CN111726934A

CN111726934A - Heat dissipation drive plate utilizing semiconductor for cooling

Info

Publication number: CN111726934A
Application number: CN202010625667.6A
Authority: CN
Inventors: 朱岳松; 檀生辉; 吴勇; 王东; 伍旭东; 陶振; 刘恒; 王凯; 吴二导; 孙鸿健; 姜敏; 何志伟; 齐红青
Original assignee: Wuhu Research Institute of Xidian University
Current assignee: Wuhu Research Institute of Xidian University
Priority date: 2020-07-02
Filing date: 2020-07-02
Publication date: 2020-09-29
Anticipated expiration: 2040-07-02
Also published as: CN111726934B

Abstract

The invention discloses a heat dissipation driving board cooled by semiconductors, which relates to the field of Printed Circuit Boards (PCB) and comprises a driving board body, components, a cold end substrate, a P-type semiconductor, an N-type semiconductor, a hot end substrate and a radiator, wherein the components are arranged on the driving board body, the cold end substrate is embedded below the components through a pressure film, two ends of the cold end substrate are respectively connected with the P-type semiconductor and the N-type semiconductor, the P-type semiconductor and the N-type semiconductor are respectively connected with the hot end substrate, and the radiator is arranged on the hot end substrate.

Description

Heat dissipation drive plate utilizing semiconductor for cooling

Technical Field

The invention belongs to the field of PCBs, and particularly relates to a heat dissipation driving board cooled by a semiconductor.

Background

The components and parts of the driving board (PCB board, circuit board) can generate certain heat when working, so that the internal temperature of the equipment can rise rapidly, if the heat is not dissipated out in time, the equipment can be heated continuously, the components can lose efficacy due to overheating, and the reliability of the electronic equipment can be reduced. At present, the heat dissipation mode of the driving board is mainly characterized in that heat-conducting silicone grease is smeared on the back surface of the driving board and connected onto a radiator, or a fan is used for air cooling, and even if components do not work, the heat dissipation limit of the conventional mode can only enable the temperature of the driving board to approach the room temperature. The back of the driving plate is coated with heat-conducting silicone grease to connect with the radiator, so that the manufacturing process is increased, the cost is increased, the complexity of the structure is increased due to air cooling heat dissipation, semiconductor refrigeration is efficient and convenient, and the temperature can be reduced to be far lower than the ambient temperature.

Disclosure of Invention

The invention aims to provide a heat dissipation driving board utilizing a semiconductor to cool so as to solve the defects caused in the prior art.

The heat dissipation drive board capable of cooling by utilizing the semiconductor comprises a drive board body, components, a cold end substrate, a P-type semiconductor, an N-type semiconductor, a hot end substrate and a radiator, wherein the components are installed on the drive board body, the cold end substrate is embedded below the components through a pressure film, two ends of the cold end substrate are respectively connected with the P-type semiconductor and the N-type semiconductor, the P-type semiconductor and the N-type semiconductor are respectively connected with the hot end substrate, and the radiator is installed on the hot end substrate.

Preferably, the P-type semiconductor and the N-type semiconductor are connected with the hot end substrate sequentially through the plug connector and the first diversion strip, the first diversion strip is replaced by an electric wire, and the hot end substrate is separated from the cold end substrate.

Preferably, the P-type semiconductor and the N-type semiconductor are both soldered to the driving board body in the form of a package.

Preferably, the cold-end substrate is connected with the P-type semiconductor and the N-type semiconductor through the second diversion strips, and the second diversion strips are replaced by printed circuits on the driving plate body.

Preferably, the radiator comprises a heat conducting plate, a plurality of radiating fins and a fan assembly, the heat conducting plate is connected with the hot end substrate and is tightly attached to the hot end substrate, the radiating fins are arranged on the heat conducting plate in an array mode, and the fan assembly is installed at the other end of each radiating fin.

Preferably, the driving board body contains four copper layers.

Preferably, the guide strip two ends are connected to the cold-end substrate through an electroplated layer on the inner wall of the via hole in the drive plate body.

The invention has the advantages that: the utility model provides a mode of a section utilizes semiconductor refrigeration principle to cool down for the drive plate body, heat radiation module comprises radiator and hot junction base plate, heat radiation module connects the bayonet joint and can realize that the semiconductor cools down for the drive plate body, cold-hot separation, the drive plate body is in cold junction base plate position, heat radiation module is in hot junction base plate position, heat radiation module's position can freely be put, need not fix on the drive plate body, greatly improved the degree of freedom of structure, and heat radiation module makes the standard component of different specifications, in the later stage use, directly select the specification according to drive plate body components and parts heating power, not only reduced development cost, production efficiency has also been improved, drive plate body lug connection connects heat radiation module and can use. The invention has compact and efficient structure, can perfectly separate cold from heat and has excellent heat dissipation effect.

Drawings

Fig. 1 is a schematic diagram of the present invention.

Fig. 2 is a semiconductor refrigeration schematic diagram.

The LED light source comprises a driving board body 1, a component 2, a cold-end substrate 3, a 4-P type semiconductor, a 5-N type semiconductor, a hot-end substrate 6, a radiator 7, a plug 8, a diversion strip I9, a diversion strip II 10 and a diversion strip II 11, and is characterized in that the LED light source is a light source.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.

