201221780 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種散熱裝置，且特別是有關於一種 風扇結構。 【先前技術】 由於電腦系統(如個人電腦、伺服器主機等）運轉時，會 有廢熱產生，又隨著電腦系統速度的增加，電腦系統運轉 所產生之廢熱也隨之大幅增加。在電腦系統運轉期間所產 生之廢熱，若不加以移除，將會降低電腦系統之效能，甚 至導致電腦系統當機或損壞。因此需要散熱裝置來移除電 腦系統運轉時產生的廢熱。 一般電腦系統中常見的散熱裝置為利用熱管連接發熱 元件以及設置於風扇出風口的散熱鰭片，發熱元件產生的 熱經由熱管傳導至散熱鰭片，以透過風扇的氣流帶走散熱 鰭片上的熱。然而，此種散熱裝置需要多個組件搭配，成 本較高。或者，亦有使風扇的蓋板直接與發熱元件接觸， 而不額外使用散熱鰭片的散熱方式。然而此種散熱方式的 熱交換效率較為不足。 因此，如何減少散熱裝置之組件的數量及成本而不降 低其散熱效率，便成為一個重要的課題。 【發明内容】 因此本發明的目的就是在提供一種散熱裝置，用以減 少所需要的組件數量以及有效地散熱。 [S] 3 201221780 本體 依照、本發明一實施例，提出一種散熱裝置，包含風扇 β &凤屬上蓋及風肩下蓋。風扇本體具有出風口。屈戶 上蓋與届[芦 w領 下蓋組裝於風扇本體。風扇上蓋包含 端，以及％ 車刖 位於出風=置於上蓋前端之多個上蓋凹陷部，上蓋凹陷部 每〜D之前。 之兩第:上蓋凹陷部包含第一底面以及位於第一底面兩侧 觸熱源，」ΐ。散熱裝置可更包含熱管，熱管之第-端接 有下蓋歆：督之第二端與第一底面接觸。風扇下蓋可包含 凹陷部及設置於下蓋前端之多個下蓋凹陷部，下^ 觸。散熱笋出風口之前。熱管之第二端可與下蓋凹陷部接 一端，置可更包含導熱板，導熱板設置於熱管之該第 部與另〜^熱源接觸。風扇上蓋可更包含有延伸部，延伸 銅或鋁。‘、、、溽接觸。風扇上蓋與風扇下蓋之材料較佳地為 卜201221780 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a fan structure. [Prior Art] When a computer system (such as a personal computer, a server host, etc.) is operated, waste heat is generated, and as the speed of the computer system increases, the waste heat generated by the operation of the computer system also increases significantly. The waste heat generated during the operation of the computer system, if not removed, will degrade the performance of the computer system and even cause the computer system to crash or be damaged. Therefore, a heat sink is required to remove the waste heat generated when the computer system is operating. A common heat sink in a computer system is a heat sink connected to a heat generating component and a heat sink fin disposed at a fan air outlet. Heat generated by the heat generating component is conducted to the heat sink fin through the heat pipe to remove heat from the heat sink fin through the airflow of the fan. . However, such a heat sink requires a plurality of components to be matched and has a high cost. Alternatively, there is also a way to dissipate the cover of the fan directly into the heat generating component without additionally using heat sink fins. However, the heat exchange efficiency of this type of heat dissipation is insufficient. Therefore, how to reduce the number and cost of the components of the heat sink without reducing the heat dissipation efficiency becomes an important issue. SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a heat sink for reducing the number of components required and for efficiently dissipating heat. [S] 3 201221780 Main body According to an embodiment of the present invention, a heat dissipating device is provided, which comprises a fan β & a Phoenix upper cover and a wind shoulder lower cover. The fan body has an air outlet. The upper cover and the [reel w collar] are assembled on the fan body. The fan upper cover includes the end, and the % rut is located at the outlet air = a plurality of upper cover recessed portions placed at the front end of the upper cover, and the upper cover recessed portion is before each ~D. The two parts: the upper cover recess includes a first bottom surface and a heat source on both sides of the first bottom surface," The heat sink may further comprise a heat pipe, and the first end of the heat pipe is connected with a lower cover: the second end of the heat pipe is in contact with the first bottom surface. The lower cover of the fan may include a recessed portion and a plurality of recessed portions of the lower cover disposed at the front end of the lower cover, and the lower cover is touched. Before the heat is blown out of the air outlet. The second end of the heat pipe may be connected to the recessed portion of the lower cover, and may further comprise a heat conducting plate, and the heat conducting plate is disposed at the first portion of the heat pipe to be in contact with the other heat source. The fan cover may further include an extension extending copper or aluminum. ‘,, 溽 contact. The material of the fan upper cover and the fan lower cover is preferably
直接形陷部或是下蓋凹陷部可以透過沖壓成形的方式 以及組☆上蓋或是風扇下蓋上，可以節省材料成: 凹_2量。散熱裝置更藉由設置於出風口前的上蓋 s D了熱交換面積，有效提升散熱裝置的熱交換效 【實施方式】 以下將以圖式及詳細說明清楚說明本發明之精神， 何所屬技術钱巾具有通常知識者在瞭解本發明之較佳實 施例後，當可由本發明所教示之技術，加以改變及修=實 其並不脫離本發明之精神與範圍。 201221780 參照第1圖，其繪示本發明之散熱裝置第一實施例 示意圖。散熱裝置100包含有風扇本體110、風扇上蓋12〇 及風扇下蓋130。風扇上蓋12〇與風扇下蓋13〇組裝於風 扇本體110上，以保護風扇本體11〇並便裝。 體no具有出風口 m。風扇上蓋120具有上蓋前:扇二 以及夕個上蓋凹陷部124，上蓋凹陷部124設置於上蓋前 ，122，且位於出風口 112之前。風扇上蓋12〇與風扇下 蓋130之材料可以為導熱性佳之金屬，如銅或鋁。 每一個上蓋凹陷部124具有第一底面126以及位於第 一底面126兩侧之兩第—側壁128。每一個上蓋凹陷部124 之截面形狀近似於u字型。上蓋凹陷部124可以透過沖壓 成形的製程直接形成在風扇上蓋12〇上。換言之，上蓋凹 陷部124為一體成形地形成在上蓋前端122上。 上蓋凹陷部124位於出風口 112之前，上蓋凹陷部124 之第一底面126與第一側壁丨28可以增加與出風口 ^2之 氣流的熱交換面積，有效增加風扇上蓋12〇的熱交換效率。 散熱震置100可更包含有熱管14〇。熱管14〇之材料 為導熱性佳之金屬，如銅或鋁。熱管14〇之第一端142與 —熱源150接觸’熱管14〇之第二端144則是與上蓋凹陷 部124之第一底面126接觸。如此一來，熱源15〇所產生 的熱量可以經由熱管140傳遞至上蓋凹陷部124，再與出 風口 112所吹出的氣流進行熱交換後散逸。 散熱裝置100可更包含有導熱板160，導熱板160之 材料可為導熱性佳之金屬’如銅或鋁。導熱板16〇設置於 熱管140之第一端142，且與熱源15〇接觸。導熱板l6(|y 5 201221780 可以增加與熱源15〇的熱交換面積’提升熱管140與熱源 150的熱交換效率。 參照第2圖，其繪示本發明之散熱裝置第二實施例的 示意圖。散熱裝置1〇〇包含有風扇本體110、風扇上蓋120 及風扇下蓋130。風扇上盘120與風扇下蓋130組裝於風 扇本體110上，以保護風扇本體110並便於組裝。風扇本 體110具有出風口 112。風扇上蓋120具有上蓋前端122 以及位於上蓋前端122之多個上蓋凹陷部124。風扇下蓋 130具有下蓋前端132以及位於下蓋前端132之多個下蓋 凹陷部134。上蓋凹陷部124與下蓋凹陷部134位於出風 口 112之前。風扇上蓋120與風扇下蓋130之材料可以為 導熱性佳之金屬，如銅或鋁。 母一個上蓋凹陷部124具有第一底面126以及位於第 底面126兩侧之兩第一侧壁128。每一個上蓋凹陷部124 之截面形狀近似於U字型。上蓋凹陷部124可以透過沖壓 成形的製程直接形成在風扇上蓋12〇上。換言之，上蓋凹 陷部124為一體成形地形成在上蓋前端122上。 每一個下蓋凹陷部134具有第二底面136以及位於第 二底面136兩側之兩第二侧壁138。每一個下蓋凹陷部134 之截面形狀近似於u字型。下蓋凹陷部134可以透過沖壓 成形的製程直接形成在風扇下蓋丨3〇上。換言之，下蓋凹 陷部134為一體成形地形成在下蓋前端上。 上蓋凹陷部124與下蓋凹陷部134位於出風口 112之 前二上蓋凹陷部m之第一底面126與第一側壁128以及 下蓋凹陷部134之第二底面136與第二側壁138可以增加 6 [ S] 201221780 與出風口 112之氣流的熱交換面積，有效增加風扇上蓋120 及風扇下蓋130的熱交換效率。 散熱裝置100可更包含有熱管140。熱管140之材料 為導熱性佳之金屬，如銅或鋁。熱管14〇之第一端142與 一熱源150接觸’熱管140之第二端144則是與上蓋凹陷 部124之第一底面126以及下蓋凹陷部134之第二底面136 接觸。如此一來’熱源150所產生的熱量可以經由熱管14〇 傳遞至上蓋凹陷部124與下蓋凹陷部丨34,再與出風口 112 所吹出的氣流進行熱交換後散逸。 散熱裝置100可更包含有導熱板16〇，導熱板16〇之 材料可為導熱性佳之金屬，如銅或鋁。導熱板16〇設置於 熱管140之第一端142，且與熱源15〇接觸。導熱板16〇 可以增加與熱源150的熱交換面積，提升熱管14〇與熱源 150的熱交換效率。 參照第3圖，其繪示本發明之散熱裝置第三實施例的 示意圖。散熱裝置100包含有風扇本體110、風扇上蓋120 及風扇下蓋130。風扇上蓋12〇與風扇下蓋13〇組裝於風 扇本體110上，以保護風扇本體11〇並便於組裝。風扇本 體110具有出風口 112。風扇上蓋12〇具有上蓋前端122 以及多個上蓋凹陷部124，上蓋凹陷部124設置於上蓋前 端122，且位於出風口 112之前。風扇上蓋12〇與風扇下 蓋130之材料可以為導熱性佳之金屬，如銅或銘。 每一個上蓋凹陷部124具有第一底面126以及位於第 —底面126兩側之兩第一側壁128。每一個上蓋凹陷部124 之截面形狀近似於U字型。上蓋凹陷部124可以透過沖壓 201221780 成，的製程直接形成在風扇上蓋i2 陷部以為一冑成形地形成在上蓋前端122上。上盖凹 母一個上蓋凹陷部124具有第一底面126以及位於第 并面U6兩侧之兩第一側壁128。每一個上蓋凹陷部以 ^面幵/狀近似於u字型。上蓋凹陷部124可以透壓 成形的製程直接形成在風扇上蓋no上。換言之，上蓋凹 邛124為一體成形地形成在上蓋前端122上。The direct depression or the lower cover depression can be formed by means of stamping and the group ☆ upper cover or the fan lower cover, which can save material: concave amount. The heat dissipating device further enhances the heat exchange efficiency of the heat dissipating device by the upper cover s D disposed in front of the air outlet. [Embodiment] The spirit of the present invention will be clearly described in the drawings and detailed description. It will be apparent to those skilled in the art that the present invention may be modified and modified without departing from the spirit and scope of the invention. 