CN102446873A - Heat radiator - Google Patents
Heat radiator Download PDFInfo
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- CN102446873A CN102446873A CN2010105101689A CN201010510168A CN102446873A CN 102446873 A CN102446873 A CN 102446873A CN 2010105101689 A CN2010105101689 A CN 2010105101689A CN 201010510168 A CN201010510168 A CN 201010510168A CN 102446873 A CN102446873 A CN 102446873A
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- radiator
- main body
- heater element
- pcb
- conductive pattern
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention relates to a heat radiator, which is characterized in that: the heat radiator can be surface mounted, the heat radiator is in a three-dimensional shape and comprises a main body which is made of metal, the main body is provided with a horizontal back surface and at least partial horizontal front surface, so partial front surface can be mounted on a conductive pattern of the printed circuit board (PCB) through alignment, and the back surface can be attached to the conductive pattern through backflow welding.
Description
Technical field
The present invention relates to a kind of radiator; More particularly; Relate to a kind of like this radiator, the front of said radiator is got puts and carries out surface mount (surface-mounted), and the back side of said radiator is reflow soldered to the conductive pattern of printed circuit board (PCB) (PCB) through soldering paste.
In addition; The present invention relates to a kind of small heat-dissipating device; Said radiator can distribute and cool off the heat that produces from heater element via the conductive pattern with the PCB of the adjacent setting of heater element more effectively, and can be installed on the conductive pattern easily with low cost.
Background technology
Recently, the size of portable electronic communications device (for example, mobile phone) and weight reduce and data processing speed and ability raising.Therefore, from the semiconductor chip that major function is provided for said device, produce a large amount of heats, this worsens the performance (for example, radio frequency (RF) performance) of semiconductor chip.
In addition, semiconductor chip (for example, realizing the light-emitting diode (LED) of high brightness) also produces a large amount of heats, and said heat shortens the useful life of led chip.
Usually; Metal heat pipe, radiator and polymer cooling pads etc. with high thermal conductivity are used to cool off effectively the heat of semi-conductive heating module or heater element (for example, be installed on the conductive pattern of printed circuit board (PCB) (PCB) field-effect transistor (FET)).
In addition, cool off effectively in order to make heat, thermal conductive ceramic or metal can be used as the material of the PCB in light-emitting diode (LED) lighting device that produces a large amount of heats.In this case, the part required thickness of in pottery or metallic circuit, carrying out cooling evenly, complex process and cost be high.For example, if process by the material of high thermal conductivity,, increased material cost thus even then also will use expensive material to the insensitive part of heat for cooling heating element entire circuit plate.
General radiator comprises that through use die casting, powder injection-molded (PIM) and the whole bag of tricks of casting (for example, Al) handle, and the metal after will handling are installed on the heater element and make high-thermal conductive metal.Therefore, the heat of heating part is passed to radiator and through the radiator radiation be dispersed in the air.For this reason, exemplary radiator has that outer surface big with the contact area of heater element, that contact with air is big, thermal conductivity is high and radiating efficiency is high.
For this purpose, according to correlation technique, (radiator of for example, Al) processing is formed the large-area front that has predetermined and contact at the back side that has level in shape and with air by metal.Use by any adhesive of processing in heat conduction elastic caoutchouc, pad and the adhesive tape with metal heat sink attached on the heater element that is installed on the PCB.
Yet, when using this elastic adhesive, pad or adhesive tape that radiator is installed, to compare with the situation of using welding method, bonding strength and thermal conductivity reduce.In addition, according to correlation technique, the installation of radiator is difficult to realize automation, therefore manually carries out.So installation cost increases and reliability of products and the convenience reduction of reprocessing.
In other words, be difficult to use soldering paste will get the method for putting (pick-and-place method) and surface mounting technology (SMT) is applied to radiator through reflow soldering.
In addition, the radiator of correlation technique weighs greatly.Particularly in size and the restricted personal terminal device of weight (for example, mobile phone and PDA(Personal Digital Assistant)), massive Application Of Radiator is limited.
Especially, in midget plant (for example, the personal terminal device), be difficult to guarantee radiator is installed in the height on the heater element.
In addition, when the radiator of being processed by Al was carried out insulating coating technology (for example, anodized) with anticorrosion, its thermal conductivity reduced.
In addition, the installation site of the radiator of correlation technique is limited to the position that is positioned on the heater element usually.
In addition, the radiator that is installed in the correlation technique on the heater element is radiation and distribute heat only, but estimates can not increase electrical grounding area (electrical ground area) on the conductive pattern in PCB.
In addition, the radiator of correlation technique can't cool off with a plurality of other the electric contact terminals that are installed on the heater element and compare the more responsive specific electric contact terminal of heat.In addition, the radiator cost of correlation technique is high.
Simultaneously; Under the situation of the semiconductor device that heater element constitutes for the epoxy-plastic packaging material (EMC) of the lead frame of the circuit that is connected to PCB by bare chip, with bare chip and protection bare chip and lead frame, the low EMC of thermal conductivity is through being installed in radiator on the bare chip with the heat radiation of bare chip and to be dispersed into outside efficient low.
Through the structure and the adhesive bonding method of the volume that increases radiator, the material that uses high thermal conductivity and improvement radiator or radiating tube, can remove the heat of heat dissipation element effectively.Yet correlation technique is not enough to remove effectively the heat that is configured in the heater element in the small-sized relatively terminal installation.
Summary of the invention
One object of the present invention is to provide a kind of radiator, and this radiator can removed the heat that produces from the heater element that is installed on the printed circuit board (PCB) (PCB) effectively with heater element position adjacent place.
Another object of the present invention is to provide a kind of radiator, this radiator can be by on the conductive pattern of the PCB of installation heater element mounted thereto easily.
Another object of the present invention is to provide a kind of radiator, this radiator can carry out surface mount and carry out reflow soldering through soldering paste through getting to put, and, can the SMT of economic and reliable be applied to said radiator that is.
Another object of the present invention is to provide a kind of radiator, this radiator can conveniently be reprocessed.
Another object of the present invention is to provide a kind of radiator, this radiator has good thermal conductivity, heat is distributed and radiation efficiency and bonding strength.
Another object of the present invention is to provide a kind of radiator, this radiator can increase the electrical grounding area.
Another object of the present invention is to provide a kind of radiator, this radiator is small and light and cheap.
Another object of the present invention is to provide a kind of radiator, this radiator can make the heater element cooling under the situation of the height that does not increase heater element.
Another object of the present invention is to provide a kind of radiator, this radiator can also be installed in a plurality of other metal terminals on the heater element and compare the more responsive metal terminal of heat and cool off certain number of degrees.
According to an aspect of the present invention; A kind of radiator is provided, and this radiator comprises three-dimensional (3D) main body, and said main body comprises the back side and the front of level; At least a portion at the said back side comprises metal level; At least a portion in said front is a level, and wherein, radiator is configured to picked up through vacuum being applied to positive said at least a portion; And on the soldering paste on the conductive pattern that the printed circuit board (PCB) (PCB) that heater element is installed on it is set, carrying out surface mount, the metal level at the back side is configured to be reflow soldered to the soldering paste that is formed on the conductive pattern.
Said main body can comprise any in metal, thermal conductive ceramic and the carbonaceous material.
Said metal can comprise any in Mg, Al and Cu or its alloy, and said thermal conductive ceramic can comprise Al
2O
3Any with among the AlN, said carbonaceous material can comprise graphite.
The outermost layer of said metal level can comprise the material that is suitable for reflow soldering.
Said main body can comprise at least one rough surface or at least one rib on the side that is formed on said main body.
Said main body can comprise at least one groove or through hole.Auxiliary cooling unit can be installed to said groove or through hole removably, and said auxiliary cooling unit comprises by metal shaft or pipe and is installed to said axle or cooling fin that a plurality of foils of pipe constitute.
Said main body can comprise the seal cavity that is filled with heat transfer medium, and capillary wick can form along the madial wall of said seal cavity along madial wall installation or a plurality of grooves of said seal cavity.
Conductive pattern can be adjacent to be arranged to one or more with the heater element that is installed on the PCB.Conductive pattern can comprise and be installed in any in dummy pattern, grounding pattern and the circuit pattern of the adjacent setting of heater element on the PCB.
On at least one that can be in the front and back of PCB one or more conductive patterns are set.
Conductive pattern can comprise and the grounding pattern that is installed in the adjacent setting of heater element on the PCB that radiator can make the electrical grounding area increase greatly.
The conductive pattern that is provided with on the side of the PCB that heater element is installed above that is connected with conductive pattern on the opposite side that is arranged on PCB through via.
PCB can comprise from polymeric substrates, film substrate, ceramic bases and metallic substrates, select any.
Said radiator also can comprise the another kind of Heat Conduction Material on the part except that the back side that is arranged on main body.The part except that the back side of main body can contact with heater element.
The part except that the back side of main body can contact with the metal can around heater element.
The height of the comparable heater element of height of radiator is low.
Description of drawings
Through the detailed description of the preferred embodiments of the present invention being carried out with reference to accompanying drawing, above-mentioned purpose of the present invention will become apparent with other advantages, wherein:
Figure 1A, Figure 1B and Fig. 1 C are the perspective views that dissimilar according to an embodiment of the invention radiators is shown respectively;
State when Fig. 2 shows the radiator practical application of Figure 1A;
Another state when Fig. 3 shows the radiator practical application of Figure 1A;
Another state when Fig. 4 shows the radiator practical application of Figure 1A;
Fig. 5 A and Fig. 5 B are respectively perspective view and the sectional views that radiator according to another embodiment of the present invention is shown;
Fig. 6 is the view that radiator according to another embodiment of the present invention is shown;
Fig. 7 is the view that radiator according to another embodiment of the present invention is shown;
Fig. 8 is the view that radiator according to another embodiment of the present invention is shown.
Embodiment
To be described in detail the preferred embodiments of the present invention with reference to accompanying drawing now.
Figure 1A, Figure 1B and Fig. 1 C are the perspective views that different radiating device 1,10 according to an embodiment of the invention and 20 are shown respectively.
Shown in Figure 1A, radiator 1 has three-dimensional (3D) rectangular shape.Radiator 1 comprises: the back side 5 of level and positive 3; Main body 2 is processed by thermal conductive ceramic or carbonaceous material.Metal level 4 is around the both sides of main body 2, so that can reflow soldering be applied to soldering paste.Yet radiator 1 is not limited to said structure, and metal level 4 can only be formed on the back side of main body 2.Radiator 1 can be reflow soldered to soldering paste through the metal level 4 that is formed at least on the back side.
Be convenient to manufacturing and be suitable for to get put and winding (tape-and-reel) encapsulation according to the radiator 1 of present embodiment.
As an example, the thermal conductive ceramic material can be the Al with high thermal conductivity
2O
3Any with among the AlN, but be not limited thereto.Further as an example, can use and have the more AlN of high thermal conductivity.
As an example, carbonaceous material can be to have any in graphite and the carbon of high thermal conductivity.Further as an example, the graphite that can use along continuous straight runs to dispel the heat more effectively, but be not limited thereto.
The radiator 10 and 20 of Figure 1B and Fig. 1 C includes the metal master of the one with 3D shape.The front 12 of radiator 10 is horizontal surface with the front 22 of the back side 14 and radiator 20 with the back side 24.Alternatively, at least a portion in the front of said radiator is a level.
Shown in Figure 1B, radiator 10 can comprise a plurality of rough surperficial 16 on the side that is formed on radiator 10, thereby has the star cross section.Yet radiator 10 can be other different shapes.For example, a plurality of ribs can be outstanding along the side of radiator 10, makes surface area increase and carry out thermal radiation effectively and distribute.
With reference to Fig. 1 C, radiator 20 has following main body 20a, and the surface area of main body 20b is little on the surface area ratio of following main body 20a.In this case; As will make an explanation below; Although radiator 20 take conductive pattern on the printed circuit board (PCB) (PCB) that other various parts are mounted thereon compactly than small size because positive 22 increase with the surface area of side, therefore can improve thermal radiation and distribute efficient.According to same principle, can increase the height of the following main body 20a of radiator 20, make thermal radiation and distribute efficient and improve, make down main body 20a simultaneously and the contact area that is installed in compactly between the miscellaneous part on the PCB minimizes.Yet, in this case, can reduce weld strength and from the heat transmission of conductive pattern.
According to exemplary embodiment, the metal that constitutes radiator 10 and 20 can comprise from the group that comprises Mg, Cu and Al or its alloy, select any.Especially, consider high thermal conductivity and reflow soldering efficient, Cu is selected in suggestion.Although Mg and Al are in light weight, they need the complex surfaces processing and are inconvenient to carry out reflow soldering.
According to exemplary embodiment, radiator 1,10 and 20 has the length of the width of about 0.5mm-10mm, about 1mm-10mm and the height of about 1mm-3mm.Further as an example, radiator 1,10 and 20 can have the length of the width of about 0.5mm-2mm, about 1mm-3mm and the height of about 0.3mm-1mm.In addition, as an example, radiator 1,10 and 20 height are less than the height (Fig. 2) of heater element 30.
Below, will carry out brief description to the manufacturing approach of radiator according to an embodiment of the invention.For the ease of explanation, will be as an example with the radiator 10 of Figure 1B.
Mould (mould die) through having the star cross section has the external diameter of about 1mm and the Cu axle of star cross section with the continuously extruded one-tenth of Cu.Here, the big as far as possible area with the outer circumferential side of Cu axle is exposed to the outside.
Then, utilize cutter that the cutting of the Cu axle after continuously extruded written treaty 2mm is long, make that cut surface is a level.
The Ni undercoating is coated on the Cu axle after the cutting.Sn is carried out on the outermost surface of Cu axle electroplate, thickness is about 0.003mm.Therefore, can carry out reflow soldering anticorrosion simultaneously easily.
The radiator of processing thus 10 has height and front 12 and the back side 14 formation horizontal surfaces of the external diameter of about 1mm, about 2mm.The outer circumferential side of radiator 10 has rough surperficial 16, so that its cross section forms star.Because the back side 14 is level, therefore can reflow soldering be conveniently used in the back side 14.In addition and since to than large-area applications reflow soldering, so weld strength and thermal conductivity increase.Surface mount can be carried out to it through getting to put in the front 12 of same level, for example, applies vacuum through the front 12 to level and picks up radiator.In addition, be formed on rough surperficial 16 on the outer circumferential side and make with the contact area of air and increase, thereby improved thermal radiation and distributed efficient.
In addition, electroplate Sn and not only help soldering paste is carried out reflow soldering, and prevent the oxidation that radiator 10 is caused by environmental change.
