CN206022344U - A kind of MCP ceramic packages of four side pin of Small Distance - Google Patents
A kind of MCP ceramic packages of four side pin of Small Distance Download PDFInfo
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- CN206022344U CN206022344U CN201621093619.2U CN201621093619U CN206022344U CN 206022344 U CN206022344 U CN 206022344U CN 201621093619 U CN201621093619 U CN 201621093619U CN 206022344 U CN206022344 U CN 206022344U
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Abstract
The utility model discloses a kind of MCP ceramic packages of four side pin of Small Distance, including ceramic body, pin, soldering and sealing ring and cover plate；Ceramic body is made up of shell substrate and ceramic wall body, the cavity of shell substrate and ceramic wall body composition shell；Enclosure has power/ground, holding wire/control line etc., and in vivo, without the need for the substrate of chip bearing, lead is four side pins, is a kind of high-grade MCP ceramic packages of high density for the encapsulation that the Digital Logic control of mini system, Power convert are integrated in.Hydrid integrated circuit is applied to, production process can be greatly simplified, improve the yield rate of circuit, improve the reliability of hydrid integrated circuit, improve the credit rating of circuit.
Description
【Technical field】
The utility model belongs to hybrid-intergated-circuit technique, is related to the package casing of integrated circuit, more particularly to a kind of little
The MCP ceramic packages of four side pin of spacing.
【Background technology】
At present the package casing great majority of hydrid integrated circuit are metal shells, and pin type pin-pitch 2.54mm is sealed
Dress size and the restriction of pin lead-out mode, the quantity of pin typically remove pin-pitch not over package perimeter.For highly dense
The encapsulation of the hydrid integrated circuit and system integrated circuit of degree starts using PGA ceramic packages, and pin mode is pin grid array
(PGA), pin-pitch 2.54mm, diameter of phi 0.46mm.Military high-grade system integrated circuit requires that encapsulation volume is little, integrated
Density is high, there is presently no the closely spaced PGA ceramic packages suitable for multi-chip Hybrid assembling.
【Utility model content】
For overcoming the deficiencies in the prior art, there is provided a kind of MCP ceramic packages of four side pin of Small Distance, realize
High-density systems level circuit packages.
For reaching above-mentioned purpose, the utility model is adopted the following technical scheme that：
A kind of MCP ceramic packages of four side pin of Small Distance, including ceramic body, pin, soldering and sealing ring and cover plate；Ceramic body by
Shell substrate and ceramic wall body composition, shell substrate and ceramic wall body constitute the cavity of shell, and shell substrate is that have interior metal
The multi-layer ceramics of conduction band, housing surface are furnished with metal conduction band figure, for assembling mounting related components chip and other devices, each core
Piece is connected with conduction band by bonding wire with device；Pin is the pin type lead for being implanted directly into ceramic body, and pin is in single-row arrangement cloth
Put on four side of outer casing bottom, form the I/O pins of circuit；Cover plate and soldering and sealing ring pass through parallel seam welding by ceramic body top seal.
Further, soldering and sealing ring and cover plate are to cut down material, have close thermal coefficient of expansion with pottery and chip.
Further, pin-pitch is 1.27mm.
Further, pinless lead be cylinder, diameter of phi 0.30mm, length 4.50mm, pin pad Φ 0.50mm.
Further, per 17 pin of side, 68 pin of number of pins, shell sizes are 27.3mm × 27.3mm × 5.6mm to quadrangle shell.
The MCP ceramic packages of four sides Small Distance pin of the present utility model include ceramic body, pin, soldering and sealing ring and cover plate；
Enclosure has power/ground, holding wire/control line etc., and the Digital Logic control of mini system, Power convert are integrated in one
Encapsulation in vivo, without the need for the substrate of chip bearing, lead is four side pins, is a kind of high-grade MCP ceramic packages of high density.
Hydrid integrated circuit is applied to, production process can be greatly simplified, improve the yield rate of circuit, improve the reliability of hydrid integrated circuit
Property, improve the credit rating of circuit.
【Description of the drawings】
The schematic diagram of Fig. 1 shell mechanisms
The bottom schematic view of Fig. 2 shells
Explanation：1- pins, 2- shell substrates, 3- ceramic wall bodies, 4- soldering and sealing rings, 5- cavitys, 6- cover plates.
【Specific embodiment】
The utility model is described in further detail with reference to specific embodiment：
As depicted in figs. 1 and 2, the MCP ceramic packages of four sides Small Distance pin of the present utility model, including ceramic body, draw
Pin, soldering and sealing ring, cover plate.MCP is multi-chip package (Multi Chip Package；MCP).
Ceramic body is made up of shell substrate 2 and ceramic wall body 3, the cavity 5 of shell substrate 2 and the composition shell of ceramic wall body 3,
Shell substrate 2 is the multi-layer ceramics for having interior metal conduction band, and 5 surface of cavity is furnished with metal conduction band figure, installs unit for assembling
Device chip and other devices, each chip are connected with conduction band by bonding wire with device；Pin 1 is the pin for being implanted directly into ceramic body
Formula lead, pin 1 are arranged in four side of outer casing bottom in single-row arrangement, form the I/O pins of circuit.
, by parallel seam welding by ceramic body top seal, soldering and sealing ring 4 and cover plate 6 are to cut down material for cover plate 6 and soldering and sealing ring 4
Material, has close thermal coefficient of expansion with pottery and chip.
Pin-pitch is 1.27mm, and pinless lead is cylinder, diameter of phi 0.30mm, length 4.50mm, pin pad Φ
0.50mm.
The high 2.50mm of MCP68N inner chamber porcelain bodies, the high 1.00mm of soldering and sealing ring, the total high 3.50mm of inner chamber, pin-pitch 1.27mm,
Per 17 pin of side, 68 pin of number of pins, shell sizes are 27.3mm × 27.3mm × 5.6mm.
MCP68N meets the H level standards of GJB2440A-2006 and GJB2438A-2002, has reached military systems and has been integrated in
Requirement in terms of electrical property, package dimension.
The hydrid integrated circuit of application MCP68N, can greatly simplify production process, improve the yield rate of circuit, improve mixing
The reliability of integrated circuit, improves the credit rating of circuit.
The model of the MCP ceramic packages of four side pin of Small Distance is MCP68N, and for LHB155304 circuits, the circuit is
1553 bus control unit circuits of 4M, ceramic package shell substrate are furnished with interconnection conduction band, and shell substrate surface has conduction band figure, use
In assembling controller chip, driver chip, interface chip etc. is installed, after the completion of assembling, test, parallel seam welding capping is carried out.
Using the LHB155304 circuits of tetra- side Small Distance pin type pin MCP ceramic packages of MCP68N, small volume, integrated level
Height, pin type pin meet high-grade highly reliable application requirement；The employing of MCP68N, simplifies LHB155304 circuits simultaneously
Production process, improves the yield rate of circuit, and reliability reaches GJB2438A-2002H levels.
Above content is with reference to specific preferred embodiment further detailed description of the utility model, it is impossible to
Assert that specific embodiment of the present utility model is only limitted to this, for the utility model person of an ordinary skill in the technical field
For, without departing from the concept of the premise utility, some simple deduction or replace can also be made, should be all considered as
Belong to the utility model scope of patent protection is determined by the claims that is submitted to.
Claims (5)
1. MCP ceramic packages of four side pin of a kind of Small Distance, it is characterised in that：Including ceramic body, pin (1), soldering and sealing ring (4)
With cover plate (6)；
Ceramic body is made up of shell substrate (2) and ceramic wall body (3), the chamber of shell substrate (2) and ceramic wall body (3) composition shell
Body (5), shell substrate (2) are the multi-layer ceramics for having interior metal conduction band, and cavity (5) surface is furnished with metal conduction band figure, is used for
Assembling mounting related components chip and other devices, each chip are connected with conduction band by bonding wire with device；Pin (1) is directly to plant
Enter the pin type lead of ceramic body, pin (1) is arranged in four side of outer casing bottom in single-row arrangement, forms the I/O pins of circuit；Cover plate
(6) and soldering and sealing ring (4) by parallel seam welding by ceramic body top seal.
2. MCP ceramic packages of four side pin of Small Distance according to claim 1, it is characterised in that：Soldering and sealing ring (4) and lid
Plate (6) is to cut down material, has close thermal coefficient of expansion with pottery and chip.
3. MCP ceramic packages of four side pin of Small Distance according to claim 1 and 2, it is characterised in that：Pin-pitch is
1.27mm.
4. MCP ceramic packages of four side pin of Small Distance according to claim 1 and 2, it is characterised in that：Pinless lead is
Cylinder, diameter of phi 0.30mm, length 4.50mm, pin pad Φ 0.50mm.
5. MCP ceramic packages of four side pin of Small Distance according to claim 1 and 2, it is characterised in that：Quadrangle shell
Per 17 pin of side, 68 pin of number of pins, shell sizes are 27.3mm × 27.3mm × 5.6mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621093619.2U CN206022344U (en) | 2016-09-29 | 2016-09-29 | A kind of MCP ceramic packages of four side pin of Small Distance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621093619.2U CN206022344U (en) | 2016-09-29 | 2016-09-29 | A kind of MCP ceramic packages of four side pin of Small Distance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206022344U true CN206022344U (en) | 2017-03-15 |
Family
ID=58260833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621093619.2U Active CN206022344U (en) | 2016-09-29 | 2016-09-29 | A kind of MCP ceramic packages of four side pin of Small Distance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206022344U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106952889A (en) * | 2017-05-19 | 2017-07-14 | 中国电子科技集团公司第十三研究所 | The ceramic pinboard installed for large-size ceramic shell |
| CN107680941A (en) * | 2017-10-13 | 2018-02-09 | 中国电子科技集团公司第十三研究所 | Ceramic package shell |
| CN110060985A (en) * | 2019-04-26 | 2019-07-26 | 西安微电子技术研究所 | A kind of small-sized integrated multipath analog switch |
-
2016
- 2016-09-29 CN CN201621093619.2U patent/CN206022344U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106952889A (en) * | 2017-05-19 | 2017-07-14 | 中国电子科技集团公司第十三研究所 | The ceramic pinboard installed for large-size ceramic shell |
| CN107680941A (en) * | 2017-10-13 | 2018-02-09 | 中国电子科技集团公司第十三研究所 | Ceramic package shell |
| CN110060985A (en) * | 2019-04-26 | 2019-07-26 | 西安微电子技术研究所 | A kind of small-sized integrated multipath analog switch |
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| GR01 | Patent grant |