CN206350230U - A kind of high impedance multilayer circuit board - Google Patents
A kind of high impedance multilayer circuit board Download PDFInfo
- Publication number
- CN206350230U CN206350230U CN201720028056.7U CN201720028056U CN206350230U CN 206350230 U CN206350230 U CN 206350230U CN 201720028056 U CN201720028056 U CN 201720028056U CN 206350230 U CN206350230 U CN 206350230U
- Authority
- CN
- China
- Prior art keywords
- board
- heat
- conducting glue
- wiring board
- glue layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model is related to a kind of high impedance multilayer circuit board, including outer copper frame, interior copper coin, upper Teflon wiring board, lower Teflon wiring board, the first heat-conducting glue layer, the second heat-conducting glue layer, the 3rd heat-conducting glue layer, the first ceramic circuit-board, the second ceramic circuit-board and rectangle opening, outer heat-conducting glue layer is fixedly connected with the inside of the outer copper frame.The high impedance multilayer circuit board, the inner layer circuit board of the high impedance multilayer circuit board is used as using the first ceramic circuit-board and the second ceramic circuit-board, so as to ensure the capacity of heat transmission of the high impedance multilayer circuit board, and pass through the outer-layer circuit plate of upper Teflon wiring board and lower Teflon wiring board as the high impedance multilayer circuit board, ensure the resistance to corrosion of the high impedance multilayer circuit board, and sealing protection is carried out to the high impedance multilayer circuit board by outer copper clad layers and interior copper clad layers, ensure the safety in utilization of beryllium oxide ceramics plate, and radiating work is carried out by interior copper coin and outer copper frame.
Description
Technical field
The utility model is related to wiring board equipment technical field, specially a kind of high impedance multilayer circuit board.
Background technology
In multiple-plate manufacture, because the refinement of circuit causes the impedance of circuit higher, line can be then caused after powered up
The serious situation of road heating, traditional wiring board heat transfer efficiency is poor, it is impossible to effective radiating treatment is carried out to wiring board, thus
The problem of wiring board is easily damaged is caused, the heat sinking function of wiring board is must assure that for this, so as to ensure that the normal of wiring board makes
With.
Utility model content
The purpose of this utility model, which is that, provides a kind of simple in construction, reasonable in design one in order to solve the above problems
Plant high impedance multilayer circuit board.
The utility model is achieved through the following technical solutions above-mentioned purpose：
A kind of high impedance multilayer circuit board, including outer copper frame, interior copper coin, upper Teflon wiring board, lower Teflon wiring board,
First heat-conducting glue layer, the second heat-conducting glue layer, the 3rd heat-conducting glue layer, the first ceramic circuit-board, the second ceramic circuit-board and rectangle are opened
It is fixedly connected with the inside of hole, the outer copper frame on the inside of outer heat-conducting glue layer, the outer heat-conducting glue layer and is fixedly connected with overcoating copper
Layer, the inside top of the outer copper clad layers is provided with upper Teflon wiring board, and the bottom of the upper Teflon wiring board is followed successively by the
One ceramic circuit-board, the first heat-conducting glue layer, the second ceramic circuit-board, the second heat-conducting glue layer, lower Teflon wiring board, the upper spy
The top of fluorine dragon wiring board is provided with upper solder mask layer, and the bottom of the lower Teflon wiring board is provided with lower solder mask layer, institute
State rectangle opening and sequentially pass through solder mask layer, upper Teflon wiring board, the first heat-conducting glue layer, the first ceramic circuit-board,
Two heat-conducting glue layers, the second ceramic circuit-board, the 3rd heat-conducting glue layer, lower Teflon wiring board and lower solder mask layer, the rectangle
The inner side of perforate is provided with the inside of interior copper clad layers, the interior copper clad layers and is fixedly connected with interior heat-conducting glue layer, the interior heat-conducting glue layer
Inner side be provided with interior copper coin.
As further prioritization scheme of the present utility model, first ceramic circuit-board and the second ceramic circuit-board are
Beryllium oxide ceramics wiring board.
As further prioritization scheme of the present utility model, four turnings of the outer copper frame are equipped with outer bolt hole.
As further prioritization scheme of the present utility model, four turnings of the interior copper coin are equipped with Inner bolt holes.
