A kind of heat radiating type intelligent wiring box
Technical field
The present invention relates to a kind of terminal box, more particularly to a kind of heat radiating type intelligent wiring box.
Background technology
Solar energy industry just worldwide flourishes as a kind of low-carbon regenerative resource, various countries' installation by
Year increases.In the cutting edge technology of photovoltaic, intelligent assembly is a kind of product that intelligent control is dissolved into and gone in photovoltaic industry, existing
Some intelligent assemblies are usually that the intelligent wiring box with intelligent chip circuit is added in common component to realize its function.
One common fault of existing intelligent wiring box is:The operating temperature of intelligent chip is higher, easily in routine work, reliability test
Etc. occasion because heating seriously damages even burning, blast, this bottleneck developed as restriction intelligent assembly.Therefore, it is necessary to
A kind of intelligent wiring box of heat radiating type is designed, solves the problems, such as the chip cooling of photovoltaic intelligent junction box, promotes modern intellectual technology
It is dissolved into well among photovoltaic industry, new force is provided for the further development of photovoltaic industry.
The content of the invention
For the present invention in the prior art, intelligent wiring box chip cooling is ineffective, baroque technical problem, carries
For a kind of heat radiating type intelligent wiring box.
Therefore, the present invention adopts the following technical scheme that:
A kind of heat radiating type intelligent wiring box, including box body (1), lid (2) and be arranged in box body (1) containing intelligence
The PCB (3) of chip, it is characterised in that:The PCB (3) is encapsulated in box body (1) by the good casting glue (4) of heat conductivility energy
Interior, when lid (2) covers with box body (1), at least part lid (2) can contact with casting glue (4), and the lid (2) has
The depressed part (21) stretched out to box body (1), and when lid (2) and box body (1) cover, the depressed part (21) and casting glue (4)
Contact, the depressed part (21) have a flat bottom surface.The present invention by the PCB containing intelligent chip by being encapsulated in thermal conductivity
Can in good casting glue, by intelligent chip run caused by the benign passage of heat that is formed by casting glue of amount of heat
Be delivered to lid, be then delivered to again outside terminal box, intelligent chip and terminal box is maintained rational operating temperature, avoid because
Temperature is too high and burns.By the design of the sunk type lid with depressed part, the depressed part of lid is contacted with casting glue, enter
Row heat scatters and disappears;The design of bottom, increase the contact area of lid and casting glue, good heat dissipation effect.
Further, some reinforcements (22) are provided with the depressed part (21).Increase lid intensity.
Further, some excessive glue grooves (11) are provided with box body (1).Casting glue is set to maintain the embedding height of setting.
Therefore, the present invention makes the amount of heat that chip is sent be led along this passage by the good casting glue of heat conductivility
Go out;The heat that casting glue is conducted sufficiently is imported into by whole lid by lid again;Air stream outside finally by lid
It is dynamic, by the heat on lid rapidly and efficiently be lost to exterior space.Form a height by intelligent chip to exterior space
Effect, reliable heat dissipation channel, it is of great advantage to the temperature of reduction intelligent wiring box chips.It solves existing intelligent wiring box
Radiating is slow, the problem of inside chip operating temperature is high.The present invention has the advantages of simple in construction, good heat dissipation effect.
Brief description of the drawings
Fig. 1 is the structural representation of the non-encapsulating state of box body of the present invention;
Fig. 2 is the structural representation of box body encapsulating state of the present invention;
Fig. 3, Fig. 4 are the structural representation of lid of the present invention.
Embodiment
The structure of the present invention is further described in detail with specific embodiment below in conjunction with the accompanying drawings, it is in the present invention and existing
There is technology identical part to refer to prior art.
As Figure 1-4, heat radiating type intelligent wiring box of the invention, including box body 1, lid 2, as shown in figure 1, in box body
The PCB3 containing intelligent chip is installed in 1, PCB3 is encapsulated in box body 1 by the good casting glue 4 of heat conductivility energy, and
During encapsulation, the liquid level of casting glue is designed to such a height:After the completion of encapsulation, when lid 2 covers with box body 1, extremely
Small part lid 2 can contact with casting glue 4.Specifically, lid 2 has the depressed part 21 stretched out to box body 1, when lid 2 and box
When body 1 covers, the depressed part 21 contacts with casting glue 4.Preferably, depressed part 21 has a flat bottom surface.With casting glue
Contact area increases, good heat dissipation effect.
As shown in figure 4, some reinforcements 22 are provided with the depressed part 21.
As shown in figure 1, being provided with some excessive glue grooves 11 in box body 1, excessive glue groove 11 makes casting glue maintain the embedding set
Highly.
The present invention designs the height of excessive glue groove as needed first when using process, ensures the liquid level of casting glue,
Then the casting glue of respective amount is put into box body, made at the top of its liquid level and excessive glue groove in same plane, after embedding adhesive curing,
Lid is covered on box body, ensures the depressed part of lid and the good contact of casting glue.
Certainly, the present invention also has other embodiment, and listed above is only presently preferred embodiments of the present invention, is not used for limiting
The practical range of the fixed present invention, the equivalent changes and modifications that all contents according to the application the scope of the claims are made, all should be the present invention
Technology category.