CN207783267U - The multi-layer H DI wiring boards of internal layer interconnection - Google Patents
The multi-layer H DI wiring boards of internal layer interconnection Download PDFInfo
- Publication number
- CN207783267U CN207783267U CN201820030338.5U CN201820030338U CN207783267U CN 207783267 U CN207783267 U CN 207783267U CN 201820030338 U CN201820030338 U CN 201820030338U CN 207783267 U CN207783267 U CN 207783267U
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- China
- Prior art keywords
- layers
- layer
- insulating radiation
- circuit layers
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005855 radiation Effects 0.000 claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 230000017525 heat dissipation Effects 0.000 claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 18
- 239000010410 layer Substances 0.000 claims description 130
- 239000000463 material Substances 0.000 claims description 8
- 239000011241 protective layer Substances 0.000 claims description 8
- 230000004888 barrier function Effects 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002365 multiple layer Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses the multi-layer H DI wiring boards of internal layer interconnection, belong to wiring board art.Including substrate, two first circuit layers, two the first insulating radiation layers, two the second circuit layers and two the second insulating radiation layers；Two first circuit layers are located at the upper and lower sides of substrate, two the first insulating radiation layers are located at the outside of two first circuit layers, two the second circuit layers are located on the outside of two the first insulating radiation layers, and two the second insulating radiation layers are located at the outside of two the second circuit layers；It further include fixed column；Further include the heavy copper positioned at fixed column both sides；Each heavy copper runs through substrate, two first circuit layers, two the first insulating radiation layers, two the second circuit layers and two the second insulating radiation layers.The utility model discloses the multi-layer H DI wiring boards of internal layer interconnection, the utility model realizes that internal layer interconnects by using heavy copper, is equipped with fixed column and improves structural stability simultaneously by heat dissipation design, improves heat dissipation effect.
Description
Technical field
The utility model is related to wiring board arts, and in particular to the multi-layer H DI wiring boards of internal layer interconnection.
Background technology
HDI (High Density Interconnector, high density interconnection) printed circuit board is aided with insulating materials
Conductor wirings are formed by structural member.It is brilliant to install integrated circuit, electricity when final products are made thereon for printed circuit board
Body, diode, passive device such as resistance, capacitance, connector etc. and other various electronic components.Printed circuit board is one
Kind provides the platform of element connection, to accept the substrate of contact part.But in existing technology, due to design etc. no
With the difference of aspect, it is poor there is internal layer interconnectivity the problems such as.Meanwhile some HDI wiring boards there is also structures built on the sand, heat dissipation
The problems such as poor, is easy to be affected by other factors, and causes to shorten its service life.
Utility model content
For the deficiency of above-mentioned existing technology, the technical problem to be solved by the present invention is to provide in stable connection
The multi-layer H DI wiring boards of layer interconnection can not only realize that internal layer interconnects, and have the characteristics that good heat dissipation.
In order to solve the above technical problems, the utility model adopts the following technical solution：
The multi-layer H DI wiring boards of internal layer interconnection, it is characterised in that：Including substrate, two first circuit layers, two first absolutely
Edge heat dissipating layer, two the second circuit layers and two the second insulating radiation layers；
Described two first circuit layers are located at the upper and lower sides of the substrate, described two first insulating radiation layer difference
Positioned at the outside of two first circuit layers, described two the second circuit layers are located at two the first insulating radiation layers
Outside, described two second insulating radiation layers are located at the outside of two the second circuit layers；
Further include through the substrate, described two first circuit layers, described two first insulating radiation layers, described two
The fixed column of the second circuit layer and described two second insulating radiation layers；
Further include the heavy copper positioned at the fixed column both sides, there is through-hole, the heavy copper to be arranged in through-hole on the substrate
On wall；
Each heavy copper is through the substrate, described two first circuit layers, described two first insulating radiation layers, described
Two the second circuit layers and described two second insulating radiation layers.
Optionally, further include through the substrate, described two first circuit layers, described two first insulating radiation layers,
Two vertical heat-dissipating pipes of described two the second circuit layers and described two second insulating radiation layers.
Optionally, further include the lateral heat dissipation pipe in described two first insulating radiation layers and be embedded in described two
Insulating layer in a first insulating radiation layer and positioned at lateral heat dissipation pipe both sides；
The both ends of the lateral heat dissipation pipe are equipped with heat emission hole.
Optionally, further include two protective layers being located on the outside of described two second insulating radiation layers.