The beneficial effects of the utility model are：
The utility model is simple in construction, reasonable in design, and this is used as using the first ceramic circuit-board and the second ceramic circuit-board
The inner layer circuit board of high impedance multilayer circuit board, so as to ensure the capacity of heat transmission of the high impedance multilayer circuit board, and passes through upper spy
Fluorine dragon wiring board and lower Teflon wiring board as the high impedance multilayer circuit board outer-layer circuit plate, it is ensured that the high impedance multilayer
The resistance to corrosion of wiring board, and sealing protection is carried out to the high impedance multilayer circuit board by outer copper clad layers and interior copper clad layers,
Ensure the safety in utilization of beryllium oxide ceramics plate, and radiating work is carried out by interior copper coin and outer copper frame, and interior copper coin is also just
It is attached in by Inner bolt holes with heat dissipation equipment, so as to improve the heat-sinking capability of the high impedance multilayer circuit board.
Brief description of the drawings
Fig. 1 is axonometric drawing of the present utility model；
Fig. 2 is sectional side view of the present utility model.
In figure：1 outer copper frame, 2 outer bolt holes, copper coin in 3,4 Inner bolt holes, Teflon wiring board on 5, solder mask on 6
Layer, 7 times Teflon wiring boards, 8 times solder mask layers, 9 first heat-conducting glue layers, 10 second heat-conducting glue layers, 11 the 3rd heat-conducting glue layers,
12 first ceramic circuit-boards, 13 second ceramic circuit-boards, copper clad layers in 14, heat-conducting glue layer, 16 outer copper clad layers, 17 outer heat conduction in 15
Glue-line, 18 rectangle openings.
Embodiment
The utility model is described in further detail below in conjunction with the accompanying drawings：
As shown in Figure 1 and Figure 2, a kind of high impedance multilayer circuit board, including outer copper frame 1, interior copper coin 3, upper Teflon wiring board
5th, lower Teflon wiring board 7, the first heat-conducting glue layer 9, the second heat-conducting glue layer 10, the 3rd heat-conducting glue layer 11, the first ceramic circuit-board
12nd, the second ceramic circuit-board 13 and rectangle opening 18, the inner side of the outer copper frame 1 are fixedly connected with outer heat-conducting glue layer 17, described
The inner side of outer heat-conducting glue layer 17 is fixedly connected with outer copper clad layers 16, and the inside top of the outer copper clad layers 16 is provided with upper Teflon line
Road plate 5, the bottom of the upper Teflon wiring board 5 is followed successively by the first ceramic circuit-board 12, first the 9, second ceramics of heat-conducting glue layer
Wiring board 13, the second heat-conducting glue layer 10, lower Teflon wiring board 7, the top of the upper Teflon wiring board 5 is provided with upper welding resistance oil
Layer of ink 6, the bottom of the lower Teflon wiring board 7 is provided with lower solder mask layer 8, and the rectangle opening 18 sequentially passes through welding resistance
Ink layer 6, upper Teflon wiring board 5, the first heat-conducting glue layer 9, the first ceramic circuit-board 12, the second heat-conducting glue layer 10, second pottery
Porcelain wiring board 13, the 3rd heat-conducting glue layer 11, lower Teflon wiring board 7 and lower solder mask layer 8, the inner side of the rectangle opening 18
Provided with interior copper clad layers 14, the inner side of the interior copper clad layers 14 is fixedly connected with interior heat-conducting glue layer 15, the interior heat-conducting glue layer 15
Inner side is provided with interior copper coin 3.The ceramic circuit-board 13 of first ceramic circuit-board 12 and second is beryllium oxide ceramics wiring board, is led to
The high thermal conductivity of peroxidating beryllium ceramic circuit-board, enables the first ceramic circuit-board and the second ceramic circuit-board quickly to be led
Thermal technology makees.Four turnings of the outer copper frame 1 are equipped with outer bolt hole 2, and four turnings of outer copper frame 1 are equipped with outer bolt hole 2,
External copper frame can be easy to be fixed.Four turnings of the interior copper coin 3 are equipped with Inner bolt holes 4, due to four of interior copper coin 3
Turning is equipped with Inner bolt holes 4, is easy to interior copper coin to be attached with heat dissipation equipment with this, and the high impedance multilayer circuit board is entered
Row quickly radiating work.
