JPH04250685A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPH04250685A JPH04250685A JP800191A JP800191A JPH04250685A JP H04250685 A JPH04250685 A JP H04250685A JP 800191 A JP800191 A JP 800191A JP 800191 A JP800191 A JP 800191A JP H04250685 A JPH04250685 A JP H04250685A
- Authority
- JP
- Japan
- Prior art keywords
- pad
- conductor
- hole
- cutout
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 abstract description 8
- 238000003825 pressing Methods 0.000 abstract description 6
- 238000005452 bending Methods 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 238000012545 processing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Abstract
Description
【０００１】0001
【産業上の利用分野】この発明は、プリント配線板に関
するものである。さらに詳しくは、この発明は、ビアス
ペースを減少させ、スルホール信頼性を向上させること
のできるプリント配線板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to printed wiring boards. More specifically, the present invention relates to a printed wiring board that can reduce via space and improve through-hole reliability.
【０００２】0002
【従来の技術】片面、両面、あるいは多層等の各種の構
造からなるプリント配線板は、電気・電子機器、通信機
器、計算機器等の多様な分野において広く用いられてお
り、高密度実装、高微細化、高集積化等の要請が高まる
につれて、様々な工夫と改良がなされてきている。[Prior Art] Printed wiring boards with various structures such as single-sided, double-sided, or multilayer are widely used in a variety of fields such as electrical and electronic equipment, communication equipment, and computing equipment, and are used for high-density packaging and high performance. As the demand for miniaturization, high integration, etc. increases, various ideas and improvements have been made.
【０００３】このような高密度実装化等の要請に対応す
るために、多層化をはじめ、表面配線密度の向上、配線
面積の減少等が必須となり、また同時に配線、その導通
性の確保による信頼性の向上が大きな課題になっている
。特にこの導通性の確保は、スルホールにおいて重要と
なっている。このような信頼性の向上を図るために、プ
リント配線板の設計、製造においては、たとえば図５に
示したように、従来は、表面実装用パッド（ア）から配
線を出してビア（イ）を形成し、このビア（イ）によっ
てスルホールを介して両面板、あるいは多層板の他層と
の導通をとっていた。[0003] In order to meet such demands for high-density packaging, it has become essential to increase the number of layers, increase the surface wiring density, and reduce the wiring area. Improving gender has become a major issue. Ensuring this conductivity is especially important for through holes. In order to improve reliability, in the design and manufacture of printed wiring boards, conventionally, as shown in Figure 5, wiring is brought out from surface mounting pads (A) and then connected to vias (A). The vias (A) provide electrical continuity with the double-sided board or other layers of the multilayer board via the through-holes.
【０００４】0004
【発明が解決しようとする課題】しかしながら、このよ
うな従来のパッド（ア）およびビア（イ）の構造の場合
には、ビア（イ）の形成のためのスペースが欠かせない
ものとなっており、このビア（イ）の存在は、高密度配
線のための大きな障害となっていた。また、このビア（
イ）でのスルホールの導通性の確保による信頼性の向上
には限界があり、どうしても導通不良の発生が避けられ
なかった。[Problem to be Solved by the Invention] However, in the case of such a conventional pad (A) and via (B) structure, space for forming the via (B) is indispensable. The existence of this via (a) has been a major hindrance to high-density wiring. Also, this via (
There is a limit to the improvement in reliability by ensuring the conductivity of the through holes in (a), and the occurrence of conductivity failures is unavoidable.
【０００５】この発明は、以上の通りの事情に鑑みてな
されたものであり、従来の表面実装用パッドの欠点を改
善し、ビアスペースを減少させ、しかもスルホール信頼
性を向上することのできる新しいプリント配線板を提供
することを目的としている。The present invention was made in view of the above-mentioned circumstances, and provides a new method that can improve the shortcomings of conventional surface mounting pads, reduce via space, and improve through-hole reliability. Its purpose is to provide printed wiring boards.
