CN107680941A - Ceramic package shell - Google Patents
Ceramic package shell Download PDFInfo
- Publication number
- CN107680941A CN107680941A CN201710954974.7A CN201710954974A CN107680941A CN 107680941 A CN107680941 A CN 107680941A CN 201710954974 A CN201710954974 A CN 201710954974A CN 107680941 A CN107680941 A CN 107680941A
- Authority
- CN
- China
- Prior art keywords
- ceramic package
- lead
- shell
- ceramic
- package shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention provides a kind of ceramic package shell, belong to ceramic packaging technology field, the ceramic package being laminated including multi-layer ceramic chip, the seal mouth ring of some leads being connected with the ceramic package and the oral area for the accommodating chamber for being arranged at the ceramic package, some leads are vertically drawn from the ceramic package surface, the lead surrounds rectangular configuration on the surface of the ceramic package, four of the rectangular configuration correspond in four with the ceramic package respectively, the one end of lead away from the ceramic package described in per one side is connected as a single entity by a connector respectively.Ceramic package shell provided by the invention, lead is vertically drawn from a surface of ceramic package, extraction location can be arranged according to the requirement of client, and because lead is drawn from side, arrangement mode on ceramic package surface is versatile and flexible, also the volume of device can be reduced, realize device miniaturization, reduce installation volume.
Description
Technical field
The invention belongs to ceramic packaging technology field, is to be related to a kind of bottom pottery that singly T-shaped lead is drawn more specifically
Porcelain package casing.
Background technology
Traditional DIP package casings（DIP is dual inline-pin package abbreviation, also makes dual inline type seal
Dress technology）Lead leading-out form is drawn for long side both sides, and it is 2.54mm to commonly use exit pitch, as shown in Figs. 7-9, DIP encapsulation
Cpu chip have two row's pins, it is necessary to be inserted on the chip carrier socket with DIP structures.Due to chip area and package area
Between ratio it is larger, therefore volume is also larger, and most middle small scale integrated circuits use this packing forms, its pin
Number is usually no more than 100.When exit number is more（More than 16 lines）, using traditional CDIP（ceramic dual-in-
Line package- ceramic double-rows straight cutting encapsulates）Shell draws lead from long side both sides, certainly will cause ceramic package in length side
It is oversized upwards, it is unfavorable for shell miniaturization and plate level layout and assembling.
The content of the invention
It is an object of the invention to provide a kind of ceramic package shell, it can solve the problem that in the prior art package casing chi be present
Very little big, the inflexible technical problem of Pin arrangement mode.
To achieve the above object, the technical solution adopted by the present invention is：A kind of ceramic package shell, including multilayer pottery are provided
Ceramic package, some leads being connected with the ceramic package and the receiving for being arranged at the ceramic package that ceramics is laminated
The seal mouth ring of the oral area of chamber, some leads are vertically drawn from the ceramic package surface, and the lead is in institute
The surface for stating ceramic package surrounds rectangular configuration, and four of the rectangular configuration in four with the ceramic package respectively one
One correspondence, the one end of lead away from the ceramic package described in per one side are connected as a single entity by a connector respectively.
Further, each described lead is respectively arranged with what is flipped over the exit that the ceramic package is connected
Bending part.
Further, the both ends of each connector are respectively arranged with first positioning hole.
Further, in lead described in every one side, one second is respectively arranged with two leads at both ends
Positioning hole.
Further, in lead described in every one side, the installation of plate level is respectively arranged with two leads at both ends
Spacing mark.
Further, the quantity of the lead on relative both sides is identical.
Further, the connector is and the lead material identical hardware.
Further, the width of the lead is between 0.10-0.50mm.
Further, the thickness of the lead is between 0.10-0.30mm.
Further, the pitch of the lead exit be 0.65 mm, 0.80 mm, 1.016 mm, 1.27 mm and
Any of 2.54mm.
The beneficial effect of ceramic package shell provided by the invention is：Compared with prior art, ceramic package of the present invention
Shell, lead are vertically drawn from a surface of ceramic package, rather than are drawn from the side of ceramic package, lead exit row
Row mode is more versatile and flexible, and extraction location can be arranged according to the requirement of client, and because lead is drawn from side,
The arrangement mode on ceramic package surface is versatile and flexible, can also reduce the volume of device, realizes device miniaturization, reduces fixing body
Product.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
In the required accompanying drawing used be briefly described, it should be apparent that, drawings in the following description be only the present invention some
Embodiment, for those of ordinary skill in the art, without having to pay creative labor, can also be according to these
Accompanying drawing obtains other accompanying drawings.
Fig. 1 is the structural representation one of ceramic package shell provided in an embodiment of the present invention；
Fig. 2 is Fig. 1 overlooking the structure diagram；
Fig. 3 is Fig. 1 present invention looks up structural representation；
Fig. 4 is the structural representation two of ceramic package shell provided in an embodiment of the present invention；
Fig. 5 is Fig. 4 overlooking the structure diagram；
Fig. 6 is Fig. 4 present invention looks up structural representation；
Fig. 7 is the structural representation of existing ceramic package shell；
Fig. 8 is Fig. 7 side structure schematic view；
Fig. 9 is Fig. 7 overlooking the structure diagram.
Wherein, each reference in figure：
1- seal mouth rings；2- ceramic packages；The positioning holes of 3- second；4- leads；The positioning holes of 5- first；6- connectors；7- pads.
Embodiment
In order that technical problems, technical solutions and advantages to be solved are more clearly understood, tie below
Drawings and Examples are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, it can be directly another
On one element or it is connected on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", " on ", " under ", "front", "rear", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " top ", " bottom " " interior ", " outer " are to be closed based on orientation shown in the drawings or position
System, it is for only for ease of and describes the present invention and simplify description, rather than indicates or imply that signified device or element must have
Specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the invention, " multiple " are meant that two or more,
Unless otherwise specifically defined.
Also referring to Fig. 1 to Fig. 6, now ceramic package shell provided by the invention is illustrated.The ceramic package
Shell, including be laminated including multi-layer ceramic chip ceramic package 2, some leads 4 being connected with the ceramic package 2 and set
The seal mouth ring 1 of the oral area of the accommodating chamber of the ceramic package 2 is placed in, some leads 4 are from one of the ceramic package 2
Surface is vertically drawn, and the lead 4 surrounds rectangular configuration, four sides of the rectangular configuration on the surface of the ceramic package 2
Four sides with the ceramic package 2 correspond respectively, the one end of lead 4 away from the ceramic package 2 point described in per one side
It is not connected as a single entity by a connector 6.
Ceramic package shell provided by the invention, compared with prior art, ceramic package shell of the present invention, lead is from ceramics
One surface of shell 2 is vertically drawn, rather than is drawn from the side of ceramic package 2, and lead exit arrangement mode is cleverer
Work is various, and extraction location can be thus arranged according to the requirement of client, and because lead is drawn from side, outside ceramics
The arrangement mode on the surface of shell 2 is versatile and flexible, can also reduce the volume of device, realizes device miniaturization, reduces installation volume.
Herein, for ease of description, one side of the ceramic package 2 provided with seal mouth ring 1 is defined as front, ceramic package 2 and envelope
The relative another side of choma 1 is the back side.
Further, drawn refering to Fig. 1 and Fig. 4, lead 4 of the present invention from the back side of ceramic package 2, conventional lead pitch
For 0.65 mm, 0.80 mm, 1.016 mm, 1.27 mm and 2.54mm, lead vertically welds with ceramic package 2, such shell category
System and encapsulation, it becomes one multi-chip module ceramic substrate with air tight housing, enclosed inside digital logic chip, mould
Intend transmission circuit, memory, passive element etc., to realize higher packaging density, more preferably systemic-function.It is mainly used in elder generation
Enter all kinds of high density integrated circuit systems such as communication engine, SRAM, resolver-to-angle converter.
Further, ceramic package is mainly included refering to Fig. 1 and Fig. 4, ceramic package shell provided in an embodiment of the present invention
2nd, seal mouth ring 1, lead and heat sink（If necessary）, the material of ceramic package 2 is 90% aluminum oxide, using multilayer aluminium oxide ceramics
Tungsten metallization high temperature co-firing technique makes, and the material of seal mouth ring 1 is teleoseal, and lead material is iron-nickel alloy, heat sink material
For alloys such as tungsten copper, molybdenum copper and CPC, ceramic package 2 and seal mouth ring 1, lead and heat sink welded using silver-copper brazing alloy.
Further, also referring to Fig. 1 and Fig. 4, as a kind of specific real of ceramic package shell provided by the invention
Mode is applied, each described lead 4 is respectively arranged with the bending part flipped over the exit that the ceramic package 2 is connected.
That is, bending part is fixedly connected with the back side of ceramic package 2, carried on the back by the bottom of the bending part and ceramic package 2 that flip over
Face connects, increase and the connection area of ceramic package 2, improves the reliability of connection.
Further, Fig. 1 and Fig. 4 is referred to, a kind of specific embodiment party as ceramic package shell provided by the invention
Formula, the both ends of each connector 6 are respectively arranged with first positioning hole 5.
Further, refering to Fig. 1 and Fig. 4, as a kind of embodiment of ceramic package shell provided by the invention,
In lead 4 described in per one side, second positioning hole 3 is respectively arranged with two leads 4 at both ends.
Further illustrate, lead is drawn from the back side of ceramic package 2, is connected with each other per side lead top（See Fig. 1 and
Fig. 4）, the lead on four sides is separate, lead and connector 6 the composition lead frame of the outermost end per one side, on lead frame
Positioning hole is provided with, shape makes lead compare concentration, be easy to the miniaturization of ceramic package shell like birdcage.What is provided in Fig. 1 is
Lead is drawn from the back side of ceramic package 2, and during concrete application, lead can also be draws from the front of ceramic package 2, Ke Yishi
The exit arrangement mode of existing lead is more versatile and flexible；When exit number is more than 16 lines, the technology that is provided using the present embodiment
Scheme can effectively realize the miniaturization of ceramic package shell.The technical scheme that the present embodiment provides has the advantage that：Can be with
Installation volume is effectively reduced, realizes the miniaturization of device；Arrangement extraction location can be required according to user, realizes the spirit of lead-out mode
Work is various；Mechanical stress buffer capacity good enough, effectively increase the board level reliability of shell.
Further, Fig. 1 to Fig. 4 is referred to, a kind of specific embodiment party as ceramic package shell provided by the invention
Formula, often in lead 4 described in one side, plate level is respectively arranged with two leads 4 at both ends spacing mark is installed.This reality
Apply in example, share the plate level with abnormity on eight leads 4 and spacing mark is installed, be easily installed.
Further, Fig. 1 and Fig. 4 is referred to, a kind of specific embodiment party as ceramic package shell provided by the invention
Formula, the quantity of the lead 4 on relative both sides are identical.The quantity of lead 4 on adjacent both sides can be the same or different.
Further, refering to Fig. 1 and Fig. 4, as a kind of embodiment of ceramic package shell provided by the invention,
The connector 6 be and the material identical hardware of lead 4.
Further, Fig. 1 to Fig. 4 is referred to, a kind of specific embodiment party as ceramic package shell provided by the invention
Formula, the width of the lead 4 is between 0.10-0.50mm.
Further, Fig. 1 and Fig. 4 is referred to, a kind of specific embodiment party as ceramic package shell provided by the invention
Formula, the thickness of the lead 4 is between 0.10-0.30mm.
Further, Fig. 1 and Fig. 4 is referred to, a kind of specific embodiment party as ceramic package shell provided by the invention
Formula, the lead is flat structure, and different from existing cylindrical-shaped structure, the advantage using flat structure is that elasticity compares
It is good, in solid time controlled released stress.
Further, a kind of embodiment as ceramic package shell provided by the invention, the lead 4 are drawn
The pitch at end is any of 0.65 mm, 0.80 mm, 1.016 mm, 1.27 mm and 2.54mm.
In a word, the ceramic package 2 drawn using back side lead is possessed can multilayer wiring, high reliability, high-air-tightness, radiating
The features such as ability is strong, integrated rear device volume and weight can be effectively reduced, miniaturization is realized, meets cooling requirements；Ceramic package 2
There can be multiple polygon cavitys for being used to accommodate chip or passive device；Ceramic package can have 2 layers to 30 layers of wire bond
Structure.Any of such 2 exit pitch of ceramic package 0.65 mm, 0.80 mm, 1.016 mm, 1.27 mm and 2.54mm,
The size of pad 7 is determined by the wire widths of shell.The lead on four sides is separate, is provided with positioning hole on lead frame, and four
Plate level with abnormity on eight leads at angle installs spacing mark, wire widths 0.10-0.50mm, lead thicknesses 0.10-
0.30mm, pin count are 8-352, and shell rear surface is provided with index and identified, and specifically No. 1 pad is provided with No. 1 index and identified, No. 2
Pad sets No. 2 index marks, is easily installed.
Wherein, ceramic package shell is by ceramic package 2, metal seal ring 1（It can determine whether there is according to customer demand）And heat
It is heavy（It can determine whether there is according to customer demand）Composition, according to user's packaging information, determine the mutual of cavity size and internal wiring
Even relation, according to plate electrode installation requirement, exit size and arrangement are determined, carries out structure design on this basis, and tied
Structure and electrical property emulation, ensure its structural reliability and radiating and requirement on electric performance.
The material of metal seal ring 1 is iron nickel or teleoseal, and heat sink material is that oxygen-free copper, molybdenum copper, tungsten copper and CPC are contour
Conducting alloy material.
Ceramic package shell provided by the invention has following advantage compared with conventional ceramic shell：
1）Miniaturization.Such package lead four sides is drawn, and compared with conventional shell, reduces the length direction profile chi of shell
It is very little, effectively realize the miniaturization of ceramic package.
2）High integration.Such shell has one side one or more cavity and two-sided each one or more cavitys, interior
Portion can install multiple chips and various passive elements, meet that the encapsulation of user's high integration requires.
3）It can realize that the exit arrangement mode of shell is more versatile and flexible after new construction.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
1. ceramic package shell, including multi-layer ceramic chip be laminated ceramic package, some be connected with the ceramic package
Lead and be arranged at the ceramic package accommodating chamber oral area seal mouth ring, it is characterised in that：Some leads are from institute
A surface for stating ceramic package is vertically drawn, and the lead surrounds rectangular configuration, the square on the surface of the ceramic package
Four of shape structure correspond in four with the ceramic package respectively, and lead described in per one side is outer away from the ceramics
One end of shell is connected as a single entity by a connector respectively.
2. ceramic package shell as claimed in claim 1, it is characterised in that：Each described lead connects with the ceramic package
The exit connect is respectively arranged with the bending part flipped over.
3. ceramic package shell as claimed in claim 1, it is characterised in that：The both ends of each connector are set respectively
There is first positioning hole.
4. ceramic package shell as claimed in claim 1, it is characterised in that：In lead described in per one side, two positioned at both ends
Second positioning hole is respectively arranged with the individual lead.
5. ceramic package shell as claimed in claim 1, it is characterised in that：In lead described in per one side, two positioned at both ends
Plate level is respectively arranged with the individual lead spacing mark is installed.
6. ceramic package shell as claimed in claim 1, it is characterised in that：The quantity phase of the lead on relative both sides
Together.
7. ceramic package shell as claimed in claim 1, it is characterised in that：The connector is identical with the lead material
Hardware.
8. ceramic package shell as claimed in claim 1, it is characterised in that：The width of the lead 0.10-0.50mm it
Between.
9. ceramic package shell as claimed in claim 1, it is characterised in that：The thickness of the lead 0.10-0.30mm it
Between.
10. ceramic package shell as claimed in claim 1, it is characterised in that：The pitch of the lead exit is 0.65
Any of mm, 0.80 mm, 1.016 mm, 1.27 mm and 2.54mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710954974.7A CN107680941A (en) | 2017-10-13 | 2017-10-13 | Ceramic package shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710954974.7A CN107680941A (en) | 2017-10-13 | 2017-10-13 | Ceramic package shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107680941A true CN107680941A (en) | 2018-02-09 |
Family
ID=61140833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710954974.7A Pending CN107680941A (en) | 2017-10-13 | 2017-10-13 | Ceramic package shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107680941A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102332407A (en) * | 2011-10-20 | 2012-01-25 | 中国电子科技集团公司第十三研究所 | Technology for manufacturing ceramic cofiring four-side lead flat package |
| CN203165873U (en) * | 2013-03-29 | 2013-08-28 | 中国航天科技集团公司第九研究院第七七一研究所 | Packaging shell with cavities at two sides |
| CN204732388U (en) * | 2015-07-13 | 2015-10-28 | 中国电子科技集团公司第十三研究所 | Go between the ceramic packaging shell of being drawn by side |
| CN205177839U (en) * | 2015-12-11 | 2016-04-20 | 苏州捷研芯纳米科技有限公司 | System level packaging circuit of airtight type ceramic package |
| CN206022344U (en) * | 2016-09-29 | 2017-03-15 | 西安微电子技术研究所 | A kind of MCP ceramic packages of four side pin of Small Distance |
-
2017
- 2017-10-13 CN CN201710954974.7A patent/CN107680941A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102332407A (en) * | 2011-10-20 | 2012-01-25 | 中国电子科技集团公司第十三研究所 | Technology for manufacturing ceramic cofiring four-side lead flat package |
| CN203165873U (en) * | 2013-03-29 | 2013-08-28 | 中国航天科技集团公司第九研究院第七七一研究所 | Packaging shell with cavities at two sides |
| CN204732388U (en) * | 2015-07-13 | 2015-10-28 | 中国电子科技集团公司第十三研究所 | Go between the ceramic packaging shell of being drawn by side |
| CN205177839U (en) * | 2015-12-11 | 2016-04-20 | 苏州捷研芯纳米科技有限公司 | System level packaging circuit of airtight type ceramic package |
| CN206022344U (en) * | 2016-09-29 | 2017-03-15 | 西安微电子技术研究所 | A kind of MCP ceramic packages of four side pin of Small Distance |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2592308B2 (en) | Semiconductor package and computer using the same | |
| CN105990265B (en) | The package module and its manufacturing method of circuit for power conversion | |
| US4965654A (en) | Semiconductor package with ground plane | |
| US8183687B2 (en) | Interposer for die stacking in semiconductor packages and the method of making the same | |
| CN101960591A (en) | Semiconductor device, semiconductor device manufacturing method, printed circuit board and electronic device | |
| CN107658270B (en) | Ceramic shell for power converter | |
| JPH01253942A (en) | Semiconductor package and computer using the same | |
| US20110140285A1 (en) | Semiconductor Device | |
| CN111128917A (en) | Chip packaging structure and manufacturing method thereof | |
| CN103811436A (en) | Thermal performance of logic chip in a package-on-package structure | |
| WO2018098647A1 (en) | Integrated circuit multichip stacked packaging structure and method | |
| CN103915405A (en) | Semiconductor device and method of making a semiconductor device | |
| US5519576A (en) | Thermally enhanced leadframe | |
| TWI620258B (en) | Package structure and manufacturing process thereof | |
| TW200425456A (en) | Multi-chip package with electrical interconnection | |
| CN117976647A (en) | TO-type insulating packaging structure and electrical appliance system | |
| CN210743941U (en) | Laminated packaging structure | |
| US20230187114A1 (en) | Power Inductor, Preparation Method of Power Inductor, and System in Package Module | |
| CN107680941A (en) | Ceramic package shell | |
| CN103022014A (en) | Encapsulation module structure with antenna and manufacturing method of encapsulation module structure | |
| TW201737445A (en) | Stacked rectifiers in a package | |
| JP2002110902A (en) | Semiconductor element and semiconductor device | |
| CN209087825U (en) | Device and semiconductor devices | |
| CN102332410A (en) | Packaging method and structure of chip | |
| CN207624678U (en) | Three-dimensional POP packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180209 |