The utility model is simple in construction, reasonable in design, is made using the first ceramic circuit-board 12 and the second ceramic circuit-board 13
For the inner layer circuit board of the high impedance multilayer circuit board, so as to ensure the capacity of heat transmission of the high impedance multilayer circuit board, and pass through
Upper Teflon wiring board 5 and lower Teflon wiring board 7 as the high impedance multilayer circuit board outer-layer circuit plate, it is ensured that the high resistant
The resistance to corrosion of anti-multilayer circuit board, and pass through outer copper clad layers 16 and the high impedance multilayer circuit board progress of 14 pairs of interior copper clad layers
Sealing protection, it is ensured that the safety in utilization of beryllium oxide ceramics plate, and radiating work is carried out by interior copper coin 3 and outer copper frame 1, and
Interior copper coin 3 also allows for being attached by Inner bolt holes 4 and heat dissipation equipment, so as to improve the radiating of the high impedance multilayer circuit board
Ability, upper solder mask layer 6 and lower solder mask layer 8 can be carried out to upper Teflon wiring board 5 and lower Teflon wiring board 7 respectively
Protection, the first heat-conducting glue layer 9, the second heat-conducting glue layer 10 and the 3rd heat-conducting glue layer 11 can then carry out the connection of different wiring boards
While ensure, the heat conductivility between different wiring boards.
General principle of the present utility model, principal character and advantage has been shown and described above.The technical staff of the industry
It should be appreciated that the utility model is not restricted to the described embodiments, the simply explanation described in above-described embodiment and specification is originally
The principle of utility model, on the premise of the utility model spirit and scope are not departed from, the utility model also has various change
And improvement, these changes and improvements are both fallen within the range of claimed the utility model.Scope is claimed in the utility model
Defined by appended claims and its effect thing.
Claims (4)
1. a kind of high impedance multilayer circuit board, it is characterised in that：Including outer copper frame（1）, interior copper coin（3）, upper Teflon wiring board
（5）, lower Teflon wiring board（7）, the first heat-conducting glue layer（9）, the second heat-conducting glue layer（10）, the 3rd heat-conducting glue layer（11）, first
Ceramic circuit-board（12）, the second ceramic circuit-board（13）And rectangle opening（18）, the outer copper frame（1）Inner side be fixedly connected with
Outer heat-conducting glue layer（17）, the outer heat-conducting glue layer（17）Inner side be fixedly connected with outer copper clad layers（16）, the outer copper clad layers
（16）Inside top be provided with upper Teflon wiring board（5）, the upper Teflon wiring board（5）Bottom be followed successively by first ceramics
Wiring board（12）, the first heat-conducting glue layer（9）, the second ceramic circuit-board（13）, the second heat-conducting glue layer（10）, lower Teflon wiring board
（7）, the upper Teflon wiring board（5）Top provided with upper solder mask layer（6）, the lower Teflon wiring board（7）Bottom
Portion is provided with lower solder mask layer（8）, the rectangle opening（18）Sequentially pass through solder mask layer（6）, upper Teflon wiring board
（5）, the first heat-conducting glue layer（9）, the first ceramic circuit-board（12）, the second heat-conducting glue layer（10）, the second ceramic circuit-board（13）,
Three heat-conducting glue layers（11）, lower Teflon wiring board（7）With lower solder mask layer（8）, the rectangle opening（18）Inner side be provided with
Interior copper clad layers（14）, the interior copper clad layers（14）Inner side be fixedly connected with interior heat-conducting glue layer（15）, the interior heat-conducting glue layer
（15）Inner side be provided with interior copper coin（3）.
2. a kind of high impedance multilayer circuit board according to claim 1, it is characterised in that：First ceramic circuit-board
（12）With the second ceramic circuit-board（13）It is beryllium oxide ceramics wiring board.
3. a kind of high impedance multilayer circuit board according to claim 1, it is characterised in that：The outer copper frame（1）Four
Turning is equipped with outer bolt hole（2）.
4. a kind of high impedance multilayer circuit board according to claim 1, it is characterised in that：The interior copper coin（3）Four
Turning is equipped with Inner bolt holes（4）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720028056.7U CN206350230U (en) | 2017-01-11 | 2017-01-11 | A kind of high impedance multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720028056.7U CN206350230U (en) | 2017-01-11 | 2017-01-11 | A kind of high impedance multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206350230U true CN206350230U (en) | 2017-07-21 |
Family
ID=59324834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720028056.7U Expired - Fee Related CN206350230U (en) | 2017-01-11 | 2017-01-11 | A kind of high impedance multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206350230U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109890127A (en) * | 2019-03-09 | 2019-06-14 | 信丰福昌发电子有限公司 | A kind of high impedance ceramic base and epoxy resin-matrix composite multi-layer wiring board |
-
2017
- 2017-01-11 CN CN201720028056.7U patent/CN206350230U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109890127A (en) * | 2019-03-09 | 2019-06-14 | 信丰福昌发电子有限公司 | A kind of high impedance ceramic base and epoxy resin-matrix composite multi-layer wiring board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170721 Termination date: 20200111 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |