CN201146179Y - Complete-crimp-connection rapid heat radiation type ceramic casing - Google Patents
Complete-crimp-connection rapid heat radiation type ceramic casing Download PDFInfo
- Publication number
- CN201146179Y CN201146179Y CN 200820036761 CN200820036761U CN201146179Y CN 201146179 Y CN201146179 Y CN 201146179Y CN 200820036761 CN200820036761 CN 200820036761 CN 200820036761 U CN200820036761 U CN 200820036761U CN 201146179 Y CN201146179 Y CN 201146179Y
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- CN
- China
- Prior art keywords
- cathode
- anode
- flange
- radiating
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Ceramic Products (AREA)
Abstract
The utility model relates to a full pressure welding quick radiating ceramic shell which is suitable for the packaging shells of clearance-typed operating semi-conductor devices. The full pressure welding quick radiating ceramic shell includes a base and a tube cap, wherein, the base comprises a big anode flange (1), a ceramic ring (2), a small anode flange (3), an anode (4), a chip locating ring (6) and a fairlead (7); the tube cap comprises a cathode (8) and a cathode flange (1). The full pressure welding quick radiating ceramic shell is characterized in that the lower end face of the anode (4) is evenly provided with a plurality of anode radiating grooves (5) and the upper end face of the cathode (8) is evenly provided with a plurality of cathode radiating grooves (9). The full pressure welding quick radiating ceramic shell is also characterized in that a radiator is not needed to be externally connected and the anode radiating grooves and cathode radiating grooves radiate automatically by the full pressure welding close contact, thereby being especially suitable for the packaging of the clearance-typed operating devices.
Description
Technical field
The utility model relates to a kind of ceramic cartridge, especially relates to a kind of pressure contact rapid radiating ceramic package.Be particularly suitable for the package casing of the semiconductor device of clearance-type work.Belong to electric and electronic technical field.
Background technology
It is the support technology platform with power semiconductor, electronic circuit technology, computer technology, modern control technology that power electronic technology is one.It is the fusion of power electronic technology (forceful electric power and weakness technology).The research of power electronic technology is at present just changed to industrialization from the basis innovation, has released many scientific achievements.Power electronic device is as the core devices of power electronic equipment, and application is very extensive, has particularly given play to increasing effect in the process of building a resource-conserving society.The conventional electric power electronic device is made up of chip, shell, radiator.For under the particular job condition, power electronic device often is in moment work and clearance-type operating state, and it needs device to have short-term operation, the function of quick heat radiating.External radiator not only can not satisfy the requirement of device quick heat radiating, and the waste data, significantly increases device volume.
Summary of the invention
The purpose of this utility model is the characteristics at the clearance-type device work, provides a kind of device that can make to need not to install radiator in addition additional and the pressure contact rapid radiating ceramic package of on-line operation.
The purpose of this utility model is achieved in that a kind of pressure contact rapid radiating ceramic package, comprises base and Guan Gai.
Described base comprises big positive flange, porcelain ring, little positive flange, anode electrode, chip locating ring and fairlead, described little positive flange is welded in the middle of the outer rim of anode electrode with one heart, the chip locating ring is welded on the outer rim top of anode electrode with one heart, big positive flange, porcelain ring and the superimposed from top to bottom concentric welding of little positive flange, fairlead is connected on the shell wall of porcelain ring
Described pipe lid comprises cathode electrode and cathode flange, and described cathode flange is welded on the outer rim of cathode electrode with one heart,
It is characterized in that:
The lower surface of described anode electrode is evenly equipped with some anode radiating grooves;
The upper surface of described cathode electrode is evenly equipped with some negative electrode radiating grooves.
The utlity model has does not need external radiator, and by the tight contact that total head connects, electrode radiating groove auto-radiating is realized the characteristics of quick heat radiating.Therefore be particularly suitable for the encapsulation of clearance-type device work.
Description of drawings
Fig. 1 is a general structure schematic diagram of the present utility model.
Fig. 2 is a base vertical view of the present utility model.
Fig. 3 is the A-A cut-away view of Fig. 2.
Fig. 4 is a pipe lid vertical view of the present utility model.
Fig. 5 is the B-B cut-away view of Fig. 4.
Among the figure: big positive flange 1, porcelain ring 2, little positive flange 3, anode electrode 4, anode radiating groove 5, chip locating ring 6, fairlead 7, cathode electrode 8, negative electrode radiating groove 9, cathode flange 10.
Embodiment
Referring to Fig. 1, the pressure contact rapid radiating ceramic package that the utility model relates to covers two parts by base and pipe and forms.
Referring to Fig. 2～3, described base mainly is made up of big positive flange 1, porcelain ring 2, little positive flange 3, anode electrode 4, chip locating ring 6 and fairlead 7.Little positive flange 3 is welded in the middle of the outer rim of anode electrode 4 with one heart, and chip locating ring 6 is welded on the outer rim top of anode electrode 4 with one heart, big positive flange 1, porcelain ring 2 and the superimposed from top to bottom concentric welding of little positive flange 3, and fairlead 7 is connected on the shell wall of porcelain ring 2.The lower surface of described anode electrode 4 is evenly equipped with some anode radiating grooves 5.
Referring to Fig. 4～5, described pipe lid mainly is made up of cathode electrode 8 and cathode flange 10.Cathode flange 10 is welded on the outer rim of cathode electrode 8 with one heart, and the upper surface of described cathode electrode 8 is evenly equipped with some negative electrode radiating grooves 9.
Described anode radiating groove 5 and negative electrode radiating groove 9, the degree of depth of groove and quantity can require according to the heat radiation of device to design.The degree of depth and the quantity that increase groove can increase radiating effect.
Described chip locating ring 6 is the concentricity between positioning chip, molybdenum sheet and the anode electrode 4 accurately, realizes the technological requirement that total head connects.
Described anode electrode 4 and cathode electrode 8 adopt two-sided lapping technology to make electrode surface have very high evenness and roughness, evenness≤0.005mm, roughness Ra≤0.8 μ.For connecing encapsulation, the total head of chip provides reliable assurance.
More than adopt silver-copper brazing alloy between each parts, disposable high-temperature soldering forms in vacuum furnace or hydrogen furnace.Have very high tension intensity and air-tightness.Tension intensity 〉=5KN/cm
2, air-tightness≤1 * 10
-9Pam
3/ S.
During use, pipe lid and bottom seat is superimposed with one heart up and down, and chip places in the middle of porcelain ring inner chamber, cathode electrode and the anode electrode, comes for chip provides protection by Vacuum Package between the pipe lid and bottom seat, realizes device function.
Claims (1)
1, a kind of pressure contact rapid radiating ceramic package comprises base and Guan Gai,
Described base comprises big positive flange (1), porcelain ring (2), little positive flange (3), anode electrode (4), chip locating ring (6) and fairlead (7), described little positive flange (3) is welded in the middle of the outer rim of anode electrode (4) with one heart, chip locating ring (6) is welded on the outer rim top of anode electrode (4) with one heart, big positive flange (1), porcelain ring (2) and the superimposed from top to bottom concentric welding of little positive flange (3), fairlead (7) is connected on the shell wall of porcelain ring (2)
Described pipe lid comprises cathode electrode (8) and cathode flange (10), and described cathode flange (10) is welded on the outer rim of cathode electrode (8) with one heart,
It is characterized in that:
The lower surface of described anode electrode (4) is evenly equipped with some anode radiating grooves (5);
The upper surface of described cathode electrode (8) is evenly equipped with some negative electrode radiating grooves (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200820036761 CN201146179Y (en) | 2008-06-13 | 2008-06-13 | Complete-crimp-connection rapid heat radiation type ceramic casing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200820036761 CN201146179Y (en) | 2008-06-13 | 2008-06-13 | Complete-crimp-connection rapid heat radiation type ceramic casing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201146179Y true CN201146179Y (en) | 2008-11-05 |
Family
ID=40083064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200820036761 Expired - Lifetime CN201146179Y (en) | 2008-06-13 | 2008-06-13 | Complete-crimp-connection rapid heat radiation type ceramic casing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201146179Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101399237B (en) * | 2008-10-24 | 2010-06-02 | 江阴市赛英电子有限公司 | Rapid heat radiation ceramic case formed by full compression joint |
| CN101916745A (en) * | 2010-05-31 | 2010-12-15 | 江阴市赛英电子有限公司 | Novel plate crimped dual-chip encapsulated ceramic package |
| CN102768997A (en) * | 2012-07-28 | 2012-11-07 | 江阴市赛英电子有限公司 | High-power complete wafer IGBT (insulated gate bipolar translator) ceramic package housing |
| CN105355605A (en) * | 2015-11-26 | 2016-02-24 | 无锡天杨电子有限公司 | Large power total-pressure-contact IGBT multi-die holder ceramic tube housing |
-
2008
- 2008-06-13 CN CN 200820036761 patent/CN201146179Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101399237B (en) * | 2008-10-24 | 2010-06-02 | 江阴市赛英电子有限公司 | Rapid heat radiation ceramic case formed by full compression joint |
| CN101916745A (en) * | 2010-05-31 | 2010-12-15 | 江阴市赛英电子有限公司 | Novel plate crimped dual-chip encapsulated ceramic package |
| CN102768997A (en) * | 2012-07-28 | 2012-11-07 | 江阴市赛英电子有限公司 | High-power complete wafer IGBT (insulated gate bipolar translator) ceramic package housing |
| CN105355605A (en) * | 2015-11-26 | 2016-02-24 | 无锡天杨电子有限公司 | Large power total-pressure-contact IGBT multi-die holder ceramic tube housing |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20081105 Effective date of abandoning: 20080613 |