?53 五、新型說明： 【新型所屬之技術領域】 上的種電路板’特別涉及-種可防止電路板 ，电子令件鋅接不良的電路板。 【先前技術】 :於-般電子裝置均具有電路板，其上可農設許多插 件兀件’例如插件電阻、插件電容、㈣直插式（MW Package ’ DIP)零件等類㈣電子零件，該動貞型的電子 在電路板上，必須使電路板上具有貫穿電路板 曰面的插孔。同時，電路板常用整塊金屬層，如銅箱， 地層和電源層，錢所述電子零件與電路板中的訊 現層導通。 然而’在f子零件的組裝過財，f經相流鮮將電 子零件‘接於電路板上。由於金屬層導熱性能強，且散熱 :積大’電路板經過回流銲後將會因散熱過快而導致電子 、、2銲接不良或冷銲，造成電子零件失效，使電路板無 去正“吏用而報廢，從而造成含有電路板的電子妒置失 效’嚴重影響電路板的品質。 、 【新型内容】 有鑒於此，需提供一種可防止電路板上的電子零件銲 接不良的電路板。 本新型的電路板，包括基板、-對第-銲塾及阻熱結 M379953 構。基板包括第一表面、第二表面、插孔及複數過孔，插 孔貫穿第一表面和第二表面。該等第一銲墊設置於第一表 _ 面和第二表面並環繞插孔。阻熱結構設置於該等第一銲墊 的周邊，用於分隔該等第一銲墊周圍的金屬層。所述過孔 設置於被阻熱結構分隔的金屬層周邊，用於將第一表面的 • 熱量傳導到第二表面。 • 本新型之電路板因插孔周邊設有阻熱結構和補充熱量 • 的過孔，從而減缓了銲接過程中熱量散失的速度，避免了 因散熱過快而導致電子零件的銲接不良或冷銲，提高電路 板的生產良率和效率。 【實施方式】 請參考圖1和圖2，本實用新型的電路板100包括基 板10、銲墊30及阻熱結構50。電路板100為雙層或多層 印刷電路板。 籲基板10包括第一表面12、第二表面14、插孔16及複 數過孔18。所述插孔16和過孔18分別貫穿第一表面12 和第二表面14。電子零件的接腳（未圖示）通過插孔16銲接 於基板10上。插孔16内壁電鍍有導電金屬層，如銅箔。 銲墊30包括一對第一銲墊32和第二銲墊34。該等第 一銲墊32設置於基板10的第一表面12和第二表面14並 環繞所述插孔16。在本實施方式中，第一銲墊32和第二 銲墊34均為銅箔。 4 第二銲墊34夬& & 大致為U形，設置於基板1〇的第二表面 14 JE®繞阻熱結構5()、第—銲塾％及插孔w。在本實施 方式中n塾34用於補熱，以減緩銲接過程中熱量散 失的速度。 在其匕只施方式中’基板10的第二表面14也可不設 第二銲墊34。 阻熱結構50貫穿第—表面η和第二表面Μ，並包括 個對％間δ又置於該等第一輝墊U周邊的阻熱區塊，從 而將基板10中該箄笛 寺第—鋅墊32周圍的金屬層分隔成四個 条狀的連接區11 ’使料第—鐸塾Μ與其周圍的金屬層 :完全連接，即減少了插孔以周圍金屬層的散熱面積減 緩了鋅接杨中熱量散失的速度，避免了因散熱過快而導 致電子零件的銲接不良或冷銲。 在本貝知方式中，阻熱區塊大致為扇形其與插孔Μ 和該等第-銲塾32同心。阻熱區塊既 與該等第-銲墊叫目連接的金屬層㈣成的鏤空區^ :咖過填充絕緣材質，如環氧樹脂，而形成的隔熱區 在本實施方式巾’過孔18用於觀，每個過孔 壁塗有綠漆，避免在銲接過程中_，以減少賴的浪費。 過孔18被分成三組，排列於其中三個連接區η的周邊 即過孔18位於插孔16的周邊。每組過孔Μ包括四個並分 M379953 成兩排排列。在銲接過程中，過孔18將第二表面14的熱 量迅速傳導到第一表面12，以減缓銲接過程中熱量散失的 速度，進而改善電子零件的銲接不良或冷銲。其中，過孔 18越靠近插孔16，其補熱效果就越好。 因插孔16周邊設有阻熱結構50和補充熱量的過孔 ' 18，從而減緩了銲接過程中熱量散失的速度，避免了因散 • 熱過快而導致電子零件的銲接不良或冷銲，提高電路板的 # 生產良率和效率。 本新型雖以較佳實施例揭露如上，然其並非用以限定 本新型。惟，任何熟悉此項技藝者，在不脫離本新型之精 神和範圍内，當可做稍許更動與潤飾，因此本新型之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1係本新型的電路板的正面不意圖。 鲁 圖2係本新型的電路板的反面不意圖。 【主要元件符號說明】 電路板 100 基板 10 連接區 11 第一表面 12 第二表面 14 插孔 16 6 M379953 過孔 18 銲墊 30 第一銲墊 32 第二銲墊 34 阻熱結構 50? 53 V. New description: [New technology field] The above-mentioned type of circuit board 'specially relates to a circuit board that can prevent the circuit board and the electronic component from being poorly connected to zinc. [Prior Art]: The general electronic devices each have a circuit board on which a plurality of plug-in components such as plug-in resistors, plug-in capacitors, (four) in-line (MW Package 'DIP) parts, and the like (4) electronic components can be planted. Dynamic electronic type on the board must have a jack on the board that runs through the top of the board. At the same time, the board is often used with a single metal layer, such as a copper box, a ground plane, and a power plane. The electronic components are electrically connected to the signal layers in the board. However, in the assembly of the f sub-components, the electronic components are connected to the circuit board by the phase flow. Because the metal layer has strong thermal conductivity and heat dissipation: the large number of 'circuit boards after reflow soldering will cause electrons, 2 poor soldering or cold soldering due to excessive heat dissipation, causing the electronic components to fail, so that the circuit board has no positives. It is used for scrapping, which causes the electronic device containing the board to fail, which seriously affects the quality of the board. [New content] In view of this, it is necessary to provide a circuit board that can prevent soldering of electronic parts on the board. The circuit board comprises a substrate, a pair of first soldering pads and a heat resistant junction M379953. The substrate comprises a first surface, a second surface, a socket and a plurality of vias, the sockets extending through the first surface and the second surface. The first bonding pad is disposed on the first surface and the second surface and surrounds the insertion hole. The heat blocking structure is disposed on the periphery of the first bonding pads for separating the metal layers around the first bonding pads. The via hole is disposed around the metal layer separated by the heat blocking structure to conduct the heat of the first surface to the second surface. • The circuit board of the present invention has a heat-insulating structure and a supplemental heat due to the periphery of the