Because the weight of radiator 10 self, radiator 10 is difficult for being moved by air supplied during reflow soldering.Therefore, be convenient to carry out reflow soldering.
Because the back side 14 has width smaller, so the area that surface mount takies on PCB is less.On the other hand because outer circumferential side has bigger area with positive 12, so thermal radiation with distribute the efficient raising.
Then, the radiator 10 that is coated with Sn or Ag carries out winding to use SMT through getting to put.
Through be applied to PCB on heater element adjacent conductive pattern on soldering paste on get to put winding radiator 10 carried out surface mount, use Reflow Soldering to meet sb. at the airport then it be reflow soldered to the soldering paste that is formed on the conductive pattern.
Through above step be reflow soldered to PCB on the radiator 10 of heater element adjacent conductive pattern absorb the heat that produces from heater element and with this heat radiation to air or make this heat cooling.
According to embodiments of the invention, small heat-dissipating device 10 is soldered to and heater element adjacent conductive pattern, with radiation with distribute the heat of heater element.Especially, if necessary, one or more radiators 10 can be set on one or more conductive patterns, so that the thermal radiation of heater element and distribute maximizing efficiency.
Can be set at least one of the surperficial front and back of PCB with the conductive pattern of the adjacent setting of heater element.
Although the Cu axle after will pushing in the present embodiment is used for radiator 10, the invention is not restricted to this.For example, can be through metal being carried out die casting or powder compaction is made radiator 10 and 20, this helps to produce in batches.
In addition, shown in Figure 1A, can make radiator 1 through technology and material that use is used for the ceramic chip part of general surface mounting device (SMD), wherein, SMT is applicable to said surface mount device.
For example, the ceramic main body 2 that comprises the radiator 1 of the ceramic bases with high thermal conductivity can not be soldered to soldering paste.For this reason, metal level 4 is provided to the back side of ceramic main body 2, conveniently to be welded to soldering paste and to weld.Can make metal level 4 through technology and material that use is generally used for the outer electrode of SMD ceramic chip part.
As an example, metal level 4 can be formed on the whole back side of ceramic main body 2, with the thermo-contact of increase with conductive pattern.Further as an example, can on the main body that comprises the back side 2, form Cu or Ag cream through heat treatment and then its plating Sn made metal level 4.
As an example, ceramic main body 2 can be by Al
2O
3With any the processing among the AlN.Further as an example, ceramic main body 2 can have sandwich construction, makes the interior metal electrode be formed within the ceramic main body 2.In this case, can further improve thermal conductivity and radiating efficiency.
Replace the thermal conductive ceramic substrate, have the main body 2 that high thermal conductivity and flexible graphite or carbon can be used for radiator 1.In this case, compare with the situation of using pottery, weight reduction and thermal conductivity and radiating efficiency improve.Yet, on the other hand, the metal level 4 that manufacturing cost increases and is difficult to be formed for overleaf carrying out reflow soldering.
State when Fig. 2 illustrates radiator 10 practical applications according to an embodiment of the invention.
Use scolder 50 will have on the heater element 30 (for example, semiconductor chip) of die-attach area 32 and the conductive pattern 40 and 40a that radiator 10 is installed in PCB 60 through reflow soldering.According to exemplary embodiment, scolder 50 can be a soldering paste.
Here, PCB 60 can be any in polymeric substrates, film substrate, ceramic bases and the metallic substrates.
In this case, the heat that produces from heater element 30 is delivered to through (that is, according to the order from the high thermal conductivity to the low heat conductivity) successively that lead frame 32, scolder 50, conductive pattern 40 and 40a, radiator 10 enter into air then and by radiation with distribute.Here, conductive pattern 40 and 40a can be at least a of the dummy pattern (dummy pattern), grounding pattern and the circuit pattern that are used for supplying electric power or signal.
For example, conductive pattern 40 can be at least a in grounding pattern and the circuit pattern.Conductive pattern 40a can be a dummy pattern.
Yet, consider the use of PCB 60, the installation site of radiator 10 is the most suitable when conductive pattern 40 is grounding pattern.
At this moment, although the heat that produces from heater element 30 is passed to the adiabatic substrate of the PCB 60 with low heat conductivity, heat also is passed to the radiator 10 with high thermal conductivity and in air, cools off then.Therefore, according to above-described heat transfer path, the heat that produces from heater element 30 can be delivered to the radiator 10 with the large-area outer circumferential side that contacts with air apace.Therefore, radiation efficiency and cooling effectiveness improve.
Heat that produces from heater element 30 even epoxy-plastic packaging material (EMC) radiation through having low heat conductivity are also distributed.
Therefore, although not shown, the metal heat sink of correlation technique can be attached to heater element 30 through traditional method, to improve thermal radiation and to distribute efficient.And in this case, the cooling effectiveness of heater element 30 is improved through radiator 10.
As an example, the back side of radiator 10 forms littler than the front of radiator 10 or outer circumferential side, thereby on PCB 60, takies minimum erection space, improves thermal radiation simultaneously and distributes efficient.
In addition, be installed at radiator 10 under the situation on the lead frame 32 that is arranged on the conductive pattern 40, can be more apace with the heat transferred of heater element 30 to radiator 10.Because conductive pattern 40 is used as grounding pattern in this case, so total electrical grounding area increases on the PCB 60.So, improved the RF characteristic of radio frequency (RF) assembly that is installed on the PCB 60.
In addition, be under the situation of circuit pattern at conductive pattern 40, because the outer circumferential side of radiator 10 and face exposure be in air and electric insulation, so circuit does not receive the influence of radiator 10.
In addition, although not shown, if use the reflow soldering of scolder 50 to be applicable to the surface of heater element 30, then can carry out surface mount to radiator 10 also can be with its direct reflow soldering on heater element 30.In this case, heat transfer and radiating efficiency improve.Yet, the complicated and whole thickness increase of installation process.In addition, be under the situation of light-emitting diode (LED) at heater element 30, can produce shade.
As another example, can be directly with radiator 10 surface mount on the lead frame 32 of heater element 30.Although conduct heat with radiating efficiency further improves, owing to the shape of lead frame 32 makes surface mount become difficult.
Therefore, can among the metal terminal of lead frame, select to need most the metal terminal of cooling, can radiator 10 concentrated areas be installed in around the selected metal terminal with a plurality of electric terminals.According to this method, refrigerating function focuses only on necessary position, has therefore reduced manufacturing cost and material cost.
More particularly, in the structure of correlation technique, the whole cooling heating element that is used for of the PCB of high thermal conductivity (for example, metallic substrates), thus cost is increased.On the other hand, according to embodiments of the invention, radiator 10 by optionally and the concentrated area be installed in the needs cooling part of PCB.Therefore, can under the lower situation of manufacturing cost, improve cooling effectiveness.
In addition,, be installed to through solder ball at heater element 30 rather than lead frame 32 under the situation of conductive pattern 40 of PCB 60 although not shown, can through scolder 50 with radiator 10 reflow solderings with heater element 30 adjacent conductive patterns 40 on.
In the exemplary embodiment, one or more conductive patterns 40 are formed adjacent with heater element 30, and one or more radiators 10 are installed on each conductive pattern 40.Here, can control refrigerating function through the quantity of adjustment conductive pattern 40 and radiator 10 to heater element 30.
As stated, in the time of around a plurality of radiators 10 concentrated areas that cheap and position are lower than heater element 30 through reflow soldering are installed in heater element 30, can improve total cooling effectiveness of heater element 30.In addition, manufacturing cost, bonding strength and reprocess efficient and improve.
Another state when Fig. 3 illustrates radiator practical application according to an embodiment of the invention.
With reference to Fig. 3, heater element 30 is welded on the front of PCB 60 rather than is installed on the back side of PCB 60.Yet, be set at as the dummy pattern 42 of conductive pattern on the position corresponding at the back side of PCB 60 with heater element 30.Secondly, scolder 52 is set on the dummy pattern 42, so that through reflow soldering radiator 110 is installed.
Be not limited to said structure,, replace the grounding pattern of dummy pattern 42 to can be used as conductive pattern and be formed on the back side, so that radiator 110 is carried out reflow soldering through the scolder that is arranged on the grounding pattern although not shown.
In this case, the heat that produces from heater element 30 is transmitted and is radiated lead frame 32, scolder 50, conductive pattern 40, radiator 10 successively according to the order from the high thermal conductivity to the low heat conductivity and enters into air then, thereby be cooled.Produce and the heat that is passed to the PCB 60 with low heat conductivity is transmitted successively and is radiated dummy pattern 42, scolder 52, radiator 110 and air from heater element 30, be cooled then.Therefore, through the radiator on the back side that is welded on PCB 60 110, the cooling rate of heater element 30 and performance improve.
In addition, owing to radiator 110 is installed on the back side, so the erection space that radiator 110 can make heater element 30 be installed on the PCB 60 minimizes.
At heater element 30 is under the situation of LED, and the illuminance of LED can not reduce.
As stated, small heat-dissipating device 10 and 110 is convenient to and heater element 30 installed adjacent, and makes the thermal radiation of heater element 30 and distribute the efficient raising.
According to exemplary embodiment, a plurality of radiators 10 can be set on a plurality of conductive patterns with a plurality of radiators 110.
In the exemplary embodiment, can use soldering paste radiator 10 and 110 to be welded at least one in the front and back of PCB.
Another state when Fig. 4 illustrates radiator 10 practical applications.
Be different from Fig. 3, Fig. 4 illustrates the via 62 with high thermal conductivity and is passing PCB 60 formation with heater element 30 corresponding positions.The inside of via 62 is filled with the metal with high thermal conductivity.Alternatively, metal level can be formed on the inwall of via 62, with heater element 30 and dummy pattern 42 thermo-contacts.
According to said structure, be delivered to dummy pattern 42 from the heat of heater element 30 radiation through via 62, and be radiated in the air more apace through scolder 52 and radiator 110.