【０００６】[0006]
【課題を解決するための手段】この発明は、上記の課題
を解決するものとして、厚さ方向に導通のための接続孔
を有し、この接続孔から線状導体幅と略同等寸法の切り
欠き部を有する表面実装用パッドを厚さ方向の両側面に
配設し、接続孔に線状導体を挿着し、かつ、両側面にお
いて前記パッドの切り欠き部に線状導体を折り曲げ押着
し、パッドと接続処理してなることを特徴とするプリン
ト配線板を提供する。 また、この発明は、このプリ
ント配線板に用いることのできる前記表面実装用パッド
をも提供する。[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention has a connecting hole for conduction in the thickness direction, and a cut having a size approximately equal to the width of the linear conductor is cut from the connecting hole. A surface mounting pad having a notch is provided on both sides in the thickness direction, a wire conductor is inserted into the connection hole, and the wire conductor is bent and pressed into the notch of the pad on both sides. To provide a printed wiring board characterized in that the printed wiring board is formed by performing a connection process with a pad. The present invention also provides the surface mounting pad that can be used in this printed wiring board.
【０００７】[0007]
【作用】この発明のプリント配線板においては、接続孔
と、導体幅と略同等寸法の切り欠き部を有する実装用パ
ッドを用い、スルホールに挿着した線状導体の両側部を
折り曲げてこの切り欠き部に押着して接続するため、従
来のようにビアの形成は必要でなく、ビアスペースを著
しく減少させることができる。[Function] In the printed wiring board of the present invention, a mounting pad having a connection hole and a notch having a size approximately equal to the width of the conductor is used, and both sides of the linear conductor inserted into the through hole are bent to form the cutout. Since the connection is made by pressing into the notch, there is no need to form vias as in the conventional case, and the via space can be significantly reduced.
【０００８】しかも、この発明のプリント配線板におい
ては、上記の構成とすることによりスルホールの導通信
頼性を大きく向上させる。Moreover, in the printed wiring board of the present invention, the conduction reliability of the through-holes is greatly improved by adopting the above-mentioned structure.
【０００９】[0009]
【実施例】以下、添付した図面に沿って実施例を示し、
さらに詳しくこの発明のプリント配線板について説明す
る。添付した図面の図１は、この発明のプリント配線板
を例示した縦断面図であり、また図２は、この例におい
て用いる表面実装用パッドを示した平面図および断面図
である。[Example] Examples are shown below according to the attached drawings,
The printed wiring board of the present invention will be explained in more detail. FIG. 1 of the attached drawings is a vertical sectional view illustrating a printed wiring board of the present invention, and FIG. 2 is a plan view and a sectional view illustrating a surface mounting pad used in this example.
【００１０】たとえばこの図１および図２に例示したよ
うに、この発明のプリント配線板においては、樹脂含浸
ガラス基材、樹脂シート、あるいは多層板における内層
材等からなる基材層（１）の厚さ方向の両側面に、この
発明のパッド（２）を配設する。そしてこのパッド（２
）は、厚さ方向に導通のための接続孔（３）を有し、こ
の接続孔（３）から線状導体幅と略同等寸法の切り欠き
部（４）とを有している。パッド（２）の素材としては
、その種類に特に限定はなく、銅、アルミニウム、ステ
ンレス等の金属、合金を薄層として形成することができ
る。その形状は一般的には長方形とすることが好ましい
が、もちろんこれに限定されることはない。For example, as illustrated in FIGS. 1 and 2, in the printed wiring board of the present invention, the base material layer (1) is made of a resin-impregnated glass base material, a resin sheet, or an inner layer material in a multilayer board. Pads (2) of the present invention are provided on both sides in the thickness direction. And this pad (2
) has a connection hole (3) for conduction in the thickness direction, and has a notch (4) having a size substantially equal to the width of the linear conductor from the connection hole (3). The material of the pad (2) is not particularly limited in its type, and metals such as copper, aluminum, stainless steel, and alloys can be formed as a thin layer. Generally, it is preferable that the shape is rectangular, but the shape is of course not limited to this.
