US20120125570A1 - Heat dissipating device - Google Patents

Heat dissipating device Download PDF

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Publication number
US20120125570A1
US20120125570A1 US13/080,678 US201113080678A US2012125570A1 US 20120125570 A1 US20120125570 A1 US 20120125570A1 US 201113080678 A US201113080678 A US 201113080678A US 2012125570 A1 US2012125570 A1 US 2012125570A1
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US
United States
Prior art keywords
cover
recessions
heat
fan
dissipating device
Prior art date
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Abandoned
Application number
US13/080,678
Inventor
Feng-Ku Wang
Hua-Fong Chen
Ting-Chiang Huang
Sheng-Jie Syu
Chih-Kuang Chung
Kai-Lin KUO
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Inventec Corp
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Inventec Corp
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Assigned to INVENTEC CORPORATION reassignment INVENTEC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, HUA-FONG, CHUNG, CHIH-KUANG, HUANG, TING-CHIANG, KUO, KAI-LIN, SYU, SHENG-JIE, WANG, FENG-KU
Publication of US20120125570A1 publication Critical patent/US20120125570A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat dissipating device. More particularly, the present invention relates to a fan structure.
  • a computer system (e.g. personal computer, server host etc.) produces waste heat in operation.
  • the waste heat produced by the computer system in operation is greatly increased accordingly. If the waste heat produced in the operation of the computer system is not removed, the computer system performance would be reduced or even a computer system crash or damage may be caused. Therefore, a heat dissipating device is needed for removing the waste heat produced by the computer system in operation.
  • the heat dissipating device in the computer system connects a heat-generating element and a heat dissipating fin disposed at an airflow outlet of the fan with a heat pipe.
  • the heat produced by the heat-generating element is conducted to the heat dissipating fin through the heat pipe, so that the heat on the heat dissipating fin is taken away by an airflow blown by the fan.
  • the heat dissipating device needs plural components in cooperation, so the cost is high.
  • there is another heat dissipating method in which a cover plate of the fan is in direct contact with the heat-generating element without additionally using the heat dissipating fin.
  • the heat exchange efficiency of this heat dissipating method is insufficient.
  • the present invention is directed to provide a heat dissipating device, which reduces the number of required components and effectively dissipates heat.
  • a heat dissipating device includes a fan body, an upper fan cover and a lower fan cover.
  • the fan body has an airflow outlet.
  • the upper fan cover and the lower fan cover are assembled on the fan body.
  • the upper fan cover includes an upper cover front portion, and multiple upper cover recessions disposed at the upper cover front portion. The upper cover recessions are located in front of the airflow outlet.
  • Each of the upper cover recessions includes a first bottom and two first side walls located on two sides of the first bottom.
  • the heat dissipating device may further include a heat pipe with a first end contacting a heat source and a second end contacting the first bottom.
  • the lower fan cover may include a lower cover front portion and multiple lower cover recessions disposed at the lower cover front portion. The lower cover recessions are located in front of the airflow outlet. The second end of the heat pipe may be in contact with the lower cover recessions.
  • the heat dissipating device may further include a heat plate. The heat plate is disposed at the first end of the heat pipe to contact the heat source.
  • the upper fan cover may further include an extending portion. The extending portion is in contact with another heat source.
  • a material of the upper fan cover and the lower fan cover can be copper or aluminum.
  • the upper cover recessions or the lower cover recessions may be directly formed on the upper fan cover or the lower fan cover by stamping, thus the material cost and the number of components can be reduced.
  • the heat dissipating device further expands a heat exchange area by the upper cover recessions disposed in front of the airflow outlet, thereby the heat exchange efficiency of the heat dissipating device can be effectively improved.
  • FIG. 1 is a schematic diagram of a heat dissipating device according to a first embodiment of the present invention
  • FIG. 2 is a schematic diagram of the heat dissipating device according to a second embodiment of the present invention.
  • FIG. 3 is a schematic diagram of the heat dissipating device according to a third embodiment of the present invention.
  • FIG. 4 is a schematic diagram of the heat dissipating device according to a fourth embodiment of the present invention.
  • FIG. 5 is a schematic diagram of the heat dissipating device according to a fifth embodiment of the present invention.
  • FIG. 1 is a schematic diagram of a heat dissipating device according to a first embodiment of the present invention.
  • the heat dissipating device 100 includes a fan body 110 , an upper fan cover 120 , and a lower fan cover 130 .
  • the upper fan cover 120 and the lower fan cover 130 are assembled on the fan body 110 to protect the fan body 110 , and are convenient to be assembled.
  • the fan body 110 has an airflow outlet 112 .
  • the upper fan cover 120 has an upper cover front portion 122 and plural upper cover recessions 124 .
  • the upper cover recessions 124 are disposed at the upper cover front portion 122 and located in front of the airflow outlet 112 .
  • a material of the upper fan cover 120 and the lower fan cover 130 may be a metal with a good thermal conductivity, such as copper or aluminum.
  • Each of the upper cover recessions 124 has a first bottom 126 and two first side walls 128 located on two sides of the first bottom 126 .