Optionally, further include two moisture barrier coatings being located on the outside of described two protective layers.
Optionally, the fixed column is made of resin material.
Optionally, described two moisture barrier coatings are made of silicone resin material.
The beneficial effects of the utility model are：
The multi-layer H DI wiring boards of internal layer interconnection are arranged heavy copper in fixed column both sides and effectively realize that internal layer interconnects, fixed
The electricity between each circuit layer is connected through each circuit layer and insulating radiation layer and substrate in the heavy copper of column both sides
Road ensure that the electrical communication between them.In the case of multiple-layer stacked, it is ensured that the reliability of interconnection effectively avoids being arranged
It is a series of that porous class realizes that interconnection etc. is led to the problem of.
Description of the drawings
Fig. 1 is the structural schematic diagram of the multi-layer H DI wiring boards for the internal layer interconnection that specific embodiment of the present invention provides.
In figure：1, substrate；2, first circuit layer；3, the first insulating radiation layer；4, the second circuit layer；5, the second insulating radiation
Layer；6, protective layer；7, moisture barrier coatings；8, fixed column；9, heavy copper；10, vertical heat-dissipating pipe；31, insulating layer；32, lateral heat dissipation pipe；
321, heat emission hole.
Specific implementation mode
It describes in detail below in conjunction with the accompanying drawings to the preferred embodiment of the utility model.
As shown in Figure 1, the multi-layer H DI wiring boards of internal layer interconnection, including the first circuit layer 2, two first of substrate 1, two
3, two the second circuit layer 4 of insulating radiation layer and two the second insulating radiation layers 5；Two first circuit layers 2 are located at base
The upper and lower sides of plate 1, two the first insulating radiation layers 3 are located at the outside of two first circuit layers 2, two the second circuit layers 4
It is located at two the first insulating radiation layers, 3 outside, two the second insulating radiation layers 5 are located at two the second circuit layers 4
Outside；Further include through 3, two the second circuit layer 4 of the first insulating radiation layer of first circuit layer 2, two of substrate 1, two and
The fixed column 8 of two the second insulating radiation layers 5.
Further include the heavy copper 9 positioned at 8 both sides of fixed column, have through-hole on substrate 1, sinks the setting of copper 9 on that inner wall of the through hole；It is each heavy
Copper 9 runs through 3, two the second circuit layer 4 of the first insulating radiation layer of first circuit layer 2, two of substrate 1, two and two second
Insulating radiation layer 5.
Further include through 3, two the second circuit layer 4 of the first insulating radiation layer of first circuit layer 2, two of substrate 1, two,
And two vertical heat-dissipating pipes 10 of two the second insulating radiation layers 5.
Further include the lateral heat dissipation pipe 32 being embedded in two the first insulating radiation layers 3 and is dissipated embedded in two first insulation
Insulating layer 31 in thermosphere 3 and positioned at 32 both sides of lateral heat dissipation pipe；The both ends of lateral heat dissipation pipe 32 are equipped with heat emission hole 321.
Vertical 10 material of heat-dissipating pipe is made of copper, and is sealed some easily evaporation liquid in the duct, is led to heat transfer, by circuit
Interlayer heat passes to vertical heat-dissipating pipe 10, and in one end of heat, heated liquid evaporation is absorbed heat simultaneously.These gas diffusions are to cold
One end, condensation heat release simultaneously.The liquid condensed out returns to hot junction and works on by returning to gravity or capillarity.Vertical heat dissipation
Pipe 10 is connected with lateral heat dissipation pipe 32, and therefore, by heat emission hole, these gases will transmit heat to ambient atmos.
Further include two protective layers 6 for being located at two 5 outsides of the second insulating radiation layer.By the way that protective layer 6 is arranged, reduce outer
Interference of boundary's factor to inner working.
Further include two moisture barrier coatings 7 for being located at two 6 outsides of protective layer.Two moisture barrier coatings 7 are by organic siliconresin material
Material is made.
In order to improve insulation performance, fixed column 8 is made of resin material.
