CN208708058U - A kind of heat sinking type control panel - Google Patents
A kind of heat sinking type control panel Download PDFInfo
- Publication number
- CN208708058U CN208708058U CN201821213881.5U CN201821213881U CN208708058U CN 208708058 U CN208708058 U CN 208708058U CN 201821213881 U CN201821213881 U CN 201821213881U CN 208708058 U CN208708058 U CN 208708058U
- Authority
- CN
- China
- Prior art keywords
- heat
- additional cooler
- control panel
- type control
- sinking type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000011889 copper foil Substances 0.000 claims abstract description 7
- 239000012790 adhesive layer Substances 0.000 claims abstract description 6
- 239000004411 aluminium Substances 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 17
- 230000017525 heat dissipation Effects 0.000 abstract description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 9
- 229910021389 graphene Inorganic materials 0.000 abstract description 9
- 239000003292 glue Substances 0.000 abstract description 5
- 238000009413 insulation Methods 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 abstract description 2
- 239000003522 acrylic cement Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of heat sinking type control panel, it include: master control borad, the heat-conducting double-sided glue-line set on the master control back, the additional cooler below the heat-conducting layer, the heat-conducting double-sided glue-line includes substrate and the thermal conductive adhesive layer set on the substrate two sides, the additional cooler includes that a horizontal base plate and several fins below the substrate, the substrate are an integral structure with the fin.The heat sinking type control panel of the utility model, structure is simple, good heat dissipation effect.By way of installing additional cooler additional for master control borad, the heat dissipation effect for the plate that tightens control；It is simple to operate using the connection type of heat-conducting double-sided glue sticking, good heat dissipation effect, while there is insulation effect again；Heat-conducting double-sided glue-line, as substrate, strengthens thermal diffusivity using copper foil；Graphene is added in heat-conducting double-sided adhesive, greatly improves the thermal conductivity of heat-conducting double-sided glue-line.
Description
Technical field
The utility model relates to control panel technical field more particularly to a kind of heat sinking type control panels.
Background technique
With the development of science and technology, circuit control panel is more and more is applied to automated production equipment and intellectual product
In.When in use, electronic component therein can generate a large amount of heat to control panel, if these heats can not scatter and disappear, it will
Electronic component is damaged, or even to will cause control panel on fire.
Therefore, the prior art is defective, needs to improve.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of heat sinking type control panel.
The technical solution of the utility model is as follows: a kind of heat sinking type control panel, comprising: master control borad is set to the master
Heat-conducting double-sided glue-line, the additional cooler below the heat-conducting layer of back are controlled, the heat-conducting double-sided glue-line includes base
Material and thermal conductive adhesive layer set on the substrate two sides, the additional cooler include a horizontal base plate and are set to institute
Several fins below substrate are stated, the substrate is an integral structure with the fin.
Further, the substrate is copper foil.
Further, the heat-conducting double-sided glue-line with a thickness of 0.1mm-0.3mm.
Further, the additional cooler is aluminium, and the additional cooler is disposably extruded into using aluminium extruded technique
Type.
Further, the additional cooler edge is equipped with several detents.
Further, the detent is sheet metal component, and the detent is fixed on the additional cooler by welding
Edge.
Further, the additional cooler is identical as the shape of the master control borad and size.
Further, the shape of the additional cooler and the master control borad is round or rectangle.
Further, the additional cooler is circle, and the detent is evenly distributed on the circular additional cooler
Edge.
Further, the additional cooler is rectangle, and the detent is four, and four detents are located at rectangle
Four sides of the additional cooler midpoint.
Using the above scheme, the heat sinking type control panel of the utility model, structure is simple, good heat dissipation effect.By for
Master control borad installs the mode of additional cooler, the heat dissipation effect for the plate that tightens control additional；Using the connection type of heat-conducting double-sided glue sticking,
It is simple to operate, good heat dissipation effect, while there is insulation effect again；Heat-conducting double-sided glue-line, as substrate, is reinforced using copper foil
Thermal diffusivity；Graphene is added in heat-conducting double-sided adhesive, greatly improves the thermal conductivity of heat-conducting double-sided glue-line.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model heat radiating type control panel；
Fig. 2 is the structural schematic diagram of heat-conducting double-sided glue-line in the utility model heat radiating type control panel；
Fig. 3 is the structural schematic diagram of the heat radiating type control panel of another embodiment of the utility model.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used for explaining this
Utility model is not used to limit the utility model.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute in the utility model embodiment
It is only limitted to the relative position in given view, rather than absolute position.
Referring to Fig. 1, the utility model provides a kind of heat sinking type control panel, comprising: master control borad 1 is set to the master
Heat-conducting double-sided glue-line 2, the additional cooler 3 set on 2 lower section of heat-conducting double-sided glue-line for controlling 1 back side of plate.By for the master
Control plate 1 installs the mode of the additional cooler 3, the heat dissipation effect for the plate that tightens control additional, and uses the company of heat-conducting double-sided glue sticking
Mode is connect, simple to operate, good heat dissipation effect, while there is insulation effect again.