  • Each of the upper cover recessions 124 has an approximately U-shaped cross-section.
  • the upper cover recessions 124 may be directly formed on the upper fan cover 120 by stamping. In other words, the upper cover recessions 124 are integrally formed on the upper cover front portion 122 .
  • the upper cover recessions 124 are located in front of the airflow outlet 112 .
  • the first bottom 126 and the first side walls 128 of the upper cover recessions 124 can increase the heat exchange area with the airflow from the airflow outlet 112 , thereby the heat exchange efficiency of the upper fan cover 120 can be effectively increased.
  • the heat dissipating device 100 may further include a heat pipe 140 .
  • the material of the heat pipe 140 may be a metal with a good thermal conductivity, such as copper or aluminum.
  • a first end 142 of the heat pipe 140 is in contact with a heat source 150
  • a second end 144 of the heat pipe 140 is in contact with the first bottom 126 of the upper cover recessions 124 .
  • the heat produced by the heat source 150 may be transferred to the upper cover recessions 124 through the heat pipe 140 , and then is dissipated after exchanging heat with the airflow blown from the airflow outlet 112 .
  • the heat dissipating device 100 may further include a heat plate 160 .
  • the material of the heat plate 160 may be metal with good thermal conductivity, such as copper or aluminum.
  • the heat plate 160 is disposed at the first end 142 of the heat pipe 140 and is in contact with the heat source 150 .
  • the heat plate 160 can increase the heat exchange area with the heat source 150 , thereby the heat exchange efficiency of the heat pipe 140 with the heat source 150 can be improved.
  • FIG. 2 is a schematic diagram of a heat dissipating device according to a second embodiment of the present invention.
  • the heat dissipating device 100 includes the fan body 110 , the upper fan cover 120 , and the lower fan cover 130 .
  • the upper fan cover 120 and the lower fan cover 130 are assembled on the fan body 110 to protect the fan body 110 and are convenient to be assembled.
  • the fan body 110 has the airflow outlet 112 .
  • the upper fan cover 120 has the upper cover front portion 122 and plural upper cover recessions 124 located at the upper cover front portion 122 .
  • the lower fan cover 130 has the lower cover front portion 132 and plural lower cover recessions 134 located at the lower cover front portion 132 .
  • the upper cover recessions 124 and the lower cover recessions 134 are located in front of the airflow outlet 112 .
  • the material of the upper fan cover 120 and the lower fan cover 130 may be a metal with a good thermal conductivity, such as copper or aluminum.
  • Each of the upper cover recessions 124 has the first bottom 126 and two first side walls 128 located on two sides of the first bottom 126 .
  • Each of the upper cover recessions 124 has an approximately U-shaped cross-section.
  • the upper cover recessions 124 may be directly formed on the upper fan cover 120 by stamping. In other words, the upper cover recessions 124 are integrally formed on the upper cover front portion 122 .
  • Each of the lower cover recessions 134 has a second bottom 136 and two second side walls 138 located on two sides of the second bottom 136 .
  • Each of the lower cover recessions 134 has an approximately U-shaped cross-section.
  • the lower cover recessions 134 may be directly formed on the lower fan cover 130 by stamping. In other words, the lower cover recessions 134 are integrally formed on the lower cover front portion 132 .
  • the upper cover recessions 124 and the lower cover recessions 134 are located in front of the airflow outlet 112 .
  • the first bottom 126 and the first side walls 128 of the upper cover recessions 124 and the second bottom 136 and the second side walls 138 of the lower cover recessions 134 can increase the heat exchange area with the airflow from the airflow outlet 112 , thereby the heat exchange efficiency of the upper fan cover 120 and the lower fan cover 130 can be effectively increased.
  • the heat dissipating device 100 may further include the heat pipe 140 .
  • the material of the heat pipe 140 is a metal with a good thermal conductivity, such as copper or aluminum.
  • the first end 142 of the heat pipe 140 is in contact with the heat source 150
  • the second end 144 of the heat pipe 140 is in contact with the first bottom 126 of the upper cover recessions 124 and the second bottom 136 of the lower cover recessions 134 .
  • the heat produced by the heat source 150 may be transferred to the upper cover recessions 124 and the lower cover recessions 134 through the heat pipe 140 , and then is dissipated after exchanging heat with the airflow blown from the airflow outlet 112 .
  • the heat dissipating device 100 may further include the heat plate 160 .
  • the material of the heat plate 160 may be a metal with a good thermal conductivity, such as copper or aluminum.
  • the heat plate 160 is disposed at the first end 142 of the heat pipe 140 and is in contact with the heat source 150 .
  • the heat plate 160 can increase the heat exchange area with the heat source 150 , thereby improving the heat exchange efficiency of the heat pipe 140 with the heat source 150 .
  • FIG. 3 is a schematic diagram of a heat dissipating device according to a third embodiment of the present invention.
  • the heat dissipating device 100 includes the fan body 110 , the upper fan cover 120 , and the lower fan cover 130 .
  • the upper fan cover 120 and the lower fan cover 130 are assembled on the fan body 110 to protect the fan body 110 and are convenient to be assembled.