The multi-layer H DI wiring boards of the multi-layer H DI wiring boards of internal layer interconnection, internal layer interconnection are arranged in 8 both sides of fixed column
Heavy copper 9 effectively realizes that internal layer interconnects, the heavy copper 9 of 8 both sides of fixed column through each circuit layer and insulating radiation layer 3 with
And substrate 1, the circuit between each circuit layer is connected, ensure that the electrical communication between them.In the case of multiple-layer stacked,
It ensures the reliability of interconnection, effectively avoids providing holes class from realizing that interconnection etc. is led to the problem of a series of.Due to existing HDI plates
Usually realize that connection, the utility model add fixed column 9, can facilitate the fabrication design of structure by the modes such as being mutually bonded,
Improve the structural stability of the entirety environment-friendly type HDI wiring boards.Run through in addition, multiple vertical heat-dissipating pipes 10 are arranged in the utility model
Each circuit layer and in multiple insulating radiation layers 3 lateral heat dissipation pipe 32 be interconnected so that between circuit layer heat transmit plus
Soon, the heat dissipation effect of wiring board is improved, lateral heat dissipation pipe 32 is provided at both ends with heat emission hole 321 and heat in wiring board is discharged,
To effectively improve the service life of HDI plates.
The embodiment of the utility model is explained in detail above in association with attached drawing, but the utility model is not limited to be retouched
The embodiment stated.For a person skilled in the art, right in the case where not departing from the utility model principle and spirit
These embodiments carry out a variety of change, modification, replacement and modification, still fall in the scope of protection of the utility model.
Claims (7)
1. the multi-layer H DI wiring boards of internal layer interconnection, it is characterised in that：Including substrate (1), two first circuit layers (2), two
One insulating radiation layer (3), two the second circuit layers (4) and two the second insulating radiation layers (5)；
Described two first circuit layers (2) are located at the upper and lower sides of the substrate (1), described two first insulating radiation layers
(3) it is located at the outside of two first circuit layers (2), described two the second circuit layers (4) are located at described in two
On the outside of first insulating radiation layer (3), described two second insulating radiation layers (5) are located at the outer of two the second circuit layers (4)
Side；
Further include through the substrate (1), described two first circuit layers (2), described two first insulating radiation layers (3), institute
State the fixed column (8) of two the second circuit layers (4) and described two second insulating radiation layers (5)；
Further include the heavy copper (9) positioned at the fixed column (8) both sides, there is through-hole, heavy copper (9) setting on the substrate (1)
On that inner wall of the through hole；
Each heavy copper (9) is through the substrate (1), described two first circuit layers (2), described two first insulating radiation layers
(3), described two the second circuit layers (4) and described two second insulating radiation layers (5).
2. the multi-layer H DI wiring boards of internal layer interconnection as described in claim 1, it is characterised in that：
Further include through the substrate (1), described two first circuit layers (2), described two first insulating radiation layers (3), institute
State two vertical heat-dissipating pipes (10) of two the second circuit layers (4) and described two second insulating radiation layers (5).
3. the multi-layer H DI wiring boards of internal layer interconnection as claimed in claim 2, it is characterised in that：
It further include lateral heat dissipation pipe (32) in described two first insulating radiation layers (3) and embedded in described two the
Insulating layer (31) in one insulating radiation layer (3) and positioned at lateral heat dissipation pipe (32) both sides；
The both ends of the lateral heat dissipation pipe (32) are equipped with heat emission hole (321).
4. the multi-layer H DI wiring boards of internal layer interconnection as described in claim 1, it is characterised in that：Further include positioned at described two
Two protective layers (6) on the outside of second insulating radiation layer (5).
5. the multi-layer H DI wiring boards of internal layer interconnection as claimed in claim 4, it is characterised in that：Further include positioned at described two
Two moisture barrier coatings (7) on the outside of protective layer (6).
6. the multi-layer H DI wiring boards of internal layer interconnection as described in claim 1, it is characterised in that：The fixed column (8) is by resin
Material is made.
7. the multi-layer H DI wiring boards of internal layer interconnection as claimed in claim 5, it is characterised in that：Described two moisture barrier coatings (7)
It is made of silicone resin material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820030338.5U CN207783267U (en) | 2018-01-09 | 2018-01-09 | The multi-layer H DI wiring boards of internal layer interconnection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820030338.5U CN207783267U (en) | 2018-01-09 | 2018-01-09 | The multi-layer H DI wiring boards of internal layer interconnection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207783267U true CN207783267U (en) | 2018-08-28 |
Family
ID=63222767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820030338.5U Expired - Fee Related CN207783267U (en) | 2018-01-09 | 2018-01-09 | The multi-layer H DI wiring boards of internal layer interconnection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207783267U (en) |
-
2018
- 2018-01-09 CN CN201820030338.5U patent/CN207783267U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180828 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |