CN207587763U - A heat-dissipating LED packaging structure - Google Patents

Abstract

the utility model discloses a radiating L ED packaging structure, which comprises a substrate, the base plate is hollow structure, it has the mounting groove that a plurality of arrays were arranged to open on one side lateral wall of base plate, install L ED lamp pearl on the bottom lateral wall of mounting groove, be equipped with a light concentration section of thick bamboo around the L ED lamp pearl, the light concentration section of thick bamboo glues even on the lateral wall all around of mounting groove, the outside of mounting groove is equipped with transparent sealing cover, it has the fresh air inlet to open between the adjacent mounting groove, the fresh air inlet is located the lateral wall of base plate, open the bottom of mounting groove has the through-hole, the through-hole is located the base plate, the through-hole internal fixation has heat conduction silica gel, heat conduction silica gel's one end and L ED lamp pearl contact, heat conduction silica gel's one end is connected with the heat conduction stick, the heat conduction stick is located the inside of base plate, install a plurality of evenly distributed's first fin on the lateral wall all around of heat conduction stick, the utility.

Description

A heat-dissipating LED packaging structure

technical field

The utility model relates to the technical field of LED lamps, in particular to a heat dissipation LED packaging structure.

Background technique

LED packaging refers to the packaging of light-emitting chips, which is quite different from integrated circuit packaging. The packaging of the LED is not only required to be able to protect the wick, but also to be able to transmit light. Therefore, LED packaging has special requirements for packaging materials. Existing LED packages are generally closed structures, so heat dissipation performance is particularly critical, and poor heat dissipation effects will greatly shorten the service life of LED packages. Patent CN206040701 U proposes a heat dissipation LED package structure, which only uses the natural flow of air to For heat dissipation, the heat dissipation effect is poor, and the LED chip is in direct contact with the air, and dust is easy to adhere to the LED chip. Therefore, we propose a heat dissipation LED packaging structure.

Utility model content

The purpose of the utility model is to solve the shortcomings in the prior art, and propose a heat-dissipating LED packaging structure.

In order to achieve the above object, the utility model adopts the following technical solutions:

A heat-dissipating LED packaging structure, including a substrate, the substrate is a hollow structure, a plurality of installation grooves arranged in an array are opened on one side wall of the substrate, and LED lamp beads are installed on the bottom side wall of the installation groove, There is a condenser tube around the LED lamp bead, and the condenser tube is adhered to the side walls around the installation groove. The outside of the installation groove is provided with a transparent sealing cover, and there are air inlet holes between adjacent installation grooves. On the side wall of the substrate, there is a through hole at the bottom of the installation groove. The through hole is located on the substrate, and a thermal conductive silica gel is fixed in the through hole. One end of the thermal conductive silica gel is in contact with the LED lamp bead, and one end of the thermal conductive silica gel is connected with a heat conduction rod. The heat conduction rod is located inside the base plate, and a plurality of uniformly distributed first heat sinks are installed on the surrounding side walls of the heat conduction rod, and a plurality of evenly distributed air ducts are connected to the side wall of the base plate away from the installation groove. One end of the air outlet is connected with an air outlet, and one end of the air outlet is provided with an opening, and a fan for drawing air from the inside to the outside is installed at the opening of the air outlet.

Preferably, a dust-proof net is provided inside the air inlet.

Preferably, the substrate is an aluminum substrate or a copper substrate.

Preferably, the first heat sink has a honeycomb structure.

Preferably, heat dissipation fins are provided on the surrounding side walls of the air duct.

Preferably, the base plate, the air inlet hole and the installation groove are of an integral structure.

Preferably, a plurality of evenly arranged second cooling fins are connected to the surrounding side walls of the air outlet tube, and the second cooling fins extend to the inside of the air outlet tube.

The beneficial effects of the utility model: through the fan, the air outlet tube, the air guide pipe, the base plate, the first heat sink, the heat conducting rod, the transparent sealing cover, the air inlet hole, the LED lamp bead, the condenser tube, the thermal silica gel, and the dustproof net And the setting of the installation groove can prevent dust from entering the transparent sealing cover. At the same time, it can quickly dissipate the heat generated by the LED lamp beads, and the heat dissipation effect is good. This device can quickly dissipate heat from the LED lamp beads, and the heat dissipation effect is good. LED lamp beads, prolong the service life of LED lamp beads.

Description of drawings

Fig. 1 is a structural schematic diagram of a heat dissipation LED packaging structure proposed by the present invention;

FIG. 2 is a partial structural schematic diagram of a heat dissipation LED packaging structure proposed by the present invention.

In the figure: 1 fan, 2 air outlet tube, 3 air duct, 4 substrate, 5 first heat sink, 6 heat conducting rod, 7 transparent sealing cover, 8 air inlet hole, 9 LED lamp bead, 10 spotlight tube, 11 Thermal silica gel, 12 dust-proof nets, 13 installation slots.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example.

Referring to Figure 1-2, a heat dissipation LED packaging structure includes a substrate 4, the substrate 4 is a hollow structure, a plurality of mounting grooves 13 arranged in an array are opened on one side wall of the substrate 4, and the bottom end of the mounting groove 13 LED lamp beads 9 are installed on the side wall, and a condenser tube 10 is arranged around the LED lamp beads 9. The condenser tube 10 is adhered to the side walls around the installation groove 13, and the outside of the installation groove 13 is provided with a transparent sealing cover 7. There is an air inlet hole 8 between adjacent installation grooves 13, the air inlet hole 8 is located on the side wall of the base plate 4, the bottom end of the installation groove 13 is opened with a through hole, the through hole is located on the base plate 4, and a heat conduction device is fixed in the through hole. Silica gel 11, one end of the heat-conducting silica gel 11 is in contact with the LED lamp bead 9, one end of the heat-conducting silica gel 11 is connected with a heat-conducting rod 6, the heat-conducting rod 6 is located inside the base plate 4, and multiple uniformly distributed The first heat sink 5 of the base plate 4 is connected with a plurality of evenly distributed air guide pipes 3 on the side wall away from the installation groove 13, and one end of the air guide pipe 3 is connected with the air outlet tube 2, and one end of the air outlet tube 2 There is an opening, the opening of the air outlet tube 2 is equipped with a fan 1 that draws air from the inside to the outside, the inside of the air inlet 8 is provided with a dust-proof net 12, the substrate 4 is an aluminum substrate or a copper substrate, and the first heat sink 5 is a honeycomb The surrounding side walls of the air guide pipe 3 are equipped with heat dissipation fins, the base plate 4, the air inlet hole 8 and the installation groove 13 are of an integrated structure, and the surrounding side walls of the air outlet tube 2 are connected with a plurality of evenly arranged The second cooling fin extends to the inside of the air outlet tube 2 .

Working principle: start the fan 1 in the air duct 2, and after the LED lamp bead 9 lights up, the heat generated by the LED lamp bead 9 is transferred to the heat-conducting silica gel 11 and the substrate 4, and the heat on the heat-conducting silica gel 11 is transferred through the heat-conducting rod 6 On the first cooling fin 5, the fan 1 sucks the outside air into the inside of the base plate 4 through the air inlet hole 8, takes away the heat on the first cooling fin 5, enters the air outlet tube 2 through the air guiding tube 3, and discharges it. The heat dissipation fins on the air duct 3 and the second heat dissipation fins on the air outlet duct 2 transfer heat out.

The above is only a preferred embodiment of the utility model, but the scope of protection of the utility model is not limited thereto. The equivalent replacement or change of the new technical solution and the concept of the utility model shall be covered by the protection scope of the utility model.

Claims (7)

1. a kind of LED encapsulation structure of heat dissipation, including substrate（4）, which is characterized in that the substrate（4）For hollow structure, substrate （4）Side side wall on be provided with the mounting grooves of multiple array arrangements（13）, mounting groove（13）Bottom end side wall on LED light is installed Pearl（9）, LED lamp bead（9）Be surrounded by light collecting barrel（10）, light collecting barrel（10）Stick in mounting groove（13）Surrounding side wall on, Mounting groove（13）Outside be equipped with transparent sealed cover（7）, adjacent fitting grooves（13）Between be provided with air inlet hole（8）, air inlet hole（8）Position In substrate（4）Side wall on, mounting groove（13）Bottom end be provided with through-hole, through-hole is located at substrate（4）On, heat conduction is fixed in through-hole Silica gel（11）, heat conductive silica gel（11）One end and LED lamp bead（9）It is in contact, heat conductive silica gel（11）One end be connected with heat conductive rod （6）, heat conductive rod（6）Positioned at substrate（4）Inside, heat conductive rod（6）Surrounding side wall on be equipped with multiple equally distributed first Cooling fin（5）, substrate（4）Far from mounting groove（13）Side side wall on be connected with multiple equally distributed guide ducts（3）, wind-guiding Pipe（3）One end be connected with chimney fan（2）, chimney fan（2）One end be equipped with opening, chimney fan（2）Opening be equipped with by The fan of exhausting from inside to outside（1）.

A kind of 2. LED encapsulation structure of heat dissipation according to claim 1, which is characterized in that the air inlet hole（8）Inside Equipped with Air Filter（12）.

A kind of 3. LED encapsulation structure of heat dissipation according to claim 1, which is characterized in that the substrate（4）For aluminum substrate Or copper base.

A kind of 4. LED encapsulation structure of heat dissipation according to claim 1, which is characterized in that first cooling fin（5）For Cellular structure.

A kind of 5. LED encapsulation structure of heat dissipation according to claim 1, which is characterized in that the guide duct（3）Surrounding Heat radiating fin is equipped on side wall.

A kind of 6. LED encapsulation structure of heat dissipation according to claim 1, which is characterized in that the substrate（4）, air inlet hole （8）And mounting groove（13）It is an integral structure.

A kind of 7. LED encapsulation structure of heat dissipation according to claim 1, which is characterized in that the chimney fan（2）Surrounding Multiple the second cooling fins being uniformly arranged are respectively connected on side wall, the second cooling fin extends to chimney fan（2）Inside.