CN111726934B - Heat dissipation drive plate utilizing semiconductor for cooling - Google Patents
Heat dissipation drive plate utilizing semiconductor for cooling Download PDFInfo
- Publication number
- CN111726934B CN111726934B CN202010625667.6A CN202010625667A CN111726934B CN 111726934 B CN111726934 B CN 111726934B CN 202010625667 A CN202010625667 A CN 202010625667A CN 111726934 B CN111726934 B CN 111726934B
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- type semiconductor
- end substrate
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- hot
- substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat dissipation driving board cooled by semiconductors, which relates to the field of Printed Circuit Boards (PCB) and comprises a driving board body, components, a cold end substrate, a P-type semiconductor, an N-type semiconductor, a hot end substrate and a radiator, wherein the components are arranged on the driving board body, the cold end substrate is embedded below the components through a pressure film, two ends of the cold end substrate are respectively connected with the P-type semiconductor and the N-type semiconductor, the P-type semiconductor and the N-type semiconductor are respectively connected with the hot end substrate, and the radiator is arranged on the hot end substrate.
Description
Technical Field
The invention belongs to the field of PCBs, and particularly relates to a heat dissipation driving board cooled by a semiconductor.
Background
The components and parts of the driving board (PCB board, circuit board) can generate certain heat when working, so that the internal temperature of the equipment can rise rapidly, if the heat is not dissipated out in time, the equipment can be heated continuously, the components can lose efficacy due to overheating, and the reliability of the electronic equipment can be reduced. At present, the heat dissipation mode of the driving board is mainly characterized in that heat-conducting silicone grease is smeared on the back surface of the driving board and connected onto a radiator, or a fan is used for air cooling, and even if components do not work, the heat dissipation limit of the conventional mode can only enable the temperature of the driving board to approach the room temperature. The back of the driving plate is coated with heat-conducting silicone grease to connect with the radiator, so that the manufacturing process is increased, the cost is increased by air cooling, the complexity of the structure is increased, the semiconductor refrigeration is efficient and convenient, and the temperature can be reduced to be far lower than the ambient temperature.
Disclosure of Invention
The invention aims to provide a heat dissipation driving board utilizing a semiconductor to cool so as to solve the defects caused in the prior art.
The heat dissipation driving board comprises a driving board body, components, a cold end substrate, a P-type semiconductor, an N-type semiconductor, a hot end substrate and a heat radiator, wherein the components are installed on the driving board body, the cold end substrate is embedded below the components through a pressure film, two ends of the cold end substrate are respectively connected with the P-type semiconductor and the N-type semiconductor, the P-type semiconductor and the N-type semiconductor are respectively connected with the hot end substrate, and the heat radiator is installed on the hot end substrate.
Preferably, the P-type semiconductor and the N-type semiconductor are connected with the hot end substrate sequentially through the plug connector and the first diversion strip, the first diversion strip is replaced by an electric wire, and the hot end substrate is separated from the cold end substrate.
Preferably, the P-type semiconductor and the N-type semiconductor are both soldered to the driving board body in the form of a package.
Preferably, the cold-end substrate is connected with the P-type semiconductor and the N-type semiconductor through the second diversion strips, and the second diversion strips are replaced by printed circuits on the driving plate body.
Preferably, the radiator comprises a heat conducting plate, a plurality of radiating fins and a fan assembly, the heat conducting plate is connected with the hot end substrate and is tightly attached to the hot end substrate, the radiating fins are arranged on the heat conducting plate in an array mode, and the fan assembly is installed at the other end of each radiating fin.
Preferably, the driving board body contains four copper layers.
Preferably, the guide strip two ends are connected to the cold-end substrate through an electroplated layer on the inner wall of the via hole in the drive plate body.
The invention has the advantages that: the utility model provides a mode of a section utilizes semiconductor refrigeration principle to cool down for the drive plate body, heat radiation module comprises radiator and hot junction base plate, heat radiation module connects the bayonet joint and can realize that the semiconductor cools down for the drive plate body, cold-hot separation, the drive plate body is in cold junction base plate position, heat radiation module is in hot junction base plate position, heat radiation module's position can freely be put, need not fix on the drive plate body, greatly improved the degree of freedom of structure, and heat radiation module makes the standard component of different specifications, in the later stage use, directly select the specification according to drive plate body components and parts heating power, not only reduced development cost, production efficiency has also been improved, drive plate body lug connection connects heat radiation module and can use. The invention has compact and efficient structure, can perfectly separate cold and heat, and has excellent heat dissipation effect.