Can make via 62 through common application technology in the PCB field.As an example, one or more vias 62 can be set, with quick transmission heat.
As an example, surface mount is carried out and reflow soldering is carried out through soldering paste in the back side through getting to put in radiator 10 and 110 front.
Fig. 5 A and Fig. 5 B illustrate radiator 120 according to another embodiment of the present invention.
With reference to Fig. 5 A and Fig. 5 B, the front 122 of radiator 120 forms with the back side 124 levels, and a plurality of ribs 126 are arranged on the outer circumferential side of radiator 120, thereby increases the thermal radiation area.In addition, through hole 128 along continuous straight runs pass radiator 120 formation.
Through hole 128 is only as the example in various types of holes.That is, the non-penetrative groove can replace through hole 128 to form.Through hole 128 can be set to a plurality of.In addition, through hole 128 not only can flatly penetrate radiator 120 but also can penetrate radiator 120 vertically.
According to said structure, the surface area increase that the existence of rib 126 can make thermal radiation and distribute.Through hole 128 also makes the surface area of radiator 120 increase.When air is flowed through through hole 128, the thermal radiation of radiator 120 and distribute efficient and improve.
As an example, surface mount is carried out and reflow soldering is carried out through soldering paste in the back side 124 through getting to put in the front 122 of radiator 120.
Fig. 6 illustrates radiator 130 according to another embodiment of the present invention.
According to this structure, comprise that the cooling fin 135 of a plurality of foils 136 can make the cooling effectiveness of radiator 130 improve.Therefore, the heat that produces from heater element is delivered to the high radiator of thermal conductivity of conductive pattern, scolder and thermal conductivity ratio EMC successively.Therefore, the cooling effectiveness of heater element improves.
Here, in case of necessity cooling fin 135 can, be installed by radiator 130 before or after being installed to PCB.Cooling fin 135 not only can be installed on the outer circumferential side of radiator 130, and can be installed on the front of radiator 130.Be installed at cooling fin 135 under the situation on the front of radiator 130, cooling fin 135 can be set on a plurality of positions.
Although radiator 130 is threaded with cooling fin 135 in said structure, can realize this connection through welding or bonding.
As an example, surface mount is carried out and reflow soldering is carried out through soldering paste in the back side through getting to put in the front of radiator 130.
Fig. 7 is the view that radiator 140 according to another embodiment of the present invention is shown.
As shown in Figure 7, radiator 140 has the sweep that directly contacts with heater element 30.
According to this structure, can come to realize more effectively the cooling of heater element 30 through the direct contact between radiator 140 and the heater element 30.
Yet in this case, total height increases.
Although not shown in Fig. 7, the heat conduction elastic component can place the contact site between heater element 30 and the radiator 140, between heater element 30 and radiator 140, to produce Elastic Contact.Said heat conduction elastic component can be set on the back side of radiator 140 or on the front of heater element 30.In view of the above, because the heat conduction elastic component guaranteed the contact between heater element 30 and the radiator 140, therefore can carry out from heater element 30 to radiator 140 heat transmission more effectively.
As an example, surface mount is carried out and reflow soldering is carried out through soldering paste in the back side through getting to put in the front of radiator 140.
Fig. 8 illustrates radiator 150 according to another embodiment of the present invention.
With reference to Fig. 8, seal cavity 151 is formed in the radiator 150, and a plurality of ribs 156 are arranged on the outer circumferential side of radiator 150.Capillary wick (wick) 154 (being woven or knitting copper cash) or a plurality of grooves form along the madial wall of radiator 150.Seal cavity 151 is filled with heat transfer medium 152, for example, and distilled water.
In other words, radiator 150 has the structure of common radiating tube.
According to such structure, heat transfer medium 152 is condensed through the capillary pressure (capillary pressure) of the core on the madial wall that is formed on seal cavity 151 154 or said a plurality of grooves, therefore moves to heating part from cooling segment.In addition, obtain heat transfer medium 152 expansions of heat and turn back to cooling segment from heating part through capillary wick 154.Here, through making the maximized capillary wick 154 of surface area or said a plurality of groove that heat transfer efficiency is improved.Seal cavity 151 can be under the vacuum condition.
As an example, surface mount is carried out and reflow soldering is carried out through soldering paste in the back side through getting to put in the front of radiator 150.
Although with reference to exemplary embodiment the present invention is explained, those skilled in the art can suitably carry out various modifications.
For example, comprise that at heater element under the situation of lead frame, radiator can contact with lead frame.Yet, if being used to carry out the metal can of electromagnetic wave insulation, heater element centers on, radiator can contact with metal can.
In addition, scope of the present invention is equally applicable to a kind of like this PCB, and said PCB comprises the radiator that is mounted thereon, with the heater element of cooling with the adjacent setting of said radiator.