  • the fan body 110 has the airflow outlet 112 .
  • the upper fan cover 120 has the upper cover front portion 122 and plural upper cover recessions 124 .
  • the upper cover recessions 124 are disposed at the upper cover front portion 122 and located in front of the airflow outlet 112 .
  • the material of the upper fan cover 120 and the lower fan cover 130 may be a metal with a good thermal conductivity, such as copper or aluminum.
  • Each of the upper cover recessions 124 has the first bottom 126 and two first side walls 128 located on two sides of the first bottom 126 .
  • Each of the upper cover recessions 124 has an approximately U-shaped cross-section.
  • the upper cover recessions 124 may be directly formed on the upper fan cover 120 by stamping. In other words, the upper cover recessions 124 are integrally formed on the upper cover front portion 122 .
  • Each of the upper cover recessions 124 has the first bottom 126 and two first side walls 128 located on two sides of the first bottom 126 .
  • Each of the upper cover recessions 124 has an approximately U-shaped cross-section.
  • the upper cover recessions 124 may be directly formed on the upper fan cover 120 by stamping. In other words, the upper cover recessions 124 are integrally formed on the upper cover front portion 122 .
  • the upper cover recessions 124 are located in front of the airflow outlet 112 .
  • the first bottom 126 and the first side walls 128 of the upper cover recessions 124 can increase the heat exchange area with the airflow from the airflow outlet 112 , thereby the heat exchange efficiency of the upper fan cover 120 can be effectively increased.
  • the upper fan cover 120 further includes an extending portion 170 .
  • the extending portion 170 extends outwards from the fan body 110 to the heat source 150 and is in contact with the heat source 150 .
  • the shape of the extending portion 170 may be designed according to the path from the fan body 110 to the heat source 150 .
  • the heat source 150 may exchange heat with the extending portion 170 in contact with the heat source 150 , so that the heat produced by the heat source 150 is conducted through the extending portion 170 to the upper cover recessions 124 , and the upper cover recessions 124 exchange heat with the airflow blown from the airflow outlet 112 to take away the heat.
  • FIG. 4 is a schematic diagram of a heat dissipating device according to a fourth embodiment of the present invention.
  • the heat dissipating device 100 includes the fan body 110 , the upper fan cover 120 , and the lower fan cover 130 .
  • the upper fan cover 120 and the lower fan cover 130 are assembled on the fan body 110 to protect the fan body 110 and are convenient to be assembled.
  • the fan body 110 has the airflow outlet 112 .
  • the upper fan cover 120 has the upper cover front portion 122 and plural upper cover recessions 124 located at the upper cover front portion 122 .
  • the lower fan cover 130 has the lower cover front portion 132 and plural lower cover recessions 134 located at the lower cover front portion 132 .
  • the upper cover recessions 124 and the lower cover recessions 134 are located in front of the airflow outlet 112 .
  • the material of the upper fan cover 120 and the lower fan cover 130 may be a metal with a good thermal conductivity, such as copper or aluminum.
  • Each of the upper cover recessions 124 has the first bottom 126 and two first side walls 128 located on two sides of the first bottom 126 .
  • Each of the upper cover recessions 124 has an approximately U-shaped cross-section.
  • the upper cover recessions 124 may be directly formed on the upper fan cover 120 by stamping. In other words, the upper cover recessions 124 are integrally formed on the upper cover front portion 122 .
  • Each of the lower cover recessions 134 has the second bottom 136 and two second side walls 138 located on two sides of the second bottom 136 .
  • Each of the lower cover recessions 134 has an approximately U-shaped cross-section.
  • the lower cover recessions 134 may be directly formed on the lower fan cover 130 by stamping. In other words, the lower cover recessions 134 are integrally formed on the lower cover front portion 132 .
  • the upper cover recessions 124 and the lower cover recessions 1 . 34 are located in front of the airflow outlet 112 .
  • the first bottom 126 and the first side walls 128 of the upper cover recessions 124 and the second bottom 136 and the second side walls 138 of the lower cover recessions 134 can increase the heat exchange area with the airflow from the airflow outlet 112 , thereby the heat exchange efficiency of the upper fan cover 120 and the lower fan cover 130 can be effectively increased.
  • the upper fan cover 120 further includes the extending portion 170 .
  • the extending portion 170 extends outwards from the fan body 110 to the heat source 150 and is in contact with the heat source 150 .
  • the shape of the extending portion 170 may be designed according to the path from the fan body 110 to the heat source 150 .
  • the heat source 150 may exchange heat with the extending portion 170 in contact with the heat source 150 , so that the heat produced by the heat source 150 is conducted through the extending portion 170 to the upper cover recessions 124 , and the upper cover recessions 124 exchange heat with the airflow blown from the airflow outlet 112 to take away the heat.
  • FIG. 5 is a schematic diagram of a heat dissipating device according to a fifth embodiment of the present invention.
  • the heat dissipating device 100 includes the fan body 110 , the upper fan cover 120 , and the lower fan cover 130 .
  • the upper fan cover 120 and the lower fan cover 130 are assembled on the fan body 110 to protect the fan body 110 and are convenient to be assembled.
  • the fan body 110 has the airflow outlet 112 .
  • the upper fan cover 120 has the upper cover front portion 122 and plural upper cover recessions 124 located at the upper cover front portion 122 .
  • the lower fan cover 130 has the lower cover front portion 132 and plural lower cover recessions 134 located at the lower cover front portion 132 .
  • the upper cover recessions 124 and the lower cover recessions 134 are located in front of the airflow outlet 112 .
  • the material of the upper fan cover 120 and the lower fan cover 130 may be a metal with a good thermal conductivity, such as copper or aluminum.
  • Each of the upper cover recessions 124 has the first bottom 126 and two first side walls 128 located on two sides of the first bottom 126 .
  • Each of the upper cover recessions 124 has an approximately U-shaped cross-section.
  • the upper cover recessions 124 may be directly formed on the upper fan cover 120 by stamping. In other words, the upper cover recessions 124 are integrally formed on the upper cover front portion 122 .
  • Each of the lower cover recessions 134 has the second bottom 136 and two second side walls 138 located on two sides of the second bottom 136 .
  • Each of the lower cover recessions 134 has an approximately U-shaped cross-section.
  • the lower cover recessions 134 may be directly formed on the lower fan cover 130 by stamping. In other words, the lower cover recessions 134 are integrally formed on the lower cover front portion 132 .
  • the upper cover recessions 124 and the lower cover recessions 134 are located in front of the airflow outlet 112 .
  • the first bottom 126 and the first side walls 128 of the upper cover recessions 124 and the second bottom 136 and the second side walls 138 of the lower cover recessions 134 can increase the heat exchange area with the airflow from the airflow outlet 112 , thereby the heat exchange efficiency of the upper fan cover 120 and the lower fan cover 130 can be effectively increased.
  • the heat dissipating device 100 may further include the heat pipe 140 .
  • the material of the heat pipe 140 is a metal with a good thermal conductivity, such as copper or aluminum.
  • the first end 142 of the heat pipe 140 is in contact with the heat source 150
  • the second end 144 of the heat pipe 140 is in contact with the first bottom 126 of the upper cover recessions 124 and the second bottom 136 of the lower cover recessions 134 .
  • the heat produced by the heat source 150 may be transferred to the upper cover recessions 124 and the lower cover recessions 134 through the heat pipe 140 , and then is dissipated after exchanging heat with the airflow blown from the airflow outlet 112 .
  • the heat dissipating device 100 may further include the heat plate 160 .
  • the material of the heat plate 160 may be a metal with a good thermal conductivity, such as copper or aluminum.
  • the heat plate 160 is disposed at the first end 142 of the heat pipe 140 and is in contact with the heat source 150 .
  • the heat plate 160 can increase the heat exchange area with the heat source 150 , thereby the heat exchange efficiency of the heat pipe 140 with the heat source 150 can be improved.
  • the upper fan cover 120 may further include the extending portion 170 .
  • the extending portion 170 extends outwards from the fan body 110 to another heat source 180 and is in contact with the heat source 180 .
  • the shape of the extending portion 170 may be designed according to the path from the fan body 110 to the heat source 180 .
  • the heat source 180 may exchange heat with the extending portion 170 in contact with the heat source 180 , so that the heat produced by the heat source 180 is conducted through the extending portion 170 to the upper cover recessions 124 , and the upper cover recessions 124 exchange heat with the airflow blown from the airflow outlet 112 to take away the heat.
  • the upper cover recessions or the lower cover recessions may be directly formed on the upper fan cover or the lower fan cover by stamping, which saves the material cost and the number of components.
  • the heat dissipating device further expands the heat exchange area by the upper cover recessions disposed in front of the airflow outlet, thereby effectively improving the heat exchange efficiency of the heat dissipating device.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipating device is disclosed, which includes a fan body, an upper fan cover, and a lower fan cover. The upper fan cover and the lower fan cover are assembled on the fan body. The fan body has an airflow outlet. The upper fan cover includes an upper cover front portion, and plural upper cover recessions disposed at the upper cover front portion. The upper cover recessions are located in front of the airflow outlet.

Description

    RELATED APPLICATIONS
  • This application claims priority to Taiwan Application Serial Number 099140008, filed Nov. 19, 2010, which is herein incorporated by reference.
    • BACKGROUND
  • 1. Field of Invention
  • The present invention relates to a heat dissipating device. More particularly, the present invention relates to a fan structure.
  • 2. Description of Related Art
  • A computer system (e.g. personal computer, server host etc.) produces waste heat in operation. With the increase of computer system efficiency, the waste heat produced by the computer system in operation is greatly increased accordingly. If the waste heat produced in the operation of the computer system is not removed, the computer system performance would be reduced or even a computer system crash or damage may be caused. Therefore, a heat dissipating device is needed for removing the waste heat produced by the computer system in operation.