jack. hole , thereby slowing down the speed of heat loss during the welding process, avoiding poor soldering or cold soldering of electronic parts due to excessive heat dissipation, and improving the production yield and efficiency of the circuit board. [Embodiment] Please refer to FIG. 1 and 2. The circuit board 100 of the present invention includes a substrate 10, a bonding pad 30, and a heat-insulating structure 50. The circuit board 100 is a two-layer or multi-layer printed circuit board. The substrate 10 includes a first surface 12, a second surface 14, and a jack. 16 and a plurality of vias 18. The receptacles 16 and vias 18 extend through the first surface 12 and the second surface 14, respectively. Pins (not shown) of the electronic components are soldered to the substrate 10 through the receptacles 16. The inner wall of the 16 is plated with a conductive metal layer, such as a copper foil. The pad 30 includes a pair of first pads 32 and second pads 34. The first pads 32 are disposed on the first surface 12 and the second surface of the substrate 10. 14 and surrounding the insertion hole 16. In the embodiment, the first pad 32 and the second pad 34 are both copper foils. 4 The second pad 34 夬 && 1〇 of the second surface 14 JE® winding thermal structure 5 (), the first solder % and the jack w. In this implementation In the formula, n塾34 is used for replenishing heat to slow the rate of heat loss during the welding process. In the second embodiment, the second surface 14 of the substrate 10 may not be provided with the second pad 34. The heat-resistant structure 50 runs through the a surface η and a second surface Μ, and including a pair of δ between the gamma and the heat-insulating block around the first luminescent pad U, thereby staking the metal around the first diaper pad-zinc pad 32 in the substrate 10. The layer is divided into four strip-shaped connecting regions 11' to make the material first-铎塾Μ and its surrounding metal layer: fully connected, that is, the heat dissipation area of the surrounding metal layer is reduced, and the heat dissipation rate in the zinc-connected poplar is slowed down. In the present invention, the heat-blocking block is substantially fan-shaped and is concentric with the socket Μ and the first-weld dies 32. The heat-blocking block is formed by a hollow layer formed by the metal layer (four) which is connected to the first-pad pad; the heat-insulating zone formed by the insulating material, such as epoxy resin, is formed in the present embodiment. 18 for viewing, each via wall is coated with green paint to avoid the waste during the welding process. The via holes 18 are divided into three groups arranged at the periphery of the three connection regions η, that is, the via holes 18 are located at the periphery of the insertion hole 16. Each set of vias consists of four and is divided into two rows by M379953. During the soldering process, the vias 18 rapidly conduct heat from the second surface 14 to the first surface 12 to slow the rate of heat loss during soldering, thereby improving soldering or cold soldering of the electronic components. Among them, the closer the via 18 is to the jack 16, the better the heat supplement effect. The heat-insulating structure 50 and the heat-receiving via hole '18 are arranged around the socket 16, thereby slowing the heat loss during the welding process, and avoiding poor soldering or cold welding of the electronic parts due to excessive heat and heat. Improve board production yield and efficiency. Although the present invention has been disclosed above in the preferred embodiments, it is not intended to limit the present invention. However, any person skilled in the art will be able to make minor changes and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this new type is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front view of a circuit board of the present invention. Lu Tu 2 is not intended to be the reverse side of the novel circuit board. [Main component symbol description] Circuit board 100 Substrate 10 Connection area 11 First surface 12 Second surface 14 Jack 16 6 M379953 Via 18 Solder pad 30 First pad 32 Second pad 34 Heat-resisting structure 50