口122對應地暴露出導電端子110。各導電端子110的主體段112鄰近對應的開口122並固定於 絕緣本體120內,而兩延伸段114a與114b各自從對應的開口122延伸至絕緣本體120外,用以後續應用中連接未繪示的線路板或其他外部裝置並傳遞訊號。 4 is a partially enlarged schematic view of a connector in accordance with an embodiment of the present invention. Figure 5 is a partial enlarged cross-sectional view of the connector of Figure 4; Referring to FIG. 3D , FIG. 4 and FIG. 5 , in the embodiment, the connector 100 completed by the foregoing manufacturing method includes a substrate 102 (shown in FIGS. 3A and 3B ), a plurality of conductive terminals 110 , and insulation. Body 120. The conductive terminals 110 are integrally formed on the substrate 102, and the conductive terminals 110 are arranged in an array and are not connected to each other. In other words, in the connector 100 fabricated by the foregoing steps, the substrate 102 and the conductive terminal 110 are fixed in the insulative housing 120. At this time, the conductive terminals 110 are separated from each other, but since the substrate 102 is fixed in the insulating body 120 when the conductive terminals 110 are still connected to each other, the residual material of the substrate 102 remaining after the array of the conductive terminals 110 is separated remains Will be in the insulative body 120. In addition, each of the conductive terminals 110 has a body segment 112 and two extending segments 114a and 114b. The body segments 112 are fixed in parallel in the insulative housing 120, and the two extending segments 114a and 114b are from the same end of the body segment 112 away from the body segment 112. The directions extend and extend to the opposite sides of the insulative housing 120, such as the upper and lower sides of the insulative housing 120 shown in FIG. Further, in the present embodiment, the insulative housing 120 has a plurality of openings 122. The opening 122 correspondingly exposes the conductive terminal 110. The body segment 112 of each of the conductive terminals 110 is adjacent to the corresponding opening 122 and is fixed to In the insulative housing 120, the two extensions 114a and 114b each extend from the corresponding opening 122 to the outside of the insulative housing 120 for connecting a circuit board or other external device not shown and transmitting signals in a subsequent application.

此外,在本實施例中,連接器100更可選擇性的配置有金屬框架130(繪示於圖3D)。絕緣本體120固定於金屬框架130上,以加強連接器100的機械強度。有關絕緣本體120與金屬框架130的配置關係如前述說明,在此不多加贅述。其中,第一卡合結構124與第二卡合結構132藉由干涉而使絕緣本體120固定於金屬框架130上,且第一卡合結構124適於相對於第二卡合結構132移動,以調整絕緣本體120與金屬框架130之間的距離。如此,第一卡合結構124與第二卡合結構132不僅能將絕緣本體120固定在金屬框架130而增加連接器100的機械強度,還可以藉由調整絕緣本體120與金屬框架130的相對距離而改善各導電端子110的延伸段114b與金屬框架130接觸的平整度,以提高連接器100的導電端子110在後續應用中的銲接效果。 In addition, in the embodiment, the connector 100 is more selectively configured with a metal frame 130 (shown in FIG. 3D). The insulative housing 120 is secured to the metal frame 130 to enhance the mechanical strength of the connector 100. The arrangement relationship between the insulative housing 120 and the metal frame 130 is as described above, and will not be further described herein. The first engaging structure 124 and the second engaging structure 132 fix the insulating body 120 to the metal frame 130 by interference, and the first engaging structure 124 is adapted to move relative to the second engaging structure 132 to The distance between the insulative housing 120 and the metal frame 130 is adjusted. As such, the first engaging structure 124 and the second engaging structure 132 can not only fix the insulating body 120 to the metal frame 130 but increase the mechanical strength of the connector 100, and can also adjust the relative distance between the insulating body 120 and the metal frame 130. The flatness of the extension of each of the conductive terminals 110 to the metal frame 130 is improved to improve the soldering effect of the conductive terminals 110 of the connector 100 in subsequent applications.