  • In general, the heat dissipating device in the computer system connects a heat-generating element and a heat dissipating fin disposed at an airflow outlet of the fan with a heat pipe. The heat produced by the heat-generating element is conducted to the heat dissipating fin through the heat pipe, so that the heat on the heat dissipating fin is taken away by an airflow blown by the fan. However, the heat dissipating device needs plural components in cooperation, so the cost is high. Or, there is another heat dissipating method in which a cover plate of the fan is in direct contact with the heat-generating element without additionally using the heat dissipating fin. However, the heat exchange efficiency of this heat dissipating method is insufficient.
  • Therefore, there is a need to reduce the number of components of the heat dissipating device without reducing the heat dissipating efficiency.
    • SUMMARY
  • Therefore, the present invention is directed to provide a heat dissipating device, which reduces the number of required components and effectively dissipates heat.
  • According to an embodiment of the present invention, a heat dissipating device includes a fan body, an upper fan cover and a lower fan cover. The fan body has an airflow outlet. The upper fan cover and the lower fan cover are assembled on the fan body. The upper fan cover includes an upper cover front portion, and multiple upper cover recessions disposed at the upper cover front portion. The upper cover recessions are located in front of the airflow outlet.
  • Each of the upper cover recessions includes a first bottom and two first side walls located on two sides of the first bottom. The heat dissipating device may further include a heat pipe with a first end contacting a heat source and a second end contacting the first bottom. The lower fan cover may include a lower cover front portion and multiple lower cover recessions disposed at the lower cover front portion. The lower cover recessions are located in front of the airflow outlet. The second end of the heat pipe may be in contact with the lower cover recessions. The heat dissipating device may further include a heat plate. The heat plate is disposed at the first end of the heat pipe to contact the heat source. The upper fan cover may further include an extending portion. The extending portion is in contact with another heat source. A material of the upper fan cover and the lower fan cover can be copper or aluminum.
  • The upper cover recessions or the lower cover recessions may be directly formed on the upper fan cover or the lower fan cover by stamping, thus the material cost and the number of components can be reduced. The heat dissipating device further expands a heat exchange area by the upper cover recessions disposed in front of the airflow outlet, thereby the heat exchange efficiency of the heat dissipating device can be effectively improved.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The following objectives, features, advantages and embodiments of the present invention can be more fully understood, with reference made to the accompanying drawings as follows:
  • FIG. 1 is a schematic diagram of a heat dissipating device according to a first embodiment of the present invention;
  • FIG. 2 is a schematic diagram of the heat dissipating device according to a second embodiment of the present invention;
  • FIG. 3 is a schematic diagram of the heat dissipating device according to a third embodiment of the present invention;
  • FIG. 4 is a schematic diagram of the heat dissipating device according to a fourth embodiment of the present invention; and
  • FIG. 5 is a schematic diagram of the heat dissipating device according to a fifth embodiment of the present invention.
    •  DETAILED DESCRIPTION
  • Hereinafter, the spirit of the present invention will be illustrated clearly with reference to the drawings and detailed description, and those skilled in the art can make variations and modifications under the teaching of the present invention with reference to the preferred embodiments without departing from the spirit and scope of the present invention.
  • Referring to FIG. 1, FIG. 1 is a schematic diagram of a heat dissipating device according to a first embodiment of the present invention. The heat dissipating device 100 includes a fan body 110, an upper fan cover 120, and a lower fan cover 130. The upper fan cover 120 and the lower fan cover 130 are assembled on the fan body 110 to protect the fan body 110, and are convenient to be assembled. The fan body 110 has an airflow outlet 112. The upper fan cover 120 has an upper cover front portion 122 and plural upper cover recessions 124. The upper cover recessions 124 are disposed at the upper cover front portion 122 and located in front of the airflow outlet 112. A material of the upper fan cover 120 and the lower fan cover 130 may be a metal with a good thermal conductivity, such as copper or aluminum.
  • Each of the upper cover recessions 124 has a first bottom 126 and two first side walls 128 located on two sides of the first bottom 126. Each of the upper cover recessions 124 has an approximately U-shaped cross-section. The upper cover recessions 124 may be directly formed on the upper fan cover 120 by stamping. In other words, the upper cover recessions 124 are integrally formed on the upper cover front portion 122.
  • The upper cover recessions 124 are located in front of the airflow outlet 112. The first bottom 126 and the first side walls 128 of the upper cover recessions 124 can increase the heat exchange area with the airflow from the airflow outlet 112, thereby the heat exchange efficiency of the upper fan cover 120 can be effectively increased.
  • The heat dissipating device 100 may further include a heat pipe 140. The material of the heat pipe 140 may be a metal with a good thermal conductivity, such as copper or aluminum. A first end 142 of the heat pipe 140 is in contact with a heat source 150, and a second end 144 of the heat pipe 140 is in contact with the first bottom 126 of the upper cover recessions 124. In this manner, the heat produced by the heat source 150 may be transferred to the upper cover recessions 124 through the heat pipe 140, and then is dissipated after exchanging heat with the airflow blown from the airflow outlet 112.
  • The heat dissipating device 100 may further include a heat plate 160. The material of the heat plate 160 may be metal with good thermal conductivity, such as copper or aluminum. The heat plate 160 is disposed at the first end 142 of the heat pipe 140 and is in contact with the heat source 150. The heat plate 160 can increase the heat exchange area with the heat source 150, thereby the heat exchange efficiency of the heat pipe 140 with the heat source 150 can be improved.
  • Referring to FIG. 2, FIG. 2 is a schematic diagram of a heat dissipating device according to a second embodiment of the present invention. The heat dissipating device 100 includes the fan body 110, the upper fan cover 120, and the lower fan cover 130. The upper fan cover 120 and the lower fan cover 130 are assembled on the fan body 110 to protect the fan body 110 and are convenient to be assembled. The fan body 110 has the airflow outlet 112. The upper fan cover 120 has the upper cover front portion 122 and plural upper cover recessions 124 located at the upper cover front portion 122. The lower fan cover 130 has the lower cover front portion 132 and plural lower cover recessions 134 located at the lower cover front portion 132. The upper cover recessions 124 and the lower cover recessions 134 are located in front of the airflow outlet 112. The material of the upper fan cover 120 and the lower fan cover 130 may be a metal with a good thermal conductivity, such as copper or aluminum.
  • Each of the upper cover recessions 124 has the first bottom 126 and two first side walls 128 located on two sides of the first bottom 126. Each of the upper cover recessions 124 has an approximately U-shaped cross-section. The upper cover recessions 124 may be directly formed on the upper fan cover 120 by stamping. In other words, the upper cover recessions 124 are integrally formed on the upper cover front portion 122.
  • Each of the lower cover recessions 134 has a second bottom 136 and two second side walls 138 located on two sides of the second bottom 136. Each of the lower cover recessions 134 has an approximately U-shaped cross-section. The lower cover recessions 134 may be directly formed on the lower fan cover 130 by stamping. In other words, the lower cover recessions 134 are integrally formed on the lower cover front portion 132.
  • The upper cover recessions 124 and the lower cover recessions 134 are located in front of the airflow outlet 112. The first bottom 126 and the first side walls 128 of the upper cover recessions 124 and the second bottom 136 and the second side walls 138 of the lower cover recessions 134 can increase the heat exchange area with the airflow from the airflow outlet 112, thereby the heat exchange efficiency of the upper fan cover 120 and the lower fan cover 130 can be effectively increased.
  • The heat dissipating device 100 may further include the heat pipe 140. The material of the heat pipe 140 is a metal with a good thermal conductivity, such as copper or aluminum. The first end 142 of the heat pipe 140 is in contact with the heat source 150, and the second end 144 of the heat pipe 140 is in contact with the first bottom 126 of the upper cover recessions 124 and the second bottom 136 of the lower cover recessions 134. In this manner, the heat produced by the heat source 150 may be transferred to the upper cover recessions 124 and the lower cover recessions 134 through the heat pipe 140, and then is dissipated after exchanging heat with the airflow blown from the airflow outlet 112.
  • The heat dissipating device 100 may further include the heat plate 160. The material of the heat plate 160 may be a metal with a good thermal conductivity, such as copper or aluminum. The heat plate 160 is disposed at the first end 142 of the heat pipe 140 and is in contact with the heat source 150. The heat plate 160 can increase the heat exchange area with the heat source 150, thereby improving the heat exchange efficiency of the heat pipe 140 with the heat source 150.
  • Referring to FIG. 3, FIG. 3 is a schematic diagram of a heat dissipating device according to a third embodiment of the present invention. The heat dissipating device 100 includes the fan body 110, the upper fan cover 120, and the lower fan cover 130. The upper fan cover 120 and the lower fan cover 130 are assembled on the fan body 110 to protect the fan body 110 and are convenient to be assembled. The fan body 110 has the airflow outlet 112. The upper fan cover 120 has the upper cover front portion 122 and plural upper cover recessions 124. The upper cover recessions 124 are disposed at the upper cover front portion 122 and located in front of the airflow outlet 112. The material of the upper fan cover 120 and the lower fan cover 130 may be a metal with a good thermal conductivity, such as copper or aluminum.
  • Each of the upper cover recessions 124 has the first bottom 126 and two first side walls 128 located on two sides of the first bottom 126. Each of the upper cover recessions 124 has an approximately U-shaped cross-section. The upper cover recessions 124 may be directly formed on the upper fan cover 120 by stamping. In other words, the upper cover recessions 124 are integrally formed on the upper cover front portion 122.
  • Each of the upper cover recessions 124 has the first bottom 126 and two first side walls 128 located on two sides of the first bottom 126. Each of the upper cover recessions 124 has an approximately U-shaped cross-section. The upper cover recessions 124 may be directly formed on the upper fan cover 120 by stamping. In other words, the upper cover recessions 124 are integrally formed on the upper cover front portion 122.
  • The upper cover recessions 124 are located in front of the airflow outlet 112. The first bottom 126 and the first side walls 128 of the upper cover recessions 124 can increase the heat exchange area with the airflow from the airflow outlet 112, thereby the heat exchange efficiency of the upper fan cover 120 can be effectively increased.
  • The upper fan cover 120 further includes an extending portion 170. The extending portion 170 extends outwards from the fan body 110 to the heat source 150 and is in contact with the heat source 150. The shape of the extending portion 170 may be designed according to the path from the fan body 110 to the heat source 150. The heat source 150 may exchange heat with the extending portion 170 in contact with the heat source 150, so that the heat produced by the heat source 150 is conducted through the extending portion 170 to the upper cover recessions 124, and the upper cover recessions 124 exchange heat with the airflow blown from the airflow outlet 112 to take away the heat.
  • Referring to FIG. 4, FIG. 4 is a schematic diagram of a heat dissipating device according to a fourth embodiment of the present invention. The heat dissipating device 100 includes the fan body 110, the upper fan cover 120, and the lower fan cover 130. The upper fan cover 120 and the lower fan cover 130 are assembled on the fan body 110 to protect the fan body 110 and are convenient to be assembled. The fan body 110 has the airflow outlet 112. The upper fan cover 120 has the upper cover front portion 122 and plural upper cover recessions 124 located at the upper cover front portion 122. The lower fan cover 130 has the lower cover front portion 132 and plural lower cover recessions 134 located at the lower cover front portion 132. The upper cover recessions 124 and the lower cover recessions 134 are located in front of the airflow outlet 112. The material of the upper fan cover 120 and the lower fan cover 130 may be a metal with a good thermal conductivity, such as copper or aluminum.
  • Each of the upper cover recessions 124 has the first bottom 126 and two first side walls 128 located on two sides of the first bottom 126. Each of the upper cover recessions 124 has an approximately U-shaped cross-section. The upper cover recessions 124 may be directly formed on the upper fan cover 120 by stamping. In other words, the upper cover recessions 124 are integrally formed on the upper cover front portion 122.
  • Each of the lower cover recessions 134 has the second bottom 136 and two second side walls 138 located on two sides of the second bottom 136. Each of the lower cover recessions 134 has an approximately U-shaped cross-section. The lower cover recessions 134 may be directly formed on the lower fan cover 130 by stamping. In other words, the lower cover recessions 134 are integrally formed on the lower cover front portion 132.
  • The upper cover recessions 124 and the lower cover recessions 1.34 are located in front of the airflow outlet 112. The first bottom 126 and the first side walls 128 of the upper cover recessions 124 and the second bottom 136 and the second side walls 138 of the lower cover recessions 134 can increase the heat exchange area with the airflow from the airflow outlet 112, thereby the heat exchange efficiency of the upper fan cover 120 and the lower fan cover 130 can be effectively increased.
  • The upper fan cover 120 further includes the extending portion 170. The extending portion 170 extends outwards from the fan body 110 to the heat source 150 and is in contact with the heat source 150. The shape of the extending portion 170 may be designed according to the path from the fan body 110 to the heat source 150. The heat source 150 may exchange heat with the extending portion 170 in contact with the heat source 150, so that the heat produced by the heat source 150 is conducted through the extending portion 170 to the upper cover recessions 124, and the upper cover recessions 124 exchange heat with the airflow blown from the airflow outlet 112 to take away the heat.
  • Referring to FIG. 5, FIG. 5 is a schematic diagram of a heat dissipating device according to a fifth embodiment of the present invention. The heat dissipating device 100 includes the fan body 110, the upper fan cover 120, and the lower fan cover 130. The upper fan cover 120 and the lower fan cover 130 are assembled on the fan body 110 to protect the fan body 110 and are convenient to be assembled. The fan body 110 has the airflow outlet 112. The upper fan cover 120 has the upper cover front portion 122 and plural upper cover recessions 124 located at the upper cover front portion 122. The lower fan cover 130 has the lower cover front portion 132 and plural lower cover recessions 134 located at the lower cover front portion 132. The upper cover recessions 124 and the lower cover recessions 134 are located in front of the airflow outlet 112. The material of the upper fan cover 120 and the lower fan cover 130 may be a metal with a good thermal conductivity, such as copper or aluminum.
  • Each of the upper cover recessions 124 has the first bottom 126 and two first side walls 128 located on two sides of the first bottom 126. Each of the upper cover recessions 124 has an approximately U-shaped cross-section. The upper cover recessions 124 may be directly formed on the upper fan cover 120 by stamping. In other words, the upper cover recessions 124 are integrally formed on the upper cover front portion 122.
  • Each of the lower cover recessions 134 has the second bottom 136 and two second side walls 138 located on two sides of the second bottom 136. Each of the lower cover recessions 134 has an approximately U-shaped cross-section. The lower cover recessions 134 may be directly formed on the lower fan cover 130 by stamping. In other words, the lower cover recessions 134 are integrally formed on the lower cover front portion 132.
  • The upper cover recessions 124 and the lower cover recessions 134 are located in front of the airflow outlet 112. The first bottom 126 and the first side walls 128 of the upper cover recessions 124 and the second bottom 136 and the second side walls 138 of the lower cover recessions 134 can increase the heat exchange area with the airflow from the airflow outlet 112, thereby the heat exchange efficiency of the upper fan cover 120 and the lower fan cover 130 can be effectively increased.
