CN205793640U - A kind of side is provided with the ceramic wafer of PAD - Google Patents
A kind of side is provided with the ceramic wafer of PAD Download PDFInfo
- Publication number
- CN205793640U CN205793640U CN201620499474.XU CN201620499474U CN205793640U CN 205793640 U CN205793640 U CN 205793640U CN 201620499474 U CN201620499474 U CN 201620499474U CN 205793640 U CN205793640 U CN 205793640U
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- CN
- China
- Prior art keywords
- layer
- pad
- wiring
- ceramic substrate
- substrate layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a kind of side and be provided with the ceramic wafer of PAD, including ceramic substrate layer, the lower surface of described ceramic substrate layer connects copper facing base plate, the upper surface of ceramic substrate layer is bonded with conductive copper plate, the upper surface of conductive copper plate is bonded with wiring layer, and wiring layer be connected above patch layer, the upper surface of described patch layer is welded with metal pad and via, and via is through patch layer until wiring layer；The inwall of described via is conducting metal, and outer wall is also nested with resin set；The both sides of described ceramic substrate layer are all covered with on Copper Foil, and Copper Foil being all bonded with PAD wiring；The lower surface of described copper facing base plate also connects bottom wiring layers；The upper surface of described patch layer is also equipped with soft board ink layer, and soft board ink film thickness is 0.05cm；It is connected between described copper facing base plate and ceramic substrate layer and has insulating sticky contact pin；It is connected between described wiring layer and conductive copper plate and has conductive adhesive sheet.This product can realize multiaspect wiring, and thermal diffusivity is good.
Description
Technical field
This utility model relates to printed-board technology field, is specially a kind of side and is provided with
The ceramic wafer of PAD.
Background technology
PCB (PrintedCircuitBoard), Chinese is printed circuit board, also known as print
Brush wiring board, is important electronic unit, is the supporter of electronic devices and components, is electronics unit device
The carrier of part electrical connection.Owing to it is to use electron printing to make, therefore it is referred to as " print
Brush " circuit board.Electronic equipment uses after printed board, due to the concordance of similar printed board, from
And avoid the mistake of artificial wiring, and can realize the automatic plug-in mounting of electronic devices and components or attachment, from
Move scolding tin, automatically detect, it is ensured that the quality of electronic equipment, improve labor productivity, fall
Low cost, and it is easy to maintenance.Traditional pcb board is divided into lamina, doubling plate and multi-layer sheet,
Prior art all can only connect up at ceramic circuit plate top surface and bottom surface, connects up only with two sides,
Finished-product volume is relatively big and is unfavorable for heat radiation.
Utility model content
For problem above, this utility model provides a kind of side and is provided with the ceramic wafer of PAD,
Side can be used for wiring and is PAD, can reduce encapsulation volume, it is adaptable to the height such as high-cooling property
Integrated circuit, can effectively solve the problem in background technology.
For achieving the above object, this utility model provides following technical scheme: a kind of side is arranged
Having the ceramic wafer of PAD, including ceramic substrate layer, the lower surface of described ceramic substrate layer connects to be had
Copper facing base plate, the upper surface of ceramic substrate layer is bonded with conductive copper plate, the upper surface of conductive copper plate
Be bonded with wiring layer, and wiring layer be connected above patch layer, the upper surface of described patch layer
It is welded with metal pad and via, and via is through patch layer until wiring layer；Described via
Inwall is conducting metal, and outer wall is also nested with resin set；The both sides of described ceramic substrate layer are all covered
It is stamped on Copper Foil, and Copper Foil and is all bonded with PAD wiring；The lower surface of described copper facing base plate also connects
It is connected to bottom wiring layers.
As a kind of preferably technical scheme of this utility model, the upper surface of described patch layer also spreads
Being provided with soft board ink layer, soft board ink film thickness is 0.05cm.
As this utility model a kind of preferably technical scheme, described copper facing base plate and ceramic substrate
Connect between Ceng and have insulating sticky contact pin.
As a kind of preferably technical scheme of this utility model, described wiring layer and conductive copper plate it
Between connect have conductive adhesive sheet.