Drawings
Fig. 1 is a schematic diagram of the present invention.
Fig. 2 is a semiconductor refrigeration schematic diagram.
The LED light source comprises a driving board body 1, a component 2, a cold-end substrate 3, a 4-P type semiconductor, a 5-N type semiconductor, a hot-end substrate 6, a radiator 7, a plug 8, a diversion strip I9, a diversion strip II 10 and a diversion strip II 11, and is characterized in that the LED light source is a light source.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1 and 2, the heat dissipation drive board cooled by using semiconductors comprises a drive board body 1, a component 2, a cold-end substrate 3, a P-type semiconductor 4, an N-type semiconductor 5, a hot-end substrate 6 and a heat radiator 7, wherein the component 2 is installed on the drive board body 1, the cold-end substrate 3 is embedded below the component 2 through a pressure film, two ends of the cold-end substrate 3 are respectively connected with the P-type semiconductor 4 and the N-type semiconductor 5, the P-type semiconductor 4 and the N-type semiconductor 5 are respectively connected with the hot-end substrate 6, and the heat radiator 7 is installed on the hot-end substrate 6.
In this embodiment, the P-type semiconductor 4 and the N-type semiconductor 5 are connected to the hot-side substrate 6 sequentially through the plug 8 and the first guide strip 9, the first guide strip 9 is replaced by an electric wire, and the hot-side substrate 6 is separated from the cold-side substrate 3.
In this embodiment, the P-type semiconductor 4 and the N-type semiconductor 5 are both soldered on the driving board body 1 in a package manner.
In this embodiment, the cold-end substrate 3 is connected with the P-type semiconductor 4 and the N-type semiconductor 5 through the second guide strip 10, and the second guide strip 10 is replaced by a printed circuit on the drive board body 1, so that the heat dissipation structure is simplified, and the cost is reduced.
In this embodiment, the heat sink 7 includes a heat conducting plate, a plurality of heat dissipating fins and a fan assembly, the heat conducting plate is connected to and closely attached to the hot end substrate 6, the heat dissipating fins are arranged on the heat conducting plate in an array, and the fan assembly is mounted at the other end of the heat dissipating fins. The hot end substrate 6 distributes heat through the heat conducting plate, the radiating fins and the fan assembly to realize centralized heat dissipation. In addition, the radiator 7 in the present invention may also adopt other forms of radiators 7, such as a water-cooled radiator 7. The heat dissipation device is arranged outside the drive board and separated from the drive version, so that the purpose of centralized heat dissipation is achieved.
In this embodiment, the driving board body 1 contains four copper layers.
In the embodiment, the second diversion strips 10 are connected to the cold-end substrate 3 through the electroplated layer on the inner wall of the via hole 11 on the driving plate body 1.
The invention encapsulates the P-type semiconductor 4 and the N-type semiconductor 5 in the form of the component 2, and is welded on the drive board body 1, the P-type semiconductor 5 and the N-type semiconductor 5 are connected with the plug, and the guide strip at the cold end is directly replaced by the printed circuit of the drive board body 1. The PCB production process mainly comprises the steps of chemical cleaning, plate cutting and film pressing, exposure and development, etching, film removing, plate stacking, drilling and electroplating, wherein a cold end substrate 3 is etched below a component 2 in the etching stage and is embedded inside a drive plate body 1 in an FR4 plate stacking mode, a cold end guide strip is connected with the cold end substrate 3 through a via hole 11 electroplating layer, and a hot end substrate 6 and a radiator 7 are inserted into a plug and connected with the drive plate body 1 through guide strips. The invention has compact and efficient structure, can perfectly separate cold and heat, and has excellent heat dissipation effect.
It will be appreciated by those skilled in the art that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The embodiments disclosed above are therefore to be considered in all respects as illustrative and not restrictive. All changes which come within the scope of or equivalence to the invention are intended to be embraced therein.