另一方面,請參考圖5,在本實施例中,由於各導電端子110的主體段112藉由上述的製作方式而平行地固定於絕緣本體120內,因此各導電端子110的主體段112的延伸方向D實際上平行於絕緣本體120的長度方向L。再者,本實施例的各導電端子110的兩延伸段114a與114b之間的距離d1小於兩延伸段114a相對於主體段112的距離d2(圖5中標示為延伸段114a相對於主體段112的距離)。換言之,兩延伸段114a與114b之間的距離d1 可視為是導電端子110的高度,而兩延伸段114a相對於主體段112的距離d2可視為是導電端子110的長度,而導電端子110的高度小於導電端子110的長度。如此,由於本實施例將導電端子110的主體段112平行地固定於絕緣本體120內,而兩延伸段114a與114b暴露於絕緣本體120外,因此絕緣本體120的厚度t可以降低至小於導電端子110的高度(距離d1)。即使絕緣本體120需包覆導電端子110的大部分而僅暴露出兩延伸段114a與114b的局部,絕緣本體120的厚度t也僅需配置成接近導電端子110的高度(距離d1)即可。相較於將導電端子垂直地插入絕緣本體,而使絕緣本體的厚度需接近導電端子的長度的技術而言,本實施例的製作方式可有效降低絕緣本體120用來包覆導電端子110所需的厚度t,以降低連接器100的整體厚度。此外,由於本實施例的連接器100利用射出成型製程在形成絕緣本體120的同時將導電端子110固定於絕緣本體120內,故導電端子110與絕緣本體120不易分離。據此,本實施例的連接器100的製作方法能降低連接器100的整體厚度,並提高連接器100的可靠度,而使連接器100具有薄型設計與良好的可靠度。 On the other hand, referring to FIG. 5, in the embodiment, since the main body segments 112 of the conductive terminals 110 are fixed in parallel in the insulative housing 120 by the above-described manufacturing manner, the main body segments 112 of the respective conductive terminals 110 are The extending direction D is substantially parallel to the length direction L of the insulative housing 120. Moreover, the distance d1 between the two extensions 114a and 114b of each of the conductive terminals 110 of the present embodiment is smaller than the distance d2 of the two extensions 114a with respect to the main body segment 112 (in FIG. 5, the extension 114a is indicated relative to the main body segment 112). the distance). In other words, the distance d1 between the two extensions 114a and 114b It can be considered as the height of the conductive terminal 110, and the distance d2 of the two extensions 114a with respect to the body segment 112 can be regarded as the length of the conductive terminal 110, and the height of the conductive terminal 110 is smaller than the length of the conductive terminal 110. As such, since the main body segment 112 of the conductive terminal 110 is fixed in parallel in the insulative housing 120, and the two extended segments 114a and 114b are exposed outside the insulative housing 120, the thickness t of the insulative housing 120 can be reduced to less than the conductive terminal. The height of 110 (distance d1). Even if the insulating body 120 needs to cover most of the conductive terminals 110 and only expose portions of the two extending portions 114a and 114b, the thickness t of the insulating body 120 only needs to be disposed close to the height (distance d1) of the conductive terminals 110. The manufacturing method of the present embodiment can effectively reduce the requirement for the insulating body 120 to cover the conductive terminal 110, as compared with the technique of inserting the conductive terminal into the insulating body vertically, so that the thickness of the insulating body needs to be close to the length of the conductive terminal. The thickness t is to reduce the overall thickness of the connector 100. In addition, since the connector 100 of the present embodiment fixes the conductive terminal 110 in the insulative housing 120 while forming the insulative housing 120 by the injection molding process, the conductive terminal 110 and the insulative housing 120 are not easily separated. Accordingly, the manufacturing method of the connector 100 of the present embodiment can reduce the overall thickness of the connector 100 and improve the reliability of the connector 100, so that the connector 100 has a thin design and good reliability.