As a kind of preferably technical scheme of this utility model, described ceramic substrate layer uses oxidation
Aluminum is made, and the conducting metal of described via inwall uses copper coating.
Compared with prior art, the beneficial effects of the utility model are: the pottery of this side straps PAD
Porcelain plate, by covering Copper Foil in the side of ceramic substrate layer, and connects PAD wiring on Copper Foil,
Discharge positive space of planes to arrange for cabling, effectively reduce volume and save space；Outside via
Resin set is set, prevents out short circuit appearance, improve device stability energy；Conductive adhesive sheet is set
With insulating sticky contact pin, it is that whole sub-structure is tightr；This utility model can realize multiaspect cloth
Line, can reduce encapsulation volume, it is adaptable to semiconductor die package industry requires height to PCB support plate
The circuit that thermal diffusivity etc. are highly integrated.
Accompanying drawing explanation
Fig. 1 is this utility model structural representation.
In figure: 1-ceramic substrate layer；2-copper facing base plate；3-conductive copper plate；4-wiring layer；5-
Patch layer；6-metal pad；7-via；8-resin set；9-Copper Foil；10-bottom wiring layers；
11-soft board ink layer；12-insulating sticky contact pin；13-conductive adhesive sheet；14-PAD wiring.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, in this utility model embodiment
Technical scheme be clearly and completely described, it is clear that described embodiment be only this
The a part of embodiment of utility model rather than whole embodiments.Based in this utility model
Embodiment, those of ordinary skill in the art are obtained under not making creative work premise
Every other embodiment, broadly falls into the scope of this utility model protection.
Embodiment:
Referring to Fig. 1, this utility model provides a kind of technical scheme: a kind of side is provided with PAD
Ceramic wafer, including ceramic substrate layer 1, the lower surface of described ceramic substrate layer 1 connects plating
Copper soleplate 2, the upper surface of ceramic substrate layer 1 is bonded with conductive copper plate 3, conductive copper plate 3
Upper surface is bonded with wiring layer 4, and wiring layer 4 be connected above patch layer 5, described patch
The upper surface of lamella 5 is welded with metal pad 6 and via 7, and via 7 is through patch layer 5
Until wiring layer 4；The inwall of described via 7 is conducting metal, and outer wall is also nested with resin set
8；The both sides of described ceramic substrate layer 1 are all covered with on Copper Foil 9, and Copper Foil 9 being all bonded with
PAD wiring 14；The lower surface of described copper facing base plate 2 also connects bottom wiring layers 10；Institute
The upper surface stating patch layer 5 is also equipped with soft board ink layer 11, and soft board ink layer 11 thickness is
0.05cm；It is connected between described copper facing base plate 2 and ceramic substrate layer 1 and has insulating sticky contact pin 12；
It is connected between described wiring layer 4 and conductive copper plate 3 and has conductive adhesive sheet 13；Described ceramic base
Flaggy 1 uses aluminium oxide to make, and the conducting metal of described via 7 inwall uses copper coating.
Operation principle of the present utility model: described ceramic substrate layer 1 is semi-conducting material aluminium oxide
Make, semiconductor device circuit design can be carried out；Described conductive copper plate 3 is by insulating sticky contact pin
12 are bonded in ceramic substrate layer 1, and the wiring layer 4 above conductive copper plate 3 is used for realizing front cloth
Line, described patch layer 5 is used for mounting surface mount elements, and the pin of surface mount elements is welded by scolding tin
On pad 6, described via 7 is through patch layer 5 until wiring layer 4, inconvenient in wiring
In the case of, realizing conduction by the copper plate of via 7 inwall, described resin set 8 is socketed in
Via 7 outer wall, it is possible to play anti-open circuit and the situation of short circuit；Described soft board ink layer 11 is used
In carrying out circuit board printing corrosion design；The described copper facing base plate 2 bottom cloth by its lower surface
Line layer 10 also is able to carry out cabling layout, it is achieved Multilayer Structure；Described ceramic substrate layer 1
The Copper Foil 9 of side wrap, also is able to connect external circuit by bonding PAD wiring 14,
Thus discharge the space in front for cabling.