As stated, radiating appliance has following various advantage according to an embodiment of the invention:
1) because the front of radiator has at least one horizontal component, therefore can be convenient to radiator carried out surface mount through getting to put.In addition, the back side of radiator is level, and is therefore big with the contact area of conductive pattern.Therefore, the back side heat that can transmit heater element is effectively realized high weld strength simultaneously.
2) because at least a portion at the back side of radiator by being applicable to that the metal that uses soldering paste to carry out reflow soldering processes, therefore can use soldering paste that radiator is carried out reflow soldering.
3) can with a plurality of radiators be arranged in PCB on the conductive pattern of the adjacent setting of heater element on.Therefore, radiation and distribute the heat of heater element effectively.
4) when radiator is welded to the grounding pattern of PCB, radiator increases the electrical grounding area, thereby has improved radio frequency (RF) characteristic.
5) can add various functions through another kind of Heat Conduction Material is set on the upper surface of radiator.
6) form of radiator, material and structure can be changed easily and economically, thereby obtain other thermal radiations of various level and distribute efficient.
7) can come further to improve thermal radiation and distribute efficient through the via that is formed on the PCB.
8) the radiator thermal conductivity is high and in light weight, and is convenient to install with low material cost.
9) radiator can make the heater element cooling under the situation of the height that does not increase heater element.
10) radiator can also make with a plurality of other metal terminals that are positioned on the heater element and compare the more responsive metal terminal cooling of heat.
Although described the present invention in detail, it should be understood that under the situation that does not break away from the scope of the present invention that is defined by the claims and spirit, can carry out various changes, replacement and change to the present invention.
Claims (25)
1. radiator, said radiator comprises three-dimensional heat conduction main body,
Wherein, said radiator be configured to picked up and with the conductive pattern that is installed in the adjacent setting of heater element on the printed circuit board (PCB) on carry out surface mount,
The back side of main body is configured to be reflow soldered to said conductive pattern.
2. radiator as claimed in claim 1, said main body comprises the front, at least a portion in said front is a level,
Wherein, said radiator is picked up through vacuum being applied to positive said at least a portion.
3. according to claim 1 or claim 2 radiator, wherein, said main body comprises any in metal, thermal conductive ceramic material and the carbonaceous material.
4. according to claim 1 or claim 2 radiator, wherein, the back side of main body is level.
5. according to claim 1 or claim 2 radiator, wherein, said main body comprises at least one rough surface or at least one rib on the side that is formed on said main body.
6. according to claim 1 or claim 2 radiator, wherein, said main body comprises at least one groove or through hole.
7. radiator as claimed in claim 6, wherein, auxiliary cooling unit is installed to said groove or through hole removably, and said auxiliary cooling unit comprises by metal shaft or pipe and is installed to the cooling fin that a plurality of foils of said axle or pipe constitute.
8. according to claim 1 or claim 2 radiator, wherein, said main body comprises the seal cavity that is filled with heat transfer medium, capillary wick is installed or a plurality of grooves form along the madial wall of said seal cavity along the madial wall of said seal cavity.
9. according to claim 1 or claim 2 radiator wherein, is provided with one or more radiators on conductive pattern.
10. according to claim 1 or claim 2 radiator, wherein, conductive pattern comprises any in circuit pattern, grounding pattern and the dummy pattern.
11. radiator according to claim 1 or claim 2 wherein, is provided with one or more conductive patterns at least one in the front and back of printed circuit board (PCB).
12. radiator according to claim 1 or claim 2, wherein, conductive pattern comprises and the grounding pattern that is installed in the adjacent setting of heater element on the printed circuit board (PCB) that radiator increases the electrical grounding area.
13. radiator according to claim 1 or claim 2, wherein, the conductive pattern that is arranged on the side of the printed circuit board (PCB) that heater element is installed is connected through the conductive pattern on via with high thermal conductivity and the opposite side that is arranged on printed circuit board (PCB).
14. radiator as claimed in claim 13, wherein, the inside of said via is filled with Heat Conduction Material or on the inwall of said via, forms metal level.
15. radiator as claimed in claim 13, wherein, radiator is installed on the conductive pattern on the said opposite side that is arranged on printed circuit board (PCB).
16. radiator according to claim 1 or claim 2, wherein, printed circuit board (PCB) comprises any in polymeric substrates, film substrate, ceramic bases and the metallic substrates.
17. radiator according to claim 1 or claim 2, said radiator also comprise the another kind of Heat Conduction Material on the part that is arranged on main body.
18. radiator according to claim 1 or claim 2, wherein, the part of main body contacts with heater element.
19. radiator according to claim 1 or claim 2, wherein, the part of main body contacts with the metal can that centers on heater element.
20. radiator according to claim 1 or claim 2, wherein, the height of the aspect ratio heater element of radiator is low.
21. radiator according to claim 1 or claim 2, wherein, radiator is provided with the winding encapsulation.
22. a radiator, said radiator comprise three-dimensional heat conduction main body, said main body comprises the front, and at least a portion in said front is a level,
Wherein, said radiator is configured to picked up through vacuum being applied to positive said at least a portion, and on the metal terminal of the outside that is exposed to heater element, carries out surface mount,
The back side of main body is configured to be reflow soldered to said metal terminal.