Referring to Fig. 2, the heat-conducting double-sided glue-line 2 includes substrate 21 and the heat-conducting glue set on 21 two sides of substrate
Adhesive layer 22.The heat-conducting double-sided glue-line 2 with a thickness of 0.1mm-0.3mm, the heat-conducting double-sided glue-line 2 of this thickness can
Superpower bonding force and excellent heat dissipation effect are provided simultaneously.The substrate 21 is copper foil, and the thermal coefficient of copper foil is high, heating conduction
It is excellent, it can assign the heat-conducting double-sided glue-line 2 excellent heat dissipation performance as substrate, while playing the role of support.It is described
Thermal conductive adhesive layer 22 includes acrylic adhesive, ceramic powders and graphene, and the content of the acrylic adhesive is
100 parts by weight, the content of the ceramic powders are 10-20 parts by weight, and the content of the graphene is 3-8 parts by weight.By
Ceramic powders are added in traditional acrylic adhesive and graphene is blended, the thermal conductive adhesive layer 22 is made.Wherein make pottery
Porcelain powder is common heat filling, has excellent heating conduction.The utility model introduces graphene, graphene it is thermally conductive
Coefficient is up to 5300W/mK, is the highest carbon material of thermal coefficient so far, a small amount of graphene is added to acrylic gluing
In agent, the heating conduction of acrylic adhesive can be significantly improved.
Referring to Fig. 1, the additional cooler 3 includes a horizontal base plate 31 and is set to below the substrate 31
Several fins 32, the substrate 31 is an integral structure with the fin 32.The design of the fin 32 increases described auxiliary
The heat dissipation area of radiator 3 is helped, to effectively strengthen the heat spreading function of the additional cooler 3.The additional cooler 3 is
The thermal coefficient of aluminium, aluminium is higher, and cost is relatively low.The additional cooler 3 is disposably extruded into using aluminium extruded technique
Type, moulding process is simple, and equipment cost is low.3 edge of additional cooler is equipped with several detents 33, and the detent 33 is metal plate
Part, the detent 33 are fixed on the edge of the additional cooler 3 by welding, and the detent 33 is in order to further
The fixed master control borad 1, while being also convenient for the accurate positionin when being bonded the master control borad 1 with the additional cooler 3.In order to match
It closes master board 1 and plays better heat dissipation effect, the additional cooler 3 is identical as the shape of the master control borad 1 and size.It is logical
In normal situation, the shape of the additional cooler 3 and the master board can be arbitrarily devised.Specifically, the auxiliary heat dissipation
The shape of device 3 and the master control borad 1 is round or rectangle.Further, in one embodiment, the additional cooler
3 be rectangle, and the detent 33 is four, and four detents 33 are located at 3 four sides of the additional cooler of rectangle
Midpoint.Further, in another embodiment, the additional cooler 300 is circle, and the detent 330 is uniformly distributed
At the edge of the circular additional cooler 300.
In conclusion the heat sinking type control panel of the utility model, structure is simple, good heat dissipation effect.By for master control
Plate installs the mode of additional cooler, the heat dissipation effect for the plate that tightens control additional；Using the connection type of heat-conducting double-sided glue sticking, operation
It is simple and convenient, good heat dissipation effect, while there is insulation effect again；Heat-conducting double-sided glue-line, as substrate, is strengthened scattered using copper foil
It is hot；Graphene is added in heat-conducting double-sided adhesive, greatly improves the thermal conductivity of heat-conducting double-sided glue-line.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all practical at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the guarantor of the utility model within novel spirit and principle
Within the scope of shield.
Claims (10)
1. a kind of heat sinking type control panel characterized by comprising master control borad, set on the thermally conductive double of the master control back
Face glue-line, the additional cooler below the heat-conducting double-sided glue-line, the heat-conducting double-sided glue-line include substrate and are set to
The thermal conductive adhesive layer on the substrate two sides, the additional cooler include a horizontal base plate and are set to below the substrate
Several fins, the substrate is an integral structure with the fin.
2. heat sinking type control panel according to claim 1, which is characterized in that the substrate is copper foil.
3. heat sinking type control panel according to claim 1, which is characterized in that the heat-conducting double-sided glue-line with a thickness of
0.1mm-0.3mm。
4. heat sinking type control panel according to claim 1, which is characterized in that the additional cooler is aluminium, institute
Additional cooler is stated using the disposable extrusion molding of aluminium extruded technique.
5. heat sinking type control panel according to claim 1, which is characterized in that if the additional cooler edge is equipped with
Dry detent.
6. heat sinking type control panel according to claim 5, which is characterized in that the detent is sheet metal component, the card
Position is fixed on the edge of the additional cooler by welding.
7. heat sinking type control panel according to claim 6, which is characterized in that the additional cooler and the master control
The shape and size of plate are identical.
8. heat sinking type control panel according to claim 7, which is characterized in that the additional cooler and the master control
The shape of plate is round or rectangle.
9. heat sinking type control panel according to claim 8, which is characterized in that the additional cooler is circle, institute
State the edge that detent is evenly distributed on the circular additional cooler.
10. heat sinking type control panel according to claim 8, which is characterized in that the additional cooler is rectangle, institute
Stating detent is four, and four detents are located at the midpoint on four sides of the additional cooler of rectangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821213881.5U CN208708058U (en) | 2018-07-27 | 2018-07-27 | A kind of heat sinking type control panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821213881.5U CN208708058U (en) | 2018-07-27 | 2018-07-27 | A kind of heat sinking type control panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208708058U true CN208708058U (en) | 2019-04-05 |
Family
ID=65940097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821213881.5U Expired - Fee Related CN208708058U (en) | 2018-07-27 | 2018-07-27 | A kind of heat sinking type control panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208708058U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110930860A (en) * | 2019-11-15 | 2020-03-27 | 深圳昌茂粘胶新材料有限公司 | Efficient heat-conducting temperature-resistant insulating carbon fiber label material and preparation method thereof |
-
2018
- 2018-07-27 CN CN201821213881.5U patent/CN208708058U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110930860A (en) * | 2019-11-15 | 2020-03-27 | 深圳昌茂粘胶新材料有限公司 | Efficient heat-conducting temperature-resistant insulating carbon fiber label material and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190405 |