The ceramic wafer of this side straps PAD, by covering Copper Foil 9 in the side of ceramic substrate layer 1,
And on Copper Foil, connect PAD wiring 14, discharge positive space of planes and arrange for cabling, effectively
Reduce volume and save space；Resin set 8 is set outside via, prevents out short circuit appearance, carry
High device stability energy；Conductive adhesive sheet 13 and insulating sticky contact pin 12 are set, are whole plank
Structure is tightr；This utility model can realize multiaspect wiring, can reduce encapsulation volume, is suitable for
In semiconductor die package industry to highly integrated circuit such as PCB support plate requirement high-cooling properties.
The foregoing is only preferred embodiment of the present utility model, not in order to limit this reality
With novel, all made within spirit of the present utility model and principle any amendment, equivalent replace
Change and improvement etc., within should be included in protection domain of the present utility model.
Claims (5)
1. side is provided with a ceramic wafer of PAD, and including ceramic substrate layer (1), it is special
Levy and be: the lower surface of described ceramic substrate layer (1) connects copper facing base plate (2), pottery
The upper surface of substrate layer (1) is bonded with conductive copper plate (3), the upper surface of conductive copper plate (3)
Be bonded with wiring layer (4), and wiring layer (4) be connected above patch layer (5), described
The upper surface of patch layer (5) is welded with metal pad (6) and via (7), and via (7)
Through patch layer (5) until wiring layer (4)；The inwall of described via (7) is conducting metal,
Outer wall is also nested with resin set (8)；The both sides of described ceramic substrate layer (1) are all covered with copper
PAD wiring (14) all it is bonded with on paper tinsel (9), and Copper Foil (9)；Described copper facing base plate (2)
Lower surface also connect and have bottom wiring layers (10).
A kind of side the most according to claim 1 is provided with the ceramic wafer of PAD, and it is special
Levy and be: the upper surface of described patch layer (5) is also equipped with soft board ink layer (11), soft board
Ink layer (11) thickness is 0.05cm.
A kind of side the most according to claim 1 is provided with the ceramic wafer of PAD, and it is special
Levy and be: connect between described copper facing base plate (2) and ceramic substrate layer (1) and have insulation bonding
Sheet (12).
A kind of side the most according to claim 1 is provided with the ceramic wafer of PAD, and it is special
Levy and be: being connected between described wiring layer (4) with conductive copper plate (3) has conductive adhesive sheet (13).
A kind of side the most according to claim 1 is provided with the ceramic wafer of PAD, and it is special
Levy and be: described ceramic substrate layer (1) uses aluminium oxide to make, described via (7) inwall
Conducting metal use copper coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620499474.XU CN205793640U (en) | 2016-05-27 | 2016-05-27 | A kind of side is provided with the ceramic wafer of PAD |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620499474.XU CN205793640U (en) | 2016-05-27 | 2016-05-27 | A kind of side is provided with the ceramic wafer of PAD |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205793640U true CN205793640U (en) | 2016-12-07 |
Family
ID=57408572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620499474.XU Expired - Fee Related CN205793640U (en) | 2016-05-27 | 2016-05-27 | A kind of side is provided with the ceramic wafer of PAD |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205793640U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109496066A (en) * | 2018-10-31 | 2019-03-19 | 上海安费诺永亿通讯电子有限公司 | A kind of metallic circuit and preparation method thereof being designed at chip ceramic matrix body specific region |
| CN111555021A (en) * | 2019-02-08 | 2020-08-18 | 三星电机株式会社 | Chip antenna module |
-
2016
- 2016-05-27 CN CN201620499474.XU patent/CN205793640U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109496066A (en) * | 2018-10-31 | 2019-03-19 | 上海安费诺永亿通讯电子有限公司 | A kind of metallic circuit and preparation method thereof being designed at chip ceramic matrix body specific region |
| CN109496066B (en) * | 2018-10-31 | 2021-08-13 | 上海安费诺永亿通讯电子有限公司 | Metal circuit designed in specific area of chip ceramic substrate and preparation method thereof |
| CN111555021A (en) * | 2019-02-08 | 2020-08-18 | 三星电机株式会社 | Chip antenna module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161207 Termination date: 20170527 |