【００１１】このパッド（２）を配設したプリント配線
板には、次いでその接続孔（３）に対応したスルホール
に線状導体（５）を挿着し、かつ、パッド（２）の切り
欠き部（４）にこの線状導体（５）を折り曲げ押着する
。この時の線状導体（５）の径、または厚みは、パッド
（２）の厚みよりも小さいか、略同等とするのが好まし
い。Next, on the printed wiring board on which this pad (2) is arranged, a linear conductor (5) is inserted into the through hole corresponding to the connection hole (3), and the notch of the pad (2) is inserted. This linear conductor (5) is bent and pressed onto the portion (4). The diameter or thickness of the linear conductor (5) at this time is preferably smaller than or approximately equal to the thickness of the pad (2).
【００１２】この線状導体（５）の折り曲げ押着により
、線状導体（５）は、パッド（２）の切り欠き部（４）
にぴったりと密着される。そしてこの押着後には、パッ
ド（２）と線状導体（５）とを接続処理する。
半田ペースト処理あるいはレーザー処理等を行う。これ
により接続導通はしっかりと確保されることになる。線
状導体（５）としては、銅、アルミニウム、その他の金
属、合金からなる素材とし、また、その形状は、丸線、
平角線、さらには複数線材によるものでもよい。接続処
理についても、半田、あるいはレーザー処理に限られる
ことはない。By bending and pressing the linear conductor (5), the linear conductor (5) fits into the notch (4) of the pad (2).
It is tightly adhered to. After this pressing, the pad (2) and the linear conductor (5) are connected. Perform solder paste processing or laser processing. This ensures solid connection continuity. The wire conductor (5) is made of copper, aluminum, other metals, or alloys, and its shape is round wire,
It may be made of a rectangular wire or even a plurality of wires. Connection processing is not limited to soldering or laser processing.
【００１３】なお、スルホールの孔については、このよ
うな線状導体（５）の径、あるいは大きさと略同一とす
る。また、線状導体（５）のスルホールへの挿着、パッ
ド（２）切り欠き部（４）への折り曲げ押着は機械的に
適宜な手段によって行うことができる。このような構造
のプリント配線板に使用するこの発明の表面実装用パッ
ド（２）の切り欠き部（４）については、適宜なエッチ
ング等の手段によって形成することができ、その配置は
、図１および図２に例示したように、パッド（２）内へ
の形成によるものでもよいし、あるいは、図３に例示し
たように、パッド（２）の端部（６）までの配置として
もよい。また、その方向についても、図１、図２および
図３に例示したように、パッド（２）の長手方向でもよ
いし、あるいは図４に示したように短手方向等であって
もよい。Note that the diameter or size of the through hole is approximately the same as the diameter or size of the linear conductor (5). Further, the insertion of the linear conductor (5) into the through hole and the bending and pressing of the linear conductor (5) into the notch (4) of the pad (2) can be performed by appropriate mechanical means. The notch (4) of the surface mounting pad (2) of the present invention used in a printed wiring board having such a structure can be formed by appropriate etching or other means, and its arrangement is shown in FIG. As illustrated in FIG. 2, it may be formed within the pad (2), or as illustrated in FIG. 3, it may be disposed up to the end (6) of the pad (2). Moreover, the direction may be the longitudinal direction of the pad (2) as illustrated in FIGS. 1, 2, and 3, or the lateral direction as shown in FIG. 4.
【００１４】いずれの場合にも、パッド（２）内に線状
導体が埋め込まれるので、図５に示した従来のようにパ
ッド（ア）とビア（イ）とを形成する必要はなく、パッ
ドとビアを両用した状態とすることができ、ビアスペー
スを大きく減少させる。また、線状導体（５）と、切り
欠き部（４）を有するパッド（２）の使用によって、ス
ルホール導通信頼性は大きく向上する。In either case, since the linear conductor is embedded in the pad (2), there is no need to form the pad (A) and via (B) as in the conventional case shown in FIG. This allows the via to be used for both purposes, greatly reducing the via space. Furthermore, through-hole conduction reliability is greatly improved by using the linear conductor (5) and the pad (2) having the notch (4).