綜上所述,本發明的連接器與其製作方法在將絕緣材料射出成型形成絕緣本體的同時將已形成導電端子的基材固定於絕緣本體內。如此,將導電端子固定於絕緣本體的步驟與形成絕緣本體的步驟在同一製程中執行,可使各導電端子的主體段平行地固定於絕緣本體內,其中導電端子的延伸方向平行於絕緣本體的 長度方向,且導電端子的高度小於導電端子的長度。因此,包覆導電端子的絕緣本體的厚度僅需大致上等於導電端子的高度即可。如此,本發明可有效降低絕緣本體用來包覆導電端子所需的厚度,且導電端子與絕緣本體不易分離。據此,本發明的連接器的製作方法能降低連接器的整體厚度,並提高連接器的可靠度,而使連接器具有薄型設計與良好的可靠度。 In summary, the connector of the present invention and its manufacturing method fix the substrate on which the conductive terminal has been formed in the insulating body while injecting and molding the insulating material to form the insulating body. In this manner, the step of fixing the conductive terminals to the insulative housing is performed in the same process as the step of forming the insulative housing, and the main body segments of the respective conductive terminals can be fixed in parallel in the insulating body, wherein the extending direction of the conductive terminals is parallel to the insulating body. The length direction, and the height of the conductive terminal is smaller than the length of the conductive terminal. Therefore, the thickness of the insulative housing covering the conductive terminals only needs to be substantially equal to the height of the conductive terminals. Thus, the present invention can effectively reduce the thickness required for the insulating body to cover the conductive terminals, and the conductive terminals are not easily separated from the insulating body. Accordingly, the method of fabricating the connector of the present invention can reduce the overall thickness of the connector and improve the reliability of the connector, so that the connector has a thin design and good reliability.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧連接器 100‧‧‧Connector

110‧‧‧導電端子 110‧‧‧Electrical terminals

112‧‧‧主體段 112‧‧‧ main body

114a、114b‧‧‧延伸段 114a, 114b‧‧‧ extension

120‧‧‧絕緣本體 120‧‧‧Insulated body

122‧‧‧開口 122‧‧‧ openings

124‧‧‧第一卡合結構 124‧‧‧First engagement structure

130‧‧‧金屬框架 130‧‧‧Metal frame

132‧‧‧第二卡合結構 132‧‧‧Second snap-in structure

Claims (8)