Claims (1)
1. A heat dissipation drive board cooled by semiconductors comprises a drive board body (1) and components (2), wherein the components (2) are installed on the drive board body (1), and the heat dissipation drive board is characterized by further comprising a cold-end substrate (3), a P-type semiconductor (4), an N-type semiconductor (5), a hot-end substrate (6) and a heat radiator (7), wherein the cold-end substrate (3) is embedded below the components (2) through a pressing film, the cold-end substrate (3) is embedded inside the drive board body (1) in an FR4 stacking mode, two ends of the cold-end substrate (3) are respectively connected with the P-type semiconductor (4) and the N-type semiconductor (5), the P-type semiconductor (4) and the N-type semiconductor (5) are respectively connected with the hot-end substrate (6), and the heat radiator (7) is installed on the substrate (6);
the P-type semiconductor (4) and the N-type semiconductor (5) are connected with the hot end substrate (6) sequentially through a plug connector (8) and a guide strip I (9), the guide strip I (9) is replaced by an electric wire, and the hot end substrate (6) is separated from the cold end substrate (3); the P-type semiconductor (4) and the N-type semiconductor (5) are welded on the drive plate body (1) in a packaging mode; the cold end substrate (3) is connected with the P-type semiconductor (4) and the N-type semiconductor (5) through the second diversion strip (10), and the second diversion strip (10) is replaced by a printed circuit on the drive plate body (1); the radiator (7) comprises a heat conducting plate, a plurality of radiating fins and a fan assembly, the heat conducting plate is connected with the hot end substrate (6) and is tightly attached to the hot end substrate, the radiating fins are arranged on the heat conducting plate in an array mode, and the fan assembly is installed at the other end of each radiating fin; the driving plate body (1) comprises four copper layers; and the second guide strip (10) is connected to the cold end substrate (3) through an electroplated layer on the inner wall of the via hole (11) on the drive plate body (1).
Priority Applications (1)
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CN202010625667.6A CN111726934B (en) | 2020-07-02 | 2020-07-02 | Heat dissipation drive plate utilizing semiconductor for cooling |
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CN202010625667.6A CN111726934B (en) | 2020-07-02 | 2020-07-02 | Heat dissipation drive plate utilizing semiconductor for cooling |
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CN111726934A CN111726934A (en) | 2020-09-29 |
CN111726934B true CN111726934B (en) | 2022-11-11 |
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CN113496968A (en) * | 2021-07-07 | 2021-10-12 | 南昌黑鲨科技有限公司 | Heat dissipation assembly for heat dissipation of chip and preparation process method |
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JP2008141027A (en) * | 2006-12-04 | 2008-06-19 | Ferrotec Corp | Bonding structure of thermoelectric conversion element and thermoelectric conversion module |
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CN110996491A (en) * | 2019-12-12 | 2020-04-10 | 维沃移动通信有限公司 | Circuit board device and electronic equipment |
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JP5040765B2 (en) * | 2008-03-25 | 2012-10-03 | 日本電気株式会社 | Semiconductor device |
CN103353098B (en) * | 2013-06-25 | 2015-09-23 | 陈志明 | A kind of high-powered LED lamp cooling device and preparation method thereof |
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2020
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JP2006269572A (en) * | 2005-03-23 | 2006-10-05 | Seiko Instruments Inc | Thermoelectric conversion module, and method of manufacturing the same and circuit substrate |
CN101106169A (en) * | 2006-03-22 | 2008-01-16 | 财团法人工业技术研究院 | LED encapsulation structure and its making method |
JP2008141027A (en) * | 2006-12-04 | 2008-06-19 | Ferrotec Corp | Bonding structure of thermoelectric conversion element and thermoelectric conversion module |
CN104426052A (en) * | 2013-09-02 | 2015-03-18 | 华为技术有限公司 | Optical device packaging device and optical module |
CN209435532U (en) * | 2018-10-29 | 2019-09-24 | 江西领德辉电路有限公司 | A kind of novel PCB circuit board |
CN210432293U (en) * | 2019-07-25 | 2020-04-28 | 深圳益实科技有限公司 | Semiconductor refrigerating device for LCD control panel |
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