CN101399237A - Rapid heat radiation ceramic case formed by full compression joint - Google Patents
Rapid heat radiation ceramic case formed by full compression joint Download PDFInfo
- Publication number
- CN101399237A CN101399237A CN 200810194490 CN200810194490A CN101399237A CN 101399237 A CN101399237 A CN 101399237A CN 200810194490 CN200810194490 CN 200810194490 CN 200810194490 A CN200810194490 A CN 200810194490A CN 101399237 A CN101399237 A CN 101399237A
- Authority
- CN
- China
- Prior art keywords
- electrode
- flange
- cathode
- anode
- anode electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention relates to a total compression-joint and quick heat-dissipation ceramic package which is suitable for an encapsulation package of a semiconductor device operated in a gap type. The ceramic package comprises a pedestal and a tube cap, wherein, the pedestal comprises a large positive flange (1), a porcelain ring (2), a small positive flange (3), an anode electrode (4), a chip holding ring (6) and a down-lead tube(7); the tube cap comprises a cathode electrode (8) and a cathode flange (10). The ceramic package is characterized in that: the lower head face of the anode electrode (4) is provided evenly with a plurality of anode cooling grooves (5); the upper head face of the cathode electrode (8) is provided evenly with a plurality of cathode cooling grooves (9). Needless to connect an external heat emitter, the electrode cooling grooves of the invention can dissipate heat quickly by self via the close contact of the total compression joint. Therefore the invention is particularly suitable for the encapsulation of the devices operated in the gap type.
Description
Technical field
The present invention relates to a kind of ceramic cartridge, especially relate to a kind of pressure contact rapid radiating ceramic package.Be particularly suitable for the package casing of the semiconductor device of clearance-type work.Belong to electric and electronic technical field.
Background technology
It is the support technology platform with power semiconductor, electronic circuit technology, computer technology, modern control technology that power electronic technology is one.It is the fusion of power electronic technology (forceful electric power and weakness technology).The research of power electronic technology is at present just changed to industrialization from the basis innovation, has released many scientific achievements.Power electronic device is as the core devices of power electronic equipment, and application is very extensive, has particularly given play to increasing effect in the process of building a resource-conserving society.The conventional electric power electronic device is made up of chip, shell, radiator.For under the particular job condition, power electronic device often is in moment work and clearance-type operating state, and it needs device to have short-term operation, the function of quick heat radiating.External radiator not only can not satisfy the requirement of device quick heat radiating, and the waste data, significantly increases device volume.
Summary of the invention
The objective of the invention is to characteristics, provide a kind of device that can make to need not to install radiator in addition additional and the pressure contact rapid radiating ceramic package of on-line operation at the clearance-type device work.
The object of the present invention is achieved like this: a kind of pressure contact rapid radiating ceramic package comprises base and Guan Gai.
Described base comprises big positive flange, porcelain ring, little positive flange, anode electrode, chip locating ring and fairlead, described little positive flange is welded in the middle of the outer rim of anode electrode with one heart, the chip locating ring is welded on the outer rim top of anode electrode with one heart, big positive flange, porcelain ring and the superimposed from top to bottom concentric welding of little positive flange, fairlead is connected on the shell wall of porcelain ring
Described pipe lid comprises cathode electrode and cathode flange, and described cathode flange is welded on the outer rim of cathode electrode with one heart,
It is characterized in that:
The lower surface of described anode electrode is evenly equipped with some anode radiating grooves;
The upper surface of described cathode electrode is evenly equipped with some negative electrode radiating grooves.
The present invention has does not need external radiator, and by the tight contact that total head connects, electrode radiating groove auto-radiating is realized the characteristics of quick heat radiating.Therefore be particularly suitable for the encapsulation of clearance-type device work.
Description of drawings
Fig. 1 is a general structure schematic diagram of the present invention.
Fig. 2 is a base vertical view of the present invention.
Fig. 3 is the A-A cut-away view of Fig. 2.
Fig. 4 is a pipe lid vertical view of the present invention.
Fig. 5 is the B-B cut-away view of Fig. 4.
Among the figure: big positive flange 1, porcelain ring 2, little positive flange 3, anode electrode 4, anode radiating groove 5, chip locating ring 6, fairlead 7, cathode electrode 8, negative electrode radiating groove 9, cathode flange 10.
Embodiment
Referring to Fig. 1, the pressure contact rapid radiating ceramic package that the present invention relates to covers two parts by base and pipe and forms.
Referring to Fig. 2～3, described base mainly is made up of big positive flange 1, porcelain ring 2, little positive flange 3, anode electrode 4, chip locating ring 6 and fairlead 7.Little positive flange 3 is welded in the middle of the outer rim of anode electrode 4 with one heart, and chip locating ring 6 is welded on the outer rim top of anode electrode 4 with one heart, big positive flange 1, porcelain ring 2 and the superimposed from top to bottom concentric welding of little positive flange 3, and fairlead 7 is connected on the shell wall of porcelain ring 2.The lower surface of described anode electrode 4 is evenly equipped with some anode radiating grooves 5.
Referring to Fig. 4～5, described pipe lid mainly is made up of cathode electrode 8 and cathode flange 10.Cathode flange 10 is welded on the outer rim of cathode electrode 8 with one heart, and the upper surface of described cathode electrode 8 is evenly equipped with some negative electrode radiating grooves 9.
Described anode radiating groove 5 and negative electrode radiating groove 9, the degree of depth of groove and quantity can require according to the heat radiation of device to design.The degree of depth and the quantity that increase groove can increase radiating effect.
Described chip locating ring 6 is the concentricity between positioning chip, molybdenum sheet and the anode electrode 4 accurately, realizes the technological requirement that total head connects.
Described anode electrode 4 and cathode electrode 8 adopt two-sided lapping technology to make electrode surface have very high evenness and roughness, evenness≤0.005mm, roughness Ra≤0.8 μ.For connecing encapsulation, the total head of chip provides reliable assurance.
More than adopt silver-copper brazing alloy between each parts, disposable high-temperature soldering forms in vacuum furnace or hydrogen furnace.Have very high tension intensity and air-tightness.Tension intensity 〉=5KN/cm
2, air-tightness≤1 * 10
-9Pam
3/ S.
During use, pipe lid and bottom seat is superimposed with one heart up and down, and chip places in the middle of porcelain ring inner chamber, cathode electrode and the anode electrode, comes for chip provides protection by Vacuum Package between the pipe lid and bottom seat, realizes device function.
Claims (1)
1, a kind of pressure contact rapid radiating ceramic package comprises base and Guan Gai,
Described base comprises big positive flange (1), porcelain ring (2), little positive flange (3), anode electrode (4), chip locating ring (6) and fairlead (7), described little positive flange (3) is welded in the middle of the outer rim of anode electrode (4) with one heart, chip locating ring (6) is welded on the outer rim top of anode electrode (4) with one heart, big positive flange (1), porcelain ring (2) and the superimposed from top to bottom concentric welding of little positive flange (3), fairlead (7) is connected on the shell wall of porcelain ring (2)
Described pipe lid comprises cathode electrode (8) and cathode flange (10), and described cathode flange (10) is welded on the outer rim of cathode electrode (8) with one heart,
It is characterized in that:
The lower surface of described anode electrode (4) is evenly equipped with some anode radiating grooves (5);
The upper surface of described cathode electrode (8) is evenly equipped with some negative electrode radiating grooves (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810194490 CN101399237B (en) | 2008-10-24 | 2008-10-24 | Rapid heat radiation ceramic case formed by full compression joint |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810194490 CN101399237B (en) | 2008-10-24 | 2008-10-24 | Rapid heat radiation ceramic case formed by full compression joint |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101399237A true CN101399237A (en) | 2009-04-01 |
| CN101399237B CN101399237B (en) | 2010-06-02 |
Family
ID=40517669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810194490 Expired - Fee Related CN101399237B (en) | 2008-10-24 | 2008-10-24 | Rapid heat radiation ceramic case formed by full compression joint |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101399237B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102637611A (en) * | 2012-04-27 | 2012-08-15 | 昆山晨伊半导体有限公司 | Preparation method of AAP power module |
| CN103426829A (en) * | 2013-08-23 | 2013-12-04 | 江阴市赛英电子有限公司 | High-power ceramic-packaged IGBT (insulated gate bipolar transistor) efficient two-side-cooling integral tube shell |
| CN109346442A (en) * | 2018-10-10 | 2019-02-15 | 唐燕 | It is a kind of be easy to radiate chip-packaging structure and its packaging method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7298046B2 (en) * | 2003-01-10 | 2007-11-20 | Kyocera America, Inc. | Semiconductor package having non-ceramic based window frame |
| CN2708499Y (en) * | 2004-06-08 | 2005-07-06 | 江阴九华集团有限公司 | Ultra-high power high-vacuum ceramic cartridge |
| CN2824288Y (en) * | 2005-03-18 | 2006-10-04 | 江阴市赛英电子有限公司 | Precise casing for high power integrated gate electrode converting thyristor |
| CN201146179Y (en) * | 2008-06-13 | 2008-11-05 | 江阴市赛英电子有限公司 | Complete-crimp-connection rapid heat radiation type ceramic casing |
-
2008
- 2008-10-24 CN CN 200810194490 patent/CN101399237B/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102637611A (en) * | 2012-04-27 | 2012-08-15 | 昆山晨伊半导体有限公司 | Preparation method of AAP power module |
| CN103426829A (en) * | 2013-08-23 | 2013-12-04 | 江阴市赛英电子有限公司 | High-power ceramic-packaged IGBT (insulated gate bipolar transistor) efficient two-side-cooling integral tube shell |
| CN103426829B (en) * | 2013-08-23 | 2015-09-30 | 江阴市赛英电子有限公司 | The overall shell of the high-power ceramic encapsulation high efficient two-sided refrigeration of IGBT |
| CN109346442A (en) * | 2018-10-10 | 2019-02-15 | 唐燕 | It is a kind of be easy to radiate chip-packaging structure and its packaging method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101399237B (en) | 2010-06-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8671570B2 (en) | Vapor chamber and method for manufacturing the same | |
| WO2019105236A1 (en) | Electrostatic chuck and semiconductor device | |
| CN201146179Y (en) | Complete-crimp-connection rapid heat radiation type ceramic casing | |
| CN101399237B (en) | Rapid heat radiation ceramic case formed by full compression joint | |
| CN107275319B (en) | LED chip flat heat pipe integrated packaging structure and preparation method thereof | |
| JP2008297615A (en) | Substrate mounting mechanism and substrate treatment apparatus equipped with the substrate mounting mechanism | |
| CN100530610C (en) | Novel integrated water-cooling thyristor ceramic housing | |
| CN201142325Y (en) | Full-compression joint fast-cooling type ceramic casing base | |
| CN101728335A (en) | Base for pressure contact rapid radiating ceramic package | |
| TW201617578A (en) | Vapor chamber | |
| CN106783749A (en) | A kind of super large-scale ceramic package structure | |
| CN205303439U (en) | External electrode ceramic encapsulates shell | |
| CN201191604Y (en) | Ultra-thin large current ceramic housing | |
| CN115241144A (en) | Liquid cooling heat dissipation packaging device of microelectronic device and manufacturing method thereof | |
| CN209626638U (en) | A kind of 400W laser list pumping source ceramic package shell | |
| CN103021973A (en) | Airtightness packaging radiating structure of integrated circuit | |
| CN201146180Y (en) | Ceramic casing of integral water-cooling heat radiation thyristor | |
| WO2021238662A1 (en) | Thin vapor chamber element structure and manufacturing method therefor | |
| WO2024047858A1 (en) | Wafer placement table | |
| WO2024047857A1 (en) | Wafer placement table | |
| CN212011595U (en) | Be suitable for parallel seal welding's anaerobic copper shell structure | |
| WO2024004040A1 (en) | Wafer placement stage | |
| KR102311212B1 (en) | Led device capable of highly dissipating heat, method of manufacturing the led device, and illumination device having the led device | |
| JP2006100410A (en) | Package for storing electronic component, and electronic apparatus | |
| TWI827071B (en) | Ultra thin vapor chamber element structure and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: 214405 Jiangsu city in Jiangyin Province, South Gate Street: Road No. 60 Patentee after: Jiangyin Saiying Electron Co., Ltd. Address before: Garden Road Chengjiang Town Industrial Park in Jiangsu Province, Jiangyin City, No. 14, 214433 Patentee before: Jiangyin Saiying Electron Co., Ltd. |
|
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 214405 Jiangsu city in Jiangyin Province, South Gate Street: Road No. 60 Patentee after: JIANGYIN SAIYING ELECTRON CO., LTD. Address before: 214405 Jiangsu city in Jiangyin Province, South Gate Street: Road No. 60 Patentee before: Jiangyin Saiying Electron Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100602 Termination date: 20191024 |