201221780 Referring to Figure 1, there is shown a schematic view of a first embodiment of a heat sink according to the present invention. The heat sink 100 includes a fan body 110, a fan upper cover 12A, and a fan lower cover 130. The fan upper cover 12 and the fan lower cover 13 are assembled to the fan body 110 to protect the fan body 11 and to be installed. The body no has an air outlet m. The fan upper cover 120 has an upper cover front: a fan 2 and an upper cover recess 124. The upper cover recess 124 is disposed in front of the upper cover 122 and before the air outlet 112. The material of the fan upper cover 12 〇 and the fan lower cover 130 may be a metal having good thermal conductivity such as copper or aluminum. Each of the upper cover recesses 124 has a first bottom surface 126 and two first side walls 128 on opposite sides of the first bottom surface 126. The cross-sectional shape of each of the upper cover recesses 124 is approximately u-shaped. The upper cover recess 124 can be formed directly on the fan upper cover 12 through a stamping process. In other words, the upper cover recess 124 is integrally formed on the front end 122 of the upper cover. Before the upper cover recess 124 is located before the air outlet 112, the first bottom surface 126 and the first side wall 28 of the upper cover recess 124 can increase the heat exchange area with the air flow of the air outlet ^2, effectively increasing the heat exchange efficiency of the fan upper cover 12A. The heat sinking device 100 may further include a heat pipe 14〇. The material of the heat pipe 14 is a metal having good thermal conductivity such as copper or aluminum. The first end 142 of the heat pipe 14 is in contact with the heat source 150. The second end 144 of the heat pipe 14 is in contact with the first bottom surface 126 of the upper cover recess 124. In this way, the heat generated by the heat source 15〇 can be transmitted to the upper cover recessed portion 124 via the heat pipe 140, and then dissipated by heat exchange with the airflow blown by the air outlet 112. The heat sink 100 may further include a heat conducting plate 160. The material of the heat conducting plate 160 may be a metal having good thermal conductivity such as copper or aluminum. The heat conducting plate 16 is disposed at the first end 142 of the heat pipe 140 and is in contact with the heat source 15A. The heat conducting plate l6 (|y 5 201221780 can increase the heat exchange area with the heat source 15A) enhances the heat exchange efficiency of the heat pipe 140 and the heat source 150. Referring to Fig. 2, there is shown a schematic view of a second embodiment of the heat sink of the present invention. The heat sink 1 includes a fan body 110, a fan upper cover 120, and a fan lower cover 130. The fan upper disk 120 and the fan lower cover 130 are assembled on the fan body 110 to protect the fan body 110 and facilitate assembly. The fan body 110 has a The tuyere 112 has a top cover front end 122 and a plurality of upper cover recesses 124 at the front end 122 of the upper cover. The fan lower cover 130 has a lower cover front end 132 and a plurality of lower cover recesses 134 at the front end 132 of the lower cover. The cover 124 and the lower cover recess 134 are located before the air outlet 112. The material of the fan upper cover 120 and the fan lower cover 130 may be a metal with good thermal conductivity, such as copper or aluminum. The upper cover recess 124 has a first bottom surface 126 and a bottom surface. Two first side walls 128 on both sides of the 126. The cross-sectional shape of each of the upper cover recesses 124 is approximately U-shaped. The upper cover recess 124 can be processed through a stamping process. The upper cover recessed portion 124 is integrally formed on the upper cover front end 122. Each of the lower cover recessed portions 134 has a second bottom surface 136 and two second sides on the two sides of the second bottom surface 136. The side wall 138. The cross-sectional shape of each of the lower cover recessed portions 134 is approximately u-shaped. The lower cover recessed portion 134 can be directly formed on the fan lower cover 〇3〇 through a press forming process. In other words, the lower cover recessed portion 134 is Formed integrally on the front end of the lower cover. The upper cover recessed portion 124 and the lower cover recessed portion 134 are located before the air outlet 112, the first bottom surface 126 of the upper cover recess portion m and the first bottom surface 128 and the second bottom surface 136 of the lower cover recess portion 134 The heat exchange area between the fan cover 120 and the fan cover 130 can be increased by the heat exchange area of the fan cover 120 and the fan cover 130. The heat sink 100 can further include a heat pipe 140. The material is a metal with good thermal conductivity, such as copper or aluminum. The first end 142 of the heat pipe 14 is in contact with a heat source 150. The second end 144 of the heat pipe 140 is the first bottom surface 12 of the recess 124 of the upper cover. 6 and the second bottom surface 136 of the lower cover recess 134 are in contact. Thus, the heat generated by the heat source 150 can be transmitted to the upper cover recess 124 and the lower cover recess 34 via the heat pipe 14 , and then blown out from the air outlet 112 . The heat dissipating device 100 may further comprise a heat conducting plate 16〇, and the material of the heat conducting plate 16〇 may be a metal with good thermal conductivity, such as copper or aluminum. The heat conducting plate 16〇 is disposed at the first end of the heat pipe 140. 142, and in contact with the heat source 15A. The heat conducting plate 16 〇 can increase the heat exchange area with the heat source 150 and increase the heat exchange efficiency of the heat pipe 14 〇 and the heat source 150. Referring to Fig. 3, there is shown a schematic view of a third embodiment of the heat sink of the present invention. The heat sink 100 includes a fan body 110, a fan upper cover 120, and a fan lower cover 130. The fan upper cover 12 and the fan lower cover 13 are assembled to the fan body 110 to protect the fan body 11 and facilitate assembly. The fan body 110 has an air outlet 112. The fan upper cover 12 has an upper cover front end 122 and a plurality of upper cover recesses 124. The upper cover recessed portion 124 is disposed at the upper cover front end 122 and is located before the air outlet 112. The material of the fan upper cover 12 〇 and the fan lower cover 130 may be a metal having good thermal conductivity, such as copper or Ming. Each of the upper cover recesses 124 has a first bottom surface 126 and two first side walls 128 on opposite sides of the first bottom surface 126. The cross-sectional shape of each of the upper cover recesses 124 is approximately U-shaped. The upper cover recess 124 can be formed by stamping 201221780, and the process is directly formed on the fan cover i2 recessed portion to be formed on the front cover front end 122 in a single shape. The upper cover recessed portion 124 has a first bottom surface 126 and two first side walls 128 on both sides of the second surface U6. Each of the upper cover recesses is approximately u-shaped in a facet/shape. The upper cover recess 124 can be formed directly on the fan upper cover no by a process of pressure forming. In other words, the upper cover recess 124 is integrally formed on the front end 122 of the upper cover.
上蓋凹陷部124位於出風口 112之前，上蓋凹陷部124 ，第一底面126與第一側壁128可以增加與出風口 112之 氣流的熱交換面積，有效增加風扇上蓋12〇的熱交換效率。 風扇上蓋120更包含有延伸部17〇。延伸部17〇由風 扇本體110向外延伸至熱源150，並與熱源15〇接觸。延 伸部170之形狀可以根據風扇本體11〇至熱源15〇的路徑 设计。熱源150可以和與其接觸的延伸部17〇進行熱交換， 使得熱源150產生的熱由延伸部17〇傳導至上蓋凹陷部 124’上蓋凹陷部124再與出風口 U2所吹出之氣流進行熱 交換而將熱量帶走。 參照第4圖，其繪示本發明之散熱裝置第四實施例的 示意圖。散熱裝置100包含有風扇本體110、風扇上蓋12〇 及風扇下蓋130。風扇上蓋120與風扇下蓋130組裝於風 扇本體110上，以保護風扇本體11〇並便於組裝❶風扇本 體丨1〇具有出風口 112。風扇上蓋120具有上蓋前端122 以及位於上蓋前端122之多個上蓋凹陷部124。風扇下蓋 130具有下蓋前端132以及位於下蓋前端132之多個下蓋 凹陷部134。上蓋凹陷部124與下蓋凹陷部134位於出風 [S] 8 201221780 口 112之前。風扇上蓋120與風扇下蓋130之材料可以為 導熱性佳之金屬，如銅或銘。 每一個上蓋凹陷部124具有第一底面126以及位於第 一底面126兩側之兩第一側壁128。每一個上蓋凹陷部124 之截面形狀近似於U字型。上蓋凹陷部124可以透過沖壓 成形的製程直接形成在風扇上蓋120上。換言之，上蓋凹 陷部124為一體成形地形成在上蓋前端122上。 每一個下蓋凹陷部134具有第二底面136以及位於第 二底面136兩側之兩第二側壁138。每一個下蓋凹陷部134 之截面形狀近似於U字型。下蓋凹陷部134可以透過沖壓 成形的製程直接形成在風扇下蓋130上。換言之，下蓋凹 陷部134為一體成形地形成在下蓋前端132上。 上蓋凹陷部124與下蓋凹陷部134位於出風口 112之 前，上蓋凹陷部124之第一底面126與第一側壁128以及 下蓋凹陷部134之第二底面136與第二側壁138可以增加 與出風口 112之氣流的熱交換面積，有效增加風扇上蓋120 及風扇下蓋130的熱交換效率。 風扇上蓋120更包含有延伸部170。延伸部170由風 扇本體110向外延伸至熱源150，並與熱源150接觸。延 伸部170之形狀可以根據風扇本體110至熱源150的路徑 設計。熱源150可以和與其接觸的延伸部170進行熱交換， 使得熱源150產生的熱由延伸部170傳導至上蓋凹陷部 124,上蓋凹陷部124再與出風口 112所吹出之氣流進行熱 交換而將熱量帶走。 參照第5圖，其繪示本發明之散熱裝置第五實施例的 201221780 示意圖。散熱裝置100包含有風扇本體110、風扇上蓋120 及風扇下蓋130。風扇上蓋120與風扇下蓋130組裝於風 扇本體110上，以保護風扇本體110並便於組裝。風扇本 體11〇具有出風口 112。風扇上蓋12〇具有上蓋前端122 以及位於上蓋前端122之多個上蓋凹陷部124。風扇下蓋Before the upper cover recess 124 is located before the air outlet 112, the upper cover recess 124, the first bottom surface 126 and the first side wall 128 can increase the heat exchange area with the air flow of the air outlet 112, thereby effectively increasing the heat exchange efficiency of the fan upper cover 12〇. The fan upper cover 120 further includes an extension portion 17A. The extension 17 is extended outwardly from the fan body 110 to the heat source 150 and is in contact with the heat source 15A. The shape of the extension 170 can be designed according to the path of the fan body 11 to the heat source 15A. The heat source 150 can exchange heat with the extending portion 17〇 in contact with the heat source 150, so that the heat generated by the heat source 150 is conducted by the extending portion 17〇 to the upper cover recess portion 124', and the cover recess portion 124 is heat exchanged with the airflow blown by the air outlet U2. Take the heat away. Referring to Figure 4, there is shown a schematic view of a fourth embodiment of the heat sink of the present invention. The heat sink 100 includes a fan body 110, a fan upper cover 12A, and a fan lower cover 130. The fan upper cover 120 and the fan lower cover 130 are assembled on the fan body 110 to protect the fan body 11 and facilitate assembly. The fan body 〇1 has an air outlet 112. The fan upper cover 120 has an upper cover front end 122 and a plurality of upper cover recessed portions 124 at the upper cover front end 122. The fan lower cover 130 has a lower cover front end 132 and a plurality of lower cover recessed portions 134 at the lower cover front end 132. The upper cover recess 124 and the lower cover recess 134 are located before the outlet [S] 8 201221780 port 112. The material of the fan upper cover 120 and the fan lower cover 130 may be a metal having good thermal conductivity, such as copper or Ming. Each of the upper cover recesses 124 has a first bottom surface 126 and two first side walls 128 on opposite sides of the first bottom surface 126. The cross-sectional shape of each of the upper cover recesses 124 is approximately U-shaped. The upper cover recess 124 can be formed directly on the fan upper cover 120 by a press forming process. In other words, the upper cover recess 124 is integrally formed on the front end 122 of the upper cover. Each of the lower cover recesses 134 has a second bottom surface 136 and two second side walls 138 on opposite sides of the second bottom surface 136. The cross-sectional shape of each of the lower cover recesses 134 is approximately U-shaped. The lower cover recess 134 can be formed directly on the fan lower cover 130 by a press forming process. In other words, the lower cover recessed portion 134 is integrally formed on the lower cover front end 132. Before the upper cover recess 124 and the lower cover recess 134 are located before the air outlet 112, the first bottom surface 126 of the upper cover recess 124 and the first bottom surface 128 and the second bottom surface 136 and the second side wall 138 of the lower cover recess 134 may be added and removed. The heat exchange area of the airflow of the tuyere 112 effectively increases the heat exchange efficiency of the fan upper cover 120 and the fan lower cover 130. The fan upper cover 120 further includes an extension portion 170. The extension 170 extends outwardly from the fan body 110 to the heat source 150 and is in contact with the heat source 150. The shape of the extension 170 can be designed according to the path of the fan body 110 to the heat source 150. The heat source 150 can exchange heat with the extension portion 170 in contact with the heat source 150, so that the heat generated by the heat source 150 is conducted by the extension portion 170 to the upper cover recess portion 124, and the upper cover recess portion 124 exchanges heat with the airflow blown from the air outlet 112 to transfer heat. take away. Referring to Fig. 5, there is shown a schematic diagram of a 201221780 of a fifth embodiment of the heat sink of the present invention. The heat sink 100 includes a fan body 110, a fan upper cover 120, and a fan lower cover 130. The fan upper cover 120 and the fan lower cover 130 are assembled to the fan body 110 to protect the fan body 110 and facilitate assembly. The fan body 11 has an air outlet 112. The fan upper cover 12A has an upper cover front end 122 and a plurality of upper cover recessed portions 124 at the upper cover front end 122. Fan cover
130具有下蓋前端132以及位於下蓋前端132之多個下蓋 凹陷部134。上蓋凹陷部124與下蓋凹陷部134位於出風 口 112之前。風扇上蓋12〇與風扇下蓋13〇之材料可以為 導熱性佳之金屬’如銅或鋁。 母一個上盍凹陷部124具有第一底面126以及位於第 一底面126兩側之兩第一側壁128。每一個上蓋凹陷部124 之截面形狀近似於u字型。上蓋凹陷部124可以透過沖壓 成形的製程直接形成在風扇上蓋12〇上。換言之，上蓋凹 陷。M24為-體成形地形成在上蓋前端122上。 每-個下蓋凹陷部134具有第二底面136以及位於第 并面U6兩側之兩第二側壁】每一個下蓋凹陷部134 2狀近似於U字型。下蓋凹陷部134可以透過沖壓 =製程直接形成在風屬下蓋肌。換言之，下蓋凹 陷部=為-航形地形成在下發端132上。 二f凹陷部124與下蓋凹陷部134位於出風口 112之 刖’上盍凹陷部124夕笙士 ^ 下蓋凹陷物之第,1:底自126與第一侧㈣8以及 與出風口 112之氣、C136與第塌138可以増加 及風扇下交換=面積’有效增加風扇上蓋⑽ 散熱襄置1〇0可更包含有熱管140。熱管140之材料 201221780 為導熱性佳之金屬，如銅或鋁。熱管丨4〇之第一端142與 一熱源150接觸，熱管140之第二端H4則是與上蓋凹陷 部124之第一底面126以及下蓋凹陷部134之第二底面136 接觸。如此一來，熱源150所產生的熱量可以經由熱管140 傳遞至上蓋凹陷部124與下蓋凹陷部134,再與出風口 112 所吹出的氣流進行熱交換後散逸。 散熱裝置100可更包含有導熱板160，導熱板160之 材料可為導熱性佳之金屬’如銅或鋁。導熱板16〇設置於 熱管14〇之第一端M2 ’且與熱源iso接觸。導熱板16〇 可以增加與熱源150的熱交換面積，提升熱管“ο與熱源 150的熱交換效率。 風扇上蓋120更包含有延伸部170。延伸部17〇由風 扇本體110向外延伸至另一熱源180,並與熱源18〇接觸。 延伸部170之形狀可以根據風扇本體110至熱源18〇的路 徑設計。熱源180可以和與其接觸的延伸部17〇進行熱交 換，使得熱源180產生的熱由延伸部170傳導至上蓋凹陷 部124，上蓋凹陷部124再與出風口 112所吹出之氣流進 行熱交換而將熱量帶走。 由上述本發明較佳實施例可知，應用本發明具有下列 優點。上蓋凹陷部或是下蓋凹陷部可以透過沖壓成形的方 式直接形成在風扇上蓋或是風扇下蓋上，可以節省材料成 本以及組件的數量。散熱裝置更藉由設置於出風口前的上 蓋凹陷部增加了熱交換面積，有效提升散熱裝置的熱交換 效率。 雖然本發明已以一較佳實施例揭露如上，然其並 201221780 以限定本發明，任何熟習此技藝者，在不脫離本發明之精 神和範圍内，當可作各種之更動與潤飾，因此本發明之保 護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下： • 第1圖繪示本發明之散熱裝置第一實施例的示意圖。 第2圖繪示本發明之散熱裝置第二實施例的示意圖。 第3圖繪示本發明之散熱裝置第三實施例的示意圖。 第4圖繪示本發明之散熱裝置第四實施例的示意圖。 第5圖繪示本發明之散熱裝置第五實施例的示意圖。 【主要元件符號說明】 100 散熱裝置 134 下蓋凹陷部 110 風扇本體 136 第二底面 112 出風口 138 第二側壁 120 風扇上蓋 140 熱管 122 上蓋前端 142 第一端 124 上蓋凹陷部 144 第二端 126 第一底面 150 熱源 128 第一側壁 160 導熱板 130 風扇下蓋 170 延伸部 132 下蓋前端 180 熱源 [S] 12The 130 has a lower cover front end 132 and a plurality of lower cover recesses 134 at the lower cover front end 132. The upper cover recess 124 and the lower cover recess 134 are located before the air outlet 112. The material of the fan upper cover 12 〇 and the fan lower cover 13 可以 may be a metal having good thermal conductivity such as copper or aluminum. The female upper upper recess 124 has a first bottom surface 126 and two first side walls 128 on either side of the first bottom surface 126. The cross-sectional shape of each of the upper cover recesses 124 is approximately u-shaped. The upper cover recess 124 can be formed directly on the fan upper cover 12 through a stamping process. In other words, the upper cover is recessed. M24 is formed in a body-formed shape on the front end 122 of the upper cover. Each of the lower cover recesses 134 has a second bottom surface 136 and two second side walls on both sides of the second surface U6. Each of the lower cover recesses 134 is approximately U-shaped. The lower cover recess 134 can be directly formed on the wind suboccipital muscle through a stamping process. In other words, the lower cover recessed portion is formed in the airfoil shape on the lower end 132. The second f recessed portion 124 and the lower cover recessed portion 134 are located at the top of the air outlet 112, and the first recessed portion of the recessed portion 124, the first bottom from the 126 and the first side (four) 8 and the air outlet 112 Gas, C136 and the first collapse 138 can be added and exchanged under the fan = area 'effectively increase the fan upper cover (10) The heat dissipation device 1 〇 0 can further include the heat pipe 140. The material of the heat pipe 140 201221780 is a metal with good thermal conductivity, such as copper or aluminum. The first end 142 of the heat pipe 接触4 is in contact with a heat source 150, and the second end H4 of the heat pipe 140 is in contact with the first bottom surface 126 of the upper cover recess 124 and the second bottom surface 136 of the lower cover recess 134. In this way, the heat generated by the heat source 150 can be transmitted to the upper cover recess portion 124 and the lower cover recess portion 134 via the heat pipe 140, and then exchanged with the airflow blown by the air outlet 112 to dissipate. The heat sink 100 may further include a heat conducting plate 160. The material of the heat conducting plate 160 may be a metal having good thermal conductivity such as copper or aluminum. The heat conducting plate 16 is disposed at the first end M2' of the heat pipe 14'' and is in contact with the heat source iso. The heat conducting plate 16〇 can increase the heat exchange area with the heat source 150, and improve the heat exchange efficiency of the heat pipe “o” with the heat source 150. The fan upper cover 120 further includes an extension 170. The extension 17〇 extends outward from the fan body 110 to another The heat source 180 is in contact with the heat source 18. The shape of the extension 170 can be designed according to the path of the fan body 110 to the heat source 18A. The heat source 180 can exchange heat with the extension 17〇 in contact therewith, so that the heat generated by the heat source 180 is The extension portion 170 is conducted to the upper cover recess portion 124, and the upper cover recess portion 124 exchanges heat with the air flow blown from the air outlet 112 to carry away heat. From the above preferred embodiment of the present invention, the application of the present invention has the following advantages. The recessed portion or the depressed portion of the lower cover can be directly formed on the fan upper cover or the fan lower cover by means of press forming, which can save material cost and the number of components. The heat dissipation device is further increased by the upper cover recessed portion disposed in front of the air outlet. The heat exchange area is effective to improve the heat exchange efficiency of the heat sink. Although the present invention has been disclosed above in a preferred embodiment, And 201221780, in order to limit the invention, those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the invention, and therefore the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; 2 is a schematic view of a second embodiment of a heat sink according to the present invention. Fig. 3 is a schematic view showing a third embodiment of the heat sink of the present invention. Fig. 5 is a schematic view showing a fifth embodiment of the heat sink of the present invention. [Main component symbol description] 100 heat sink 134 lower cover recess 110 fan body 136 second bottom surface 112 air outlet 138 second side wall 120 fan upper cover 140 heat pipe 122 upper cover front end 142 first end 124 upper cover recess 144 second end 126 first bottom surface 150 heat source 128 first Side wall 160 Thermal plate 130 Fan lower cover 170 Extension 132 Lower cover front 180 Heat source [S] 12