  • The heat dissipating device 100 may further include the heat pipe 140. The material of the heat pipe 140 is a metal with a good thermal conductivity, such as copper or aluminum. The first end 142 of the heat pipe 140 is in contact with the heat source 150, and the second end 144 of the heat pipe 140 is in contact with the first bottom 126 of the upper cover recessions 124 and the second bottom 136 of the lower cover recessions 134. In this manner, the heat produced by the heat source 150 may be transferred to the upper cover recessions 124 and the lower cover recessions 134 through the heat pipe 140, and then is dissipated after exchanging heat with the airflow blown from the airflow outlet 112.
  • The heat dissipating device 100 may further include the heat plate 160. The material of the heat plate 160 may be a metal with a good thermal conductivity, such as copper or aluminum. The heat plate 160 is disposed at the first end 142 of the heat pipe 140 and is in contact with the heat source 150. The heat plate 160 can increase the heat exchange area with the heat source 150, thereby the heat exchange efficiency of the heat pipe 140 with the heat source 150 can be improved.
  • The upper fan cover 120 may further include the extending portion 170. The extending portion 170 extends outwards from the fan body 110 to another heat source 180 and is in contact with the heat source 180. The shape of the extending portion 170 may be designed according to the path from the fan body 110 to the heat source 180. The heat source 180 may exchange heat with the extending portion 170 in contact with the heat source 180, so that the heat produced by the heat source 180 is conducted through the extending portion 170 to the upper cover recessions 124, and the upper cover recessions 124 exchange heat with the airflow blown from the airflow outlet 112 to take away the heat.
  • It should be known from the above preferred embodiments of the present invention that the application of the present invention has the following advantages. The upper cover recessions or the lower cover recessions may be directly formed on the upper fan cover or the lower fan cover by stamping, which saves the material cost and the number of components. The heat dissipating device further expands the heat exchange area by the upper cover recessions disposed in front of the airflow outlet, thereby effectively improving the heat exchange efficiency of the heat dissipating device.
  • Although the present invention has been described with reference to the above embodiments, these embodiments are not intended to limit the present invention. It will be apparent to those skilled in the art that various modifications and variations can be made without departing from the scope or spirit of the present invention. Therefore, the scope of the present invention shall be defined by the appended claims.

Claims (17)

1. A heat dissipating device, comprising:
a fan body having an airflow outlet;
an upper fan cover assembled on the fan body, wherein the upper fan cover comprises:
an upper cover front portion, and
a plurality of upper cover recessions disposed at the upper cover front portion and located in front of the airflow outlet; and
a lower fan cover assembled on the fan body.
2. The heat dissipating device of claim 1, wherein each of the upper cover recessions comprises a first bottom and two first side walls located on two sides of the first bottom.
3. The heat dissipating device of claim 2, further comprising a heat pipe with a first end contacting a heat source and a second end contacting the first bottoms.
4. The heat dissipating device of claim 3, wherein the lower fan cover comprises:
a lower cover front portion; and
a plurality of lower cover recessions disposed at the lower cover front portion and located in front of the airflow outlet.
5. The heat dissipating device of claim 4, wherein each of the lower cover recessions comprises a second bottom and two second side walls located on two sides of the second bottom, and the second end of the heat pipe is in contact with the second bottoms.
6. The heat dissipating device of claim 5, further comprising a heat plate disposed at the first end of the heat pipe to contact the heat source.
7. The heat dissipating device of claim 6, wherein the upper fan cover further comprises an extending portion, and the extending portion is in contact with another heat source.
8. The heat dissipating device of claim 1, wherein the upper fan cover further comprises an extending portion, and the extending portion is in contact with a heat source.
9. The heat dissipating device of claim 8, wherein the lower fan cover comprises:
a lower cover front portion; and
a plurality of lower cover recessions disposed at the lower cover front portion and located in front of the airflow outlet.
10. The heat dissipating device of claim 9, further comprising a heat pipe with a first end contacting a heat source and a second end located between the upper cover recessions and the lower cover recessions.
11. The heat dissipating device of claim 10, further comprising a heat pipe with a first end contacting a heat source and a second end contacting the first bottoms.
12. The heat dissipating device of claim 11, wherein each of the upper cover recessions comprises a first bottom and two first side walls located on two sides of the first bottom, and the second end of the heat pipe is in contact with the first bottoms.
13. The heat dissipating device of claim 12, wherein each of the lower cover recessions comprises a second bottom and two second side walls located on two sides of the second bottom, and the second end of the heat pipe is in contact with the second bottoms.
14. The heat dissipating device of claim 1, wherein the lower fan cover comprises:
a lower cover front portion; and
a plurality of lower cover recessions disposed at the lower cover front portion and located in front of the airflow outlet.
15. The heat dissipating device of claim 14, wherein a material of the upper fan cover and the lower fan cover is copper or aluminum.
16. The heat dissipating device of claim 15, wherein each of the upper cover recessions comprises a first bottom and two first side walls located on two sides of the first bottom, and each of the lower cover recessions comprises a second bottom and two second side walls located on two sides of the second bottom, and the first bottoms are opposite to the second bottoms.
17. The heat dissipating device of claim 16, wherein the upper fan cover further comprises an extending portion, and the extending portion is in contact with a heat source.
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