一種連接器的製作方法,包括:提供一基材;於該基材上形成排列成陣列的多個導電端子,其中各該導電端子具有一主體段以及兩延伸段,該兩延伸段從該主體段的同一端往遠離該主體段的方向延伸;將一絕緣材料射出成型形成一絕緣本體,以將該基材與該些導電端子固定於該絕緣本體內,其中各該導電端子的該主體段平行地固定於該絕緣本體內,而該兩延伸段從該主體段各自延伸至該絕緣本體外並位於該絕緣本體的相對兩側;分離該些導電端子的陣列,以使該些導電端子彼此不連接;以及將該絕緣本體固定於一金屬框架上,其中該絕緣本體具有至少一第一卡合結構,位於該絕緣本體的一端,而該金屬框架具有至少一第二卡合結構,位於該金屬框架的一端並對應於該第一卡合結構,在將該絕緣本體固定於該金屬框架上的步驟中,更包括將該絕緣本體藉由該第一卡合結構與該第二卡合結構互相干涉而固定於該金屬框架上,該第一卡合結構適於相對於該第二卡合結構移動,以調整該絕緣本體與該金屬框架之間的一距離。 A method of manufacturing a connector, comprising: providing a substrate; forming a plurality of conductive terminals arranged in an array on the substrate, wherein each of the conductive terminals has a body segment and two extension segments, the two extension segments from the body The same end of the segment extends away from the body segment; an insulating material is injection molded to form an insulating body to fix the substrate and the conductive terminals in the insulating body, wherein the body segment of each of the conductive terminals The two extensions extend from the main body segment to the outside of the insulating body and are located on opposite sides of the insulating body; the array of the conductive terminals are separated such that the conductive terminals are connected to each other. And connecting the insulative housing to a metal frame, wherein the insulative housing has at least one first engaging structure at one end of the insulative housing, and the metal frame has at least one second engaging structure, One end of the metal frame corresponds to the first engaging structure, and in the step of fixing the insulating body to the metal frame, the insulating body is further included The first engaging structure is fixed to the metal frame by interfering with the second engaging structure, and the first engaging structure is adapted to move relative to the second engaging structure to adjust the insulating body and the A distance between the metal frames. 如申請專利範圍第1項所述的連接器的製作方法,其中於該基材上形成該些導電端子的步驟包括沖壓成型或蝕刻製程。 The method of fabricating the connector of claim 1, wherein the step of forming the conductive terminals on the substrate comprises a stamping or etching process. 如申請專利範圍第1項所述的連接器的製作方法,更包括: 在於該基材上形成該些導電端子的步驟之後,電鍍一保護層於該些導電端子上。 The method for manufacturing the connector according to claim 1, further comprising: After the step of forming the conductive terminals on the substrate, a protective layer is plated on the conductive terminals. 如申請專利範圍第1項所述的連接器的製作方法,其中在形成該絕緣本體的步驟中,更包括同時形成多個開口於該絕緣本體上,該些開口對應地暴露出該些導電端子,各該導電端子的該主體段鄰近對應的該開口並固定於該絕緣本體內,而該兩延伸段各自從對應的該開口延伸至該絕緣本體外。 The method of manufacturing the connector of claim 1, wherein the step of forming the insulating body further comprises simultaneously forming a plurality of openings on the insulating body, the openings correspondingly exposing the conductive terminals The body segment of each of the conductive terminals is adjacent to the corresponding opening and is fixed in the insulating body, and the two extending segments each extend from the corresponding opening to the outside of the insulating body. 一種連接器,包括:一基材;一絕緣本體;多個導電端子,一體成型地位在該基材上,該些導電端子排列成陣列且彼此不連接,其中各該導電端子具有一主體段以及兩延伸段,該主體段平行地固定於該絕緣本體內,而該兩延伸段從該主體段的同一端往遠離該主體段的方向延伸,且各自延伸至該絕緣本體外而位於該絕緣本體的相對兩側;以及一金屬框架,該絕緣本體固定於該金屬框架上,其中該絕緣本體具有至少一第一卡合結構,位於該絕緣本體的一端,而該金屬框架具有至少一第二卡合結構,位於該金屬框架的一端並對應於該第一卡合結構,該絕緣本體藉由該第一卡合結構與該第二卡合結構互相干涉而固定於該金屬框架上,該第一卡合結構適於相對於該第二卡合結構移動,以調整該絕緣本體與該金屬框架之間的一距離。 A connector includes: a substrate; an insulative housing; a plurality of conductive terminals integrally formed on the substrate, the conductive terminals being arranged in an array and not connected to each other, wherein each of the conductive terminals has a body segment and Two extensions, the body segments are fixed in parallel in the insulating body, and the two extensions extend from the same end of the body segment away from the body segment, and each extends outside the insulating body to be located on the insulating body And a metal frame, the insulative housing is fixed to the metal frame, wherein the insulative housing has at least one first engaging structure at one end of the insulative housing, and the metal frame has at least one second card a first structure of the metal frame corresponding to the first engaging structure, the insulating body being fixed to the metal frame by interfering with the first engaging structure and the second engaging structure, the first The engaging structure is adapted to move relative to the second engaging structure to adjust a distance between the insulating body and the metal frame. 如申請專利範圍第5項.所述的連接器,其中該第一卡合結構包括一卡槽,而該第二卡合結構包括一凸柱。 The connector of claim 5, wherein the first engaging structure comprises a card slot, and the second engaging structure comprises a stud. 如申請專利範圍第5項所述的連接器,其中該絕緣本體具有多個開口,該些開口對應地暴露出該些導電端子,各該導電端子的該主體段鄰近對應的該開口並固定於該絕緣本體內,而該兩延伸段各自從對應的該開口延伸至該絕緣本體外。 The connector of claim 5, wherein the insulative housing has a plurality of openings, the openings correspondingly exposing the conductive terminals, the main body segment of each of the conductive terminals being adjacent to the corresponding opening and fixed to the The insulating body, and the two extensions each extend from the corresponding opening to the outside of the insulating body. 如申請專利範圍第5項所述的連接器,其中各該導電端子的該兩延伸段之間的距離小於該兩延伸段相對於該主體段的距離。 The connector of claim 5, wherein a distance between the two extensions of each of the conductive terminals is less than a distance of the two extensions relative to the body segment.
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TWI817378B (en) * 2022-03-08 2023-10-01 欣興電子股份有限公司 Connector and method for manufacturing thereof

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TWM464868U (en) * 2013-04-01 2013-11-01 Unimicron Technology Corp Connector
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TWM464868U (en) * 2013-04-01 2013-11-01 Unimicron Technology Corp Connector
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