As shown in fig. 1 and 2, the heat dissipation drive board cooled by using semiconductors comprises a drive board body 1, a component 2, a cold-end substrate 3, a P-type semiconductor 4, an N-type semiconductor 5, a hot-end substrate 6 and a heat radiator 7, wherein the component 2 is installed on the drive board body 1, the cold-end substrate 3 is embedded below the component 2 through a pressure film, two ends of the cold-end substrate 3 are respectively connected with the P-type semiconductor 4 and the N-type semiconductor 5, the P-type semiconductor 4 and the N-type semiconductor 5 are respectively connected with the hot-end substrate 6, and the heat radiator 7 is installed on the hot-end substrate 6.

In this embodiment, the P-type semiconductor 4 and the N-type semiconductor 5 are connected to the hot-side substrate 6 sequentially through the plug 8 and the first guide strip 9, the first guide strip 9 is replaced by an electric wire, and the hot-side substrate 6 is separated from the cold-side substrate 3.

In this embodiment, the P-type semiconductor 4 and the N-type semiconductor 5 are both soldered to the driving board body 1 in a package manner.

In this embodiment, the cold-end substrate 3 is connected with the P-type semiconductor 4 and the N-type semiconductor 5 through the second guide strip 10, and the second guide strip 10 is replaced by a printed circuit on the drive board body 1, so that the heat dissipation structure is simplified, and the cost is reduced.

In this embodiment, the heat sink 7 includes a heat conducting plate, a plurality of heat dissipating fins and a fan assembly, the heat conducting plate is connected to and closely attached to the hot end substrate 6, the heat dissipating fins are arranged on the heat conducting plate in an array, and the fan assembly is mounted at the other end of the heat dissipating fins. The hot end substrate 6 distributes heat through the heat conducting plate, the radiating fins and the fan assembly to realize centralized heat dissipation. In addition, the radiator 7 in the present invention may also adopt other forms of radiators 7, such as a water-cooled radiator 7. The heat dissipation device is arranged outside the drive plate and separated from the drive version, so that the purpose of centralized heat dissipation is achieved.

In the present embodiment, the driving board body 1 contains four copper layers.

In this embodiment, the second diversion strips 10 are connected to the cold-end substrate 3 through the electroplated layer on the inner wall of the via hole 11 on the driving board body 1.

The P-type semiconductor 4 and the N-type semiconductor 5 are packaged in the form of components 2 and welded on the drive board body 1, the P-type semiconductor 5 and the N-type semiconductor 5 are connected to the plug, and the guide strip at the cold end is directly replaced by the printed circuit of the drive board body 1. The PCB production process mainly comprises the steps of chemical cleaning, plate cutting and film pressing, exposure and development, etching, film removing, plate stacking, drilling and electroplating, wherein a cold-end substrate 3 is etched below the component 2 in the etching stage and is embedded inside the drive plate body 1 in an FR4 plate stacking mode, a cold-end flow guide strip is connected with the cold-end substrate 3 through a through hole 11 electroplating layer, and a hot-end substrate 6 and a radiator 7 are inserted into a plug and connected with the drive plate body 1 through flow guide strips. The invention has compact and efficient structure, can perfectly separate cold from heat and has excellent heat dissipation effect.

It will be appreciated by those skilled in the art that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The embodiments disclosed above are therefore to be considered in all respects as illustrative and not restrictive. All changes which come within the scope of or equivalence to the invention are intended to be embraced therein.

Claims

1. The utility model provides an utilize heat dissipation drive plate of semiconductor cooling, includes drive plate body (1) and components and parts (2), components and parts (2) are installed on drive plate body (1), its characterized in that still includes cold junction base plate (3), P type semiconductor (4), N type semiconductor (5), hot junction base plate (6) and radiator (7), the below of components and parts (2) is inlayed through the compact film and is had cold junction base plate (3), the both ends of cold junction base plate (3) are connected with P type semiconductor (4), N type semiconductor (5) respectively, P type semiconductor (4), N type semiconductor (5) are connected with hot junction base plate (6) again respectively, install on hot junction base plate (6) radiator (7).

2. A heat dissipating driving board cooled by a semiconductor according to claim 1, wherein: the P-type semiconductor (4) and the N-type semiconductor (5) are connected with the hot end substrate (6) sequentially through a plug connector (8) and a first diversion strip (9), the first diversion strip (9) is replaced by an electric wire, and the hot end substrate (6) is separated from the cold end substrate (3).

3. A heat dissipating driving board cooled by a semiconductor according to claim 1, wherein: the P-type semiconductor (4) and the N-type semiconductor (5) are welded on the drive plate body (1) in a packaging mode.

4. A heat dissipating driving board cooled by a semiconductor according to claim 1, wherein: the cold end substrate (3) is connected with the P-type semiconductor (4) and the N-type semiconductor (5) through the second diversion strip (10), and the second diversion strip (10) is replaced by a printed circuit on the drive plate body (1).

5. A heat dissipating driving board cooled by a semiconductor according to claim 2, wherein: the radiator (7) comprises a heat conducting plate, a plurality of radiating fins and a fan assembly, the heat conducting plate is connected with the hot end substrate (6) and is tightly attached to the hot end substrate, the radiating fins are arranged on the heat conducting plate in an array mode, and the fan assembly is installed at the other end of each radiating fin.

6. A heat dissipating driving board cooled by a semiconductor according to claim 1, wherein: the driving plate body (1) comprises four copper layers.

7. The heat dissipation driving board cooled by the semiconductor according to claim 4, wherein: and the second guide strip (10) is connected to the cold end substrate (3) through an electroplated layer on the inner wall of the via hole (11) on the drive plate body (1).