23. a radiator, said radiator comprises three-dimensional body, and said main body comprises the back side of level, and at least a portion at the said back side comprises metal level,
Wherein, said radiator is configured to picked up and on soldering paste, carries out surface mount, and said soldering paste is arranged on the conductive pattern of the printed circuit board (PCB) that heater element is installed,
The metal level at the back side is configured to be reflow soldered to the soldering paste that is formed on the conductive pattern.
24. radiator as claimed in claim 23, said main body also comprises the front, and at least a portion in said front is a level,
Wherein, said radiator is picked up through vacuum being applied to positive said at least a portion.
25. a printed circuit board (PCB), wherein, claim 1 or 2 radiator are reflow soldered to metal terminal or conductive pattern with the adjacent setting of heater element through soldering paste, so that the heater element cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105101689A CN102446873A (en) | 2010-10-07 | 2010-10-07 | Heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105101689A CN102446873A (en) | 2010-10-07 | 2010-10-07 | Heat radiator |
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| CN102446873A true CN102446873A (en) | 2012-05-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105101689A Pending CN102446873A (en) | 2010-10-07 | 2010-10-07 | Heat radiator |
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| CN103796474A (en) * | 2012-10-29 | 2014-05-14 | 鸿富锦精密工业（深圳）有限公司 | Circuit board heat dissipation structure |
| WO2014204982A2 (en) * | 2013-06-19 | 2014-12-24 | SMART Storage Systems, Inc. | Electronic system with heat extraction and method of manufacture thereof |
| US9158349B2 (en) | 2013-10-04 | 2015-10-13 | Sandisk Enterprise Ip Llc | System and method for heat dissipation |
| US9348377B2 (en) | 2014-03-14 | 2016-05-24 | Sandisk Enterprise Ip Llc | Thermal isolation techniques |
| CN105789093A (en) * | 2016-03-28 | 2016-07-20 | 珠海迈科智能科技股份有限公司 | Automatic surface mounting device of radiator |
| US9470720B2 (en) | 2013-03-08 | 2016-10-18 | Sandisk Technologies Llc | Test system with localized heating and method of manufacture thereof |
| US9485851B2 (en) | 2014-03-14 | 2016-11-01 | Sandisk Technologies Llc | Thermal tube assembly structures |
| US9497889B2 (en) | 2014-02-27 | 2016-11-15 | Sandisk Technologies Llc | Heat dissipation for substrate assemblies |
| US9519319B2 (en) | 2014-03-14 | 2016-12-13 | Sandisk Technologies Llc | Self-supporting thermal tube structure for electronic assemblies |
| US9549457B2 (en) | 2014-02-12 | 2017-01-17 | Sandisk Technologies Llc | System and method for redirecting airflow across an electronic assembly |
| US9898056B2 (en) | 2013-06-19 | 2018-02-20 | Sandisk Technologies Llc | Electronic assembly with thermal channel and method of manufacture thereof |
| CN107949158A (en) * | 2017-12-22 | 2018-04-20 | 英迪迈智能驱动技术无锡股份有限公司 | A kind of cooling mechanism for wiring board |
| US10013033B2 (en) | 2013-06-19 | 2018-07-03 | Sandisk Technologies Llc | Electronic assembly with thermal channel and method of manufacture thereof |
| CN116744546A (en) * | 2023-08-09 | 2023-09-12 | 深圳市凌鑫电子有限公司 | Superconductive heat dissipation battery protection board |
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| US9549457B2 (en) | 2014-02-12 | 2017-01-17 | Sandisk Technologies Llc | System and method for redirecting airflow across an electronic assembly |
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| US9497889B2 (en) | 2014-02-27 | 2016-11-15 | Sandisk Technologies Llc | Heat dissipation for substrate assemblies |
| US9519319B2 (en) | 2014-03-14 | 2016-12-13 | Sandisk Technologies Llc | Self-supporting thermal tube structure for electronic assemblies |
| US9485851B2 (en) | 2014-03-14 | 2016-11-01 | Sandisk Technologies Llc | Thermal tube assembly structures |
| US9348377B2 (en) | 2014-03-14 | 2016-05-24 | Sandisk Enterprise Ip Llc | Thermal isolation techniques |
| CN105789093A (en) * | 2016-03-28 | 2016-07-20 | 珠海迈科智能科技股份有限公司 | Automatic surface mounting device of radiator |
| CN107949158A (en) * | 2017-12-22 | 2018-04-20 | 英迪迈智能驱动技术无锡股份有限公司 | A kind of cooling mechanism for wiring board |
| CN116744546A (en) * | 2023-08-09 | 2023-09-12 | 深圳市凌鑫电子有限公司 | Superconductive heat dissipation battery protection board |
| CN116744546B (en) * | 2023-08-09 | 2023-10-24 | 深圳市凌鑫电子有限公司 | Superconductive heat dissipation battery protection board |
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Application publication date: 20120509 |