【００１５】もちろん、この発明は、以上の例によって
限定されることはなく、その細部については様々な態様
が可能である。[0015] Of course, the present invention is not limited to the above examples, and various modifications can be made to the details thereof.
【００１６】[0016]
【発明の効果】この発明により、以上詳しく説明した通
り、従来のビアスペースを減少させ、かつ、スルホール
導通信頼性を向上させることができる。According to the present invention, as explained in detail above, the conventional via space can be reduced and the through-hole conduction reliability can be improved.
【図１】この発明のプリント配線板を例示した縦断面図
である。FIG. 1 is a longitudinal sectional view illustrating a printed wiring board of the present invention.
【図２】この発明の実装用パッドを例示した平・断面図
である。FIG. 2 is a plan and cross-sectional view illustrating a mounting pad of the present invention.
【図３】この発明のパッドの他の例を示した平面図であ
る。FIG. 3 is a plan view showing another example of the pad of the invention.
【図４】この発明のパッドのさらに別の例を示した平面
図である。FIG. 4 is a plan view showing still another example of the pad of the invention.
【図５】従来のパッドとビアの構造を示した平面図であ
る。FIG. 5 is a plan view showing a conventional pad and via structure.
１ 基材層 ２ パッド ３ 接続孔 ４ 切り欠き部 ５ 線状導体 ６ 端 部 1 Base material layer 2 Pad 3 Connection hole 4 Notch part 5 Linear conductor 6 End part
Claims (2)
、この接続孔から線状導体幅と略同等寸法の切り欠き部
を有する表面実装用パッドを厚さ方向の両側面に配設し
、接続孔に線状導体を挿着し、かつ、両側面において前
記パッドの切り欠き部に線状導体を折り曲げ押着し、パ
ッドと接続処理してなることを特徴とするプリント配線
板。Claim 1: A surface mounting pad having a connection hole for conduction in the thickness direction, and a surface mounting pad having a notch having a size substantially equal to the width of the linear conductor is disposed from the connection hole on both sides in the thickness direction. A printed wiring board characterized in that the wire conductor is inserted into the connection hole, the wire conductor is bent and pressed into the notch of the pad on both sides, and the wire conductor is connected to the pad. .
、この接続孔から線状導体幅と略同等寸法の切り欠き部
を有することを特徴とするプリント配線板表面実装用パ
ッド。2. A pad for surface mounting on a printed wiring board, characterized in that it has a connection hole for conduction in the thickness direction, and has a cutout portion extending from the connection hole and having a size substantially equal to the width of the linear conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3008001A JPH0812948B2 (en) | 1991-01-25 | 1991-01-25 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3008001A JPH0812948B2 (en) | 1991-01-25 | 1991-01-25 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04250685A true JPH04250685A (en) | 1992-09-07 |
| JPH0812948B2 JPH0812948B2 (en) | 1996-02-07 |
Family
ID=11681144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3008001A Expired - Lifetime JPH0812948B2 (en) | 1991-01-25 | 1991-01-25 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0812948B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04250686A (en) * | 1991-01-25 | 1992-09-07 | Matsushita Electric Works Ltd | Printed circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04250686A (en) * | 1991-01-25 | 1992-09-07 | Matsushita Electric Works Ltd | Printed circuit board |
-
1991
- 1991-01-25 JP JP3008001A patent/JPH0812948B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04250686A (en) * | 1991-01-25 | 1992-09-07 | Matsushita Electric Works Ltd | Printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04250686A (en) * | 1991-01-25 | 1992-09-07 | Matsushita Electric Works Ltd | Printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0812948B2 (en) | 1996-02-07 |
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